JPH0794567B2 - Method for producing molded article having fluorine-containing thin surface layer - Google Patents

Method for producing molded article having fluorine-containing thin surface layer

Info

Publication number
JPH0794567B2
JPH0794567B2 JP4294641A JP29464192A JPH0794567B2 JP H0794567 B2 JPH0794567 B2 JP H0794567B2 JP 4294641 A JP4294641 A JP 4294641A JP 29464192 A JP29464192 A JP 29464192A JP H0794567 B2 JPH0794567 B2 JP H0794567B2
Authority
JP
Japan
Prior art keywords
plasma
molded article
fluorine
producing
surface layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4294641A
Other languages
Japanese (ja)
Other versions
JPH0665408A (en
Inventor
益弘 小駒
隆夫 森脇
和夫 高橋
幸子 岡崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
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Filing date
Publication date
Priority to JP59256175A priority Critical patent/JPS61133239A/en
Application filed by Individual filed Critical Individual
Priority to JP4294641A priority patent/JPH0794567B2/en
Publication of JPH0665408A publication Critical patent/JPH0665408A/en
Publication of JPH0794567B2 publication Critical patent/JPH0794567B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12Chemical modification
    • C08J7/123Treatment by wave energy or particle radiation

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、潤滑性、撥水性、光透
過性、耐候性、帯電防止性等の特性を有し、このためこ
れらの特性が要求される種々の用途に用いられる、フッ
素含有表面薄層を有する成形品の製造方法に関する。
BACKGROUND OF THE INVENTION The present invention has properties such as lubricity, water repellency, light transmission, weather resistance, and antistatic properties, and is therefore used in various applications requiring these properties. The present invention relates to a method for producing a molded article having a thin surface layer containing fluorine.

【0002】[0002]

【従来の技術及びその課題】高分子物質からなる基材
に、該基材が保有しない特性を有する表面層を設ける試
みは従来より数多くなされており、現在その簡便さの故
に広く行なわれているのは、大気中でフッ素系添加剤を
含む重合体の溶液を、同一重合体からなる基材上に湿式
塗布、加熱乾燥して、基材上にフッ素系添加剤含有表面
層を形成させる方法であるが、この方法は下記のような
欠点がある。
2. Description of the Related Art Many attempts have been made in the past to provide a base material made of a polymer material with a surface layer having characteristics not possessed by the base material, and it is now widely used due to its simplicity. The method is a method of forming a fluorine-containing additive-containing surface layer on a substrate by wet-coating a solution of a polymer containing a fluorine-containing additive on a substrate made of the same polymer in the air and heating and drying. However, this method has the following drawbacks.

【0003】(イ)表面層の形成に際してフッ素系添加
剤含有重合体溶液を基材に塗布するウェットプロセスが
あるため、塗布された重合体溶液を加熱乾燥する必要が
あり、そのため融点や転移点の低い熱可塑性高分子シー
トやプラスチック成形品は寸法安定性が損われるので基
材として使用できない。 (ロ)最近真空蒸着法、スパッタリング法、イオンプレ
ーティング法などにより、平面、球面、凸凹面等の形状
の如何に拘らず極めて薄く、しかも均一な表面層を有す
る成形品が工業的に得られているが、上記のフッ素系添
加剤含有重合体溶液の基材上への湿式塗布方法では、薄
く均一な表面層が得られにくい。
(A) Since there is a wet process for coating a base material with a polymer solution containing a fluorine-based additive when forming the surface layer, it is necessary to heat and dry the coated polymer solution, and therefore the melting point and transition point are required. Thermoplastic polymer sheets and plastic molded products having a low viscosity cannot be used as a substrate because the dimensional stability is impaired. (B) Recently, by vacuum evaporation method, sputtering method, ion plating method, etc., a molded product having an extremely thin and uniform surface layer can be industrially obtained regardless of the shape of a flat surface, a spherical surface, an uneven surface, or the like. However, it is difficult to obtain a thin and uniform surface layer by the wet coating method of the above-mentioned fluorine-containing additive-containing polymer solution on the substrate.

【0004】(ハ)溶剤を使用するので爆発や中毒の危
険性がある。 (ニ)フツ素系添加剤含有表面層と基材との接着性が十
分でなく、使用中にフッ素含有表面層が基材から剥離し
やすい。 (ホ)フッ素系添加剤含有表面層が使用中に溶解流失し
てその機能が低下する。 ウェットプロセスによりフッ
素系添加剤含有表面層を基材上に設ける上記の従来技術
の欠点を解決するものとして低温プラズマ重合法が知ら
れており、これは0.01〜10トール(Torr)の
真空下でN2、Ar、He等のキャリアガスの放電プラ
ズマとモノマー有機ガスとを混合し、被処理基材表面に
これらの混合ガスを接触させることにより、該基材表面
にプラズマ重合膜を形成させるものである。この重合膜
の形成は、J.L.VossenおよびW.Kern編「Thin Film Proc
esses」Academic Press、New York(1978)第365
頁記載のCAP図(Competitive Ablation and Polymer
ization Scheme)に示される現象、すなわち重合(Poly
merization)と削除(Ablation)との競走反応によるも
のとしてとらえられている。
(C) Since a solvent is used, there is a risk of explosion and poisoning. (D) The adhesiveness between the fluorine-containing additive-containing surface layer and the substrate is not sufficient, and the fluorine-containing surface layer is likely to peel off from the substrate during use. (E) The surface layer containing the fluorine-based additive is dissolved and lost during use and its function is deteriorated. A low temperature plasma polymerization method is known as a method for solving the above-mentioned drawbacks of the prior art in which a surface layer containing a fluorine-containing additive is provided on a substrate by a wet process, which is a vacuum of 0.01 to 10 Torr. A discharge plasma of a carrier gas such as N 2 , Ar, He or the like is mixed with a monomer organic gas below, and a plasma polymerized film is formed on the surface of the substrate by contacting the mixed gas with the surface of the substrate to be treated. It is what makes me. The formation of this polymerized film is described by JL Vossen and W. Kern in “Thin Film Proc.
esses "Academic Press, New York (1978) No. 365
CAP diagram on page (Competitive Ablation and Polymer
Phenomenon shown in the
merization) and deletion (Ablation) are considered to be due to the race reaction.

【0005】しかしながら上記プラズマ重合法は、窒
素、ケイ素および不飽和結合を有する化合物の重合膜を
基材表面上に形成する場合には極めて有効な方法である
が、酸素やハロゲンを有する化合物、特にフッ素化合物
の重合膜を基材上に形成することが困難であるという欠
点があった。そこで上記プラズマ重合法の欠点を解消す
るために、例えば(i)反応系にH2ガスあるいはケイ素
元素を添加する、特に基材として水素を含有しないある
いは出現しないものに対しては反応系にH2ガスを添加
する、(ii)モノマー原料として、テトラフルオロエチレ
ン等の炭素−炭素二重結合を有する反応系フッ素化合物
を用いる、(iii)基材としてポリエチレン、ポリプロピ
レン等のH2が出現するポリマーを用いる等のプラズマ
放電法によりフッ素含有表面層を基材上に形成させるこ
とが行われており(E.Kay,IUPAC Synposium on plasma C
hemistry,Limoges,France(1977)およびT.Masuoka,H.Yas
uda,J.Polym,Sci.,20,2633〜2642(1982)参照)、この方
法はフッ素含有表面層を基材上に形成させるという点で
はその目的を達成するが、他方、用いられるH2ガスの
爆発の危険性、炭素−炭素二重結合を有するフッ素化合
物の爆発や中毒の危険性などの欠点があった。
However, the above-mentioned plasma polymerization method is an extremely effective method for forming a polymerized film of nitrogen, silicon and a compound having an unsaturated bond on the surface of a substrate. There is a drawback that it is difficult to form a polymerized film of a fluorine compound on a substrate. In order to solve the above-mentioned drawbacks of the plasma polymerization method, for example, (i) H 2 gas or silicon element is added to the reaction system. 2 gas is added, (ii) a reactive fluorine compound having a carbon-carbon double bond such as tetrafluoroethylene is used as a monomer raw material, (iii) a polymer in which H 2 appears such as polyethylene or polypropylene as a base material A fluorine-containing surface layer has been formed on a substrate by a plasma discharge method such as (E. Kay, IUPAC Synposium on plasma C
hemistry, Limoges, France (1977) and T. Masuoka, H. Yas
uda, J. Polym, Sci., 20, 2633-2642 (1982)), this method achieves its purpose in that it forms a fluorine-containing surface layer on a substrate, while the H 2 There are drawbacks such as the danger of gas explosion and the danger of explosion and poisoning of a fluorine compound having a carbon-carbon double bond.

【0006】一方、ポリエチレン、ポリプロピレンなど
の有機高分子化合物を、CF4、CHF3等フッ素炭化水
素やフッ化炭素から生成される含フッ素プラズマに接触
させることにより、有機高分子化合物の表面領域にフッ
素を導入し改質する方法が提案されている(特開昭55
−99932号)。この方法では、上記(iii)の問題の
ほかに、改質される材料の表面にエッチングに起因する
粗さが形成されるという難点がある。
On the other hand, when an organic polymer compound such as polyethylene or polypropylene is brought into contact with fluorine-containing plasma generated from fluorocarbons such as CF 4 and CHF 3 or fluorocarbon, the surface region of the organic polymer compound is exposed. A method for introducing and modifying fluorine has been proposed (JP-A-55).
-99932). In addition to the problem (iii), this method has a drawback that roughness due to etching is formed on the surface of the material to be modified.

【0007】[0007]

【発明の目的】本発明の目的は、上記した従来技術の欠
点を改良し、潤滑性、撥水性、光透過性、耐候性、帯電
防止性等の諸特性を有し、特に表面がエッチングにより
浸食されず平滑性を維持し、このためこれらの特性が要
求される種々の用途に用いられる、フッ素含有表面薄層
を有する成形品を極めて安全に製造できる製造方法を提
供することにある。
The object of the present invention is to improve the above-mentioned drawbacks of the prior art and to have various properties such as lubricity, water repellency, light transmission, weather resistance, antistatic property, etc. It is an object of the present invention to provide a manufacturing method capable of manufacturing a molded article having a fluorine-containing thin surface layer, which is not corroded and maintains smoothness, and which is used in various applications requiring these properties, in an extremely safe manner.

【0008】[0008]

【課題を解決するための手段】本発明者らは種々検討し
た結果、不燃性等の利点を有するものの非反応性である
と認識され、従来プラズマ処理により基材上に薄層を形
成しにくいと考えられていた、CF4、C26などの飽
和フッ化炭素化合物やSF6などのフッ化硫黄化合物が
驚くべきことにマイクロ波プラズマ放電により基材上に
潤滑性、撥水性、光透過性、耐候性、帯電防止性等を有
する強固なフッ素含有薄層を、全体としての基材の性質
を変えることなく形成することを見出しこの知見に基づ
き本発明を完成させた。
As a result of various studies, the inventors of the present invention have recognized that they have advantages such as noncombustibility but are non-reactive, and it is difficult to form a thin layer on a substrate by conventional plasma treatment. It was thought that saturated fluorocarbon compounds such as CF 4 and C 2 F 6 and sulfur fluoride compounds such as SF 6 were surprisingly considered to have a lubricity, water repellency and light The inventors have found that a strong fluorine-containing thin layer having permeability, weather resistance, antistatic property, etc. can be formed without changing the properties of the substrate as a whole, and the present invention has been completed based on this finding.

【0009】すなわち、本発明の要旨はプラズマ発生系
と、プラズマ発生系に取着され反応ガス供給路及び排気
路を有するプラズマ反応系とを備えたマイクロ波放電プ
ラズマ装置を用い、飽和フッ化炭素化合物またはフッ化
硫黄化合物の反応ガスをプラズマ反応系に導入しマイク
ロ波放電プラズマを発生させ、プラズマ反応系に配置さ
れる基材上にフッ素含有薄層を有する成形品を製造する
際、基材をプラズマ反応系であって、排気路側に配置し
て基材上にフッ素含有薄層を形成させる成形品の製造方
法にある。
That is, the gist of the present invention is a plasma generation system.
And the reaction gas supply path and exhaust attached to the plasma generation system
And a plasma reaction system having a channel.
Using a plasma device, a reaction gas of a saturated fluorocarbon compound or a sulfur fluoride compound is introduced into the plasma reaction system to generate microwave discharge plasma, which is then placed in the plasma reaction system.
When manufacturing a molded article having a fluorine-containing thin layer on a base material, the method for manufacturing a molded article, wherein the base material is a plasma reaction system and is arranged on the exhaust passage side to form the fluorine-containing thin layer on the base material. It is in.

【0010】本発明の成形品の製造において原料として
用いられるフッ素化合物としては、常温で気体あるいは
放電処理時の温度で気体化する飽和フッ化炭素化合物及
びフッ化硫黄化合物であればいずれも使用でき、その例
として低毒性や不燃性等を備えたCF4及びC26並び
に不燃性や非腐食性等を備えたSF6等が挙げられる。
これは単独又は併用でき、更に放電電圧の調整等の目的
として、不活性ガス例えばN2、Ar、He等のガスで
希釈して用いることもできる。
As the fluorine compound used as a raw material in the production of the molded article of the present invention, any of a saturated fluorocarbon compound and a sulfur fluoride compound which are gasified at room temperature or gasified at a temperature during discharge treatment can be used. Examples thereof include CF 4 and C 2 F 6 having low toxicity and nonflammability, and SF 6 having nonflammability and noncorrosion.
These may be used alone or in combination, and may be diluted with an inert gas such as N 2 , Ar, or He for the purpose of adjusting the discharge voltage.

【0011】また本発明の成形品の製造において用いら
れる基材としては、天然高分子、合成高分子、セラミッ
クス等が挙げられ、これらは単独でまたは混合体で用い
られる。上記天然高分子としては、綿、麻、絹、木材等
を挙げることができ、また合成高分子としては、ナイロ
ン、ポリエステル、ポリカーボネート、ポリアセター
ル、ポリスルホン、ポリエーテルスルホン、ポリエステ
ルエーテルケトン、ポリアクリレート、ポリイミド、ポ
リアラミド、ポリビニルアルコール、ポリウレタン、ポ
リメタクリレート、ポリセルロース、ポリエポキシド、
ポリ塩化ビニル等が挙げられ、さらにセラミックスとし
ては、ケイ酸塩ガラス、石英ガラス、ホウ酸塩ガラスお
よびリン酸塩ガラス等のガラス類、アルミナセメント、
ポルトランドセメントおよびマグネシアセメント等のセ
メント類、ジルコン磁器、アルミナ磁器およびチタン磁
器等の磁器類が挙げられ、その他として銅、アルミニウ
ム、鉄、ニッケルおよびインジウム等の無機物の単独、
酸化物、アモルファス又は合金等が挙げられる。これ
は、単独又は混合されたものでもよく、更に繊維状、板
状、シート状、ブロック状等のいかなる形状のものであ
っても差しつかえない。
The substrate used in the production of the molded article of the present invention includes natural polymers, synthetic polymers and ceramics, which may be used alone or in a mixture. Examples of the natural polymer include cotton, hemp, silk, and wood, and examples of the synthetic polymer include nylon, polyester, polycarbonate, polyacetal, polysulfone, polyether sulfone, polyester ether ketone, polyacrylate, and polyimide. , Polyaramid, polyvinyl alcohol, polyurethane, polymethacrylate, polycellulose, polyepoxide,
Examples thereof include polyvinyl chloride, and further ceramics include silicate glass, quartz glass, glasses such as borate glass and phosphate glass, alumina cement,
Cement such as Portland cement and magnesia cement, porcelain such as zircon porcelain, alumina porcelain and titanium porcelain and the like, and other inorganic substances such as copper, aluminum, iron, nickel and indium,
Examples thereof include oxides, amorphous materials and alloys. These may be used alone or as a mixture, and may have any shape such as fibrous shape, plate shape, sheet shape, block shape and the like.

【0012】[0012]

【0013】本発明に用いられるマイクロ波放電プラズ
マ装置は、図3に示すように、プラズマ発生系(マグネ
トロン)1、導波管8、プラズマ反応系2、原料、キャ
リアガス供給路3及び排気路4により基本的に構成さ
れ、反応系2の内部にはアルミナ管6、6’が配置され
るものであり、プラズマ処理される基材7をプラズマ発
生領域より下流の排気路4側に配置させてなる。好まし
くは基材7はアルミナ管6、6’の下流に配置される。
このように基材を配置することによりエッチャントは基
材に到達せず、寿命の長い中性ラジカルのみが基材7に
到達し得る。
Microwave discharge plasma used in the present invention
As shown in FIG. 3, the apparatus is basically constituted by a plasma generation system (magnetron) 1, a waveguide 8, a plasma reaction system 2, a raw material, a carrier gas supply path 3 and an exhaust path 4, and the reaction system 2 Alumina tubes 6 and 6'are arranged inside the substrate, and the substrate 7 to be plasma-treated is arranged on the exhaust passage 4 side downstream from the plasma generation region. Preferred
The base material 7 is arranged downstream of the alumina tubes 6, 6 '.
By arranging the base material in this way, the etchant does not reach the base material, and only neutral radicals having a long life can reach the base material 7.

【0014】そして、本発明で用いるマイクロ波プラズ
マ発生方法としては、導波管型方式によりマイクロ波プ
ラズマを発生し、これにより薄層を形成する反応を起こ
方法である。
As a microwave plasma generation method used in the present invention, a microwave plasma is generated by a waveguide type method.
This is a method of generating plasma and causing a reaction to form a thin layer .

【0015】形成される表面薄層の厚さは成形品の目的
とする用途等に応じて任意に変動されることができ、例
えば層厚0.001〜10μで十分に帯電防止性能等が
発揮される。フィルム、シート等の生産性が必要な場合
には0.001〜0.1μの厚さで連続生産が可能とな
る。
The thickness of the surface thin layer to be formed can be arbitrarily changed according to the intended use of the molded product. For example, a layer thickness of 0.001 to 10 .mu. To be done. When productivity of films, sheets and the like is required, continuous production is possible with a thickness of 0.001 to 0.1 μm.

【0016】[0016]

【実施例】以下実施例を挙げて本発明を更に説明する
が、本発明はこれらの実施例に限定されるものではな
い。 比較例1 (1)基材として、市販ポリエチレンテレフタレートフ
ィルム(以下PETフィルムと略称する)を、原料ガス
としてCF4を、プラズマ放電装置として図2に示した
高周波放電によるプラズマ放電装置を用いて、PETフ
ィルムをプラズマ放電処理した。
The present invention will be further described with reference to the following examples, but the present invention is not limited to these examples. Comparative Example 1 (1) Using a commercially available polyethylene terephthalate film (hereinafter abbreviated as PET film) as a substrate, CF 4 as a raw material gas, and a plasma discharge device by high frequency discharge shown in FIG. 2 as a plasma discharge device, The PET film was plasma discharge treated.

【0017】図2に示したプラズマ放電装置は、プラズ
マ発生系(高周波電源)1、プラズマ反応系2、原料、
キャリアガス供給路3及び排気路4により基本的に構成
され、前記プラズマ反応系2には1.5cmの間隔を保っ
て一対のアルミニウム電極5、5’が配置され、下部電
極5’上に被処理物である直径3.2cmの円形PETフ
ィルム7がセットされた。
The plasma discharge device shown in FIG. 2 includes a plasma generation system (high frequency power supply) 1, a plasma reaction system 2, raw materials,
The plasma reaction system 2 is basically composed of a carrier gas supply path 3 and an exhaust path 4, and a pair of aluminum electrodes 5 and 5'are arranged in the plasma reaction system 2 with a distance of 1.5 cm therebetween. A circular PET film 7 having a diameter of 3.2 cm, which was a processed product, was set.

【0018】原料、キャリアガス供給路3を経由して原
料ガスであるCF4を1〜4トール(Torr)の圧力
下5〜50cm3/分の流速でプラズマ反応系2に導入
し、50Wのレベルで13.56MHzの高周波電力を
電極5、5’に印加して放電を起させ、0.25〜30
分間プラズマ放電処理してPETフィルム上に表面薄層
を形成させた。なお放電中PETフィルムの温度は特に
制御されなかったが、ガラス転移点(69℃)以下に保
たれた。
CF 4 as a raw material gas is introduced into the plasma reaction system 2 at a flow rate of 5 to 50 cm 3 / min under a pressure of 1 to 4 Torr through the raw material and the carrier gas supply passage 3 to obtain 50 W. A high frequency power of 13.56 MHz is applied to the electrodes 5 and 5'to generate a discharge, and a level of 0.25 to 30
A plasma discharge treatment was performed for a minute to form a thin surface layer on the PET film. The temperature of the PET film during discharge was not particularly controlled, but was kept below the glass transition point (69 ° C.).

【0019】(2)得られたプラズマ放電処理PETフ
ィルムの表面薄層についてESCAスペクトル(X線光
電子スペクトル)を測定した結果、ベンゼン環のフッ素
化に由来する−CF2−結合の形成が認められ、=CF
−結合の形成が認められなかったことから、この表面薄
層は下記の構造を有するものと推論される。
(2) The ESCA spectrum (X-ray photoelectron spectrum) of the thin surface layer of the obtained plasma discharge treated PET film was measured, and as a result, formation of —CF 2 — bond derived from fluorination of the benzene ring was observed. , = CF
Since no bond formation was observed, it is inferred that this skin layer has the structure:

【0020】[0020]

【化1】 [Chemical 1]

【0021】[0021]

【化2】 [Chemical 2]

【0022】またこの表面薄層の厚さはESCA分析に
より約0.002μであった。 (3)次に水滴接触角(θ)の、プラズマ放電処理時間
(t)の関数としての変化を図1中のa、b、cに示
す。この図において、1つの点印(ドット)は3〜4回
の測定の平均値を意味する。未処理PETフィルムの接
触角は70゜(t=0分)であり、これは文献値と一致
した。図1に示すa、b、cにより、原料ガス流速及び
圧力を変動させても、接触角は処理時間に依存すること
が認められ、放電処理が始まると接触角は急速に上昇
し、10〜20分間で100〜110゜に到達し、その
後、一定となった。
The thickness of this thin surface layer was about 0.002 μm by ESCA analysis. (3) Next, changes in the contact angle of water drop (θ) as a function of the plasma discharge treatment time (t) are shown in a, b and c in FIG. In this figure, one dot (dot) means the average value of 3 to 4 measurements. The contact angle of the untreated PET film was 70 ° (t = 0 min), which was in agreement with literature values. From a, b, and c shown in FIG. 1, it was confirmed that the contact angle depended on the treatment time even when the raw material gas flow rate and pressure were varied, and the contact angle rapidly increased when the discharge treatment started. It reached 100-110 ° in 20 minutes and became constant thereafter.

【0023】ポリテトラフルオロエチレン(PTFE)
の接触角は108°であるので、本例において10〜2
0分間CF4プラズマ放電処理されたPETフィルム表
面はPTFEと同等の疎水性を有することが判明した。
また、処理後約24時間経過後の測定結果及び同一試料
の約2ケ月後の測定結果も誤差内で一致した値を保持し
ていたことを確認した。
Polytetrafluoroethylene (PTFE)
Has a contact angle of 108 °, the contact angle is 10 to 2 in this example.
It was found that the surface of the PET film treated with CF 4 plasma discharge for 0 minutes had a hydrophobic property equivalent to that of PTFE.
In addition, it was confirmed that the measured results after about 24 hours after the treatment and the measured results after about 2 months of the same sample retained the same value within the error.

【0024】(4)さらに走査電子顕微鏡(SEM)を
用いて、プラズマ放電処理PETフィルムの表面薄層の
表面粗さを観察した結果、この表面薄層は、未処理PE
Tフィルムに比べエッチングに由来する均一な粗さを有
することが判明した。 実施例1 (1)基材としてPETフィルムを、原料ガスとしてC
4を、プラズマ放電装置として図3に示したマイクロ
波放電によるプラズマ放電装置を用いて、PETフィル
ムをプラズマ放電処理した。
(4) Further, the surface roughness of the surface thin layer of the plasma discharge treated PET film was observed using a scanning electron microscope (SEM). As a result, this surface thin layer was found to be untreated PE.
It was found to have a uniform roughness due to etching compared to the T film. Example 1 (1) PET film as a base material and C as a raw material gas
The PET film was subjected to plasma discharge treatment by using the plasma discharge device by microwave discharge shown in FIG. 3 as the plasma discharge device of F 4 .

【0025】図3に示したプラズマ放電装置は、プラズ
マ発生系(マグネトロン)1、プラズマ反応系2、原
料、キャリアガス供給路3及び排気路4により基本的に
構成され、反応系2の内部にはアルミナ管6、6’が配
置され、被処理物である長方形(4.5×2.5cm)の
PETフィルム7が内壁にセットされた。原料、キャリ
アガス供給路3を経由して原料ガスであるCF4を比較
例1と同一条件でプラズマ反応系2に導入し、160W
のレベルで2450MHzのマイクロ波放電によりプラ
ズマを発生させ、0.25〜30分間プラズマ放電処理
してPETフィルム上に表面薄層を形成させた。なお放
電中PETフィルムの温度は特に制御されなかったが、
ガラス転移点(69℃)以下に保たれた。
The plasma discharge device shown in FIG. 3 is basically composed of a plasma generation system (magnetron) 1, a plasma reaction system 2, a raw material, a carrier gas supply passage 3 and an exhaust passage 4, and is provided inside the reaction system 2. Alumina tubes 6 and 6 ′ were arranged, and a rectangular (4.5 × 2.5 cm) PET film 7 as an object to be treated was set on the inner wall. CF 4 which is a raw material gas is introduced into the plasma reaction system 2 under the same conditions as in Comparative Example 1 through the raw material and the carrier gas supply passage 3, and 160 W
With a microwave discharge of 2450 MHz at
Zuma was generated and plasma discharge treatment was performed for 0.25 to 30 minutes to form a thin surface layer on the PET film. Although the temperature of the PET film during discharge was not particularly controlled,
The temperature was kept below the glass transition point (69 ° C.).

【0026】(2)得られたプラズマ放電PETフィル
ムの表面薄層についてESCAスペクトルを測定した結
果、比較例1で得られたプラズマ放電PETフィルムの
表面薄層と同様の構造を有することが確認された。 (3)次に水滴接触角(θ)の、プラズマ放電処理時間
(t)の関数としての変化を図1中dに示す。この図に
おいて1つの点(ドット)は3〜4回の測定の平均値を
意味する。図1に示すdより、接触角は放電処理が始ま
ると急速に上昇し、20分間で約105゜に到達し、そ
の後一定となった。従って本例において20分間CF4
プラズマ放電処理されたPETフィルム表面はPTFE
と同等の疎水性を有することが判明した。また、処理後
約24時間経過後の測定結果及び試料の約2ケ月後の測
定結果も誤差内で一致した値を保持していたことを確認
した。
(2) As a result of measuring the ESCA spectrum of the surface thin layer of the obtained plasma discharge PET film, it was confirmed that it had the same structure as the surface thin layer of the plasma discharge PET film obtained in Comparative Example 1. It was (3) Next, the change in the contact angle of water droplet (θ) as a function of the plasma discharge treatment time (t) is shown in d in FIG. In this figure, one point (dot) means the average value of 3 to 4 measurements. From d shown in FIG. 1, the contact angle rapidly increased when the discharge treatment started, reached about 105 ° in 20 minutes, and became constant thereafter. Therefore, in this example, CF 4 for 20 minutes
The surface of the PET film treated with plasma discharge is PTFE
It was found to have a hydrophobicity equivalent to that of In addition, it was confirmed that the measurement results after about 24 hours after the treatment and the measurement results after about 2 months of the sample also kept the same value within the error.

【0027】(4)さらに走査電子顕微鏡(SEM)を
用いて、プラズマ放電処理PETフィルムの表面薄膜層
の表面粗さを観察した結果、この表面薄層は未処理PE
Tフィルムと同様な平滑性を有し、この点で均一な粗さ
を有する比較例1のプラズマ放電処理PETフィルムの
表面薄層と相違することが判明した。 比較例2 (1)基材としてPETフィルムを、原料としてSF6
を用いて比較例1と同一のプラズマ放電装置にてプラズ
マ放電処理をした。
(4) Further, the surface roughness of the surface thin film layer of the plasma discharge treated PET film was observed using a scanning electron microscope (SEM).
It has been found that it has the same smoothness as the T film, and in this respect is different from the surface thin layer of the plasma discharge treated PET film of Comparative Example 1 having a uniform roughness. Comparative Example 2 (1) PET film as a base material and SF 6 as a raw material
Was subjected to plasma discharge treatment using the same plasma discharge device as in Comparative Example 1.

【0028】原料であるSF6を1〜2トール(Tor
r)の圧力下で10SCC/分の流速で、不活性ガスHe
と共にプラズマ反応系2に導入し、30Wのレベルで1
3.56MHzの高周波電力を電極に印加して放電を起
こさせ、1〜30分間のプラズマ放電による処理をして
PETフィルム上に薄層を形成させた。 (2)水滴接触角(θ)の、プラズマ放電処理時間
(t)の関数としての変化を図1中eに示す。この図に
おいて1つの点(ドット)は3〜4回の測定の平均値を
意味する。図1に示すeより、接触角は放電処理が始ま
ると急速に上昇し、20分間で約108゜に達し、その
後一定となった。従って本例において、20分間SF6
プラズマ放電処理されたPETフィルム表面は、PTF
Eと同等の疎水性を有することが判明した。
The raw material SF 6 is added to 1-2 torr (Tor).
Inert gas He at a flow rate of 10 SCC / min under the pressure of r)
With plasma reaction system 2 and 1 at 30W level
A high frequency power of 3.56 MHz was applied to the electrodes to cause discharge, and plasma discharge was performed for 1 to 30 minutes to form a thin layer on the PET film. (2) The change in the contact angle of water drop (θ) as a function of the plasma discharge treatment time (t) is shown in e in FIG. In this figure, one point (dot) means the average value of 3 to 4 measurements. From e shown in FIG. 1, the contact angle rapidly increased when the discharge treatment started, reached about 108 ° in 20 minutes, and became constant thereafter. Therefore, in this example, SF 6 for 20 minutes
The surface of the PET film treated by plasma discharge is PTF
It was found to have the same hydrophobicity as E.

【0029】[0029]

【発明の効果】本発明のフッ素含有表面薄層を有する成
形品の製造方法は、その製造に際して低毒性、不燃性を
有する飽和フッ素炭素化合物または不燃性、非腐食性を
有するフッ化炭素化合物およびフッ化硫黄化合物を用い
るので、従来のプラズマ放電処理に比べて、爆発等の危
険が少なく安全であるという利点がある。
Industrial Applicability The method for producing a molded article having a fluorine-containing thin surface layer of the present invention is a saturated fluorocarbon compound having low toxicity and nonflammability or a fluorocarbon compound having nonflammability and noncorrosion during production. Since a sulfur fluoride compound is used, there is an advantage that it is safe with less danger of explosion and the like as compared with the conventional plasma discharge treatment.

【0030】また本発明のフッ素含有表面薄層を有する
成形品は、潤滑性、撥水性、光透過性、耐候性、帯電防
止性等の特性を有し、特にマイクロ波プラズマ処理され
ることにより優れた平滑性を有し、下記の用途に好まし
く用いられる。 (イ)潤滑性を要求される磁気テープ、磁気ディスク、
光記録ディスク、磁気テープのリーダーテープやトレー
ラーテープ、カメラ・時計等の精密機器の摺動部品、セ
ラミック人工骨関節等の摺動部材あるいは高分子ポリマ
ーの剥離材等、 (ロ)撥水性を要求される防水性地図情報フィルム、薬
品・精密機器の防湿フィルム、水産業用網、サンルーフ
を含む乗物用窓材、高層ビル用も含む窓材、屋根瓦、傘
等の雨具あるいは包装パッケージ等、 (ハ)光透過性を要求される植物育成用農業用フィル
ム、ソーラーコレクタ用フイルムあるいは赤外線吸収セ
ル等、 (ニ)耐候性を要求される軽量・昼間照明費の節減等の
効果がある野外用屋根材等、 (ホ)帯電防止性を要求される防塵用壁材、写真用製版
用フィルム、防塵服、レコード等、 (ニ)その他人工血管、人工臓器、血液バック等の医用
材、酸素、水素等を高度分離する多孔質材等。
Further, the molded article having the fluorine-containing thin surface layer of the present invention has properties such as lubricity, water repellency, light transmittance, weather resistance and antistatic property, and in particular, it is subjected to microwave plasma treatment. It has excellent smoothness and is preferably used in the following applications. (A) Magnetic tapes, magnetic disks, which require lubricity,
Optical recording disks, magnetic tape leader tapes, trailer tapes, sliding parts for precision equipment such as cameras and watches, sliding members such as ceramic artificial bone joints, or polymeric polymer release materials, etc. (b) Water repellency is required Waterproof map information film, moisture-proof film for chemicals and precision instruments, fishnets, window materials for vehicles including sunroofs, window materials for high-rise buildings, roof tiles, rain gear such as umbrellas, packaging packages, etc. ( C) Agricultural film for plant cultivation that requires light transmission, film for solar collectors or infrared absorption cells, etc. (d) Light weight that requires weather resistance and outdoor roof that is effective in reducing daytime lighting costs wood, etc., (e) dustproof wall materials that require antistatic properties, photographic plate making films, dustproof clothing, records, etc., (d) other vascular prostheses, artificial organs, medical materials such as blood back Oxygen, porous material or the like for high separation of hydrogen or the like.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明のプラズマ処理フィルム及び比較例1
のプラズマ処理フィルムの水滴接触角と処理時間の関係
を示すグラフ。
FIG. 1 is a plasma-treated film of the present invention and Comparative Example 1
3 is a graph showing the relationship between the water drop contact angle and the treatment time of the plasma-treated film of FIG.

【図2】 従来例の成形品の製造において用いられるマ
イクロ波放電によるプラズマ放電装置の概略図。
FIG. 2 is a schematic view of a plasma discharge device by microwave discharge used in manufacturing a molded article of a conventional example.

【図3】 本発明の成形品の製造において用いられるマ
イクロ波放電によるプラズマ放電装置の概略図。
FIG. 3 is a schematic view of a plasma discharge device by microwave discharge used in the production of the molded product of the present invention.

【符号の説明】[Explanation of symbols]

1‥‥‥プラズマ発生系 2‥‥‥プラズマ反応系 3‥‥‥供給路 4‥‥‥排気路 7‥‥‥基材 1 ... Plasma generation system 2 ... Plasma reaction system 3 ... Supply path 4 ... Exhaust path 7 ... Base material

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】プラズマ発生系と、前記プラズマ発生系に
取着され反応ガス供給路及び排気路を有するプラズマ反
応系とを備えたマイクロ波放電プラズマ装置を用い、
和フッ化炭素化合物またはフッ化硫黄化合物の反応ガス
前記プラズマ反応系に導入しマイクロ波放電プラズマ
を発生させ、前記プラズマ反応系に配置される基材上に
フッ素含有薄層を有する成形品を製造する際、前記基材
前記プラズマ反応系であって、前記排気路側に配置す
ることを特徴とするフッ素含有表面薄層を有する成形品
の製造方法。
1. A plasma generating system and a plasma generating system
Plasma reactor with attached reaction gas supply passage and exhaust passage
And a reaction gas of a saturated fluorocarbon compound or a sulfur fluoride compound is introduced into the plasma reaction system to generate a microwave discharge plasma, and the reaction gas is placed in the plasma reaction system. that the manufacture of molded articles having a fluorine-containing thin layer on a substrate, said substrate comprising said plasma reaction system, a molded article having a fluorine-containing skin layer, characterized in that arranged in the exhaust path side Manufacturing method.
【請求項2】飽和フッ化炭素化合物がCF4またはC2
6である特許請求の範囲第1項記載の成形品の製造方
法。
2. The saturated fluorocarbon compound is CF 4 or C 2 F.
The method for producing a molded article according to claim 1, wherein the method is 6.
【請求項3】フッ化硫黄化合物がSF6である特許請求
の範囲第1項記載の成形品の製造方法。
3. The method for producing a molded article according to claim 1, wherein the sulfur fluoride compound is SF 6 .
【請求項4】基材が天然高分子、合成高分子及びセラミ
ックスからなる群から選択される1種の材料である特許
請求の範囲第1項記載の成形品の製造方法。
4. The method for producing a molded article according to claim 1, wherein the base material is one kind of material selected from the group consisting of natural polymers, synthetic polymers and ceramics.
【請求項5】基材が天然高分子、合成高分子及びセラミ
ックスからなる群から選択される少なくとも2種の材料
の混合体である特許請求の範囲第1項記載の成形品の製
造方法。
5. The method for producing a molded article according to claim 1, wherein the base material is a mixture of at least two kinds of materials selected from the group consisting of natural polymers, synthetic polymers and ceramics.
【請求項6】合成高分子がポリエチレンテレフタレート
である特許請求の範囲第5項記載の成形品の製造方法。
6. The method for producing a molded article according to claim 5, wherein the synthetic polymer is polyethylene terephthalate.
JP4294641A 1984-12-03 1992-11-02 Method for producing molded article having fluorine-containing thin surface layer Expired - Lifetime JPH0794567B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59256175A JPS61133239A (en) 1984-12-03 1984-12-03 Molded article having surface thin layer containing fluorine
JP4294641A JPH0794567B2 (en) 1984-12-03 1992-11-02 Method for producing molded article having fluorine-containing thin surface layer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59256175A JPS61133239A (en) 1984-12-03 1984-12-03 Molded article having surface thin layer containing fluorine
JP4294641A JPH0794567B2 (en) 1984-12-03 1992-11-02 Method for producing molded article having fluorine-containing thin surface layer

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59256175A Division JPS61133239A (en) 1984-12-03 1984-12-03 Molded article having surface thin layer containing fluorine

Publications (2)

Publication Number Publication Date
JPH0665408A JPH0665408A (en) 1994-03-08
JPH0794567B2 true JPH0794567B2 (en) 1995-10-11

Family

ID=26542606

Family Applications (2)

Application Number Title Priority Date Filing Date
JP59256175A Granted JPS61133239A (en) 1984-12-03 1984-12-03 Molded article having surface thin layer containing fluorine
JP4294641A Expired - Lifetime JPH0794567B2 (en) 1984-12-03 1992-11-02 Method for producing molded article having fluorine-containing thin surface layer

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP59256175A Granted JPS61133239A (en) 1984-12-03 1984-12-03 Molded article having surface thin layer containing fluorine

Country Status (1)

Country Link
JP (2) JPS61133239A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61200134A (en) * 1985-02-28 1986-09-04 Japan Synthetic Rubber Co Ltd Rigic plastic article coated with plasma-polymerized film
ITMI20041035A1 (en) * 2004-05-24 2004-08-24 Hysytech Srl METHOD FOR MANUFACTURING COMPONENTS FOR COMBUSTIBLE AND COMBUSTIBLE CELL MADE WITH SUCH METHOD
US7244291B2 (en) * 2005-05-02 2007-07-17 3M Innovative Properties Company Electret article having high fluorosaturation ratio
KR20130069711A (en) 2010-06-07 2013-06-26 신닛테츠 수미킨 가가쿠 가부시키가이샤 Lenticular lens sheet and process for production thereof, and optical element

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599932A (en) * 1979-01-24 1980-07-30 Hitachi Ltd Surface treatment of organic high polymer
JPS5956724A (en) * 1982-09-27 1984-04-02 Isamu Kato Formation of thin film by microwave plasma
JPS60248742A (en) * 1984-05-23 1985-12-09 Agency Of Ind Science & Technol Surface modification of polyvinyl chloride resin molded article
JPS6160730A (en) * 1984-09-03 1986-03-28 Hiraoka & Co Ltd Surface modification of polyvinyl chloride resin molding

Also Published As

Publication number Publication date
JPH0533265B2 (en) 1993-05-19
JPH0665408A (en) 1994-03-08
JPS61133239A (en) 1986-06-20

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