JPH09124310A - Method for producing CdTe crystal - Google Patents

Method for producing CdTe crystal

Info

Publication number
JPH09124310A
JPH09124310A JP30350395A JP30350395A JPH09124310A JP H09124310 A JPH09124310 A JP H09124310A JP 30350395 A JP30350395 A JP 30350395A JP 30350395 A JP30350395 A JP 30350395A JP H09124310 A JPH09124310 A JP H09124310A
Authority
JP
Japan
Prior art keywords
heat treatment
crystal
temperature
cdte
cdte crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30350395A
Other languages
Japanese (ja)
Inventor
Satoshi Oraku
智 大楽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP30350395A priority Critical patent/JPH09124310A/en
Publication of JPH09124310A publication Critical patent/JPH09124310A/en
Pending legal-status Critical Current

Links

Landscapes

  • Measurement Of Radiation (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

(57)【要約】 【課題】 放射線検出器に適用された場合にそのエネル
ギー分解能を大幅に改善させるCdTe結晶の製造方法
を提供すること。 【解決手段】 塩素が添加されたCdTe結晶を熱処理
して高抵抗のCdTe結晶を製造する方法であって、塩
素が添加されたCdTe結晶を、真空中で、400℃以
上440℃以下の温度域で第1次熱処理を施した後、一
旦、以下の第2次熱処理温度未満に降温させ、次いで、
360℃以上400℃以下の温度域で第2次熱処理を施
すことを特徴とする。この熱処理によりCdTe結晶の
高抵抗化とキャリアのライフタイムの改善が図れ放射線
検出器に適用された場合にそのエネルギー分解能を大幅
に改善できる。
(57) Abstract: A method for producing a CdTe crystal is provided, which greatly improves the energy resolution when applied to a radiation detector. A method for producing a high-resistance CdTe crystal by heat-treating a chlorine-added CdTe crystal, wherein the chlorine-added CdTe crystal is heated in a temperature range of 400 ° C. to 440 ° C. inclusive. After performing the first heat treatment in, once lower the temperature below the second heat treatment temperature below, then,
The second heat treatment is performed in a temperature range of 360 ° C. or higher and 400 ° C. or lower. By this heat treatment, the resistance of the CdTe crystal can be increased and the lifetime of the carrier can be improved. When applied to a radiation detector, the energy resolution can be greatly improved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、放射線線量計や医
療放射線診断装置等放射線検出器の素子材料に用いられ
る高抵抗CdTe結晶の製造方法に係り、特に、放射線
検出器のエネルギー分解能を大幅に改善させるCdTe
結晶の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a high-resistance CdTe crystal used as a material for a radiation detector such as a radiation dosimeter or a medical radiation diagnostic apparatus, and in particular, the energy resolution of the radiation detector is significantly increased. CdTe to improve
The present invention relates to a method for producing crystals.

【0002】[0002]

【従来の技術】一般に、II−VI族化合物半導体の一つで
あるテルル化カドミウム(以下、CdTe)結晶は、吸
収係数が大きくかつ室温動作が可能なため優れた放射線
検出器の素子材料として有望である。
2. Description of the Related Art In general, a cadmium telluride (CdTe) crystal, which is one of II-VI group compound semiconductors, has a large absorption coefficient and is capable of operating at room temperature, so it is a promising element material for an excellent radiation detector. Is.

【0003】この放射線検出器は、検出素子となるCd
Te結晶基板の対向する面に一対の電極を形成して作製
される。そして、この放射線検出器においては、各電極
間にバイアス電圧が印加され、CdTe結晶に放射線が
入射されると結晶内に電子−正孔対が形成され、生成さ
れたキャリア(すなわち電子及び正孔)が各電極に到達
し放射線検出の信号を得ることができるものである。
This radiation detector uses Cd as a detection element.
It is manufactured by forming a pair of electrodes on opposite surfaces of a Te crystal substrate. Then, in this radiation detector, when a bias voltage is applied between the electrodes and radiation is incident on the CdTe crystal, an electron-hole pair is formed in the crystal and the generated carriers (that is, electrons and holes) are formed. ) Can reach each electrode and obtain a radiation detection signal.

【0004】ところで、放射線検出器の高エネルギー分
解能を得るためには、検出素子に用いられるCdTe結
晶は高抵抗で、かつ、結晶内に生成されるキャリアのラ
イフタイムが長いこと(すなわち、キャリアがトラップ
され難いこと)が要求される。結晶の比抵抗値が低い場
合、高バイアス電圧によるリークノイズが増大するた
め、高エネルギー分解能を得ることができなくなるから
である。
By the way, in order to obtain a high energy resolution of the radiation detector, the CdTe crystal used for the detection element has a high resistance and the lifetime of the carrier generated in the crystal is long (that is, the carrier is It is required to be difficult to be trapped). This is because if the specific resistance value of the crystal is low, the leak noise due to the high bias voltage increases, and it becomes impossible to obtain high energy resolution.

【0005】そして、高エネルギー分解能を得るために
は、1×109(Ω・cm)以上の比抵抗値が必要であ
る。
In order to obtain a high energy resolution, a specific resistance value of 1 × 10 9 (Ω · cm) or more is required.

【0006】[0006]

【発明が解決しようとする課題】ここで、高抵抗を有す
るこの様なCdTe結晶は、従来、この結晶中に塩素を
添加することにより製造されている。このCdTe結晶
の高抵抗化の現象は、添加された塩素原子がTeの一部
と置換し、置換された塩素原子とCdの空孔とで構成さ
れる複合欠陥の作用により起こっているものと推察され
ている。
Here, such a CdTe crystal having a high resistance is conventionally manufactured by adding chlorine to this crystal. The phenomenon of increasing the resistance of the CdTe crystal is caused by the action of a compound defect in which the added chlorine atom replaces a part of Te and the substituted chlorine atom and the vacancy of Cd. It is speculated.

【0007】そして、従来においては塩素が添加された
CdTe結晶について、これを真空中で熱処理して結晶
内の抵抗を均一化させ、もって放射線検出器の素子材料
として提供されている。
Conventionally, a CdTe crystal added with chlorine is heat-treated in vacuum to make the resistance in the crystal uniform, and thus provided as an element material for a radiation detector.

【0008】ところで、このCdTe結晶は、添加され
る塩素の量が増加するに伴い結晶の比抵抗値が減少しか
つ上記ライフタイムも減少する特性を有していた。
By the way, the CdTe crystal had such characteristics that the specific resistance value of the crystal decreased and the above-mentioned lifetime also decreased as the amount of chlorine added increased.

【0009】このため、CdTe結晶を素子材料とした
放射線検出器にはそのエネルギー分解能に一定の限界を
有する問題点があった。
Therefore, the radiation detector using the CdTe crystal as the element material has a problem that the energy resolution thereof has a certain limit.

【0010】そこで、従来においては添加する塩素量を
適量に設定し、かつ、上記CdTe結晶の真空中での熱
処理について温度域を徐々に下げながら多段階でこれを
行う等の検討がなされているが、この方法による効果も
一定の限界を有していた。
Therefore, conventionally, studies have been made such that the amount of chlorine to be added is set to an appropriate amount and the heat treatment of the CdTe crystal in vacuum is performed in multiple stages while gradually lowering the temperature range. However, the effect of this method has a certain limit.

【0011】本発明はこの様な問題点に着目してなされ
たもので、その課題とするところは、放射線検出器の素
子材料に適用された場合にそのエネルギー分解能を大幅
に改善させるCdTe結晶の製造方法を提供することに
ある。
The present invention has been made by paying attention to such a problem, and the problem is that a CdTe crystal that significantly improves the energy resolution when applied to a device material of a radiation detector is used. It is to provide a manufacturing method.

【0012】[0012]

【課題を解決するための手段】そこで、本発明者は上記
課題を解決するため鋭意実験を重ねたところ、以下のよ
うな技術的知見を得るに至った。すなわち、塩素が添加
されたCdTe結晶に対し2段階の熱処理を施す際、あ
る一定の温度条件で第1次熱処理を施し、一旦、第2次
熱処理温度未満、好ましくは室温近傍まで降温させた
後、第1次熱処理温度より低温の第2次熱処理を施した
場合、放射線検出器の高エネルギー分解能を可能とする
CdTe結晶が得られることを見出した。更に、降温処
理を間に介したこの熱処理について、2段階でなしに3
段階等多段に設定して同様の実験を試みたところ、2段
階加熱に較べて大きな改善は確認されなかった。本発明
はこの様な技術的知見に基づき完成されたものである。
The inventors of the present invention have made extensive studies in order to solve the above problems, and have obtained the following technical knowledge. That is, when a two-step heat treatment is performed on a CdTe crystal to which chlorine is added, the first heat treatment is performed under a certain temperature condition, and once the temperature is lowered below the second heat treatment temperature, preferably near room temperature. It was found that a CdTe crystal that enables a high energy resolution of the radiation detector is obtained when the second heat treatment at a temperature lower than the first heat treatment temperature is performed. Furthermore, regarding this heat treatment through the temperature lowering process, it is possible to use 3 steps instead of 2 steps.
When the same experiment was attempted by setting in multiple stages such as stages, no significant improvement was confirmed as compared with the two-stage heating. The present invention has been completed based on such technical knowledge.

【0013】すなわち、請求項1に係る発明は、塩素が
添加されたCdTe結晶を熱処理して高抵抗のCdTe
結晶を製造する方法を前提とし、塩素が添加されたCd
Te結晶を、真空中で、400℃以上440℃以下の温
度域で第1次熱処理を施した後、一旦、以下の第2次熱
処理温度未満に降温させ、次いで、360℃以上400
℃以下の温度域で第2次熱処理を施すことを特徴とする
ものである。
That is, the invention according to claim 1 heats a CdTe crystal to which chlorine is added to obtain a high resistance CdTe crystal.
Based on the method of producing crystals, Cd added with chlorine
The Te crystal is subjected to a first heat treatment in a temperature range of 400 ° C. or higher and 440 ° C. or lower in a vacuum, and then temporarily cooled to a temperature lower than the following second heat treatment temperature, and then 360 ° C. or higher and 400 ° C. or higher.
It is characterized in that the secondary heat treatment is performed in a temperature range of ℃ or less.

【0014】この様な技術的手段において塩素が添加さ
れた上記CdTe結晶は単結晶でも多結晶でも任意であ
るが、放射線検出器のより高いエネルギー分解能を得る
ためには単結晶が好ましい。
The CdTe crystal added with chlorine by such technical means may be either a single crystal or a polycrystal, but the single crystal is preferable in order to obtain a higher energy resolution of the radiation detector.

【0015】また、第1次熱処理を施した後の降温処理
温度については第2次熱処理温度未満であれば任意であ
るが、室温近傍まで降温させることが好ましく、かつ、
この温度条件でCdTe結晶を1時間以上保持すること
が望ましい(請求項2)。
Further, the temperature lowering treatment temperature after the first heat treatment is optional as long as it is lower than the second heat treatment temperature, but it is preferable to lower the temperature to near room temperature, and
It is desirable to hold the CdTe crystal for 1 hour or more under this temperature condition (claim 2).

【0016】次に、上記第1次熱処理の温度域は400
℃以上440℃以下であることが必要である。440℃
を越えた場合や400℃未満の場合には、放射線検出素
子として適用された際のエネルギー分解能の改善効果が
得られなくなる。また、第1次熱処理の処理時間は1時
間以上行うことが好ましい。
Next, the temperature range of the first heat treatment is 400.
It is necessary that the temperature is from ℃ to 440 ℃. 440 ° C
If the temperature exceeds 400 ° C or is lower than 400 ° C, the effect of improving the energy resolution when applied as a radiation detection element cannot be obtained. In addition, the processing time of the first heat treatment is preferably 1 hour or more.

【0017】他方、第2次熱処理の温度域は360℃以
上400℃以下であることが必要である。400℃を越
えた場合や360℃未満の場合には、第1次熱処理と同
様に放射線検出素子として適用された際のエネルギー分
解能の改善効果が得られなくなる。また、第2次熱処理
の処理時間は1時間以上行うことが好ましい。
On the other hand, the temperature range of the second heat treatment must be 360 ° C. or higher and 400 ° C. or lower. When the temperature exceeds 400 ° C. or lower than 360 ° C., the effect of improving the energy resolution when applied as a radiation detecting element cannot be obtained as in the first heat treatment. In addition, the processing time of the secondary heat treatment is preferably 1 hour or more.

【0018】また、CdTe結晶の合成に適用される各
原料の純度については、他の不純物によるキャリアの挙
動を避けるため、99.9999%以上であることが望
ましい。
The purity of each raw material applied to the synthesis of CdTe crystals is preferably 99.9999% or more in order to avoid the behavior of carriers due to other impurities.

【0019】ここで、塩素が添加されたCdTe結晶に
対して上述した熱処理方法を施した場合、放射線検出器
の高エネルギー分解能を可能とするCdTe結晶が得ら
れる理由について本発明者は以下のように推察してい
る。
Here, the reason why the CdTe crystal which enables high energy resolution of the radiation detector is obtained when the above-mentioned heat treatment method is applied to the CdTe crystal to which chlorine is added is as follows. I guess.

【0020】まず、塩素が添加されたCdTe結晶に対
し図1の熱処理温度プロファイルに示すように真空中で
400℃以上440℃以下の温度域で第1次熱処理を施
すと、従来の熱処理と同様の作用によりCdTe結晶内
の抵抗を均一化させることが可能となる。
First, as shown in the heat treatment temperature profile of FIG. 1, the CdTe crystal added with chlorine is subjected to the first heat treatment in a temperature range of 400 ° C. to 440 ° C. in a vacuum, similar to the conventional heat treatment. By the action of, it becomes possible to make the resistance in the CdTe crystal uniform.

【0021】次に、上記第1次熱処理を施した後、一
旦、第2次熱処理温度未満に降温させ、次いで、360
℃以上400℃以下の温度域で第2次熱処理を施すと、
原因は現在のところ不明であるが結晶内のトラップレベ
ルが低下し上述したキャリアのライフタイムの改善が図
れる。すなわち、以下に述べる実施例と比較例のデータ
から明らかなように各CdTe結晶の比抵抗値は略同一
である。しかし各結晶を素子材料として組込んだ放射線
検出器のエネルギー分解能(ピークスペクトルの半値
幅)は比較例に較べ実施例のそれが大幅に優れている。
この様に各CdTe結晶の比抵抗値が略同等であるにも
拘らず実施例に係る放射線検出器のエネルギー分解能が
大幅に改善されていることから、上記降温処理後の第2
次熱処理により結晶内のトラップレベルが低下し上述し
たライフタイムの改善が図られているものと推察してい
る。
Next, after the above-mentioned primary heat treatment, the temperature is once lowered to below the secondary heat treatment temperature, and then 360.
When the second heat treatment is performed in the temperature range of ℃ to 400 ℃,
The cause is unknown at present, but the trap level in the crystal is lowered and the above-mentioned carrier lifetime can be improved. That is, as is clear from the data of Examples and Comparative Examples described below, the specific resistance value of each CdTe crystal is substantially the same. However, the energy resolution (half-width of peak spectrum) of the radiation detector incorporating each crystal as an element material is significantly superior to that of the comparative example.
As described above, the energy resolution of the radiation detector according to the embodiment is greatly improved even though the specific resistance values of the CdTe crystals are substantially the same.
It is assumed that the subsequent heat treatment lowers the trap level in the crystal and improves the above-mentioned lifetime.

【0022】[0022]

【発明の実施の形態】以下、本発明の実施の形態につい
て具体的実施例を挙げて詳細に説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to specific examples.

【0023】[実施例1]いずれも純度99.9999
%のCdとTeをそのmol組成比(Te/Cd)が
0.999となるように内径100mmの石英容器に収
納し、更に、塩素濃度が300ppmとなるように塩化
カドミウムを添加した。次に、この石英容器を1.0×
10-6Torr以下の真空度にて封入し、電気炉に設置
した後、グラディエント・フリーズ法にて結晶育成を行
った。すなわち、1100℃で10時間程原料を溶融
し、0.3℃/時間の割合で1050℃まで冷却し結晶
化させた後、60℃/時間の割合で室温まで冷却し塩素
が添加されたCdTe結晶を得た。そして、この様にし
て作成されたCdTe結晶から20×20mmウエハを
切り出した。
[Example 1] Purity is 99.9999 in all cases
% Cd and Te were stored in a quartz container having an inner diameter of 100 mm so that the molar composition ratio (Te / Cd) was 0.999, and cadmium chloride was added so that the chlorine concentration was 300 ppm. Next, place this quartz container at 1.0 ×
After enclosing at a vacuum degree of 10 −6 Torr or less and installing in an electric furnace, crystal growth was performed by a gradient freeze method. That is, the raw material was melted at 1100 ° C. for about 10 hours, cooled to 1050 ° C. at a rate of 0.3 ° C./hour and crystallized, and then cooled to room temperature at a rate of 60 ° C./hour, and CdTe containing chlorine was added. Crystals were obtained. Then, a 20 × 20 mm wafer was cut out from the CdTe crystal thus produced.

【0024】次に、切り出した上記ウエハを、真空中
で、420℃の温度で10時間の熱処理(第1次熱処
理)を施し、次いで、一旦室温まで冷却し、かつ、室温
で1時間保持した後、380℃の温度で10時間の熱処
理(すなわち第2次熱処理)を施した。熱処理後のCd
Te結晶ウエハの比抵抗値は1.4×109(Ω・c
m)であった。
Next, the cut-out wafer was subjected to a heat treatment (primary heat treatment) at a temperature of 420 ° C. for 10 hours in a vacuum, then cooled once to room temperature, and kept at room temperature for 1 hour. After that, a heat treatment (that is, a second heat treatment) was performed at a temperature of 380 ° C. for 10 hours. Cd after heat treatment
The resistivity of Te crystal wafer is 1.4 × 10 9 (Ω · c
m).

【0025】そして、このCdTe結晶ウエハから放射
線検出器を作製し、その放射線検出特性評価を行った。
Then, a radiation detector was produced from this CdTe crystal wafer, and its radiation detection characteristics were evaluated.

【0026】この放射線検出特性評価には、線源とし
て、241Am(アメリシウム)を用いた。この結果、バ
イアス電圧30Vに対し、ピークスペクトルの半値幅
が、目標とする12〜13%より良好な10.1%とい
う高エネルギー分解能を得ることができた。
For the radiation detection characteristic evaluation, 241 Am (americium) was used as a radiation source. As a result, it was possible to obtain a high energy resolution of 10.1% in which the half-value width of the peak spectrum was better than the target value of 12 to 13% with respect to the bias voltage of 30V.

【0027】[実施例2]実施例1で作製したCdTe
結晶ウエハを、真空中で、440℃の温度で5時間の熱
処理(第1次熱処理)を施し、次いで、一旦360℃ま
で冷却し、かつ、この温度で3時間保持した後、400
℃の温度で10時間の熱処理(すなわち第2次熱処理)
を施した。熱処理後のCdTe結晶ウエハの比抵抗値は
1.5×109(Ω・cm)であった。
[Example 2] CdTe produced in Example 1
The crystal wafer is subjected to heat treatment (primary heat treatment) at a temperature of 440 ° C. for 5 hours in vacuum, then once cooled to 360 ° C., and then held at this temperature for 3 hours, and then 400
Heat treatment for 10 hours at a temperature of ℃ (ie secondary heat treatment)
Was given. The specific resistance value of the CdTe crystal wafer after the heat treatment was 1.5 × 10 9 (Ω · cm).

【0028】そして、このCdTe結晶ウエハから実施
例1と同様の放射線検出器を作製し、線源として241
m(アメリシウム)を用いた放射線検出特性評価を行っ
た。
Then, from this CdTe crystal wafer, a radiation detector similar to that of Example 1 was prepared, and a radiation source of 241 A was used.
Radiation detection characteristics were evaluated using m (americium).

【0029】この結果、バイアス電圧30Vに対し、ピ
ークスペクトルの半値幅が、目標とする12〜13%よ
り良好な11.2%という高エネルギー分解能を得るこ
とができた。
As a result, with respect to the bias voltage of 30 V, the high energy resolution of 11.2%, which is better than the target 12 to 13%, was obtained.

【0030】[実施例3]実施例1で作製したCdTe
結晶ウエハを、真空中で、400℃の温度で10時間の
熱処理(第1次熱処理)を施し、次いで、一旦室温まで
冷却し、かつ、室温で1時間保持した後、360℃の温
度で10時間の熱処理(すなわち第2次熱処理)を施し
た。熱処理後のCdTe結晶ウエハの比抵抗値は1.5
×109(Ω・cm)であった。
[Example 3] CdTe prepared in Example 1
The crystal wafer is subjected to heat treatment (primary heat treatment) in vacuum at a temperature of 400 ° C. for 10 hours, then once cooled to room temperature and kept at room temperature for 1 hour, and then at a temperature of 360 ° C. for 10 hours. A heat treatment (that is, a secondary heat treatment) was performed for a time. The specific resistance value of the CdTe crystal wafer after heat treatment is 1.5
It was × 10 9 (Ω · cm).

【0031】そして、このCdTe結晶ウエハから実施
例1と同様の放射線検出器を作製し、線源として241
m(アメリシウム)を用いた放射線検出特性評価を行っ
た。
Then, from this CdTe crystal wafer, a radiation detector similar to that of Example 1 was prepared, and a radiation source of 241 A was used.
Radiation detection characteristics were evaluated using m (americium).

【0032】この結果、バイアス電圧30Vに対し、ピ
ークスペクトルの半値幅が、目標とする12〜13%よ
り良好な10.3%という高エネルギー分解能を得るこ
とができた。
As a result, it was possible to obtain a high energy resolution of 10.3%, which is better than the target 12 to 13% in the half width of the peak spectrum with respect to the bias voltage of 30V.

【0033】[比較例1]実施例1で作製したCdTe
結晶ウエハを熱処理せずにこのCdTe結晶ウエハから
実施例1と同様の放射線検出器を作製した。このCdT
e結晶ウエハの比抵抗値は1.6×109(Ω・cm)
であった。
[Comparative Example 1] CdTe produced in Example 1
A radiation detector similar to that of Example 1 was produced from this CdTe crystal wafer without heat-treating the crystal wafer. This CdT
e The specific resistance value of the crystal wafer is 1.6 × 10 9 (Ω · cm)
Met.

【0034】そして、線源として241Am(アメリシウ
ム)を用いた放射線検出特性評価を行ったところ、バイ
アス電圧30Vに対し、ピークスペクトルの半値幅が5
2.6%であり、放射線検出器として使用することは困
難であった。
When radiation detection characteristics were evaluated using 241 Am (americium) as a radiation source, the half-value width of the peak spectrum was 5 at a bias voltage of 30V.
It was 2.6%, and it was difficult to use it as a radiation detector.

【0035】[比較例2]実施例1で作製したCdTe
結晶ウエハを、真空中で、420℃の温度で10時間の
熱処理を施した。この熱処理後のCdTe結晶ウエハの
比抵抗値は1.4×109(Ω・cm)であった。
[Comparative Example 2] CdTe produced in Example 1
The crystal wafer was heat-treated in vacuum at a temperature of 420 ° C. for 10 hours. The specific resistance value of the CdTe crystal wafer after this heat treatment was 1.4 × 10 9 (Ω · cm).

【0036】そして、このCdTe結晶ウエハから実施
例1と同様の放射線検出器を作製し、線源として241
m(アメリシウム)を用いた放射線検出特性評価を行っ
た。
Then, a radiation detector similar to that of Example 1 was prepared from this CdTe crystal wafer and used as a radiation source of 241 A.
Radiation detection characteristics were evaluated using m (americium).

【0037】この結果、バイアス電圧30Vに対し、ピ
ークスペクトルの半値幅が19.4%であり、目標とす
る高エネルギー分解能を得ることができなかった。
As a result, the full width at half maximum of the peak spectrum was 19.4% with respect to the bias voltage of 30 V, and the target high energy resolution could not be obtained.

【0038】[0038]

【発明の効果】請求項1〜2記載の発明に係るCdTe
結晶の製造方法によれば、塩素が添加されたCdTe結
晶を、真空中で、400℃以上440℃以下の温度域で
第1次熱処理を施した後、一旦、以下の第2次熱処理温
度未満に降温させ、次いで360℃以上400℃以下の
温度域で第2次熱処理を施しているため、放射線検出器
に適用された場合にそのエネルギー分解能を大幅に改善
させるCdTe結晶が得られる効果を有している。
EFFECTS OF THE INVENTION CdTe according to the invention of claims 1 and 2
According to the method for producing a crystal, a CdTe crystal to which chlorine is added is subjected to a first heat treatment in a temperature range of 400 ° C. or higher and 440 ° C. or lower in a vacuum, and then once less than the following second heat treatment temperature. Since the second heat treatment is performed in the temperature range of 360 ° C. or higher and 400 ° C. or lower, there is an effect that a CdTe crystal that significantly improves the energy resolution when applied to a radiation detector can be obtained. doing.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る熱処理温度プロファイルを示すグ
ラフ図。
FIG. 1 is a graph showing a heat treatment temperature profile according to the present invention.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】塩素が添加されたCdTe結晶を熱処理し
て高抵抗のCdTe結晶を製造する方法において、 塩素が添加されたCdTe結晶を、真空中で、400℃
以上440℃以下の温度域で第1次熱処理を施した後、
一旦、以下の第2次熱処理温度未満に降温させ、次い
で、360℃以上400℃以下の温度域で第2次熱処理
を施すことを特徴とするCdTe結晶の製造方法。
1. A method for producing a high resistance CdTe crystal by heat-treating a chlorine-added CdTe crystal, wherein the chlorine-added CdTe crystal is heated at 400 ° C. in vacuum.
After performing the first heat treatment in the temperature range of 440 ° C. or lower,
A method for producing a CdTe crystal, which comprises once lowering the temperature to below the second heat treatment temperature and then performing the second heat treatment in a temperature range of 360 ° C. or higher and 400 ° C. or lower.
【請求項2】上記第1次熱処理後、室温近傍まで降温さ
せ、かつ、この温度条件でCdTe結晶を1時間以上保
持することを特徴とする請求項1記載のCdTe結晶の
製造方法。
2. The method for producing a CdTe crystal according to claim 1, wherein after the first heat treatment, the temperature is lowered to near room temperature, and the CdTe crystal is held under this temperature condition for 1 hour or more.
JP30350395A 1995-10-27 1995-10-27 Method for producing CdTe crystal Pending JPH09124310A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30350395A JPH09124310A (en) 1995-10-27 1995-10-27 Method for producing CdTe crystal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30350395A JPH09124310A (en) 1995-10-27 1995-10-27 Method for producing CdTe crystal

Publications (1)

Publication Number Publication Date
JPH09124310A true JPH09124310A (en) 1997-05-13

Family

ID=17921763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30350395A Pending JPH09124310A (en) 1995-10-27 1995-10-27 Method for producing CdTe crystal

Country Status (1)

Country Link
JP (1) JPH09124310A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003078703A1 (en) * 2002-03-19 2003-09-25 Nikko Materials Co., Ltd. CdTe SINGLE CRYSTAL AND CdTe POLYCRYSTAL, AND METHOD FOR PREPARATION THEREOF
JP2014059155A (en) * 2012-09-14 2014-04-03 Shimadzu Corp Radioactive ray detector manufacturing method
JP2014196213A (en) * 2013-03-29 2014-10-16 Jx日鉱日石金属株式会社 Semiconductor wafer, radiation detection element, radiation detector and method of producing compound semiconductor single crystal
JP2016153362A (en) * 2016-02-02 2016-08-25 Jx金属株式会社 Method for producing compound semiconductor crystal for radiation detection element
CN106435738A (en) * 2016-09-20 2017-02-22 广东先导稀材股份有限公司 Preparation method of cadmium zinc telluride polycrystals
WO2020235124A1 (en) 2019-05-17 2020-11-26 Jx金属株式会社 Semiconductor wafer, radiation detection element, radiation detector, and production method for compound semiconductor monocrystalline substrate
WO2020235123A1 (en) 2019-05-17 2020-11-26 Jx金属株式会社 Semiconductor wafer, radiation detection element, radiation detector, and production method for compound semiconductor monocrystalline substrate

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003078703A1 (en) * 2002-03-19 2003-09-25 Nikko Materials Co., Ltd. CdTe SINGLE CRYSTAL AND CdTe POLYCRYSTAL, AND METHOD FOR PREPARATION THEREOF
US7211142B2 (en) 2002-03-19 2007-05-01 Nippon Mining & Metals Co., Ltd. CdTe single crystal and CdTe polycrystal, and method for preparation thereof
JP2014059155A (en) * 2012-09-14 2014-04-03 Shimadzu Corp Radioactive ray detector manufacturing method
JP2014196213A (en) * 2013-03-29 2014-10-16 Jx日鉱日石金属株式会社 Semiconductor wafer, radiation detection element, radiation detector and method of producing compound semiconductor single crystal
JP2016153362A (en) * 2016-02-02 2016-08-25 Jx金属株式会社 Method for producing compound semiconductor crystal for radiation detection element
CN106435738A (en) * 2016-09-20 2017-02-22 广东先导稀材股份有限公司 Preparation method of cadmium zinc telluride polycrystals
WO2020235124A1 (en) 2019-05-17 2020-11-26 Jx金属株式会社 Semiconductor wafer, radiation detection element, radiation detector, and production method for compound semiconductor monocrystalline substrate
WO2020235123A1 (en) 2019-05-17 2020-11-26 Jx金属株式会社 Semiconductor wafer, radiation detection element, radiation detector, and production method for compound semiconductor monocrystalline substrate
US11967659B2 (en) 2019-05-17 2024-04-23 Jx Metals Corporation Semiconductor wafer, radiation detection element, radiation detector, and production method for compound semiconductor monocrystalline substrate
US12021160B2 (en) 2019-05-17 2024-06-25 Jx Metals Corporation Semiconductor wafer, radiation detection element, radiation detector, and production method for compound semiconductor monocrystalline substrate

Similar Documents

Publication Publication Date Title
JP5953116B2 (en) Compound semiconductor crystal for radiation detection element, radiation detection element, and radiation detector
JPH06338507A (en) Semiconductor substrate, solid-state imaging device, and manufacturing method thereof
JP6310794B2 (en) Radiation detection element, radiation detector, and manufacturing method of radiation detection element
JP6980893B2 (en) Semiconductor wafers made from single crystal silicon and their manufacturing process
JP7250919B2 (en) Method for manufacturing semiconductor wafer, radiation detection element, radiation detector, and compound semiconductor single crystal substrate
JPH09124310A (en) Method for producing CdTe crystal
JP7265004B2 (en) Method for manufacturing semiconductor wafer, radiation detection element, radiation detector, and compound semiconductor single crystal substrate
CN110366612A (en) Compound semiconductor and its manufacturing method
JP6097854B2 (en) Method for producing compound semiconductor crystal for radiation detection element
JPH05155699A (en) Production of cdte single crystal
Novosad et al. Luminescence and photosensitivity of PbI2 crystals
EP0627506A1 (en) CdTe crystal for use in radiation detector and method of manufacturing such CdTe crystal
JPH07108839B2 (en) Method for producing CdTe single crystal
Fornaro et al. Growth of lead iodide platelets for room temperature X-ray detection by the vapor transport method
JP7103314B2 (en) Carbon concentration evaluation method in silicon single crystal substrate
Hermon et al. Study of trapping levels in doped HgI2 radiation detectors
JPH0818917B2 (en) Method for producing CdTe single crystal
JP2858598B2 (en) Method for producing CdTe single crystal
JPH0791155B2 (en) Method for producing CdTe single crystal
JPH09115848A (en) Semiconductor substrate and semiconductor device manufacturing method
Squillante et al. State-of-the-art X-ray detectors fabricated on PCG grown mercuric iodide platelets.
RU2202655C1 (en) Method of production of resistive silicon
Zelenina et al. Growth and annealing of CdZnTe: Cl crystals with different content of Zn for nuclear detectors
JPH11283988A (en) Manufacture of semiconductor film
JPH06211598A (en) Silicon single crystal and heat treatment method thereof