JPH0799400A - Substrate holding and fixing device - Google Patents

Abstract

(57) [Summary] [Purpose] The purpose is to install backup pins collectively while avoiding obstacles when holding and fixing the board. [Structure] The backup pin temporarily fixed by an electromagnet to the board that has been conveyed is pressed against the backup pin by a component so that the electric circuit of the electromagnet opens at the same time. The main fixing is performed by increasing the voltage of. [Effect] Even on the supporting surface mounting substrate, the backup pins can be collectively installed only at positions where stress is not applied to the components.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to holding and fixing of a printed circuit board, and more particularly to a technique effective when applied to a device having parts mounted on a supporting surface.

[0002]

2. Description of the Related Art As a conventional method for holding and fixing a substrate, there is well known a method in which a backup pin is pressed against a substrate and then fixed at a position in contact with a substrate or a component as described in JP-A-4-64297.

[0003]

In the conventional method, the backup pin is pressed against the substrate and fixed at that position.
When a component is mounted on the board supporting surface, if there is a backup pin on the component, stress is applied to the component during work such as component mounting or solder paste printing, resulting in low reliability.

It is an object of the present invention to solve the above problems while making the best use of a short-time operation by collective operation.

[0005]

In order to solve the above problems, according to the present invention, when a substrate on which a component is mounted is conveyed on a supporting surface, a backup base having backup pins temporarily fixed to the upper end is raised by an electromagnet. , The upper end of the backup pin is brought into contact with the substrate supporting surface.

At this time, when the backup pin is pushed down by the mounted component, the electric circuit of the electromagnet is cut off, and the backup pin at that position drops.

Thereafter, the main fixing is performed by increasing the voltage applied to the electromagnet.

[0008]

[Function] It is not necessary to prepare backup pin data for each type by directly applying the backup pin to the substrate and eliminating the unnecessary backup pin.

Further, by collectively performing the above operation, the arrangement of the backup pins is completed in a short time.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a detailed view of the backup mechanism. The backup pin 2 is composed of a non-conductive pin A and a stopper B which is a conductive material and has a small holding force, and can be slid up and down. .

An electric wire serving as an electric circuit of the electromagnet 9 is wired in B, and the circuit is closed only when the backup pin 2 is attracted by the electromagnet 9.

2 and 3 show an overall view of the backup mechanism. FIG. 2 shows a state before setting the backup pin 2, and FIG. 3 shows a state at the time of setting.

Next, the operation of the embodiment of the present invention having the above configuration will be described.

First, when the first substrate is transferred to a predetermined position by the transfer rail 1, the backup pin push-up plate 5 is lifted by the plate drive unit 6 as shown in FIG.
The backup pin 2 is pushed up to the upper end.

At this time, the backup pin 2 is held at the upper end by the electromagnet control section 7 with a minimum force that does not drop even if the backup pin pushing plate 5 is removed.

Next, the backup table drive unit 4 raises the backup table 3 so that the upper ends of the backup pins 2 are at the same level as the substrate supporting surface.

At this time, if there is a mounted component on the substrate supporting surface as shown in FIG. 3, the component hits the raised backup pin 2 and the backup pin 2 is pushed down.

As a result, the electric circuit of the electromagnet holding the pin is opened and the backup pin 2 is lowered to the position of the backup pin pushing plate 5.

After that, the holding force of the electromagnet is set to "strong" by the electromagnet control unit 7 and the backup pin 2 is permanently fixed.

When the same substrate is continuously worked, the backup table driving unit 4 moves only the backup table 3 up and down to change the type of the board. After the backup table 3 is lowered, The backup pin push-up plate 5 is raised again to return to the state of FIG. 2 and the above operation is performed again.

[0022]

【The invention's effect】 [Brief description of drawings]

FIG. 1 is a detailed view of a backup mechanism of a substrate holding mechanism according to an embodiment of the present invention.

FIG. 2 is a side view showing a preparatory stage of the substrate holding mechanism according to the embodiment of the present invention.

FIG. 3 is a side view showing a holding and fixing state of the substrate holding mechanism according to the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Conveying rail, 2 ... Backup pin, 3 ... Backup stand, 4 ... Backup stand drive part, 5 ... Backup pin pushing plate, 6 ... Plate drive part, 7 ... Electromagnet control part, 8 ... Slide bearing, 9 ... Electromagnet.

Claims (3)

[Claims] 1. A substrate holding and fixing device for lifting a substrate which is guided in a guide groove formed in a pair of transport rails and preventing the substrate from warping against pressure from above. A support is provided below the transport rail, and a plurality of cylinder chambers that open vertically are formed in this support. A magnetic pin having a non-magnetic backup pin having conductivity and no residual magnetism is formed in each cylinder chamber. A support body combining the above is arranged, and an electromagnet is arranged in the upper part of the cylinder chamber, in which the backup pin can be moved up and down. One end of the electric circuit in the electromagnet is installed below the electromagnet, and the circuit is closed only when the known conductive support is in contact with the electromagnet. A substrate holding and fixing device having the above structure. 2. A substrate holding device for holding a substrate by using the method according to claim 1, and raising and lowering the entire holding mechanism to accommodate substrates having different plate thicknesses. 3. A substrate holding device according to claim 1, further comprising a mechanism for absorbing a subtle unevenness of the substrate by sandwiching a conductive elastic body in the fixing portion to prevent the backup pin from dropping unnecessarily. .