JPH0810197Y2 - 半導体素子収納用パッケージ - Google Patents

半導体素子収納用パッケージ

Info

Publication number
JPH0810197Y2
JPH0810197Y2 JP1989086046U JP8604689U JPH0810197Y2 JP H0810197 Y2 JPH0810197 Y2 JP H0810197Y2 JP 1989086046 U JP1989086046 U JP 1989086046U JP 8604689 U JP8604689 U JP 8604689U JP H0810197 Y2 JPH0810197 Y2 JP H0810197Y2
Authority
JP
Japan
Prior art keywords
convex portion
semiconductor element
insulating frame
metal
metal base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989086046U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0325242U (cs
Inventor
敏幸 千歳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1989086046U priority Critical patent/JPH0810197Y2/ja
Publication of JPH0325242U publication Critical patent/JPH0325242U/ja
Application granted granted Critical
Publication of JPH0810197Y2 publication Critical patent/JPH0810197Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
JP1989086046U 1989-07-21 1989-07-21 半導体素子収納用パッケージ Expired - Lifetime JPH0810197Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989086046U JPH0810197Y2 (ja) 1989-07-21 1989-07-21 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989086046U JPH0810197Y2 (ja) 1989-07-21 1989-07-21 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0325242U JPH0325242U (cs) 1991-03-15
JPH0810197Y2 true JPH0810197Y2 (ja) 1996-03-27

Family

ID=31635462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989086046U Expired - Lifetime JPH0810197Y2 (ja) 1989-07-21 1989-07-21 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH0810197Y2 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100573619C (zh) * 2005-12-14 2009-12-23 学校法人中村产业学园 Led道路交通信号灯

Also Published As

Publication number Publication date
JPH0325242U (cs) 1991-03-15

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