JPH0794035A - Tape wire for relay connection - Google Patents
Tape wire for relay connectionInfo
- Publication number
- JPH0794035A JPH0794035A JP24155493A JP24155493A JPH0794035A JP H0794035 A JPH0794035 A JP H0794035A JP 24155493 A JP24155493 A JP 24155493A JP 24155493 A JP24155493 A JP 24155493A JP H0794035 A JPH0794035 A JP H0794035A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- electric wire
- tape
- relay connection
- copper conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Insulated Conductors (AREA)
Abstract
(57)【要約】
【目的】 電子部品同士の接続を簡単に、安価に、信頼
性良く行える中継接続用のテープ電線を提供する。
【構成】 所定長さにしたテープ電線10の端部に銅導
体1を露出させ、この露出部の表面上にレーザ反射率が
75%以下の金属(例えばSn、Ni、Zn)のメッキ
3を設ける。このメッキによりレーザ吸収性が高まり、
銅導体1を極部加熱になるレーザ溶接で電子部品A、B
のリードLに信頼性良く接合することが可能になるた
め、中継用コネクタが不要であり、半田付けのように電
子部品に熱的悪影響を及ぼすこともなくなる。
(57) [Abstract] [Purpose] To provide a tape electric wire for relay connection, which enables easy, inexpensive, and reliable connection between electronic components. A copper conductor 1 is exposed at an end of a tape electric wire 10 having a predetermined length, and a metal 3 (for example, Sn, Ni, Zn) having a laser reflectance of 75% or less is plated on the exposed surface of the copper conductor 1. Set up. This plating enhances laser absorption,
Electronic parts A and B by laser welding that heats the copper conductor 1 to the extreme part
Since it is possible to reliably join to the lead L, the relay connector is not necessary, and the electronic components are not adversely affected by heat like soldering.
Description
【0001】[0001]
【産業上の利用分野】この発明は、電子部品類の中継接
続に用いるテープ電線、特に、被中継導体のレーザ溶接
による接合を可能ならしめたテープ電線に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape electric wire used for relay connection of electronic parts, and more particularly to a tape electric wire capable of joining relayed conductors by laser welding.
【0002】[0002]
【従来の技術】従来、電子部品同士を互いに電気接続す
る場合には、コネクタを使用するか、中継接続用の基板
やテープ電線を用いてこれ等の基板や電線の導体に電子
部品のリードを半田付けするなどの方法が採られてい
た。2. Description of the Related Art Conventionally, when electronic parts are electrically connected to each other, a connector is used, or a substrate for relay connection or a tape electric wire is used and leads of the electronic parts are attached to conductors of these boards and electric wires. Methods such as soldering were adopted.
【0003】[0003]
【発明が解決しようとする課題】コネクタによる接続
は、コネクタハウジングの成形用金型、端子成形用金型
を含むコネクタ製造設備に多額の投資を必要とする。し
かも、その設備は1品種の1部品しか製造できず、生産
の効率化、コスト削減の面で好ましくない。Connection by a connector requires a large investment in a connector manufacturing facility including a mold for molding a connector housing and a mold for molding a terminal. Moreover, the equipment can manufacture only one part of one kind, which is not preferable in terms of production efficiency and cost reduction.
【0004】また、電子部品のリードを中継部品の導体
に半田付けして中継する方法は、半田付け時に電子部品
が高温に晒されるのと、半田自体の長期信頼性に不安が
あるため、これも好ましい接続法とは言えない。Further, in the method of soldering the leads of the electronic component to the conductor of the relay component for relaying, the electronic component is exposed to high temperature during soldering and there is concern about the long-term reliability of the solder itself. Is not a preferable connection method.
【0005】そこで、中継部品の導体を極部加熱による
接合が可能なレーザ溶接で電子部品のリードに接合する
ことを考えた。ところが、中継部品として多用されてい
るテープ電線等の導体は通常、銅で形成されており、こ
の銅はレーザの吸収性が悪いことから、レーザ溶接では
全く接合しないか接合しても接合強度が小さくて実用に
耐えないものになる。Therefore, it has been considered to join the conductor of the relay component to the lead of the electronic component by laser welding capable of joining by heating the pole portion. However, conductors such as tape electric wires, which are often used as relay parts, are usually formed of copper, and this copper has poor laser absorption. It will be small and not practical.
【0006】この発明は、これ等の問題を解決するのに
有効な中継接続用のテープ電線を提供しようとするもの
である。The present invention is intended to provide a tape wire for relay connection, which is effective in solving these problems.
【0007】[0007]
【課題を解決するための手段】上記の課題を解決する本
発明の中継接続用テープ電線は、所定の長さにしたテー
プ電線の導体端部を露出させ、この露出導体の表面にレ
ーザ反射率が75%以下の金属のメッキを施したもので
ある。In the tape wire for relay connection of the present invention which solves the above-mentioned problems, the conductor end portion of the tape wire having a predetermined length is exposed, and the laser reflectance on the surface of this exposed conductor. Is plated with a metal of 75% or less.
【0008】なお、レーザ反射率が75%以下のメッキ
用金属としてはNi、Sn、Znなどが挙げられる。こ
れ等の金属を用いたメッキの膜厚は0.5〜50μmの
範囲にあるのが望ましい。Examples of plating metals having a laser reflectance of 75% or less include Ni, Sn and Zn. The film thickness of the plating using these metals is preferably in the range of 0.5 to 50 μm.
【0009】テープ電線の導体は、被中継導体の配列ピ
ッチが等しければ、一端側と他端側の配列ピッチを同じ
にする。また、被中継導体の配列ピッチに差がある場合
にはそのピッチ差に合わせて一端側と他端側の配列ピッ
チを異ならせる。If the conductors of the tape electric wire have the same arrangement pitch of the relayed conductors, the arrangement pitches of the one end side and the other end side are the same. Further, when there is a difference in the arrangement pitch of the relayed conductors, the arrangement pitch on the one end side and the other end side are made different according to the pitch difference.
【0010】[0010]
【作用】テープ電線の銅導体は、そのままではレーザの
吸収性が悪くてレーザ溶接が難しいが、この発明では、
この導体の表面にレーザ反射率の低い金属をメッキして
あるので、レーザの吸収率が高まって安定したレーザ溶
接が行える。レーザ溶接はエネルギーを集中させて接合
面のみを溶かすので半田付けと違って電子部品に及ぼす
熱的影響を大巾に低減できる。また、このレーザ溶接で
直接の接合を行えばコネクタも不要であり、従来の問題
が全て無くなる。The copper conductor of the tape wire is poor in laser absorption as it is and difficult to laser weld. However, in the present invention,
Since the surface of this conductor is plated with a metal having a low laser reflectance, the laser absorptivity is increased and stable laser welding can be performed. Since laser welding concentrates energy and melts only the joint surface, thermal influence on electronic parts can be greatly reduced unlike soldering. Further, if the laser welding is used for direct joining, no connector is required, and all the problems of the prior art are eliminated.
【0011】レーザ溶接のための金属メッキの厚さは前
述の0.5〜50μmが最適である。0.5μm未満の
厚さではレーザ溶接性の向上効果がたいして現れない。
一方50μmを越えるとレーザ溶接性の向上効果が横ば
い状態になり、また、生産性が悪くなってコスト高にな
り、電線の屈曲特性も低下する。The thickness of the metal plating for laser welding is optimally 0.5 to 50 μm as described above. If the thickness is less than 0.5 μm, the effect of improving the laser weldability does not appear so much.
On the other hand, when the thickness exceeds 50 μm, the effect of improving the laser weldability is leveled off, the productivity is deteriorated, the cost is increased, and the bending property of the electric wire is deteriorated.
【0012】[0012]
【実施例】図1及び図2に、この発明のテープ電線の具
体例を示す。例示のテープ電線10、20は、電子部品
A、Bの中継接続に利用するもので、銅導体1を絶縁被
覆2で覆ってある。この銅導体1を図のように適当な長
さ露出させ、この部分の導体表面にレーザ反射率が75
%以下の金属メッキ3を施すと、この発明のテープ電線
に仕上がる。1 and 2 show specific examples of the tape electric wire of the present invention. The illustrated tape electric wires 10 and 20 are used for relay connection of electronic components A and B, and a copper conductor 1 is covered with an insulating coating 2. This copper conductor 1 is exposed for an appropriate length as shown in the figure, and the laser reflectance is 75 on the conductor surface of this portion.
% Or less of the metal plating 3, the tape electric wire of the present invention is finished.
【0013】なお、図1のテープ電線10は、中継接続
する電子部品A、BのリードLが同一ピッチであるの
で、銅導体1をリードの配列ピッチと同一ピッチで平行
に配列している。一方、図2のテープ電線20は、電子
部品A、BのリードLの配列ピッチが異なるので、銅導
体1の配列ピッチを途中で変化させて各リードの配列ピ
ッチに合致させている。In the tape electric wire 10 of FIG. 1, the leads L of the electronic components A and B to be relayed and connected have the same pitch, so that the copper conductors 1 are arranged in parallel at the same pitch as the arrangement pitch of the leads. On the other hand, in the tape electric wire 20 of FIG. 2, since the arrangement pitch of the leads L of the electronic components A and B is different, the arrangement pitch of the copper conductors 1 is changed on the way to match the arrangement pitch of each lead.
【0014】以下に、より詳細な実施例について述べ
る。A more detailed embodiment will be described below.
【0015】−実験例1− 図1に示すテープ電線10を試作した。この試作品は銅
導体1の厚さを70μm、幅を0.8mmとし、露出した
両端の表面にレーザ吸収率の異なる金属のメッキを施し
た。使用したメッキ用金属は表1に示す5種類であり、
いずれも、その膜厚は10μmにした。これ等の試料に
対し、電子部品のリード(Fe−42wt%Ni、0.
2mm厚さ)をレーザ溶接して接合し、接合強度として剪
断強度を測定した。結果を表1に併せて示す。-Experimental Example 1- The tape electric wire 10 shown in FIG. In this prototype, the copper conductor 1 had a thickness of 70 μm and a width of 0.8 mm, and the exposed surfaces of both ends were plated with metals having different laser absorptivities. There are five types of plating metals used in Table 1,
In both cases, the film thickness was 10 μm. For these samples, electronic component leads (Fe-42 wt% Ni, 0.
2 mm thick) was laser-welded and joined, and the shear strength was measured as the joining strength. The results are also shown in Table 1.
【0016】[0016]
【表1】 [Table 1]
【0017】この実験結果から、レーザ反射率が下地の
銅よりも高い金属メッキでは逆効果になるが、レーザ反
射率が75%以下の金属メッキがあると良好な接合強度
が得られることがよく判る。From the results of this experiment, metal plating having a laser reflectance higher than that of the underlying copper has the opposite effect, but metal plating having a laser reflectance of 75% or less often gives good bonding strength. I understand.
【0018】−実験例2− 図1に示すテープ電線10を試作した。ここでは表2に
示すようにメッキ3をSnメッキとし、このメッキの厚
さと銅導体1の厚さを変えたものを11種類用意した。
銅導体1の幅はいずれも0.8mmである。そして、この
11種類の試料の銅導体1を電子部品のリード(Fe−
42wt%Ni、0.2mm厚さ)上に載せ、レーザ溶接
にて接合した。-Experimental Example 2- A tape electric wire 10 shown in FIG. Here, as shown in Table 2, Sn plating was used as the plating 3, and 11 kinds of plating having different thicknesses of the copper conductor 1 were prepared.
The width of each copper conductor 1 is 0.8 mm. Then, the copper conductors 1 of the 11 kinds of samples are connected to leads (Fe-
42 wt% Ni, 0.2 mm thick) and joined by laser welding.
【0019】その接合部の接合強度として剪断強度を測
定し、これを表2に併せて示した。Shear strength was measured as the joint strength of the joint portion, and this is also shown in Table 2.
【0020】[0020]
【表2】 [Table 2]
【0021】この表2から判るように、、銅導体1の厚
さは大きい方が高い接合強度が得られるが、80μmよ
り厚くなってもその効果は向上しない。As can be seen from Table 2, the greater the thickness of the copper conductor 1 is, the higher the bonding strength can be obtained, but the effect is not improved even when the thickness is more than 80 μm.
【0022】また、Snメッキの厚さも、0.5μm未
満では充分な接合強度が得られていないし、逆に50μ
m以上にしても効果の伸びが見られない。If the Sn plating thickness is less than 0.5 μm, sufficient bonding strength is not obtained, and conversely 50 μm.
Even if it is more than m, the effect does not grow.
【0023】[0023]
【発明の効果】以上説明したように、この発明のテープ
電線は、中継用の銅導体に電子部品のリードをレーザ溶
接して接合することができるので、コネクタによる中継
が不要になり、また、電子部品に熱的悪影響を及ぼすこ
ともなくなり、中継接続の簡易化、コスト低減、信頼性
向上に寄与できる。As described above, in the tape electric wire of the present invention, since the lead of the electronic component can be laser-welded and joined to the copper conductor for relay, the relay by the connector is unnecessary, and It also prevents the electronic components from being adversely affected by heat and contributes to simplification of relay connection, cost reduction, and reliability improvement.
【図1】実施例のテープ電線を中継対象の電子部品を含
めて示す平面図FIG. 1 is a plan view showing a tape electric wire of an embodiment including electronic parts to be relayed.
【図2】他の実施例のテープ電線を中継対象の電子部品
を含めて示す平面図FIG. 2 is a plan view showing a tape electric wire of another embodiment including electronic parts to be relayed.
1 銅導体 2 絶縁被覆 3 レーザ反射率が75%以下の金属のメッキ 10、20 テープ電線 1 Copper conductor 2 Insulation coating 3 Metal plating with laser reflectance of 75% or less 10, 20 Tape wire
Claims (3)
を露出させ、この露出導体の表面にレーザ反射率が75
%以下の金属のメッキを施して成る中継接続用テープ電
線。1. A conductor end portion of a tape electric wire having a predetermined length is exposed, and the surface of the exposed conductor has a laser reflectance of 75.
Tape wire for relay connection, which is formed by plating metal of less than 100%.
0μm以下にした請求項1記載の中継接続用テープ電
線。2. The thickness of the metal plating is 0.5 μm or more and 5
The tape wire for relay connection according to claim 1, which has a thickness of 0 μm or less.
の配列ピッチを被中継導体の配列ピッチ差に合わせて異
ならせてある請求項1又は2記載の中継接続用テープ電
線。3. The tape wire for relay connection according to claim 1, wherein the array pitch on one end side of the conductor and the array pitch on the other end side are made different according to the array pitch difference of the relayed conductors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24155493A JPH0794035A (en) | 1993-09-28 | 1993-09-28 | Tape wire for relay connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24155493A JPH0794035A (en) | 1993-09-28 | 1993-09-28 | Tape wire for relay connection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0794035A true JPH0794035A (en) | 1995-04-07 |
Family
ID=17076086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24155493A Pending JPH0794035A (en) | 1993-09-28 | 1993-09-28 | Tape wire for relay connection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0794035A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000195598A (en) * | 1998-12-25 | 2000-07-14 | Fujitsu Ten Ltd | Connection structure of connector and substrate |
| WO2000049841A1 (en) * | 1999-02-18 | 2000-08-24 | Siemens Aktiengesellschaft | Electrical connection method and connection site |
-
1993
- 1993-09-28 JP JP24155493A patent/JPH0794035A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000195598A (en) * | 1998-12-25 | 2000-07-14 | Fujitsu Ten Ltd | Connection structure of connector and substrate |
| WO2000049841A1 (en) * | 1999-02-18 | 2000-08-24 | Siemens Aktiengesellschaft | Electrical connection method and connection site |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1327748C (en) | Solder structure and soldering method of electronic assembly | |
| CN104221099B (en) | Resistor and its mounting structure | |
| JP4312409B2 (en) | Common mode filter | |
| JPS6268691A (en) | Welding method by laser beam | |
| CN101536122A (en) | Terminal and coil device using the same | |
| JPH11251176A (en) | Ceramic electronic component | |
| US4592137A (en) | Method of circuit connection across both surfaces of substrate | |
| CN100553035C (en) | Electronic devices with bus bar assemblies and electronic components mounted thereon by soldering | |
| JP6074890B2 (en) | Circuit board with conducting wire and manufacturing method thereof | |
| JPH11189835A (en) | Tin-nickel alloy and parts surface-treated with this alloy | |
| US3451122A (en) | Methods of making soldered connections | |
| DE10103084B4 (en) | Semiconductor module and method for its production | |
| JPH11330340A (en) | Semiconductor device and its mounting structure | |
| JPH06296073A (en) | Flexible printed circuit board | |
| CN105491816B (en) | Magnetic coil welding method | |
| JPH0794035A (en) | Tape wire for relay connection | |
| JP2012523685A (en) | Conductor grid for electronic housing and manufacturing method | |
| JPH0897530A (en) | Electronic part mounting board and its manufacture | |
| JPS59993A (en) | Method of bonding metal plate electrode | |
| JPH0326615Y2 (en) | ||
| JPS62147608A (en) | wire harness | |
| JP2007335767A (en) | Component connection terminals for semiconductor power modules | |
| JPH0550141B2 (en) | ||
| JPH1092998A (en) | Lead frame for electronic device manufacturing | |
| JP4776204B2 (en) | Coil parts manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD07 | Notification of extinguishment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7427 Effective date: 20060424 |