JPH0786867A - Electronic component and manufacturing method thereof - Google Patents

Abstract

(57) [Summary] [Object] The present invention relates to an electronic component and a method of manufacturing the same, and an object thereof is to simplify a sealing structure of a through hole. [Structure] A SAW device 3 housed in a space formed between upper and lower cases 7 and 1 is provided, and a through hole 8 is provided in an upper case 7 corresponding to an input / output electrode 6 of the SAW device 3. A sphere 9 is provided in the hole 8 and hermetically sealed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a SAW filter and its manufacturing method.

[0002]

2. Description of the Related Art For example, in a conventional SAW filter, a SAW device is housed in a space formed between upper and lower cases which are hermetically sealed, and one of the upper and lower cases has a first connection penetrating the case. A terminal is provided as a means, and the terminal and the input / output electrode of the SAW device are connected to each other in the case by wire bonding which is the second connecting means.

[0003]

In the above configuration,
There has been a problem that a sealing body has to be provided in the outer peripheral portion of the terminal in the through-hole portion of the case, so that the structure becomes complicated and large.

Therefore, the present invention aims to simplify the sealing structure of the through hole.

[0005]

To achieve this object, the present invention comprises an upper case, a lower case, and a device housed in a space formed between the upper case and the lower case.
A through hole is provided in at least one of the upper and lower cases corresponding to the input / output electrodes of the device, and a first connecting unit electrically connected to the input / output electrode of the device is provided in the through hole. On the outer surface side of the case of the through hole, the first
The second connecting means electrically connected to the connecting means is provided and at least one of the first and second connecting means seals the through hole portion.

[0006]

With the above construction, since the through hole portion is sealed by at least one of the first and second connecting means for connecting the outer surface portion of the case and the input / output electrodes of the device, the conventional sealing body is unnecessary. Therefore, the structure is greatly simplified and the size can be easily reduced.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, reference numeral 1 designates a lower case, which is made of, for example, borosilicate glass, soda glass, quartz or the like. As shown in FIG. 2, the lower case 1 has a recess 2 formed in the upper surface thereof, and the SAW device 3 is housed in the recess as shown in FIGS. As shown in FIG. 2, the SAW device 3 includes a substrate 4 made of crystal, lithium tantalate, or the like.
The comb-teeth electrodes 5 made of Al are provided facing each other, and the input / output electrodes 6 are provided at both ends of the substrate 4 in the longitudinal direction.

The upper surface of the lower case 1 is shown in FIGS.
As shown in FIG. 4, the upper case 7 is superposed. The upper case 7 is made of the same material as the lower case 1 or a material whose thermal expansion coefficient is roughly matched, and the outer peripheral portion of the lower surface thereof and the outer peripheral portion of the lower case 1 are brought into contact with each other as shown in FIGS. In this state, heat is applied to bond the atoms and make them airtight.

A through hole 8 is provided in a portion of the upper case 7 corresponding to the input / output electrode 6 of the SAW device 3, and a spherical body 9 is provided in the through hole 8 as a first connecting means. 9 is compressed between the conductive layer 10 as the second connecting means provided on the upper surface of the upper case 7 and the input / output electrode 6 of the SAW device 3 as shown in FIG. In this case, the sphere 9 is made of Sn, Au, Cu, an alloy and solder containing them as the main components, or a conductive film provided on the outer surface of the elastic body, and has a diameter of 0.2 mm and the through hole 8 Since the diameter is smaller than 0.22 mm, a slight gap is formed between the two when inserting into the through hole 8, as shown in FIG.

However, as shown in FIG. 4, when the conductive layer 10 is compressed, the spherical body 9 expands in the outer peripheral direction to seal the through hole 8. Of course, the outer surface portion of the through hole 8 is also sealed by the conductive layer 10.

1 to 4, reference numeral 11 denotes an external connection terminal provided on the outer peripheral portion of the through hole of the upper case 7, and the conductive layer 10 is welded onto the external connection terminal 11 as shown in FIG. There is. Incidentally, the conductive layer 10 is made of, for example, Sn, A
u or a solder material, or a thin plate material having a thin film formed on the surface thereof, and the external connection terminal 11 is made of Au, Sn, a solder material, or a metal material having the surface thereof formed thereon.

The substrate 4 of the SAW device 3 is adhered to the inner bottom surface of the recess 2 of the lower case 1 with an adhesive material, and a gap 12 is formed between the upper surface and the lower surface of the upper case 7. Further, since the distance between the upper surface of the input / output electrode 6 and the lower surface of the conductive layer 10 is 0.18 mm or less, the spherical body 9 is compressed by the conductive layer 10 as described above, and the through hole 8 is sealed and conductive. The layers 10, the spheres 9 and the input / output electrodes 6 are electrically connected.

FIG. 5 shows another embodiment, in which a protrusion 13 is formed on the inner bottom surface of the recess 2 of the lower case 1 corresponding to the input / output electrode 6.
Is provided. That is, the substrate 4 of the SAW device 3 is supported by the two projections 13 at the input / output electrode 6 portion thereof, and the sphere 9 is pressed from above. Therefore, the substrate 4 is supported by the two upper and lower support points between the upper and lower cases 1 and 7,
There is little heat conduction from the outer circumference of the lower cases 1 and 7, and the thermal durability is high.

FIGS. 6 and 7 show another embodiment. In this embodiment, three spheres 14 having a diameter smaller than that of the sphere 9 are inserted in the through hole 8 side by side in the longitudinal direction, and are electrically conductive. The layer 10 is compressed as shown in FIG. 7, and then heat is applied from the upper surface of the conductive layer 10 to the three layers, the input / output electrode 6, and the conductive layer 1.
It is welded to 0.

In order to perform this welding, the input / output electrode 6
In general, Al is used, or it is necessary to take measures such as providing an Au layer on the upper surface. Also in this case, the diameter of the spherical body 14 is small and it does not adhere to the inner wall of the through hole 8.

FIG. 8 and FIG. 9 show another embodiment. In this embodiment, after inserting the spherical body 9 into the through hole 8, a pressing force and thermal energy or ultrasonic energy is applied from above the spherical body 9. The spherical body is melted and deformed to form a sealing body 9a for the through hole 8, and then a conductive layer 15 is provided on the external connection terminal 11 as shown in FIG.

The conductive layer 15 is made of a conductive paste and penetrates into the through hole 8 to connect the sealing body 9a and the external connection terminal 11.

FIG. 10 shows another embodiment. In this embodiment, external connection terminals 11 are continuously extended in the through hole 8 and on the lower surface of the upper case 7 below the through hole 8, and the extended portion 11a is formed. It serves as a second connecting means and electrically connects the input / output electrode 6, the sealing body 9a, and the external connection terminal, and seals the metal surface of the external connection terminal 11 to the inside and the lower surface of the through hole 8 and the metal. By joining metals such as Au, Ag, Sn, Cu, and solder of the stopper 9a, the effect of sealing the through hole 8 is further enhanced.

11 to 13 show another embodiment. In this embodiment, two through holes 8 coextending portions 11a are formed, and further one extending portion 11a and the lower surface of the upper case 7 are provided. As shown in FIG. 11, the shield surface 11 is further extended.
A is formed, and a gap 16 is formed between the shield surface 11A and the other extended portion 11a to separate each.

As a result, the SAW device has a comb-shaped electrode 5
Will be shielded on the upper surface of.

Of course, if a shield is required even in the lower side, it may be provided on the lower surface side of the lower case 1.

14 to 16 show another embodiment. In this embodiment, the shield surface is further shown in FIG.
The upper case 7 extends to the outer circumference of the lower surface of the upper case 7, and the upper case 7 is installed on the lower case 1 through this outer peripheral portion as shown in FIG. That is, the extended portion 11B of the outer periphery, the lower case 1
The upper and lower cases 1 and 7 are anodically bonded with the external connection terminal 11 connected to the extended portion 11B as the anode and the lower case 1 as the cathode while being brought into contact with the upper surface of the. At this time, a thin film of Al or the like is desirable as a material for forming the extension of the external connection terminal.

FIG. 17 shows another embodiment. In this embodiment, in order to make it easier to insert the spherical body 9 or 14 into the through hole 8, the upper surface side portion of the upper case 7 of the through hole 8 is expanded. It is a thing.

18 and 19 show another embodiment. In this embodiment, the upper and lower sides of the through hole 8 are widened and the middle portion thereof is narrowed to a diameter smaller than that of the sphere 9. Therefore, when the sphere 9 is inserted by applying pressure and heat energy or ultrasonic energy, the sphere is compressed and deformed as shown in FIG.

20 and 21 show a manufacturing method, in which a plurality of recesses 2 are provided in the lower case body 1A in the vertical and horizontal directions. Therefore, first of all, the SAW device 3 is formed in these recesses 2.
The upper case body 7A and the lower case body 1A are stacked in this state.
Bonding is performed by the interatomic bond method or the anodic method as described above.
Of course, other joining, for example, joining via an adhesive may be used.

Next, a spherical body 9 is inserted into each through hole 8, and in that state, the spherical body 9 is transformed into a sealing body 9a as shown in FIG. 10, or as shown in FIG. Do.

From this state, the electronic component is divided into individual pieces as shown in FIG.

[0028]

As described above, the present invention comprises the upper and lower cases and the device housed in the space formed between the upper and lower cases, and the upper and lower cases corresponding to the input / output electrodes of the device. A through hole is provided in at least one of the lower cases, and a first connecting means electrically connected to the input / output electrodes of the device is provided in the through hole; Second electrically connected to one connection means
Is provided, and the through-hole portion is sealed by at least one of the first and second connecting means.

With the above construction, since the through hole portion is sealed by at least one of the first and second connecting means for connecting the outer surface portion of the case and the input / output electrodes of the device, the conventional sealing body is provided. It is not necessary, and the structure is greatly simplified and the size can be easily reduced.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view of an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the same.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a cross-sectional view of the sphere of FIG. 3 compressed with a conductive layer.

FIG. 5 is a sectional view of another embodiment of the present invention.

FIG. 6 is a sectional view of another embodiment of the present invention.

FIG. 7 is a sectional view of the same.

FIG. 8 is a sectional view of another embodiment of the present invention.

FIG. 9 is a sectional view of the same.

FIG. 10 is a sectional view of another embodiment of the present invention.

FIG. 11 is a bottom view of an upper case according to another embodiment of the present invention.

FIG. 12 is a sectional view of the same.

FIG. 13 is a sectional view of the same.

FIG. 14 is a bottom view of an upper case according to another embodiment of the present invention.

FIG. 15 is a sectional view of the same.

FIG. 16 is a sectional view of the same.

FIG. 17 is a sectional view of another embodiment of the present invention.

FIG. 18 is a sectional view of another embodiment of the present invention.

FIG. 19 is a sectional view of the same.

FIG. 20 is an exploded perspective view showing a manufacturing method according to an embodiment of the present invention.

FIG. 21 is a perspective view of the same.

[Explanation of symbols]

 1 Lower Case 2 Recess 3 SAW Device 6 Input / Output Electrode 7 Upper Case 8 Through Hole 9 Sphere

Claims (15)

[Claims] 1. An upper and lower case, and a device housed in a space formed between the upper and lower cases, wherein at least one of the upper and lower cases corresponding to input / output electrodes of the device. A through hole is provided, and a first connecting means electrically connected to the input / output electrode of the device is provided in the through hole, and the case outer surface side of the through hole is electrically connected to the first connecting means. A second connecting means connected to
An electronic component in which at least one of these first and second connecting means has a through hole portion sealed. 2. The electronic component according to claim 1, wherein the first connecting means is a sphere inserted from the outer surface side of the case of the through hole. 3. The electronic component according to claim 2, wherein the first connecting means is compressed between the second connecting means and the input / output electrodes of the device. 4. The electronic component according to claim 2, wherein the case outer surface side of the through hole is expanded. 5. The electronic component according to claim 1, wherein a plurality of spheres each having a diameter smaller than the diameter of the through hole are arranged in the through hole in the longitudinal direction to form the first connecting means. 6. The electronic component according to claim 5, wherein the first connecting means is compressed between the second connecting means and the input / output electrodes of the device. 7. The electronic component according to claim 5, wherein the through hole has an outer surface side that is widened. 8. The electronic component according to claim 1, wherein a conductive film is continuously provided on the inner wall surface of the through hole from the outer surface of the case to constitute the second connecting means. 9. The first connecting means is made of a conductive material which is inserted into the input / output electrode of the device from the outer surface side of the case of the through hole and is welded to the input / output electrode and the second connecting means. The electronic component according to claim 8. 10. The electronic component according to claim 8, wherein a lower end portion of the through hole of the conductive film forming the second connecting means is extended in a direction of an inner surface of the case. 11. The electronic component according to claim 10, wherein a portion of the conductive film forming the second connecting means that extends inside the case is extended to the inside surface of the case to form a shield surface. 12. A case in which a case inner surface extension portion of the conductive film constituting the second connecting means is expanded in the outer peripheral direction of the case inner surface, and the upper and lower case outer peripheral portions are brought into contact with each other via the outer peripheral extension portion. Item 10. The electronic component according to Item 10. 13. An upper case and a lower case are provided with a plurality of recesses in at least one direction, the devices are housed in the recesses, respectively, and then the other case is superposed, and then the input / output electrodes of the device are accommodated. A method of manufacturing an electronic component, wherein first connecting means electrically connected to an input / output electrode of the device is inserted into a through hole provided in at least one of the upper and lower cases. 14. The method of manufacturing an electronic component according to claim 13, wherein after the first connecting means is inserted into the through hole, thermal energy is applied to the first connecting means to weld the input / output electrodes of the device. . 15. A sphere is inserted into a through hole as a first connecting means, and then a second connecting means is provided on an outer surface portion of a case of the through hole to form a second connecting means and an input / output electrode of a device. The method of manufacturing an electronic component according to claim 13, wherein the connecting means of No. 1 is compressed.