JPH0796681B2 - Method for producing palladium-coated silver powder - Google Patents
Method for producing palladium-coated silver powderInfo
- Publication number
- JPH0796681B2 JPH0796681B2 JP63024616A JP2461688A JPH0796681B2 JP H0796681 B2 JPH0796681 B2 JP H0796681B2 JP 63024616 A JP63024616 A JP 63024616A JP 2461688 A JP2461688 A JP 2461688A JP H0796681 B2 JPH0796681 B2 JP H0796681B2
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- Prior art keywords
- silver
- palladium
- powder
- particles
- slurry
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- Powder Metallurgy (AREA)
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- Ceramic Capacitors (AREA)
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- Conductive Materials (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は積層セラミツクコンデンサーの電極、積層セラ
ミツク基板の回路等を形成するための組成物に好適のパ
ラジウム被覆銀粉の製造方法に関するものである。TECHNICAL FIELD The present invention relates to a method for producing a palladium-coated silver powder suitable for a composition for forming an electrode of a laminated ceramic capacitor, a circuit of a laminated ceramic substrate, or the like.
積層セラミツクコンデンサーは、チタン酸バリウム等の
誘電体を主成分とし、積層セラミツク基板はアルミナ、
ガラス等を主成分として、これらをバインダ及び溶剤と
混合し、該混合物をドクターブレード法、ロールコータ
ー法等によつてグリーンシートと為し、グリーンシート
上に、必要な電極、回路を形成する導電性被膜形成用組
成物を塗布し、これらを複数層積み重ねて900〜1400℃
で焼成することにより製造している。この焼成温度は主
成分の焼結性に依存しており、主成分によつて必要な焼
成温度が決まる。この電極、回路に用いられる導電性被
膜形成用組成物はその焼成温度で溶融したり、蒸発した
りせず、しかも当該セラミツクに焼付け可能なものでな
ければならない。Laminated ceramic capacitors are mainly composed of a dielectric such as barium titanate, and the laminated ceramic substrate is made of alumina,
Glass, etc. as a main component, these are mixed with a binder and a solvent, and the mixture is made into a green sheet by a doctor blade method, a roll coater method, etc. 900-1400 ° C by applying a composition for forming a protective film and stacking multiple layers of these
It is manufactured by firing at. The firing temperature depends on the sinterability of the main component, and the required firing temperature is determined depending on the main component. The conductive film-forming composition used for the electrodes and circuits must be one that does not melt or evaporate at the firing temperature and that can be baked on the ceramic.
このような導電性被膜形成用組成物の導電材料として、
パラジウム又は焼成温度に対応してPd含有率の異なる種
々の銀−パラジウム合金が用いられている。As a conductive material of such a conductive film forming composition,
Palladium or various silver-palladium alloys having different Pd contents depending on the firing temperature are used.
近年上記のような積層セラミツクにおいて主成分をより
低温で焼結できるものにし、それにより導電性被膜形成
用組成物の導電材料も、より安価なPd含有率の低い銀−
パラジウム合金を用いることができるようにし、これら
両方のコスト節減による積層セラミツク製品の低価格化
が図られている。In recent years, it has been possible to sinter the main component in a laminated ceramic as described above at a lower temperature, thereby making the conductive material of the composition for forming a conductive film also cheaper silver having a low Pd content-
Palladium alloys can be used, and cost reductions of both of these are aimed at reducing the price of laminated ceramic products.
ところで上記導電性材料が銀−パラジウム合金の場合、
銀−パラジウムの共沈粉末が用いられている。これに銀
粉末(融点960.5℃)とパラジウム粉末(融点1552℃)
の混合物を用いると、焼成温度に昇温する途中で、銀粉
がパラジウムと合金化する前に溶融し、微少球化した
り、蒸発するからである。銀−パラジウム共沈粉末は硝
酸銀と硝酸パラジウムを所望の比率で混合し、これに炭
酸ソーダ等を加えて銀及びパラジウムの炭酸塩を沈澱さ
せ、これにホルマリン、ギ酸、ヒドラジン等の還元剤を
作用せしめて得られるもので、X線回折図からは一応合
金粉になつていると認められる。By the way, when the conductive material is a silver-palladium alloy,
A silver-palladium coprecipitated powder is used. Add to this silver powder (melting point 960.5 ° C) and palladium powder (melting point 1552 ° C).
This is because the use of the mixture of (3) causes the silver powder to melt before being alloyed with palladium, to become fine spheres or to evaporate during the heating to the firing temperature. The silver-palladium coprecipitated powder is prepared by mixing silver nitrate and palladium nitrate at a desired ratio, adding sodium carbonate and the like to precipitate silver and palladium carbonates, and then applying a reducing agent such as formalin, formic acid, and hydrazine to the mixture. It is obtained at most, and it is recognized from the X-ray diffraction pattern that it is tentatively made into alloy powder.
ところがこの共沈粉末を用いた導電性被膜形成用組成物
により電極、回路等を形成してみると、Pdが所定量含有
されているにも拘らず、局部的に銀が溶融している現象
が認められる。この為この共沈粉末を用いる場合、焼成
温度に相応する所定のPd含有率よりPdが幾分多めの銀−
パラジウム共沈粉末を用いざるを得なかつた。However, when electrodes, circuits, etc. were formed from the composition for forming a conductive film using the coprecipitated powder, a phenomenon in which silver was locally melted despite the fact that a predetermined amount of Pd was contained Is recognized. Therefore, when this coprecipitated powder is used, silver containing Pd slightly higher than the predetermined Pd content corresponding to the firing temperature is used.
There was no choice but to use a palladium coprecipitated powder.
本発明は、銀とパラジウムの割合が同一の場合には銀の
分離や蒸発を生ずる温度が、共沈粉より高く、パラジウ
ムで銀粉の全表面が隙間なく被覆された銀粉の製造方法
を提供することを課題とする。The present invention provides a method for producing silver powder in which the temperature at which silver is separated or evaporated when the ratio of silver and palladium is the same is higher than that of coprecipitated powder, and the entire surface of silver powder is covered with palladium without any gaps. This is an issue.
上記課題を解決するため、本発明が提供するパラジウム
被覆銀粉の製造方法においては、銀塩を還元剤で還元し
て銀粒子を析出せしめたままのスラリーであって、粒子
形状がほぼ球形で平均粒子径が0.1〜2μmの銀粒子が
5〜55g/の濃度で懸濁しているスラリー中に、所望量
のパラジウムを還元析出させうる量の還元剤を溶解し、
次いで該スラリーにパラジウム濃度10〜100g/のジク
ロロジアミンパラジウム溶液を添加し、温度20〜70℃で
銀粒子表面にパラジウムを還元析出せしめることを特徴
とする。In order to solve the above problems, in the method for producing a palladium-coated silver powder provided by the present invention, the slurry is a slurry in which silver particles are precipitated by reducing a silver salt with a reducing agent, and the particle shape is almost spherical and average. In a slurry in which silver particles having a particle diameter of 0.1 to 2 μm are suspended at a concentration of 5 to 55 g /, a reducing agent in an amount capable of reducing and precipitating a desired amount of palladium is dissolved,
Then, a dichlorodiaminepalladium solution having a palladium concentration of 10 to 100 g / is added to the slurry, and palladium is reduced and precipitated on the surface of silver particles at a temperature of 20 to 70 ° C.
本発明において、銀粒子の形状をほぼ球形とするのは比
表面積を出来るだけ小さくし、ビヒクル吸着量を減らす
ことにより導電性被膜形成用組成物中の導電粉末の含有
率を高め、緻密な焼成膜が得られるようにするためであ
る。銀粒子の平均粒子径は0.1〜2μmとする必要があ
る。0.1μm未満では焼成時の収縮により被膜に「ちぢ
み」が発生し易く、2μmを超えると焼成後の膜厚が厚
くなりすぎ経済的でないからである。このような銀粉は
クロロジアミン銀、硝酸銀、炭酸銀を二酸化チオ尿素、
水素化ホウ素ナトリウム、ホルマリン、ヒドラジン等で
還元することにより得ることができる。この銀粒子の表
面は5重量%以上のパラジウムにより被覆されている必
要がある。5重量%未満では銀粒子の表面がPdで完全に
被覆されないことがあり、パラジウムは多くても良いが
通常は55重量%程度までのものが良い。55重量%程度を
超えると、焼成温度が高くなり、焼成温度の低温化から
焼成温度の高いものを使用することがないからである。In the present invention, making the shape of the silver particles substantially spherical makes the specific surface area as small as possible and increases the content of the conductive powder in the composition for forming a conductive film by reducing the amount of adsorbed vehicle, thus providing a dense firing. This is so that a film can be obtained. The average particle size of silver particles needs to be 0.1 to 2 μm. If it is less than 0.1 μm, “thickness” tends to occur in the coating due to shrinkage during firing, and if it exceeds 2 μm, the film thickness after firing becomes too thick and it is not economical. Such silver powder includes silver chlorodiamine, silver nitrate, silver carbonate, thiourea dioxide,
It can be obtained by reduction with sodium borohydride, formalin, hydrazine and the like. The surface of the silver particles needs to be coated with 5% by weight or more of palladium. If the amount is less than 5% by weight, the surface of the silver particles may not be completely covered with Pd, and the amount of palladium may be large, but usually up to about 55% by weight. This is because if it exceeds about 55% by weight, the firing temperature becomes high, and the one having a high firing temperature will not be used due to the lowering of the firing temperature.
このような銀粒子のPdによる被覆は、前記のごとく銀塩
を還元剤で還元したままの銀粒子が5〜55g/の濃度で
懸濁しているスラリー中に、所望量のPdを還元析出させ
得る量の還元剤を予め溶解しておき、次いでこのスラリ
ーにPd濃度10〜100g/のジクロロジアミンパラジウム
(Pd(NH3)2Cl2)溶液を添加し、温度20〜70℃で反応
させることにより行う。The coating of such silver particles with Pd is carried out by reducing and depositing a desired amount of Pd in a slurry in which silver particles, which are obtained by reducing a silver salt with a reducing agent, are suspended at a concentration of 5 to 55 g / as described above. advance dissolving the amount of reducing agent to obtain, then Pd concentration 10 to 100 g / dichloro diamine palladium (Pd (NH 3) 2 Cl 2) to the slurry was added and reacted at a temperature 20 to 70 ° C. By.
銀粒子にPdを被覆するにあたり、銀塩を還元剤で還元し
て銀粒子を析出せしめたままのスラリーを使用するの
は、還元析出した銀粒子を濾別すると表面状態が変化し
てPdの被覆に悪影響を与え、更に銀粒子を濾別後乾燥す
ると2次粒子に凝集し、これを水に再分散しても完全に
1次粒子に戻ることはないため2次粒子にPdを被覆する
ことになり、ペースト混練時にPdで被覆されていない表
面が現れるので、いずれの場合も銀粒子の全表面を隙間
なくPdで被覆することが難しくなるからである。When coating silver particles with Pd, using a slurry in which the silver salt is reduced by reducing the silver salt with a reducing agent to precipitate the silver particles is because when the reduced and precipitated silver particles are filtered out, the surface state changes and The coating is adversely affected, and when silver particles are filtered off and dried, they aggregate into secondary particles, and even if they are redispersed in water, they do not completely return to primary particles, so secondary particles are coated with Pd. This is because a surface not covered with Pd appears during paste kneading, and in any case, it becomes difficult to cover the entire surface of the silver particles with Pd without any gap.
銀粒子のスラリー濃度を5〜55g/とするのは、5g/
未満では生産効率が悪く、逆に55g/を越えると銀粒子
の増加に応じてPdの添加濃度も高くなる結果、Pdが単独
で析出しやすくなり、不経済となるからである。The slurry concentration of silver particles is 5 to 55 g /
If it is less than 55 g /, on the contrary, if it exceeds 55 g /, the concentration of Pd added increases as the number of silver particles increases. As a result, Pd tends to precipitate alone, which is uneconomical.
本発明方法では、銀粒子の懸濁したスラリーに還元剤を
添加した後にPd源であるジクロロジアミンパラジウム
(Pd(NH3)2Cl2)の溶液を添加するのでなければ、銀
粒子の全表面をPdで被覆することが難しい。その理由は
明らかではないが、本方法では銀粒子を還元析出せしめ
たままのスラリーを用いるので、スラリー中に銀塩の還
元に用いた還元剤が若干残留しているため、先にジクロ
ロジアミンパラジウムを添加すると残留する少量の還元
剤によりPdの析出が緩慢に且つ局所的に起こり、銀粒子
の表面を被覆せずに単独で析出沈降するPd粒子が多くな
るためと考えられる。In the method of the present invention, unless the solution of dichlorodiaminepalladium (Pd (NH 3 ) 2 Cl 2 ) which is a Pd source is added after the reducing agent is added to the slurry in which the silver particles are suspended, the entire surface of the silver particles is Is difficult to coat with Pd. The reason for this is not clear, but since the method uses a slurry in which silver particles have been reduced and precipitated, the reducing agent used for reducing the silver salt remains in the slurry. It is considered that the addition of Pd causes the Pd particles to slowly and locally precipitate due to the small amount of the reducing agent remaining, and to increase the number of Pd particles that precipitate and settle alone without coating the surface of the silver particles.
Pd源としてジクロロジアミンパラジウム(Pd(NH3)2Cl
2)を使用するのは、塩化パラジウムや硝酸パラジウム
では還元反応が急激であるため析出するPd粒子の粒径が
不均一となり(パラジウム黒も生成する)、銀粒子の全
表面を隙間なく均一に被覆することが難しいのに対し
て、ジクロロジアミンパラジウムを用いると穏やかな還
元反応で均一な粒径のPd粒子が析出し、銀粒子の全表面
を隙間なく安定して被覆できるからである。又、ジクロ
ロジアミンパラジウムは還元反応が穏やかであるため、
反応温度が20℃未満では反応が遅く生産効率が低くなる
ため20℃以上の温度で反応させる必要がある。しかし、
反応温度が70℃を越えると反応が速くなり過ぎ、Pd粒子
が単独で析出して銀粒子の表面を完全に被覆できないこ
とがあるので、20〜70℃の範囲の温度で還元反応させ
る。Dichlorodiamine palladium (Pd (NH 3 ) 2 Cl as a Pd source
2 ) is used because palladium chloride or palladium nitrate causes a rapid reduction reaction so that the precipitated Pd particles have non-uniform particle sizes (palladium black is also generated) and the entire surface of silver particles is made uniform without gaps. This is because it is difficult to coat, but when dichlorodiaminepalladium is used, Pd particles having a uniform particle size are deposited by a mild reduction reaction, and the entire surface of the silver particles can be stably covered without gaps. Also, since dichlorodiamine palladium has a mild reduction reaction,
If the reaction temperature is lower than 20 ° C, the reaction is slow and the production efficiency is low, so it is necessary to react at a temperature of 20 ° C or higher. But,
If the reaction temperature exceeds 70 ° C, the reaction becomes too fast, and the Pd particles may precipitate alone to completely cover the surface of the silver particles, so the reduction reaction is carried out at a temperature in the range of 20 to 70 ° C.
Pd還元剤としては二酸化チオ尿素、水素化ホウ素ナトリ
ウム、ホルマリン、ヒドラジン等が挙げられる。銀粒子
スラリーに添加するジクロロジアミンパラジウム溶液の
Pd濃度が10g/未満では生産効率が悪く、100g/を超
えるとPdの析出粒子が大きくなつたり単独で析出したり
して銀粒子表面を完全に被覆しないことがある。Examples of the Pd reducing agent include thiourea dioxide, sodium borohydride, formalin, hydrazine and the like. Of dichlorodiamine palladium solution to be added to silver particle slurry
If the Pd concentration is less than 10 g /, the production efficiency is poor, and if it exceeds 100 g /, the precipitated particles of Pd may become large or may be precipitated alone, and the silver particle surface may not be completely covered.
このようにして得られるパラジウム被覆銀粉は、従来の
パラジウム、銀−パラジウムと同様に有機質ビヒクルと
混練してペースト状の導電性被膜形成用組成物にするこ
とができるが、前記したように本発明の銀粉は、球形で
表面全面がPdで被覆されており比較的滑らかであるため
ビヒクル吸着量が少なく、従来品よりペースト中の含有
率を高くすることができ、40〜90重量%含有せしめう
る。上記組成物はガラス粉末、無機質酸化物粉末を若干
量含んでいても良い。有機質ビヒクルとしてターピネオ
ール、ブチルカルビトール、トルエン等の溶媒にエチル
セルロース、メタクリレート樹脂などを溶解したものが
使用できる。The thus obtained palladium-coated silver powder can be kneaded with an organic vehicle in the same manner as conventional palladium and silver-palladium to form a paste-like composition for forming a conductive film. The silver powder is spherical and has a relatively smooth surface and is coated with Pd, so it has a relatively small amount of adsorbed vehicle and can have a higher content in the paste than conventional products, and can be contained in 40 to 90% by weight. . The composition may contain glass powder and inorganic oxide powder in some amounts. As the organic vehicle, it is possible to use a solvent prepared by dissolving ethyl cellulose, a methacrylate resin or the like in a solvent such as terpineol, butyl carbitol or toluene.
実験No.1 純水1にAg量80gに相当するクロロジアミン銀を溶解
して50℃に加温し、37%ホルマリン溶液120gを添加して
銀粒子を析出させた。この銀粒子の形状はほぼ球形で平
均粒子径は0.5μmであつた。次いでこの析出銀粒子を
保有する反応液に二酸化チオ尿素10gと純水を加えて全
体の液量を3にした後50℃に加温し、このスラリーに
50℃に加温されたPd量で20gのジクロロジアミンパラジ
ウム溶液400mlを添加し、10分間撹拌を続けた後沈澱物
を濾過乾燥した。分析の結果この沈澱物はAg79.1重量
%、Pd20.4重量%で、Pd被覆Ag粉の収量は97gであっ
た。又このPd被覆銀粉を顕微鏡で見ながら割って見たと
ころ、どれも表面全面が完全にPdで被覆されたものであ
った。Experiment No. 1 Silver chlorodiamine corresponding to an Ag amount of 80 g was dissolved in pure water 1 and heated to 50 ° C., and 120 g of a 37% formalin solution was added to precipitate silver particles. The silver particles had a substantially spherical shape and the average particle diameter was 0.5 μm. Next, 10 g of thiourea dioxide and pure water were added to the reaction liquid containing the precipitated silver particles to make the total liquid volume 3 and then heated to 50 ° C.
400 ml of a solution of 20 g of dichlorodiaminepalladium in the amount of Pd heated to 50 ° C. was added, and the precipitate was filtered and dried after continuing stirring for 10 minutes. As a result of analysis, the precipitate was Ag 79.1% by weight and Pd 20.4% by weight, and the yield of Pd-coated Ag powder was 97 g. When the Pd-coated silver powder was cracked with a microscope, all of the surfaces were completely coated with Pd.
実験No.2〜5 実験No.1と同様にして銀粒子を得た後、二酸化チオ尿素
の添加量、スラリー液量、ジクロロジアミンパラジウム
の濃度、添加量、反応温度を種々変えてPd被覆Ag粉を調
製した。Experiment Nos. 2 to 5 After obtaining silver particles in the same manner as Experiment No. 1, Pd-coated Ag was variously changed by changing the addition amount of thiourea dioxide, the amount of slurry liquid, the concentration of dichlorodiamine palladium, the addition amount, and the reaction temperature. A flour was prepared.
実験No.6〜7 Pdの還元剤として水素化ホウ素ナトリウムを用いた他は
実験No.2〜5と同様に行ない、Pd被覆Ag粉を得た。これ
らのPd被覆銀粉を顕微鏡で見ながら割って見たところ、
どれも表面全面が完全にPdで被覆されたものであった。Experiment Nos. 6 to 7 Pd-coated Ag powder was obtained in the same manner as Experiments 2 to 5 except that sodium borohydride was used as the reducing agent for Pd. When I split these Pd-coated silver powders with a microscope,
All of the surfaces were completely covered with Pd.
製造条件及び得られたPd被覆Ag粉の分析値をまとめて第
1表に示す。Table 1 shows the production conditions and the analytical values of the obtained Pd-coated Ag powder.
実験No.8〜14 実験No.1で得られたPd被覆銀粉と、該銀粉と同じAg/Pd
比になるように調製されたAg−Pd共沈粉とを、エチルセ
ルロースのターピネオール溶液をビヒクルに用い、粉末
含有率の種々異なるそれぞれのペーストを調製し、アル
ミナ基板上に所定のパターンでスクリーン印刷し、ピー
ク温度1000℃のベルト炉で焼成し、比抵抗を測定した。 Experiment Nos. 8 to 14 Pd-coated silver powder obtained in Experiment No. 1 and the same Ag / Pd as the silver powder.
The Ag-Pd coprecipitated powder prepared so as to have a ratio was prepared by using a terpineol solution of ethyl cellulose as a vehicle to prepare respective pastes having different powder contents, and screen-printed in a predetermined pattern on an alumina substrate. The specific resistance was measured by firing in a belt furnace with a peak temperature of 1000 ° C.
第2表からPd被覆Ag粉の含有率が40重量%未満では焼成
面が緻密でなく、所望の抵抗値が得られないこと、又90
重量%を越えるとスクリーン印刷に必要な粘性を超えて
しまうことが判る。一方Ag−Pd共沈粉によると粉末含有
率がもつと狭く、50〜85重量%で、50重量%より少ない
比抵抗∞のものは焼成面にAgの蒸発と、微少球化が認め
られ、85重量%を超えるとスクリーン印刷ができなくな
つた。 From Table 2, if the content of Pd-coated Ag powder is less than 40% by weight, the fired surface is not dense and the desired resistance value cannot be obtained.
It can be seen that if the content exceeds the weight percentage, the viscosity required for screen printing is exceeded. On the other hand, according to the Ag-Pd co-precipitated powder, the powder content is narrow, 50-85 wt%, the specific resistance ∞ less than 50 wt%, the evaporation of Ag on the fired surface, microspheres are observed, If it exceeds 85% by weight, screen printing cannot be performed.
実験No.15〜24 実験No.1〜7のPd被覆Ag粉及びこれらとAg/Pd比が同等
のAg−Pd共沈粉を60重量%含有するペースト状組成物を
調製し、実験No.8〜14と同様のパターンを用いてアルミ
ナ基板上にスクリーン印刷し、種々の温度で焼成し比抵
抗を測定した。Experiment Nos. 15 to 24 Pd-coated Ag powders of Experiments Nos. 1 to 7 and paste-like compositions containing 60% by weight of Ag-Pd coprecipitated powders having the same Ag / Pd ratio as those were prepared. Screen printing was performed on an alumina substrate using the same pattern as 8 to 14, and the specific resistance was measured by firing at various temperatures.
第3表の結果よりPd被覆Ag粉は共沈粉に比べて耐熱性が
約50℃優れていることが判る。なお比抵抗が∞のものは
いずれも焼成面にAgの蒸発と微小球化が認められた。 From the results in Table 3, it can be seen that the Pd-coated Ag powder is superior in heat resistance to the coprecipitated powder by about 50 ° C. In all samples with a specific resistance of ∞, evaporation of Ag and microsphere formation were observed on the fired surface.
本発明により、表面が完全にパラジウムで被覆された銀
粉が得られるようになり、このパラジウム被覆銀粉を用
いるとPd含有率が同一であつても共沈粉に比べて銀の分
離温度が高く、従つて従来よりPd含有量が少なくても、
従来のPd含有量の多い組成物と同温度で焼成でき、導電
性の良い導電膜を形成できる経済的に優れた導電性被膜
形成用組成物を得ることができる。According to the present invention, it becomes possible to obtain a silver powder whose surface is completely coated with palladium, and when this palladium-coated silver powder is used, the separation temperature of silver is higher than that of coprecipitated powder even if the Pd content is the same, Therefore, even if the Pd content is lower than before,
It is possible to obtain an economically excellent composition for forming a conductive film, which can be fired at the same temperature as a conventional composition having a large Pd content and can form a conductive film having good conductivity.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭58−123601(JP,A) 特開 昭56−150101(JP,A) 特開 昭58−37166(JP,A) 特開 昭64−75603(JP,A) ─────────────────────────────────────────────────── ─── Continuation of front page (56) Reference JP-A-58-123601 (JP, A) JP-A-56-150101 (JP, A) JP-A-58-37166 (JP, A) JP-A 64-- 75603 (JP, A)
Claims (1)
めたままのスラリーであって、粒子形状がほぼ球形で粒
子径が0.1〜2μmの銀粒子が5〜55g/の濃度で懸濁
している該スラリー中に、所望量のパラジウムを還元析
出させ得る量の還元剤を予め溶解し、次いで該スラリー
にパラジウム濃度10〜100g/のジクロロジアミンパラ
ジウム溶液を添加し、温度20〜70℃で前記銀粒子の全表
面にパラジウムを還元析出せしめることを特徴とするパ
ラジウム被覆銀粉の製造方法。1. A slurry which is prepared by reducing silver salt with a reducing agent to deposit silver particles, and has a particle shape of approximately spherical and a particle diameter of 0.1 to 2 μm at a concentration of 5 to 55 g /. In the suspended slurry, an amount of a reducing agent capable of reducing and precipitating a desired amount of palladium is previously dissolved, and then a dichlorodiamine palladium solution having a palladium concentration of 10 to 100 g / is added to the slurry at a temperature of 20 to 70. A method for producing a palladium-coated silver powder, which comprises reducing and depositing palladium on the entire surface of the silver particles at 0 ° C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63024616A JPH0796681B2 (en) | 1988-02-04 | 1988-02-04 | Method for producing palladium-coated silver powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63024616A JPH0796681B2 (en) | 1988-02-04 | 1988-02-04 | Method for producing palladium-coated silver powder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01198403A JPH01198403A (en) | 1989-08-10 |
| JPH0796681B2 true JPH0796681B2 (en) | 1995-10-18 |
Family
ID=12143083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63024616A Expired - Lifetime JPH0796681B2 (en) | 1988-02-04 | 1988-02-04 | Method for producing palladium-coated silver powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0796681B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6396001B2 (en) * | 2013-04-08 | 2018-09-26 | アオイ電子株式会社 | Circuit board and thermal print head |
| US9530534B2 (en) | 2015-04-03 | 2016-12-27 | C3Nano Inc. | Transparent conductive film |
| CN113275585B (en) * | 2021-05-24 | 2023-05-19 | 北京理工大学珠海学院 | A kind of nano-nickel wire and its preparation method |
| CN115555557A (en) * | 2022-08-29 | 2023-01-03 | 南通领跑者新材料科技有限公司 | Preparation method of composite flake silver powder and low-resistance conductive paste containing the silver powder |
| JP2024043085A (en) * | 2022-09-16 | 2024-03-29 | 三井化学株式会社 | Conductive composition, circuit board, electrical device and manufacturing method thereof |
| CN116833420A (en) * | 2023-06-19 | 2023-10-03 | 武汉船用电力推进装置研究所(中国船舶集团有限公司第七一二研究所) | Preparation method of silver-palladium alloy powder with core-shell structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56150101A (en) * | 1980-04-18 | 1981-11-20 | Shinroku Kawakado | Preparation of powder coated with noble metal |
| JPS5837166A (en) * | 1981-08-27 | 1983-03-04 | Shinroku Kawakado | Production of noble metal coated powder |
| JPS58123601A (en) * | 1982-01-18 | 1983-07-22 | ティーディーケイ株式会社 | Manufacture of conductive metal powder |
| JPS6475603A (en) * | 1987-09-18 | 1989-03-22 | Tanaka Precious Metal Ind | Fine composite silver-palladium powder and production thereof |
-
1988
- 1988-02-04 JP JP63024616A patent/JPH0796681B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01198403A (en) | 1989-08-10 |
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