JPH0796478B2 - Method for producing CdTe single crystal - Google Patents

Method for producing CdTe single crystal

Info

Publication number
JPH0796478B2
JPH0796478B2 JP34940091A JP34940091A JPH0796478B2 JP H0796478 B2 JPH0796478 B2 JP H0796478B2 JP 34940091 A JP34940091 A JP 34940091A JP 34940091 A JP34940091 A JP 34940091A JP H0796478 B2 JPH0796478 B2 JP H0796478B2
Authority
JP
Japan
Prior art keywords
single crystal
crystal
heat treatment
temperature
growth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP34940091A
Other languages
Japanese (ja)
Other versions
JPH05155699A (en
Inventor
良一 大野
稔 船木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Japan Energy Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Energy Corp filed Critical Japan Energy Corp
Priority to JP34940091A priority Critical patent/JPH0796478B2/en
Publication of JPH05155699A publication Critical patent/JPH05155699A/en
Publication of JPH0796478B2 publication Critical patent/JPH0796478B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Measurement Of Radiation (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の技術分野】本発明は、放射線検出素子用等とし
て有用な高抵抗CdTe単結晶の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a high resistance CdTe single crystal useful for a radiation detecting element or the like.

【0002】[0002]

【従来技術】CdTe単結晶は放射線検出素子等に有用
であり、その特性向上、特に高エネルギ−分解能化をめ
ざして、従来からその製造方法が検討されている。
2. Description of the Related Art CdTe single crystals are useful for radiation detecting elements and the like, and their manufacturing methods have been studied in the past for the purpose of improving the characteristics thereof, and in particular, achieving higher energy resolution.

【0003】高エネルギ−分解能を達成するための結晶
特性としては、主に次の2点が重要である。
The following two points are mainly important as crystal characteristics for achieving high energy resolution.

【0004】第1点は、抵抗率が高いことである。抵抗
率が低いと放射線検出器の信号ノイズが増大し好ましく
なく、1×108Ωcm以上の値が必要である。この抵
抗率を得るために、結晶中に1乃至10ppmの微量の
塩素を添加し、350℃以上450℃以下の温度でこれ
を熱処理することが有効である。
The first point is that the resistivity is high. A low resistivity undesirably increases the signal noise of the radiation detector and requires a value of 1 × 10 8 Ωcm or more. In order to obtain this resistivity, it is effective to add a minute amount of chlorine of 1 to 10 ppm into the crystal and heat-treat this at a temperature of 350 ° C. or higher and 450 ° C. or lower.

【0005】第2点はキャリアライフタイムが大きいこ
とである。キャリアライフタイムが小さいと、キャリア
収集効率が低下し、エネルギ−分解能が低下する。キャ
リアライフタイムを増大するには結晶の純度を向上させ
ることが重要であり、このため、結晶の育成温度が低く
坩堝からの汚染を最小限に抑えられ、しかも、高純度化
の効果があるトラベリングヒ−タ−法(THM法)で結
晶を育成することが効果的である。
The second point is that the carrier lifetime is large. When the carrier lifetime is short, the carrier collection efficiency is lowered and the energy resolution is lowered. In order to increase the carrier lifetime, it is important to improve the purity of the crystal. Therefore, the growth temperature of the crystal is low and the contamination from the crucible can be minimized. It is effective to grow crystals by a heater method (THM method).

【0006】即ち、高エネルギ−分解能の素子を製造す
るには結晶中に1乃至10ppmの微量の塩素を添加し
たCdTe結晶をTHM法で製造し、それを350℃以
上450度以下の温度で熱処理した結晶を使用すること
が重要であった。
That is, in order to manufacture a high energy-resolution element, a CdTe crystal in which a trace amount of chlorine of 1 to 10 ppm is added is manufactured by the THM method and heat-treated at a temperature of 350 ° C. or higher and 450 ° C. or lower. It was important to use the prepared crystals.

【0007】[0007]

【本発明が解決する問題点】しかしながら、上記の方法
で製造した単結晶を使用して放射線検出素子を作成した
場合、育成したインゴットの成長方向長手の位置によっ
て、素子の性能が異なるという問題があった。即ち、長
さ10cmのインゴットでは、成長開始端から5cmま
での成長開始部の結晶を使用して作製した0.2cm×
0.2cm×0.12cmの素子は241Amの59.5
KeVのエネルギ−を有する放射線に対するエネルギ−
分解能が5KeVを超えるものが多くなり、成長開始端
から5cm以降の成長終盤に育成された結晶を使用した
素子はエネルギ−分解能5KeV以下の良好な素子が多
く得られる傾向があり、結果として、THM法で育成し
た1本の結晶インゴットから取れるエネルギ−分解能5
KeV以下の優れた素子の歩留まりが35%程度と低い
という問題点があった。
However, when a radiation detecting element is produced using the single crystal produced by the above method, there is a problem that the element performance varies depending on the longitudinal position of the grown ingot in the growth direction. there were. That is, in the case of a 10 cm long ingot, 0.2 cm x produced by using the crystal of the growth start portion up to 5 cm from the growth start end.
A 0.2 cm x 0.12 cm element is 241 Am 59.5.
Energy for radiation having an energy of KeV
The resolution is more than 5 KeV in many cases, and the element using the crystal grown at the end of the growth of 5 cm from the growth start end tends to obtain many good elements with energy-resolution of 5 KeV or less. As a result, THM Energy obtained from a single crystal ingot grown by the method-resolution 5
There has been a problem that the yield of excellent elements of KeV or less is as low as 35%.

【0008】本発明は、上記の問題点を解決したもので
あって、THM法で育成した1本の結晶インゴットから
歩留まり良くエネルギ−分解能5KeV以下の優れた放
射線検出素子を得ることのできるCdTe単結晶の製造
方法を提供するものである。
The present invention has solved the above-mentioned problems, and a single crystal ingot grown by the THM method can be used to obtain an excellent radiation detection element having an energy resolution of 5 KeV or less with a good yield. A method for producing a crystal is provided.

【0009】[0009]

【問題点を解決する手段および作用】すなわち、本発明
は、放射線検出素子用のCdTe単結晶の製造方法にお
いて、塩素を添加したCdTe単結晶を、500℃以上
900℃以下の温度で第1の熱処理を行なった後、35
0℃以上450℃以下の温度で第2の熱処理を行なうこ
とを特徴とするCdTe単結晶の製造方法を提供するも
のである。本発明者等は、THM法で長さが4cm以下
の短い単結晶を育成した場合、素子の性能が成長開始部
の単結晶も良好であることから、エネルギ−分解能が成
長方向長手に分布する原因が、結晶析出後に引き続き受
ける熱履歴の影響であると考え本発明に至ったものであ
る。即ち、THM法で長い単結晶を育成した場合、育成
炉の温度分布により、成長開始部の単結晶は、結晶析出
後に育成炉の低温部へ徐々に移動するため、低温で長時
間の熱履歴を受けることになる。本発明者等の単結晶育
成では、この熱履歴を受ける時間は約700時間を超え
る。それに対して、成長終盤の単結晶は成長開始部の単
結晶に比べ、成長後に受ける低温での熱履歴の時間も少
ない。
That is, the present invention provides a method for producing a CdTe single crystal for a radiation detecting element, wherein a chlorine-added CdTe single crystal is used as a first material at a temperature of 500 ° C. or higher and 900 ° C. or lower. 35 after heat treatment
The present invention provides a method for producing a CdTe single crystal, which comprises performing a second heat treatment at a temperature of 0 ° C or higher and 450 ° C or lower. The present inventors have found that when a short single crystal having a length of 4 cm or less is grown by the THM method, the element performance is good even for the single crystal at the growth start portion, so that the energy resolution is distributed in the longitudinal direction of the growth direction. The present invention is considered to be due to the influence of the thermal history that is continuously received after crystal precipitation, and the present invention has been achieved. That is, when a long single crystal is grown by the THM method, the single crystal at the growth start part gradually moves to the low temperature part of the growth furnace after crystal precipitation due to the temperature distribution of the growth furnace. Will be received. In the single crystal growth by the present inventors, the time for receiving this thermal history exceeds about 700 hours. On the other hand, the single crystal in the final stage of growth has a shorter thermal history at a low temperature after the growth than the single crystal in the growth start part.

【0010】そこで、エネルギ−分解能低下の原因が、
結晶析出後に引き続き、低温で極めて長時間熱履歴を受
けるためであると考え、育成した結晶を500℃以上9
00℃以下の温度域で熱処理することによって、この結
晶析出後の低温の熱履歴を消し去ることができると推定
し実験したところ、良好な結果が得られ本発明に至った
ものである。
Therefore, the cause of the decrease in energy resolution is
It is thought that this is because, after the crystal precipitation, the crystal grown is subjected to a thermal history at a low temperature for an extremely long time, and the grown crystal is kept at 500 ° C. or higher for 9 hours or more.
It was estimated that it was possible to eliminate the low-temperature thermal history after crystal precipitation by heat treatment in the temperature range of 00 ° C. or lower, and an experiment was conducted. As a result, good results were obtained, which led to the present invention.

【0011】本発明における第1の熱処理温度は500
℃以上900℃以下とされ、より好ましくは600℃以
上800℃以下とされる。熱処理温度が500℃未満で
は結晶析出後の低温での熱履歴の影響を完全には消せ
ず、また、900℃を超えると高蒸気圧成分であるCd
が単結晶から抜けることにより放射線検出素子の性能の
低下が起こるからである。
The first heat treatment temperature in the present invention is 500.
C. to 900.degree. C., more preferably 600.degree. C. to 800.degree. If the heat treatment temperature is lower than 500 ° C, the influence of the thermal history at a low temperature after crystal precipitation cannot be completely eliminated, and if it exceeds 900 ° C, the high vapor pressure component Cd
This is because the radiation of the radiation-detecting element deteriorates due to the removal of the single crystal from the single crystal.

【0012】第2の熱処理温度は350℃以上450℃
以下とされ、より好ましくは350℃以上400℃以下
とされる。350℃未満でも、450℃を超えても、抵
抗率は1×108Ωcm以下となるからである。また、
塩素の添加量は1重量ppm以上10重量ppm以下と
され、より好ましくは1.5重量ppm以上3重量pp
m以下とされる。
The second heat treatment temperature is 350 ° C. or higher and 450 ° C.
Or less, and more preferably 350 ° C. or higher and 400 ° C. or lower. This is because the resistivity becomes 1 × 10 8 Ωcm or less at temperatures lower than 350 ° C. or higher than 450 ° C. Also,
The amount of chlorine added is from 1 to 10 ppm by weight, and more preferably from 1.5 to 3 ppm by weight.
m or less.

【0013】[0013]

【実施例】THM法で育成した塩素濃度2重量ppmの
長さ10cmのCdTe単結晶から結晶成長方向に等間
隔に40枚のウエハ−を切り出し、石英アンプルに真空
封入し、700℃で3時間、第1の熱処理をした後、1
0℃/時間で385℃まで降温し、さらにこの温度で1
8時間の第2の熱処理を行なった。第2の熱処理後、室
温まで40℃/時間で降温した。
[Example] 40 wafers were cut out from a CdTe single crystal having a chlorine concentration of 2 wtppm and a length of 10 cm grown by the THM method at equal intervals in the crystal growth direction, vacuum-sealed in a quartz ampoule, and kept at 700 ° C for 3 hours. , After the first heat treatment, 1
The temperature was lowered to 385 ° C at 0 ° C / hour, and then 1
A second heat treatment of 8 hours was performed. After the second heat treatment, the temperature was lowered to room temperature at 40 ° C./hour.

【0014】この熱処理を行なった結晶を使用して各ウ
エハ−から約30個ずつ放射線検出素子を作製した。
Using this heat-treated crystal, about 30 radiation detecting elements were prepared from each wafer.

【0015】次に、それぞれの素子について241Amの
放射線(59.5keVのエネルギ−をもっている)に
対するエネルギ−分解能(ピ−ク強度半値幅)を測定し
た。その結果、成長開始部のウエハ−でも、エネルギ−
分解能が4keV以上5keV未満の素子が最も多く得
られ、全作製素子数に対する5keV未満の素子の割合
は81%となり、高い歩留まりが得られた。
Next, the energy resolution (peak intensity half width) for radiation of 241 Am (having an energy of 59.5 keV) was measured for each element. As a result, even in the wafer at the growth start portion, energy
The element with the resolution of 4 keV or more and less than 5 keV was obtained most, and the ratio of the element with less than 5 keV to the total number of fabricated elements was 81%, and a high yield was obtained.

【0016】上記実施例では熱処理の雰囲気を真空とし
たが、Arや窒素などの不活性ガス雰囲気としても同様
の効果が得られる。
In the above embodiment, the heat treatment atmosphere is a vacuum, but the same effect can be obtained by using an inert gas atmosphere such as Ar or nitrogen.

【0017】また、上記実施例では第1の熱処理に引き
続いて第2の熱処理を行なったが、第1の熱処理後いっ
たん室温まで冷却した後、第2の熱処理を行なっても同
様の効果が得られる。
Although the second heat treatment is performed after the first heat treatment in the above embodiment, the same effect can be obtained by performing the second heat treatment after cooling to room temperature after the first heat treatment. To be

【0018】さらに、上記実施例では第1の熱処理を単
結晶をウエハ−にしてから行なったが、インゴットのま
ま行なっても第2の熱処理をウエハ−にしてから行なえ
ば同様の効果が得られる。
Further, in the above-mentioned embodiment, the first heat treatment is carried out after the single crystal is made into a wafer, but the same effect can be obtained if the second heat treatment is carried out even after carrying out the ingot as it is. .

【0019】[0019]

【発明の効果】本発明により、THM法で作製したイン
ゴット全域からエネルギ−分解能5KeV以下の良好な
放射線検出素子を歩留まり良く作製することができるよ
うになった。
According to the present invention, it becomes possible to manufacture a good radiation detecting element having an energy resolution of 5 KeV or less from a whole area of an ingot manufactured by the THM method with a high yield.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 放射線検出素子用のCdTe単結晶の製
造方法において、塩素を添加したCdTe単結晶を、5
00℃以上900℃以下の温度で第1の熱処理を行なっ
た後、350℃以上450℃以下の温度で第2の熱処理
を行なうことを特徴とするCdTe単結晶の製造方法。
1. A method for producing a CdTe single crystal for a radiation detecting element, comprising:
A method for producing a CdTe single crystal, which comprises performing a first heat treatment at a temperature of 00 ° C. to 900 ° C. and then performing a second heat treatment at a temperature of 350 ° C. to 450 ° C.
JP34940091A 1991-12-09 1991-12-09 Method for producing CdTe single crystal Expired - Fee Related JPH0796478B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34940091A JPH0796478B2 (en) 1991-12-09 1991-12-09 Method for producing CdTe single crystal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34940091A JPH0796478B2 (en) 1991-12-09 1991-12-09 Method for producing CdTe single crystal

Publications (2)

Publication Number Publication Date
JPH05155699A JPH05155699A (en) 1993-06-22
JPH0796478B2 true JPH0796478B2 (en) 1995-10-18

Family

ID=18403496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34940091A Expired - Fee Related JPH0796478B2 (en) 1991-12-09 1991-12-09 Method for producing CdTe single crystal

Country Status (1)

Country Link
JP (1) JPH0796478B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7002230B2 (en) 2003-02-07 2006-02-21 Nikko Materials Co., Ltd. CdTe-base compound semiconductor single crystal for electro-optic element

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06345598A (en) * 1993-06-04 1994-12-20 Japan Energy Corp CdTe crystal for radiation detection element and manufacturing method thereof
JP4614616B2 (en) * 2002-11-08 2011-01-19 Jx日鉱日石金属株式会社 ZnTe single crystal and method for producing the same
US8405037B2 (en) 2008-02-12 2013-03-26 Shimadzu Corporation Radiation detector manufacturing method, a radiation detector, and a radiographic apparatus
JP6097854B2 (en) * 2016-02-02 2017-03-15 Jx金属株式会社 Method for producing compound semiconductor crystal for radiation detection element
EP3923036A4 (en) 2019-05-17 2022-11-02 JX Nippon Mining & Metals Corporation SEMICONDUCTOR WAFER, RADIATION DETECTION ELEMENT, RADIATION DETECTOR AND PRODUCTION METHOD FOR COMPOUND SEMICONDUCTOR SINGLE CRYSTALLINE SUBSTRATE
JP7250919B2 (en) 2019-05-17 2023-04-03 Jx金属株式会社 Method for manufacturing semiconductor wafer, radiation detection element, radiation detector, and compound semiconductor single crystal substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7002230B2 (en) 2003-02-07 2006-02-21 Nikko Materials Co., Ltd. CdTe-base compound semiconductor single crystal for electro-optic element

Also Published As

Publication number Publication date
JPH05155699A (en) 1993-06-22

Similar Documents

Publication Publication Date Title
JP6980893B2 (en) Semiconductor wafers made from single crystal silicon and their manufacturing process
JP7250919B2 (en) Method for manufacturing semiconductor wafer, radiation detection element, radiation detector, and compound semiconductor single crystal substrate
JPH0796478B2 (en) Method for producing CdTe single crystal
JP2006001784A (en) Silicon carbide single crystal and single crystal wafer
JP4971994B2 (en) Process for producing silicon carbide crystals with increased minority carrier lifetime
JP7265004B2 (en) Method for manufacturing semiconductor wafer, radiation detection element, radiation detector, and compound semiconductor single crystal substrate
CN110366612A (en) Compound semiconductor and its manufacturing method
US6562130B2 (en) Low defect axially grown single crystal silicon carbide
JPH09124310A (en) Method for producing CdTe crystal
JPH07108839B2 (en) Method for producing CdTe single crystal
JP2005008472A (en) High quality 4H silicon carbide single crystal and single crystal wafer
Bradford et al. PREPARATION OF VAPOR GROWN LEAD–TIN TELLURIDE FOR 8–14 MICROMETER PHOTODIODES
JP7217715B2 (en) Compound semiconductor substrate and manufacturing method thereof
Fornaro et al. Growth of lead iodide platelets for room temperature X-ray detection by the vapor transport method
EP0627506A1 (en) CdTe crystal for use in radiation detector and method of manufacturing such CdTe crystal
JP6713341B2 (en) Compound semiconductor substrate and manufacturing method thereof
JP3439302B2 (en) Heat treatment method for ZnSe crystal
JP2858598B2 (en) Method for producing CdTe single crystal
JPH0818917B2 (en) Method for producing CdTe single crystal
RU2202655C1 (en) Method of production of resistive silicon
JPH0791155B2 (en) Method for producing CdTe single crystal
JP4843929B2 (en) Heat treatment method of GaAs crystal and GaAs crystal substrate
Shin et al. Characterization of high-resistivity CdTe crystals for γ-ray detectors
JP6396245B2 (en) Indium phosphide single crystal wafer and method for producing indium phosphide single crystal wafer
JP2021015905A (en) Carbon concentration evaluation method in silicon single crystal substrate

Legal Events

Date Code Title Description
S803 Written request for registration of cancellation of provisional registration

Free format text: JAPANESE INTERMEDIATE CODE: R316803

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20071018

Year of fee payment: 12

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081018

Year of fee payment: 13

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091018

Year of fee payment: 14

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313532

S803 Written request for registration of cancellation of provisional registration

Free format text: JAPANESE INTERMEDIATE CODE: R316803

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101018

Year of fee payment: 15

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101018

Year of fee payment: 15

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 15

Free format text: PAYMENT UNTIL: 20101018

R370 Written measure of declining of transfer procedure

Free format text: JAPANESE INTERMEDIATE CODE: R370

S803 Written request for registration of cancellation of provisional registration

Free format text: JAPANESE INTERMEDIATE CODE: R316803

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101018

Year of fee payment: 15

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 16

Free format text: PAYMENT UNTIL: 20111018

LAPS Cancellation because of no payment of annual fees