JPH0794064A - Flat thermal fuse - Google Patents
Flat thermal fuseInfo
- Publication number
- JPH0794064A JPH0794064A JP25930593A JP25930593A JPH0794064A JP H0794064 A JPH0794064 A JP H0794064A JP 25930593 A JP25930593 A JP 25930593A JP 25930593 A JP25930593 A JP 25930593A JP H0794064 A JPH0794064 A JP H0794064A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- low melting
- metal wire
- flux
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 70
- 239000002184 metal Substances 0.000 claims abstract description 70
- 238000002844 melting Methods 0.000 claims abstract description 45
- 230000008018 melting Effects 0.000 claims abstract description 44
- 230000004907 flux Effects 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 11
- 239000010408 film Substances 0.000 description 8
- 239000011247 coating layer Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000567 combustion gas Substances 0.000 description 4
- 238000002485 combustion reaction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 240000006240 Linum usitatissimum Species 0.000 description 1
- 235000004431 Linum usitatissimum Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は合金型の面状温度ヒュ−
ズに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an alloy type sheet temperature heater.
It's about
【0002】[0002]
【従来の技術】合金型の温度ヒュ−ズとして、金属板の
片面に絶縁膜を設け、その絶縁膜上に低融点可溶金属線
を配設し、その低融点可溶金属線を絶縁被覆体で保護
し、低融点可溶金属線の両端にリ−ド線を取付け、金属
板が何れの位置でスポット的に加熱されても、その熱を
低融点可溶金属線に伝え低融点可溶金属線を溶断させて
加熱源の運転を停止させる面状温度ヒュ−ズが知られて
いる。2. Description of the Related Art As an alloy type temperature fuse, an insulating film is provided on one side of a metal plate, a low melting point soluble metal wire is disposed on the insulating film, and the low melting point soluble metal wire is insulated and coated. Protect with a body and attach lead wires to both ends of the low melting point fusible metal wire to transfer the heat to the low melting point fusible metal wire no matter where the metal plate is spot heated. 2. Description of the Related Art A planar temperature fuse is known which melts a molten metal wire and stops the operation of a heating source.
【0003】例えば、瞬間湯沸器においては、急速な加
熱と頻繁な加熱・冷却の繰返しにより、燃焼室胴板部の
熱疲労が早期に発生し、更には、燃焼ガス中の腐食性成
分による胴板部の腐食も重なって、胴板部に孔が開き、
胴板部内の燃焼ガスが外部に噴出する危険性があり、か
かる危険性を排除するために、上記燃焼室胴板部に対面
して遮熱板を配設し、この遮熱板に面状温度ヒュ−ズを
取付け、上記噴出燃焼ガスの壁面への接触を遮熱板で防
止すると共に遮熱板への噴出燃焼ガスの接触によって面
状温度ヒュ−ズを作動させ、マイコン制御によりガス供
給電磁弁を閉鎖してガスの燃焼を停止することが知られ
ている。For example, in an instantaneous water heater, thermal fatigue of the combustion chamber body plate occurs early due to rapid heating and frequent heating / cooling, and moreover, due to corrosive components in the combustion gas. Corrosion of the body plate also overlapped, holes opened in the body plate,
There is a risk that the combustion gas in the body plate will be ejected to the outside, and in order to eliminate this risk, a heat shield plate is arranged facing the combustion chamber body plate part, and the heat shield plate has a planar shape. A temperature fuse is attached to prevent the jetted combustion gas from contacting the wall surface with a heat shield plate, and the jetted combustion gas comes into contact with the heat shield plate to activate the planar temperature fuse and supply gas by microcomputer control. It is known to close the solenoid valve to stop the combustion of gas.
【0004】従来、かかる面状温度ヒュ−ズとして、図
4の(イ)並びに図4の(ロ)〔図4の(イ)のロ−ロ
断面図〕に示すように、片面に良熱伝導性の絶縁膜1
1'を設けた金属板1'の片面に蛇行溝13'をプレス成
型し、この溝13'内に低融点可溶金属線5'を収容し、
金属板片面の全体に絶縁被覆層6'を設けたものが公知
である(実開平5−27558号公報)。Conventionally, as such a surface temperature fuse, as shown in (a) of FIG. 4 and (b) of FIG. 4 [a cross-sectional view of FIG. Conductive insulation film 1
A meandering groove 13 'is press-molded on one surface of a metal plate 1'provided with 1', and a low melting point fusible metal wire 5'is housed in this groove 13 ',
It is known that an insulating coating layer 6'is provided on the entire one surface of a metal plate (Japanese Utility Model Laid-Open No. 27558/1993).
【0005】また、図5に示すように、片面に良熱伝導
性の絶縁膜11'を設けた金属板1'の片面両端部に電極
群2',…を固着し、この両電極群にまたがって低融点
可溶金属線5',…を橋設し、低融点可溶金属線5'にフ
ラックス4'を塗布し、このフラックス塗布低融点可溶
金属線並びに電極2',…を部分的な絶縁被覆層6'で覆
ったものが公知である(特開平5−12972号公
報)。Further, as shown in FIG. 5, electrode groups 2 ', ... Are fixed to both ends of one side of a metal plate 1'provided with an insulating film 11' having good thermal conductivity on one side. The low melting point fusible metal wire 5 ′, ... Is bridged, the flux 4 ′ is applied to the low melting point fusible metal wire 5 ′, and the flux coating low melting point fusible metal wire and the electrodes 2 ′ ,. What is covered with a conventional insulating coating layer 6'is known (Japanese Patent Laid-Open No. 5-12972).
【0006】[0006]
【発明が解決しようとする課題】上記の面状温度ヒュ−
ズ中、図4に示す面状温度ヒュ−ズにおいては、低融点
可溶金属線5'が溝13'に納められているので、絶縁被
覆層6'を薄くしても、他物の衝突等による低融点可溶
金属線5'の破断を防止でき、安全である。しかし、溝
13'と低融点可溶金属線5'との間に隙間を残し、低融
点可溶金属線5'の溶融時、その溶融金属をその隙間を
伝って流動させることにより低融点可溶金属線5'を溶
断させているので、空隙中酸素による低融点可溶金属線
5'の酸化が避けられず、この酸化皮膜の不溶性のため
に低融点可溶金属線5'の溶断が難くなり、溶断作動特
性の低下が問題となる。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
In the sheet temperature fuse shown in FIG. 4, since the low melting point fusible metal wire 5'is housed in the groove 13 ', even if the insulating coating layer 6'is thinned, collision with another object will occur. It is safe because it can prevent the low melting point fusible metal wire 5'from being broken. However, by leaving a gap between the groove 13 ′ and the low melting point fusible metal wire 5 ′, when the low melting point fusible metal wire 5 ′ is melted, the molten metal is flowed through the gap to allow the low melting point to be formed. Since the molten metal wire 5'is fused, the low melting point soluble metal wire 5'cannot be oxidized by the oxygen in the void, and the low melting point soluble metal wire 5'cannot be fused due to the insolubility of the oxide film. It becomes difficult, and deterioration of the fusing action characteristic becomes a problem.
【0007】他方、図5に示す面状温度ヒュ−ズにおい
ては、低融点可溶金属線5'にフラックス4'が塗布され
ているので、上記酸化を防止でき、また、低融点可溶金
属線5'が溶融すると溶融フラックスとの接触のために
界面エネルギ−が大となって球状化が促され、かつその
球状化の発生に伴うくびれ箇所に溶融フラックスが食い
込んで分断が速められるので、良好な溶断特性を保障で
きる。また、絶縁被覆層6'が低融点可溶金属線5'並び
に電極2'上の部分的なものとされているので、金属板
1'の他面(絶縁被覆層側面)の絶縁被覆層6'が存在し
ない部分でも充分に感熱が可能であり、感熱面積が広
い。しかしながら、フラックス4'を塗布する際、フラ
ックス4'が流動して広がり易く、絶縁被覆層6'と金属
板1'との界面にフラックス層が介在し易く、かかる介
在があると、絶縁被覆層6'が剥離され易く、特に面状
温度ヒュ−ズの常時使用温度がフラックスの融点以上の
場合に問題が大きい。On the other hand, in the sheet temperature fuse shown in FIG. 5, since the flux 4'is applied to the low melting point soluble metal wire 5 ', the above oxidation can be prevented and the low melting point soluble metal can be prevented. When the wire 5'is melted, the interface energy is increased due to contact with the molten flux and spheroidization is promoted, and the molten flux digs into the constricted portion due to the occurrence of the spheroidization to accelerate the division. Good fusing characteristics can be guaranteed. Further, since the insulating coating layer 6'is partially formed on the low melting point soluble metal wire 5'and the electrode 2 ', the insulating coating layer 6 on the other surface (side surface of the insulating coating layer) of the metal plate 1'. It is possible to fully sense heat even in the area where'is not present, and the heat sensitive area is wide. However, when the flux 4 ′ is applied, the flux 4 ′ easily flows and spreads, and the flux layer easily intervenes at the interface between the insulating coating layer 6 ′ and the metal plate 1 ′. 6'is easily peeled off, and there is a big problem especially when the continuous temperature temperature of the flat temperature fuse is higher than the melting point of the flux.
【0008】本発明の目的は、低融点可溶金属線へのフ
ラックスの塗布のために優れた作動性を備え、広い感熱
面積を有し、他物との接触に対し低融点可溶金属線を安
定に保持し得、絶縁被覆の剥離を防止できる面状温度ヒ
ュ−ズを提供することにある。An object of the present invention is to provide a low melting point soluble metal wire with excellent operability for applying a flux to the low melting point soluble metal wire, to have a wide heat sensitive area, and to have a low melting point soluble metal wire against contact with other objects. The present invention is to provide a sheet-like temperature fuse capable of stably holding the temperature and preventing peeling of the insulating coating.
【0009】[0009]
【課題を解決するための手段】本発明の面状温度ヒュ−
ズは、少なくとも片面に良熱伝導性の絶縁膜を有する金
属板の片面に凹条が設けられ、該凹条に低融点可溶金属
線が納められると共にフラックスが付着され、同凹条に
樹脂がモ−ルドされて低融点可溶金属線並びにフラック
スが樹脂で封止されていることを特徴とする構成であ
る。DISCLOSURE OF THE INVENTION The planar temperature fuse of the present invention
The groove is provided on one side of a metal plate having an insulating film with good thermal conductivity on at least one side, and the low melting point fusible metal wire is housed in the groove and flux is attached to the groove, and a resin is applied to the groove. Is molded so that the low melting point soluble metal wire and the flux are sealed with resin.
【0010】[0010]
【作用】凹条内に低融点可溶金属線が納められ、同凹条
内にフラックスが塗布されているから、フラックスが流
動して広がるのを排除でき、樹脂モ−ルド体と金属板と
の間でのフラックスの介在を回避でき、樹脂モ−ルド体
を強固に固着できる。また、低融点可溶金属線が樹脂モ
−ルドで封止されており、酸化されることがなく、更
に、フラックスが塗布されているので、優れた作動性を
有し、更にまた、樹脂モ−ルドによる絶縁被覆が凹条部
分だけにとどめられており、非絶縁被覆部分でも感熱さ
せ得、広い感熱面積を備えている。[Function] Since the low melting point soluble metal wire is housed in the groove and the flux is applied in the groove, it is possible to prevent the flux from flowing and spreading, and the resin mold body and the metal plate can be prevented. It is possible to avoid the interposition of flux between them and firmly fix the resin mold body. In addition, the low melting point metal wire is sealed with a resin mold, is not oxidized, and has a flux applied, so that it has excellent operability. -The insulating coating by the ridge is limited to only the concave portion, so that even the non-insulating coating portion can be heat-sensitive and has a wide heat-sensitive area.
【0011】[0011]
【実施例】以下、図面を参照しつつ本発明の実施例を説
明する。図1の(イ)は本発明の実施例を示す平面説明
図、図1の(ロ)は図1の(イ)におけるロ−ロ断面図
である。図1の(イ)並びに(ロ)において、1は少な
くとも片面に良熱伝導性の絶縁薄膜11を有する金属
板、例えば、少なくとも片面をアルマイト処理したアル
ミニウム板、2は該金属板1の片面にプレス成型された
蛇行凹条である。3は凹条2の底部に塗布されたフラッ
クス(低融点可溶金属線の融点よりも低融点)である。
4は凹条2内に収容された低融点可溶金属線であり、両
端にリ−ド線5,5が接続され、これらの各リ−ド線5
が蛇行凹条2の各端から引出されている。6は凹条2に
モ−ルドされた樹脂、例えば、エポキシ樹脂接着剤であ
り、凹条2の両側縁端部20,20に接着され、このモ
−ルド樹脂6により凹条2が封止されている。Embodiments of the present invention will be described below with reference to the drawings. 1A is a plan explanatory view showing an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line B-B in FIG. In (a) and (b) of FIG. 1, 1 is a metal plate having an insulating thin film 11 having good thermal conductivity on at least one side, for example, an aluminum plate having at least one side anodized, and 2 is on one side of the metal plate 1. It is a press-molded meandering groove. 3 is a flux (lower melting point than the melting point of the low melting point fusible metal wire) applied to the bottom of the recess 2.
Reference numeral 4 denotes a low-melting point fusible metal wire housed in the recessed ridge 2, and lead wires 5 and 5 are connected to both ends thereof.
Are drawn out from each end of the meandering groove 2. Reference numeral 6 denotes a resin molded in the recessed line 2, for example, an epoxy resin adhesive, which is adhered to both side edge portions 20, 20 of the recessed line 2 and the recessed line 2 is sealed by the molded resin 6. Has been done.
【0012】上記フラックス3においては、通常の条件
のもとでは、凹条2から流出することがなく、従って、
凹条2の両側縁端部20,20のフラックス3による濡
れをよく排除でき、モ−ルド樹脂6と凹条2の縁端部2
0とを強固に接着できる。Under the normal conditions, the flux 3 does not flow out from the groove 2, and therefore,
Wetting of both side edge portions 20, 20 of the groove 2 by the flux 3 can be well eliminated, and the mold resin 6 and the edge portion 2 of the groove 2 can be eliminated.
0 can be firmly bonded.
【0013】上記面状温度ヒュ−ズにおいては、金属板
1が加熱され、低融点可溶金属線4が溶融されると、既
に溶融されているフラックス3との接触界面において溶
融金属の界面エネルギ−が大となり、球状化が促され、
その球状化に伴い発生するくびれ部に溶融フラックスが
食い込んで溶融金属の分断が速められ、作動が迅速化さ
れる。In the above-mentioned sheet temperature fuse, when the metal plate 1 is heated and the low melting point metal wire 4 is melted, the interfacial energy of the molten metal at the contact interface with the flux 3 already melted. -Becomes large, spheroidization is promoted,
The molten flux intrudes into the constricted portion generated due to the spheroidization, accelerating the fragmentation of the molten metal and accelerating the operation.
【0014】図2の(イ)乃至図2の(ニ)は本発明の
別実施例を製作過程により示す平面図であり、図2の
(ホ)は図2の(ハ)におけるホ−ホ断面図を示し、図
2の(ヘ)並びに図2の(ト)はそれぞれ図2の(ニ)
におけるヘ−ヘ断面図並びにト−ト断面図を示してい
る。図2の(イ)乃至図2の(ト)において、1は金属
板であり、図3の(イ)(平面図)並びに図3の(ロ)
〔図3の(イ)におけるロ−ロ断面図〕に示すように、
少なくとも片面に良熱伝導性の絶縁薄膜11を有する金
属板1の片面側に、一対の凸条12,12間に挾まれて
なる凹条13を複数本並行にプレス成型されていると共
に隣同志の凹条13,13間の相対向する凸条間に凹部
130がプレス成型されている。図3の(イ)において、1
4,14は金属板片面の両端平坦部を、15,…は結着
用孔をそれぞれ示している。この金属板1には、アルマ
イト処理により酸化皮膜を形成したアルミニウム板をプ
レス成型したものを使用できる。2 (a) to 2 (d) are plan views showing another embodiment of the present invention in the manufacturing process, and FIG. 2 (e) is the ho-ho in FIG. 2 (c). FIG. 2 (f) and FIG. 2 (g) are sectional views of FIG. 2 (d).
2 shows a cross-sectional view and a cross-sectional view along the line. In FIGS. 2A to 2G, 1 is a metal plate, and FIG. 3A is a plan view and FIG. 3B is a plan view.
As shown in [a sectional view taken along line (a) of FIG. 3],
On one surface side of the metal plate 1 having the insulating thin film 11 having good thermal conductivity on at least one surface, a plurality of concave stripes 13 sandwiched between a pair of convex stripes 12 and 12 are press-molded in parallel and adjacent to each other. Between the concave ridges 13, 13 facing each other
130 is press molded. In (a) of FIG. 3, 1
Reference numerals 4, 14 denote flat portions on both sides of one side of the metal plate, and 15, ... Bind holes. As the metal plate 1, a press-formed aluminum plate having an oxide film formed by alumite treatment can be used.
【0015】図2の(イ)において、21(22)は第
1絶縁プレ−ト部材であり、絶縁プレ−トの片面に各低
融点可溶金属線を直列に接続するためのブリッジ用導体
211(221)が固設されており、片側の第1絶縁プレ−ト部
材22にはリ−ド用導体222も固設されている。15,
…は結着用孔である。In FIG. 2A, reference numeral 21 (22) is a first insulating plate member, which is a bridge conductor for connecting low melting point fusible metal wires in series on one surface of the insulating plate.
211 (221) is fixed, and the lead conductor 222 is also fixed to the first insulating plate member 22 on one side. 15,
... are binding holes.
【0016】図2の(ロ)乃至図2の(ニ)において、
31(32)は第2絶縁プレ−ト部材であり、切欠部31
1,321,322を有し、第1絶縁プレ−ト部材21(22)
上に重ねられている。15,…は結着用孔である。2 (b) to 2 (d),
31 (32) is a second insulating plate member, and the cutout 31
The first insulation plate member 21 (22) having 1,321,322
Overlaid on top. 15, ... are binding holes.
【0017】図2の(イ)に示す製作段階においては、
金属板1の片面が上側に向けられ、両端平坦部に第1絶
縁プレ−ト部材21(22)が導体(ブリッジ用導体21
1,221並びにリ−ド用導体222)固設面を上側にして配設
されている。At the manufacturing stage shown in FIG.
One side of the metal plate 1 is directed upward, and the first insulating plate member 21 (22) is provided with a conductor (bridge conductor 21
1, 221 and the lead conductor 222) are arranged with the fixed surface facing upward.
【0018】図2の(ロ)に示す製作段階においては、
図2の(イ)における各第1絶縁プレ−ト部材21(2
2)上に各第2絶縁プレ−ト部材31(32)が積層さ
れ、この第1絶縁プレ−ト部材と第2絶縁プレ−ト部材
との積層体が結着孔15を通しプラスチツクリベット
(図示されていない)により金属板1に固定されてい
る。この段階において、第2絶縁プレ−ト部材31(3
2)の各切欠部311,321,322から第1絶縁プレ−ト部材
21(22)の各ブリッジ用導体211,221の各端211a,22
1aまたはリ−ド用導体222の各端222aが露出している。At the manufacturing stage shown in FIG. 2B,
Each first insulating plate member 21 (2 in FIG. 2A)
2) Each second insulating plate member 31 (32) is laminated thereon, and the laminated body of the first insulating plate member and the second insulating plate member passes through the binding hole 15 and the plastic rivet ( It is fixed to the metal plate 1 by (not shown). At this stage, the second insulating plate member 31 (3
2) From the notches 311, 321, 322 to the ends 211a, 22 of the bridge conductors 211, 221 of the first insulating plate member 21 (22).
1a or each end 222a of the lead conductor 222 is exposed.
【0019】図2の(ハ)に示す製作段階においては、
金属板1の凹条13底部に、図2の(ホ)に示されてい
るようにフラックス4が塗付され、このフラックス塗布
凹条に低融点可溶金属線5が納められ、各低融点可溶金
属線5の両端が第2絶縁プレ−ト部材21(22)の各
ブリッジ用導体端211a,221aにハンダ付け又は溶接によ
り接続され、また、各リ−ド用導体端222aに各リ−ド線
7,7がハンダ付け又は溶接により接続されている。而
して、これらの接続により低融点可溶金属線6,…並び
にリ−ド線7,7が電気的に直列に接続されている。At the manufacturing stage shown in FIG. 2C,
As shown in FIG. 2E, the flux 4 is applied to the bottom of the recess 13 of the metal plate 1, and the low melting point fusible metal wire 5 is housed in the flux applying recess and each low melting point. Both ends of the fusible metal wire 5 are connected to the bridge conductor ends 211a and 221a of the second insulating plate member 21 (22) by soldering or welding, and to the lead conductor ends 222a. -The wires 7, 7 are connected by soldering or welding. The low melting point metal wires 6, ... And the lead wires 7,7 are electrically connected in series by these connections.
【0020】図2の(ニ)に示す製作段階においては、
図2の(ホ)に示す半製品に対して、図2の(ヘ)並び
に図2の(ト)にも示されているように、凹条13に樹
脂6、例えば、エポキシ樹脂接着剤がモ−ルドされて低
融点可溶金属線並びにフラックスが封止されていると共
に第1絶縁プレ−ト部材21(22)の各ブリッジ用導
体端211a,221a及びリ−ド用導体端222a,222aが同上樹脂
6のモ−ルドにより絶縁されている。At the manufacturing stage shown in FIG.
As shown in FIG. 2F and FIG. 2G, the semi-finished product shown in FIG. 2E is provided with a resin 6, for example, an epoxy resin adhesive, in the groove 13. It is molded so that the low melting point fusible metal wire and the flux are sealed and the bridge conductor ends 211a and 221a and the lead conductor ends 222a and 222a of the first insulating plate member 21 (22). Are insulated by a resin 6 mold.
【0021】[0021]
【発明の効果】本発明の面状温度ヒュ−ズは、上述した
通りの構成であり、金属板の凹条内に低融点可溶金属線
が納められ、同凹条内にフラックスが塗布されているか
ら、フラックスが流動して広がるのを排除でき、樹脂モ
−ルド体をフラックスの付着してない部分に強固に固着
できる。また、低融点可溶金属線が樹脂モ−ルドで封止
されており、空隙に接することがないから、酸化される
ことがなく、更に、フラックスが塗布されているので、
優れた作動性を呈し、更にまた、樹脂モ−ルドによる絶
縁被覆が凹条部分だけにとどめられており、非絶縁被覆
部分でも感熱させ得、広い感熱面積を備えている。The sheet temperature fuse of the present invention is constructed as described above, and the low melting point soluble metal wire is housed in the recess of the metal plate, and the flux is applied in the recess. Therefore, the flux can be prevented from flowing and spreading, and the resin mold body can be firmly fixed to the portion where the flux is not attached. In addition, since the low melting point metal wire is sealed with a resin mold and does not come into contact with the voids, it is not oxidized and further, since flux is applied,
It exhibits excellent operability, and furthermore, the insulating coating by the resin mold is limited to only the recessed portion, so that the non-insulating coating portion can be made to be heat-sensitive and has a wide heat-sensitive area.
【0022】従って、本発明によれば、優れた作動性を
備え、広い感熱面積を有し、他物との接触に対し低融点
可溶金属線を安定に保持し得、かつ絶縁被覆の剥離を防
止できる面状温度ヒュ−ズを提供できる。Therefore, according to the present invention, it has excellent operability, has a wide heat-sensitive area, can stably hold the low-melting-point soluble metal wire against contact with another object, and peels the insulating coating. It is possible to provide a planar temperature fuse capable of preventing the above.
【図1】図1の(イ)は本発明の実施例を示す説明図、
図1の(ロ)は図1の(イ)におけるロ−ロ断面図であ
る。FIG. 1A is an explanatory view showing an embodiment of the present invention,
1B is a cross-sectional view taken along the line of FIG.
【図2】図2の(イ)乃至(ニ)は本発明の実施例を製
作過程で示す説明図、図2の(ホ)は図2の(ハ)にお
けるホ−ホ断面図、図2の(ヘ)並びに図2の(ト)は
図2の(ニ)におけるヘ−ヘ断面図並びにト−ト断面図
である。2A to 2D are explanatory views showing an embodiment of the present invention in a manufacturing process, FIG. 2E is a sectional view taken along the line HO in FIG. 2C, and FIG. (F) and (g) of FIG. 2 are a cross-sectional view and a cross-sectional view of (d) of FIG.
【図3】図3の(イ)は図2における金属板を示す平面
図、図3の(ロ)は図3の(イ)のロ−ロ断面図であ
る。3 (a) is a plan view showing the metal plate in FIG. 2, and FIG. 3 (b) is a cross-sectional view taken along line (b) of FIG.
【図4】図4の(イ)は従来例を示す説明図、図4の
(ロ)は図4の(イ)におけるロ−ロ断面図である。FIG. 4A is an explanatory view showing a conventional example, and FIG. 4B is a cross-sectional view taken along line B-B of FIG.
【図5】上記とは別の従来例を示す説明図である。FIG. 5 is an explanatory diagram showing another conventional example different from the above.
1 金属板 11 絶縁膜 13 凹条 4 フラツクス 5 低融点可溶金属線 6 樹脂 1 Metal Plate 11 Insulating Film 13 Recessed Strip 4 Flax 5 Low Melting Point Metal Wire 6 Resin
Claims (1)
片面に凹条が設けられ、該凹条に低融点可溶金属線が納
められると共にフラックスが付着され、同凹条に樹脂が
モ−ルドされて低融点可溶金属線並びにフラックスが樹
脂で封止されていることを特徴とする面状温度ヒュ−
ズ。1. A metal sheet having an insulating film on at least one side thereof is provided with a concave line on one side thereof. The low melting point metal wire is housed in the concave line and flux is adhered to the concave line, and a resin is applied to the concave line. A sheet-like temperature fuse characterized in that the low melting point fusible metal wire and the flux are sealed with resin.
Z.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25930593A JPH0794064A (en) | 1993-09-21 | 1993-09-21 | Flat thermal fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25930593A JPH0794064A (en) | 1993-09-21 | 1993-09-21 | Flat thermal fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0794064A true JPH0794064A (en) | 1995-04-07 |
Family
ID=17332235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25930593A Pending JPH0794064A (en) | 1993-09-21 | 1993-09-21 | Flat thermal fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0794064A (en) |
-
1993
- 1993-09-21 JP JP25930593A patent/JPH0794064A/en active Pending
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