JPH0793338B2 - Manufacturing method of mini-mold type LED - Google Patents
Manufacturing method of mini-mold type LEDInfo
- Publication number
- JPH0793338B2 JPH0793338B2 JP60252248A JP25224885A JPH0793338B2 JP H0793338 B2 JPH0793338 B2 JP H0793338B2 JP 60252248 A JP60252248 A JP 60252248A JP 25224885 A JP25224885 A JP 25224885A JP H0793338 B2 JPH0793338 B2 JP H0793338B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- row
- led
- cut
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、セラミック基板上にLEDチップをボンディン
グし、樹脂モールドした後、ダイシングソーで切断して
発光ダイオード（LED）とするミニモールド型LEDの製造
方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention is a mini-mold type LED in which an LED chip is bonded onto a ceramic substrate, resin-molded, and then cut with a dicing saw to form a light-emitting diode (LED). The present invention relates to a manufacturing method of.
［従来の技術］ 例えば、LEDを製造する場合、第４図に示すように短冊
状に成形したセラミック基板（ボンディング基板）Ａに
LEDチップをボンディングし、ポッティング成型法によ
り樹脂Ｂで封止した後、基板Ａを裁断して個々の製品と
することがある。[Prior Art] For example, when manufacturing an LED, a ceramic substrate (bonding substrate) A formed in a strip shape as shown in FIG.
The LED chip may be bonded and sealed with the resin B by the potting molding method, and then the substrate A may be cut into individual products.
しかし、このようにして製造したのでは、基板Ａのスル
ーホールに形成された電極部Ｃに成型樹脂が付着し易
く、歩留りが悪くなる。それは、ボンディング済みの基
板Ａをモールド型に装着する前に、予め樹脂をモールド
型に入れておかなければならないため、成型工程中に電
極部Ｃに成型樹脂が入り込み易いからである。However, if manufactured in this way, the molding resin is likely to adhere to the electrode portions C formed in the through holes of the substrate A, resulting in poor yield. This is because the resin must be put in the mold in advance before mounting the bonded substrate A in the mold, and therefore the molding resin easily enters the electrode portion C during the molding process.
また、セラミック基板Ａをセットする際には、特殊な寸
法、材質の歯を持ったダイシングソーが必要な上、カッ
ティングが困難であり、量産性に乏しいといった問題が
ある。Further, when setting the ceramic substrate A, a dicing saw having teeth of special dimensions and materials is required, cutting is difficult, and mass productivity is poor.
更に、トランスファーモールドで金型にセラミック基板
を圧力を加えて装着すると、基板に割れが生じるおそれ
がある。又、更に基板上の広い面に一体モールドをした
後に定寸法ピッチでモールドを切断することによる製法
で作製する半導体素子が提案されているが、側面、四周
面は切断により荒削りとなり、光透過の面で難点を有し
ている。Furthermore, when the ceramic substrate is applied to the mold by transfer molding under pressure, the substrate may be cracked. Further, a semiconductor element has been proposed which is manufactured by a method in which a wide surface on a substrate is integrally molded and then the mold is cut at a fixed pitch. However, the side surface and the four peripheral surfaces are rough-cut by cutting, and the light transmission It has a problem in terms of surface.
光の透過を充分にし、かつ金型からの離型を容易にする
ためには、モールド側は台形とすることが望ましい。It is desirable that the mold side has a trapezoidal shape in order to sufficiently transmit light and to facilitate the release from the mold.
［発明の目的］ 本発明の目的は、量産性に優れたミニモールド型LEDの
製造方法を提供することにある。[Object of the Invention] An object of the present invention is to provide a method for manufacturing a mini-mold type LED excellent in mass productivity.
［発明の概要］ 本発明は、多数のスルーホールと直線パターンを所定の
配列状態で形成したプリント基板上の所定の位置にLED
チップを多数個ボンディングして、これらを樹脂で被覆
した後に切断して個別部品とするLEDの製造方法におい
て、前記プリント基板のスルーホールが平行に並ぶ列の
間に、LEDチップが並ぶ列を前記スルーホール列と平行
にして設け、前記LEDチップを樹脂で被覆する際、該樹
脂を、LEDチップが並ぶ一列毎にLEDチップの列方向に対
する直角方向での断面形状がスルーホールの列に沿うカ
ットラインにかさならず上方に向けて凸となる形状であ
り前記断面形状が列方向で同一となる畝状に設け、プリ
ント基板を、前記LEDチップの列に並ぶスルーホールの
列に沿うカットラインに沿って切断し、プリント基板と
前記樹脂を、該樹脂の長さ方向に対し直角となる方向で
あってLEDチップ間を通るカットラインに沿って切断し
たことを特徴とするミニモールド型LEDの製造方法であ
り、この製造方法により上記目的を達成するものであ
る。[Summary of the Invention] The present invention provides an LED at a predetermined position on a printed circuit board in which a large number of through holes and linear patterns are formed in a predetermined arrangement.
In a method of manufacturing an LED in which a large number of chips are bonded, and these are covered with a resin and then cut into individual parts, between the rows in which the through holes of the printed board are arranged in parallel, the rows in which the LED chips are arranged are When the LED chips are covered with resin and provided in parallel with the through hole row, the resin is cut along the row of through holes for each row in which the LED chips are lined up in a direction perpendicular to the row direction of the LED chips. Provided in a ridge shape in which the cross-sectional shape is the same in the column direction, and the printed board is a cut line along the row of through holes arranged in the row of the LED chips. The mini-mold is characterized in that the printed circuit board and the resin are cut along a cut line passing through between the LED chips in a direction perpendicular to the length direction of the resin. A mold method of manufacturing an LED, by this manufacturing method is to achieve the above object.
［実施例］ 第１図及び第２図は本発明の一実施例を示すもので、基
板12に、電極部となるスルーホール11を多数の平行な列
とした配列状態に形成し、そのスルーホール11の列の間
で平行にして並ぶ多数のLEDチップ13をダイボンディン
グするとともに、金線ワイヤボンディングが行われてい
る。[Embodiment] FIGS. 1 and 2 show an embodiment of the present invention, in which through holes 11 serving as electrode portions are formed in a parallel array in a substrate 12 and the through holes 11 are formed. A large number of LED chips 13 arranged in parallel between the rows of holes 11 are die-bonded, and gold wire wire bonding is performed.
次に、トランスファーモールドでLEDチップ13を樹脂モ
ールドにより封止する。この場合、トランスファー金型
はボンディング基板上を直線的に樹脂が流れる掘り込み
を有する形状でよい。この樹脂モールドにより樹脂14
が、基板12上でLEDチップが並ぶ一列毎に長さ方向（LED
チップ列の列方向）に対する直角方向での断面形状がス
ルーホールの列に沿うカットライン（後述）にかさなら
ず上方に向けて突出する台形形状となり前記断面形状が
前記長さ方向で同一となる畝状に形成される。Next, the LED chip 13 is sealed by resin molding by transfer molding. In this case, the transfer mold may have a shape in which the resin linearly flows on the bonding substrate. This resin mold allows resin 14
However, in the length direction (LED
The cross-sectional shape in the direction perpendicular to the row direction of the chip row is a trapezoidal shape that protrudes upward without being cut by a cut line (described later) along the row of through holes, and the cross-sectional shape is the same in the length direction. It is formed in a ridge shape.
続いて、最終製品形状となるように基板12裏面に粘着シ
ート（図示せず）を貼り、ダイサー（同一のダイシング
ソー）によって基板部と樹脂部を同時に切断する。この
切断は第１図と第２図に示すようにカットラインl1（樹
脂の長さ方向に対し直角となる方向であってLEDチップ
間を通る）,l2（スルーホールの列に沿う）に沿って行
われる。粘着シートは切断せず、カット後も面状の位置
にLEDを保持する。この後、出荷検査を行い、テーピン
グ出荷する。Then, an adhesive sheet (not shown) is attached to the back surface of the substrate 12 so that the final product shape is obtained, and the substrate portion and the resin portion are simultaneously cut by a dicer (the same dicing saw). As shown in FIGS. 1 and 2, this cutting is cut lines l 1 (direction perpendicular to the length direction of the resin and passing between the LED chips), l 2 (along the row of through holes) Is done along. The adhesive sheet is not cut, and the LED is held in a planar position even after cutting. After this, a shipping inspection is performed and taping is shipped.
この結果、樹脂モールドの際に用いる金型は、連続した
多数例のモールド形状をなす掘り込みを有し、かつ樹脂
流入のゲートを１個とするものでよく、従来のチップ毎
にゲートを設ける必要がなくなり、広い面状の薄く、一
定厚さで樹脂を行き渡らせる金型の掘り込み精度を必要
とせず、樹脂の流動性が良好となって、均質で歩留りの
良い製品が得られる。即ち、薄板状の成型部に発生し勝
ちなモールド樹脂材料の流れ込み不足や気泡の発生がな
くなり、樹脂材料の型内の流動性が良好となる。また、
LEDにとって光の放射性は主要な要素となるが、上述し
たようにモールド樹脂に対しては、その長さ方向に直角
となる方向で切断しているので、その切断面は光の放射
される方向のモールド形状の二面のみであり、金型面の
転写である他のモールド形状面は良好な光透過面を有す
ることになる。As a result, the metal mold used for resin molding may have a number of continuous dugouts having a mold shape and one resin inflow gate, and a conventional gate is provided for each chip. There is no need for it, a wide surface is thin, and there is no need for digging precision of a mold that spreads the resin with a constant thickness, the fluidity of the resin is good, and a homogeneous and high-yield product can be obtained. That is, the insufficient inflow of the mold resin material which is likely to occur in the thin plate-shaped molding portion and the generation of bubbles are eliminated, and the fluidity of the resin material in the mold is improved. Also,
Light emission is a major factor for LEDs, but as described above, the cut surface is cut in the direction perpendicular to the length direction of the mold resin, so the cut surface is the direction in which light is emitted. The mold surface is only two surfaces, and the other mold surface, which is a transfer of the mold surface, has a good light transmitting surface.
なお、上記実施例はLEDの１チップの場合であるが、第
３図に示す２チップの場合も同様である。更には、実施
例ではモールド樹脂上面が平坦に形成されているが、こ
の上面の全体又は一部をレンズ状にしてもよい。Although the above embodiment is for one LED chip, the same is true for the two chips shown in FIG. Further, although the upper surface of the mold resin is formed flat in the embodiment, the entire or a part of the upper surface may be formed into a lens shape.
［効果］ （１）ボンディング基板（スルーホール基板）上にLED
チップを統一された間隔でボンディングすることによ
り、作業が容易となり、量産性が向上する。[Effect] (1) LED on bonding board (through-hole board)
By bonding the chips at uniform intervals, work becomes easier and mass productivity is improved.
（２）簡単なモールド法及び金型構造により多数個の製
品を一時に製造することが可能である。(2) It is possible to manufacture a large number of products at one time by a simple molding method and mold structure.
（３）一枚の基板より多数の製品を作ることができ、材
料の有効利用が図れて量産性、コストパフォーマンスの
向上に寄与できる。(3) A large number of products can be produced from one substrate, effective use of materials can be achieved, and mass productivity and cost performance can be improved.
（４）ダイサーによるカット後の出荷検査は、製品がバ
ラバラにならないようにシートに貼ったままで点灯、電
圧特性のチェックが可能である。(4) In the shipping inspection after cutting with a dicer, it is possible to check the voltage characteristics while lighting the product while it is attached to the sheet so that the products do not fall apart.
（５）光透過面が金型の転写面であり、充分な光透過率
を有したものとなる。(5) The light transmitting surface is the transfer surface of the mold, and has a sufficient light transmittance.
第１図は本発明方法の一実施例を示す斜視図、第２図及
び第３図は最終製品形状を示す斜視図、第４図は従来の
方法を説明するための斜視図である。 11……スルーホール 12……基板 13……LEDチップ 14……モールド樹脂 15……金線FIG. 1 is a perspective view showing an embodiment of the method of the present invention, FIGS. 2 and 3 are perspective views showing the final product shape, and FIG. 4 is a perspective view for explaining a conventional method. 11 …… Through hole 12 …… Board 13 …… LED chip 14 …… Mold resin 15 …… Gold wire
Claims (1)
の配列状態で形成したプリント基板上の所定の位置にLE
Dチップを多数個ボンディングして、これらを樹脂で被
覆した後に切断して個別部品とするLEDの製造方法にお
いて、 前記プリント基板のスルーホールが平行に並ぶ列の間
に、LEDチップが並ぶ列を前記スルーホールの列と平行
にして設け、前記LEDチップを樹脂で被覆する際、該樹
脂を、LEDチップが並ぶ一列毎にLEDチップの列方向に対
する直角方向での断面形状がスルーホールの列に沿うカ
ットラインにかさならず上方に向けて凸となる形状であ
り前記断面形状が列方向で同一となる畝状に設け、 プリント基板を、前記LEDチップの列に並ぶスルーホー
ルの列に沿うカットラインに沿って切断し、プリント基
板と前記樹脂を、該樹脂の長さ方向に対し直角となる方
向であってLEDチップ間を通るカットラインに沿って切
断したことを特徴とするミニモールド他LEDの製造方
法。1. A LE at a predetermined position on a printed circuit board in which a large number of through holes and linear patterns are formed in a predetermined arrangement.
In the method of manufacturing an LED in which a large number of D chips are bonded, and these are covered with resin and then cut into individual parts, a row of LED chips is arranged between the rows of through holes of the printed circuit board which are arranged in parallel. When the LED chips are covered with a resin in parallel with the row of through holes, the resin has a cross-sectional shape in a direction perpendicular to the row direction of the LED chips for each row in which the LED chips are arranged in a row of through holes. The ridge is formed so that it does not protrude along the cut line along the line and the cross-sectional shape is the same in the row direction, and the printed circuit board is cut along the row of through holes arranged in the row of the LED chips. A mini module characterized in that it is cut along a line, and the printed circuit board and the resin are cut along a cut line that is perpendicular to the length direction of the resin and that passes between the LED chips. Field other method of manufacturing an LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60252248A JPH0793338B2 (en) | 1985-11-11 | 1985-11-11 | Manufacturing method of mini-mold type LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60252248A JPH0793338B2 (en) | 1985-11-11 | 1985-11-11 | Manufacturing method of mini-mold type LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62112333A JPS62112333A (en) | 1987-05-23 |
| JPH0793338B2 true JPH0793338B2 (en) | 1995-10-09 |
Family
ID=17234575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60252248A Expired - Lifetime JPH0793338B2 (en) | 1985-11-11 | 1985-11-11 | Manufacturing method of mini-mold type LED |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0793338B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002111065A (en) * | 2000-09-26 | 2002-04-12 | Rohm Co Ltd | Semiconductor light emitting device |
| JP2008153698A (en) * | 2008-03-07 | 2008-07-03 | Matsushita Electric Ind Co Ltd | Surface mount type photoelectric conversion device |
| WO2019230172A1 (en) * | 2018-05-31 | 2019-12-05 | 浜松ホトニクス株式会社 | Electronic component, method of manufacturing electronic component, and electronic device |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5977613A (en) * | 1996-03-07 | 1999-11-02 | Matsushita Electronics Corporation | Electronic component, method for making the same, and lead frame and mold assembly for use therein |
| JP3827497B2 (en) | 1999-11-29 | 2006-09-27 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device |
| JP2003100980A (en) | 2001-09-27 | 2003-04-04 | Hamamatsu Photonics Kk | Semiconductor device and manufacturing method thereof |
| KR100646630B1 (en) | 2004-10-08 | 2006-11-23 | 서울반도체 주식회사 | Manufacturing method of printed circuit board for light emitting diode and printed circuit board for light emitting diode using same |
| JP5308464B2 (en) * | 2011-01-24 | 2013-10-09 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5572054A (en) * | 1978-11-27 | 1980-05-30 | Nec Corp | Preparation of semiconductor device |
| JPS58201347A (en) * | 1982-05-20 | 1983-11-24 | Unie Kurisutaru Kk | Leadless chip parts and preparation thereof |
-
1985
- 1985-11-11 JP JP60252248A patent/JPH0793338B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002111065A (en) * | 2000-09-26 | 2002-04-12 | Rohm Co Ltd | Semiconductor light emitting device |
| JP2008153698A (en) * | 2008-03-07 | 2008-07-03 | Matsushita Electric Ind Co Ltd | Surface mount type photoelectric conversion device |
| WO2019230172A1 (en) * | 2018-05-31 | 2019-12-05 | 浜松ホトニクス株式会社 | Electronic component, method of manufacturing electronic component, and electronic device |
| US11462667B2 (en) | 2018-05-31 | 2022-10-04 | Hamamatsu Photonics K.K. | Electronic component, method of manufacturing electronic component, and electronic device |
| TWI827595B (en) * | 2018-05-31 | 2024-01-01 | 日商濱松赫德尼古斯股份有限公司 | Electronic components, manufacturing methods of electronic components, electronic devices |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62112333A (en) | 1987-05-23 |
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