JPH0779184B2 - Wiring pattern forming method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring pattern forming method in a printed wiring board in which a pattern having a first unit system dimension and a pattern having a second unit system dimension are mixed.

[0002]

2. Description of the Related Art Conventionally, when pattern wiring is performed in the pattern design of a printed wiring board, a standard millimeter-based 2.50 mm or inch-based 2.54 mm grid and its divided grid (for example, a millimeter diameter) are used. 0.5 mm, and the inch diameter is 0.508 mm).

Therefore, in the pattern design for forming the wiring pattern on the inch grid, the flat package I
When it becomes necessary to use a mounting pad for a component of lead pitch of an electronic component such as C having a millimeter pitch (for example, 1.0 mm, 0.8 mm, 0.65 mm, etc.), as shown in FIG. Only a part of the flat package IC mounting pad 2 having a millimeter lead pitch is mounted on the inch lattice 1 which is a reference when designing the pattern of the printed wiring board.

Therefore, it is difficult to design a wiring pattern by a computer or the like, and as shown in an enlarged view in FIG. 6, for each connection portion of the mounting pad pattern 2 and the wiring pattern 3 on the inch grid 1 as shown in FIG. It is necessary to manually design the wiring pattern portion 3a extending from the wiring pattern 3 with respect to the mounting pad pattern 2 occupying variously displaced positions. In addition, 4 is a through hole land.

[0005]

However, since the design of the wiring pattern portion 3a requires manual work, there is a drawback that it takes a lot of time.

The present invention has been made in view of the above circumstances, and has a grid pattern of a first unit system size serving as a reference when forming a wiring pattern and a component of a second unit system size having a pitch different from the grid pattern. An object of the present invention is to provide a wiring pattern forming method for improving the workability of forming a wiring pattern with a mounting pad pattern.

[0007]

In order to achieve the above object, the present invention provides a grid of a first unit system size on the surface of a printed wiring board.
Forming a printed wiring pattern on the printed wiring;
On the printed wiring board surface in the area where the pattern is formed,
The main unit with the interval of the second unit system dimension different from the first unit system dimension.
Forming an array of parts, and the main body in the array direction
If the part is not located on the lattice,
Simultaneously with the main body part, an auxiliary part that extends to the position on the grid
Multiple pads for connecting lead terminals of electronic components
And a step of forming a pattern .

[0008]

Since the present invention is configured as described above, the pad pad
The auxiliary part of the turn extends onto the lattice pattern . others
Therefore, the designing speed of the wiring pattern formation between different dimensional systems can be improved, and further the workability can be improved.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing a pattern example of an embodiment of the present invention, FIG. 2 is a diagram showing a wiring example with the pattern shown in FIG. 1,
FIG. 3 is an enlarged view showing details of the wiring portion. The same parts as those in FIGS. 4 to 6 are designated by the same reference numerals.

In the above drawing, 1 is a first unit system, for example, a grid pattern formed by an inch system and serving as a reference for forming a wiring pattern of a printed wiring board, 2 is a second unit system different from the grid pattern 1, for example, It is a pad pattern for mounting an electronic component corresponding to a lead of an electronic component such as a flat package IC formed of a millimeter system. These grid patterns
1 and pad pattern 2 are mixed in the same area on the printed wiring board surface.
It exists and is formed.

Further, 2a is inclined to the main body portion of the pad pattern 2 up to the point where it intersects with the adjacent grid pattern 1 in order to compensate for the decentering caused by the pitch difference between both patterns as the centers of both patterns move away from the overlapping position. in extension appended auxiliary section, the present as part of the pad pattern 2 the auxiliary section 2a at the time of formation of the pad pattern 2
It is formed at the same time as the body part . Accordingly, auxiliary section 2a of the path Ddopatan 2 intersects the grating pattern 1, the wiring pattern between the grid pattern 1 and the pad pattern 2 is formed. Therefore, lattice pattern 1 and the pad pattern 2
Since the wiring pattern is formed by the auxiliary portion 2a for compensating for the positional deviation between the wiring pattern and the wiring pattern, a special work process for changing the wiring pattern 1 for forming the wiring pattern between the wiring pattern 1 and the pad pattern 2 is required. do not do.

Reference numeral 3 is a wiring pattern, and 4 is a through hole land.

In the above embodiment, the dimension of the reference grid is set to the inch series dimension, and the mounting component having the millimeter lead pitch in the inch series dimension is mounted. However, the present invention is not limited to this. In addition, inch-based mounting components may be mounted.

Further, in the above-mentioned embodiment, the invention is applied to the planar mounting component, but the present invention is not limited to this, and the through hole to the reference lattice point is similarly applied to the through hole mounting component in which the reference lattice mismatches. You may form an auxiliary part .

Further, the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

[0017]

As described in detail above, according to the wiring pattern forming method of the present invention, the auxiliary portion compensates for the difference in the reference dimensions and makes them dimensionally the same, so that the wiring pattern forming reference Since there is no need to change the grid pattern, it is possible to improve the designing speed of the wiring pattern formation between different dimensional systems and to improve the workability.

Further, when the pad pattern is superposed on the reference grid pattern, the auxiliary portion is extendedly formed on the main body of the pad pattern, so that the area of the pad pattern is increased and the adhesive strength of the pad pattern is enhanced. As a result, the pad pattern can be prevented from peeling off, and a wiring pattern having a stable shape can be formed.

Further, it is possible to prevent the short circuit between the pattern and the pad, the gap defect, etc., which have been apt to occur due to the difference in the reference dimensions when the printed wiring board is manufactured, and to improve the quality of the printed wiring board.

[Brief description of drawings]

FIG. 1 is a diagram showing a pattern example of an embodiment of the present invention.

FIG. 2 is a diagram showing an example of wiring with the pattern shown in FIG.

FIG. 3 is an enlarged view showing details of a wiring connection portion.

FIG. 4 is a diagram showing an example of a conventional pattern.

FIG. 5 is a diagram showing an example of wiring with the pattern shown in FIG.

FIG. 6 is an enlarged view showing details of a conventional wiring connection portion.

[Explanation of symbols]

 1… Lattice pattern 2… Pad pattern 2a… Auxiliary pattern

Claims (1)

[Claims] 1. A grid of a first unit system size on a printed wiring board surface.
Forming a printed wiring pattern on the printed wiring;
On the printed wiring board surface in the area where the pattern is formed,
The main unit with the interval of the second unit system dimension different from the first unit system dimension.
Forming an array of parts, and the main body in the array direction
If the part is not located on the lattice,
Simultaneously with the main body part, an auxiliary part that extends to the position on the grid
Multiple pads for connecting lead terminals of electronic components
And a step of forming a pattern.