JPH0810459A - Electronic part working tool - Google Patents

Abstract

PURPOSE:To surely catch chips for improving the operability of working electronic parts by providing an electronic part working tool with a suction device provided with a guide member consisting of guide plates projecting downward and approaching each other toward the lower side between the pressure reducing chamber and a chip container. CONSTITUTION:A suction device 6 for sucking chips caught in a cover 3 is provided with a vacuum device 61 for sucking chips, a pressure reducing chamber 51 opened downward while high pressure air and chips are ejected from the vacuum device 61 and the air is filtered and ejected and a removably attachable chip container 63 opening upward below the pressure reducing chamber 51. A guide member 52 consisting of guide plates projecting downward and approaching each other toward the lower side is interposed between the pressure reducing chamber 51 and the chip container 63. Thus, the guide member 52 is squeezed into the lower side so that the transported chips can be deposited in a predetermined position of the chip container 63 without flying up.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is preferably applied to cutting unnecessary lead terminals from a wiring board after soldering, and particularly, scattering of chips such as the lead terminals and vinyl coating of lead wires. The present invention relates to a processing tool for electronic parts that can prevent

[0002]

2. Description of the Related Art As described above, in a processing tool for processing electronic parts such as cutting unnecessary lead terminals from a wiring board after soldering or cutting vinyl coating of lead wires, A typical conventional technique in which chips such as vinyl coating are prevented from scattering is, for example, an actual Kaihei 1-15.
Shown at 7669.

FIG. 10 is a plan view showing the structure of a nipper, which is a conventional processing tool. The nipper main body 80 is attached between a tooth portion 81 for cutting the lead terminal and the like, a grip 82 gripped by an operator, and a base end portion 83 of the grip 82, and a pair of teeth of the tooth portion 81 are not attached. And a compression spring 84 for holding the two in a separated state during a cutting operation.

On the upper surface of the nipper body 80 thus constructed, a cover 90 for preventing scattering of the chips is provided.
Is installed. The cover 90 includes an upper plate 91 facing the teeth 81 of the nipper body 80, and a side plate 92 for attaching the upper plate 91 to one of the pair of grips 82 of the nipper body 80 at the base end portion 83. Mounting piece 93
It is comprised including.

When the lead terminal is cut, the chips are scattered in a direction substantially perpendicular to the tooth portion 81, collide with the upper plate 91 and collide with the concave portion 85 on the back surface of the tooth portion 81 of the nipper body 80. Is collected in the space between the upper plate 91 and the upper plate 91.

[0006]

In the prior art as described above, most of the cut chips are the upper plate 9 serving as a barrier.
It is possible to prevent scattering by hitting 1. However, since there is no means for forcibly capturing the chips, some of the chips exceed the upper plate 91 and the recess 85.
There is a problem of jumping out from. According to the experiments by the inventor of the present invention, in such a conventional technique, about 70% of chips can actually be collected.

Further, if the cutting operation is continuously carried out without removing the chips in the recess 85, the chips will drop when the tooth portion 81 is opened and adhere to the wiring board to cause a failure. There is a fear. On the other hand, in order to prevent such inconvenience, every time the lead terminal is cut, the nipper main body 80 is moved to the chip collection container to remove the chips, which leads to poor workability. There is also the problem of a significant decrease.

An object of the present invention is to provide an electronic component processing tool which can reliably capture chips and improve the workability of the electronic component processing operation.

[0009]

SUMMARY OF THE INVENTION According to the present invention, a processing tool main body for processing a lead terminal or the like of an electronic component, and a chip of an electronic component mounted on the processing tool main body and cut off by the processing are captured. A cover and a suction device for sucking chips captured in the cover, wherein suction means for sucking the chips, high-pressure air and chips from the suction means are discharged, and the air is filtered. A decompression chamber opened downward and detachably provided below the decompression chamber while being discharged, and a chip container opened upward, interposed between the decompression chamber and the chip container, and projected downward. And a suction device provided with a guide member composed of a guide plate that comes closer to each other toward the lower side.

Further, according to the present invention, a detection means mounted on the processing tool main body and detecting a processing operation of the processing tool main body with respect to the electronic component, and the suction means are driven in response to a detection result of the detection means. And a driving means.

Furthermore, in the detection means of the present invention, the contact is closed by being sandwiched by the base end of the grip of the processing tool at the time of the processing operation of the processing tool main body or immediately before the processing operation of the electronic component. It is a switch.

[0012]

According to the present invention, a cover connected to the suction means of the suction device is attached to a processing tool body such as a nipper for performing processing such as cutting of lead terminals of electronic parts and cutting of coating. The chips that have been cut off by the processing are captured by the cover and further collected in the chip container of the suction device that is separate from the processing tool body.

Therefore, since the chips are forcibly captured, it is possible to prevent the chips from scattering and reliably capture them. Further, the chips do not remain in the processing tool body, and therefore, even if the worker does not perform the work of removing the chips each time after finishing the cutting work, the chips in the pre-processing are The workability can be markedly improved without fear of being attached to the electronic component to be processed.

Further, according to the invention, the suction device comprises the suction means, a decompression chamber, a chip container, and a guide member. The suction means sucks the chips captured in the cover and discharges them together with the high-pressure air into the decompression chamber. The decompression chamber is provided with a filter means realized by a sponge, felt, or the like, filters only the high-pressure air and discharges it to the outside, and drops chips into a chip container below. The swarf container is configured to be detachable from the suction device main body, for example, in a drawer type, and a guide member is interposed between the opening of the swarf container and the opening of the decompression chamber. The guide member is composed of a combination of guide plates that project downward and are closer to each other toward the lower side.

Therefore, when the chips that are swirling in the decompression chamber fall into the chip container, they are guided by the guide member and collected near the center of the chip container.
As a result, it is possible to prevent a problem that the chips are fitted into the peripheral edge portion of the opening of the chip container, the chip container cannot be attached or detached, or the chips are ejected from the gap between the chip container and the main body to the outside. can do.

Further, preferably, in order to detect the cutting operation of the processing tool body, a detection means realized by a switch or the like is provided. The contact of the switch is closed, for example, by being sandwiched by the base end portion of the grip of the processing tool body during or immediately before the processing operation of the processing tool body. The drive means drives and controls the suction means in response to the detection result of the detection means.

Therefore, when the machining is not performed, the suction means is at rest, and at the time when the machining is started and the chips are scattered, the suction means has already started the suction, whereby the air consumption, Electric power cost, noise, etc. can be suppressed and chips can be reliably captured.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an overall configuration diagram of a processing tool according to an embodiment of the present invention. In this processing tool, when the lead terminal 13 of the electronic component 12 soldered to the wiring board 1 is cut by the nipper 2 which is the processing tool main body, the chips generated thereby are not scattered by the cover 3. The drive circuit 7 drives the suction device 6 in response to the output from the switch 4 that detects the cutting operation and captures the chips captured by the cover 3 via the suction hose 5 and the suction device 6 It is collected in the chip container 63 inside.

FIG. 2 is an enlarged cross-sectional view showing the essential parts of the nipper 2 and the cover 3, and FIG. 3 is a bottom view of the cover 3, provided that FIG. 2 is seen from the section line A--A of FIG. It is a figure. The nipper 2 includes a pair of left and right tooth portions 21a and 21b, a pair of left and right grips 22a and 22b held by an operator,
The grip 22a, 22b is provided with a compression spring 24 interposed between the base end portions 23a, 23b. The left side tooth portion 21a and the right side grip 22b are integrally formed, and similarly, the right side tooth portion 21b and the left side grip 2 are formed.
It is integrally formed with 2a and is pivotally supported by a pivot 25 so that the teeth 21a and 21b can be opened and closed.

An insertion hole 25a penetrating in the axial direction is formed in the pivot 25, and a guide slope 25b is formed in the opening of the insertion hole 25 on the side opposite to the cover 3 by counterboring or the like. Has been formed. Furthermore, a rotation restraining pin hole 26 is formed facing the cover 3 at the base end portion 23a.

The main body 30 of the cover 3 has the tooth portion 21.
A suction port 31 facing the back surface of a, 21b is formed,
A cylindrical joint 34 made of brass or the like is press-fitted in the vicinity of the end of the suction port 31 opposite to the teeth 21a, 21b. The suction hose 5 is connected to the joint 34, and a negative pressure from the suction device 6 is supplied to the suction port 31.

On the bottom surface of the cover 3 facing the nippers 2, a rotation inhibiting pin 33 fitted in the rotation inhibiting pin hole 26 is erected. The rotation inhibiting pin 33 is provided in the rotation inhibiting pin hole. In the state where it is fitted in 26, the pivot 2
5, the countersunk screw 27, which is inserted through the through hole 25a in FIG.
The cover 3 is attached to the upper surface of the nipper 2 by being screwed on. At this time, the plate portion 27a of the plate screw 27
Is guided by the guide slope 25b, and the plate screw 2
The center of 7 is aligned with the center of the pivot 25. Therefore, the cover 3 is accurately positioned and fixed on the upper surface of the nipper 2.

A switch 4 as a detecting means is attached to the rear portion of the cover 3. The switch 4 includes a main body 41 accommodating a contact S2, which will be described later, and a lever 42 that is pressed by the base end 23a to close the contact S2 when the grips 22a and 22b are closed. Cables 43 and 46 for outputting the detection result to the drive circuit 7,
It comprises a pair of connectors 44, 45 capable of electrically connecting / disconnecting the cables 43, 46 to / from each other. The cable 46 is connected to the drive circuit 7.

The body 30 of the cover 3 is made of a transparent resin, for example, an acrylic resin, by integral molding or shaving in order to improve workability during cutting work. Further, preferably, a carbon-based antistatic agent may be mixed with the resin to be molded. The suction hose 5 has a length of, for example, about 1.2 m, and is formed of a material having a flexibility, a thickness that does not contract with negative pressure, and a wall thickness.
The cable 46 is integrally attached to the suction hose 5.

Therefore, when the workability deteriorates due to the deterioration of the visibility of the back surfaces of the teeth 21a, 21b due to the attachment of scratches or dirt to the main body 30, the dish screw 27 is removed and the suction hose 5 is removed from the joint 34. The main body 30 can be easily replaced by detaching the connector 45 and the connector 44 from each other.

The suction device 6 is generally provided with a vacuum device 61, an air valve 62, a decompression chamber 51, a guide member 52, and a chip container 63. The air valve 62 is realized by a solenoid valve or the like, and is opened / closed by the drive circuit 7. This air valve 6
2, high-pressure compressed air from a pressure source 64 such as a compressor is supplied, and when the air valve 62 is opened, the compressed air is supplied to the vacuum device 61 via a pipe line 65. . Vacuum device 61
Is connected to the suction hose 5 via a conduit 66.

The vacuum device 61 generally has a double cylinder structure, and the inner cylinder 67 connects the suction hose 5 connected via the pipe line 66 to the decompression chamber via the pipe line 68. 5
Connect to 1. Compressed air is supplied to the inside of the outer cylinder 69 provided so as to surround the inner cylinder 67 via the pipe line 65. In the inner cylinder 67, one or a plurality of through holes 70 are formed obliquely from the outer peripheral surface to the inner peripheral surface from the conduit 66 side toward the conduit 68 side. Therefore, when the air valve 62 is opened, a compressed air flow due to the compressed air through the pipe line 65 is generated in the direction of the pipe line 68, whereby the inside of the suction hose 5 becomes a negative pressure from the pipe line 66 and the inside of the cover 3 is formed. Negative pressure is supplied to the suction port 31 of.

FIG. 4 shows a decompression chamber 51 and a chip container 63.
It is a perspective view for explaining the neighborhood. The chip container 6
3 has an opening at the top and is configured to be detachable from the main body 53 of the suction device 6 in a pull-out manner. This chip container 6
3 above the decompression chamber 5 from which high-pressure air and chips are discharged from the vacuum device 61 through the pipe line 68.
1 is formed. The decompression chamber 51 has an opening downward facing the chip container 63, and a filter 54 made of sponge, felt or the like is provided on the upper portion. Therefore, only the compressed air discharged into the decompression chamber 51 is discharged into the main body 53.

Between the decompression chamber 51 and the chip container 63,
The guide member 52 is interposed. FIG. 5 shows the guide member 5
2 is a plan view of FIG. 2, and FIG. 6 is a side view thereof. The guide member 52 includes a tubular portion 55 that is airtight along the inner peripheral surface of the side wall 51a of the decompression chamber 51, and a guide portion 56 that extends below the tubular portion 55, and is integrally formed by sheet metal processing or resin molding. ing. The tubular portion 55 has a shape in which a part of one side surface of the square tube is cut out, and the remaining portion 55a of the one side surface is formed by spot welding or the like on the inner peripheral surface of the side wall 51a. Fixed, thus the guide member 52 is
a.

The guide portions 56 are combined so that the three guide plates 57 are closer to each other as the guide plates 57 are located on the lower side of the cylindrical portion 55, that is, as they are closer to the chip container 63. Is configured. Therefore, the guide portion 56 is narrowed down toward the lower side to form an opening 58 that is sufficiently narrower than the opening area of the decompression chamber 51.

Therefore, the chips carried along with the high-pressure compressed air from the pipe 68 into the decompression chamber 51 are swirled in the decompression chamber 51 as the compressed air is discharged through the filter 54. It can be gradually lowered from the flying state, collected by the guide plate 56 toward the narrow opening 58 side, and can be deposited from the opening 58 to the vicinity of a predetermined position of the chip container 63 without rising.

Therefore, the pipe 68 is directly connected to the chip container 6
It is possible to prevent the chips from jumping out from the attachment / detachment port of the chip container 63 to / from the main body 53, which may occur when the chips are connected to the device 3, and to reliably collect the chips. It is possible to prevent a problem that the chip container 63 is caught between the container 63 and the main body 53 and cannot be pulled out from the main body 53.

FIG. 7 is a plan view of the nipper 2 for explaining the operation of the switch 4, and FIG. 8 is a sectional view in a state corresponding to FIG. 7, viewed from the section line BB in FIG. There is. The contact portion S2 includes the lever 42 and the contact 40. In the state where the tooth portions 21a and 21b are opened as shown in FIG. 7 (2), the lever 42 is
Is separated from the contact 40 by a compression spring 47 in the body 41. On the other hand, as shown in FIG. 7 (1), when the teeth 21a and 21b are closed, the lever 42 repels the compression spring 47 by the base end 23a as shown in FIG. 8 (1). It is pressed and displaced against the force and contacts the contact 40.

Depending on the mounting position of the switch 4, the tooth portion 21
The timing at which the lever 42 contacts the contact 40 when the a and 21b are closed is different, and the tooth portions 21a and 21b sandwich the lead terminal 13, that is, the tooth portions 21a and 21b.
The contact 40 can already be brought into contact with the lever 42 even when b is slightly open. That is, the suction start timing of the suction device 6 can be changed by adjusting the mounting position of the switch 4. In this embodiment, in order to surely suck the chips of the cut lead terminal 13, the suction start timing of the vacuum device 61 is set so that the lead terminal 13 is sandwiched, that is, immediately before the cutting. The mounting position is adjusted to reduce the delay in the negative pressure generation timing due to the suction hose 5 or the like.

That is, the distance x between the contact 40 and the portion of the lever 42 that first contacts the contact 40 is determined by the lead terminal 1
It is set so that it becomes exactly zero before the cutting of 3. Therefore, when the lead terminal 13 is sandwiched, first the lever 4
8 (1) when the above-mentioned portion of the contact point 2 and one end of the contact point 40 on the upper left side in FIG. The lever 42 is in contact with the entire left side surface of the contact 40, as shown in FIG. If the diameters of the lead terminals 13 are not uniform, this distance x may be set so that the contact portion S2 becomes conductive at least before completely cutting any lead terminal.

FIG. 9 is an electric circuit diagram showing a specific structure of the drive circuit 7. The drive circuit 7 is roughly configured to include a power supply input section 71, a DC power supply section 72, and a control section 73. The power input unit 71 is a power switch S1.
And a fuse F1 are provided, and the commercial frequency power supply 74
AC power of 100 V, for example, is supplied to the solenoid valve SV1 for driving the air valve 62 and the DC power supply 72.

The DC power supply section 72 is a full-wave rectifier circuit 7 including a transformer TR and a bridge circuit of diodes D1 to D4.
5, a smoothing capacitor C1, a light emitting diode D5 for a pilot lamp, and a current limiting resistor R1 of the light emitting diode D5. The transformer TR steps down the input voltage of 100V from the power supply input section 71 to, for example, 12V and supplies it to the full-wave rectification circuit 75. The full-wave rectifier circuit 75 rectifies the input voltage into direct current and
Derived between 6 and 77. A smoothing capacitor C1 is interposed between the lines 76 and 77, so that the DC power source unit 72 transfers to the relay coil L1 of the control unit 73.
A DC voltage of V can be supplied. Further, a series circuit of a resistor R1 and a light emitting diode D5 is interposed between the lines 76 and 77. Therefore, when the power switch S1 is turned on and the drive circuit 7 is energized, the light emitting diode is turned on. D5 lights up.

In the control unit 73, the lines 76 and 77 are
The contact portion S2 and the relay coil L1 are interposed in series between them, and the relay coil L1 is excited when the contact portion S2 becomes conductive in the state where the DC voltage is drawn between the lines 76 and 77. . In the relay switch S3 corresponding to the relay coil L1, the relay switch S3 and the solenoid valve SV1 are connected in series and are connected in parallel with the primary winding of the transformer TR. Therefore,
When the relay coil L1 is excited, the relay switch S3
Is conducted, the solenoid valve SV1 is excited, and the air valve 62 is opened. Also, the relay coil L
1, a diode D6 is connected in parallel, and this diode D6 absorbs the counter electromotive force generated when the power supply to the relay coil L1 is cut off.

As described above, according to this embodiment, the nipper 2
Since the chips 3 are captured by the cover 3 facing the tooth portions 21a and 21b, and the chips are sucked by the suction device 6 to be collected, the chips are not scattered from the nippers 2.
The chips can be reliably collected, and according to an experiment by the inventor of the present invention, about 98% thereof can be collected, and the collection efficiency can be remarkably improved as compared with the prior art. . In addition, since the back surfaces of the teeth 21a and 21b are always kept clean, the chips are removed from the wiring board 1 without the troublesome cleaning work of the chips every time the operator finishes the cutting work. There is no risk of adhesion, and the occurrence of defective products can be suppressed and workability can be improved.

Furthermore, since the suction operation is automatically performed by the switch 4, it is not necessary to perform a special switch operation, and the workability can be improved. Furthermore, since the suction device 6 operates only when suction is required, problems such as air consumption, power cost, and noise can be minimized as compared with the case where suction is always performed. Furthermore, since the suction device 6 is operated before the cutting of the lead terminal 13 is completed, there is no response delay due to the suction hose 5, etc., and the cut chips are quickly sucked without staying in the cover 3. Pressure source 6
The effect can be further exerted when the suction capacity is low due to the influence of the discharge pressure of No. 4 and the like.

The chips discharged from the vacuum device 61 together with the high-pressure compressed air are first filtered by the filter 54 in the decompression chamber 51 to guide the downward chips to the guide member 52. The portions 56 gather and drop into the predetermined position of the chip container 63 from the narrow opening 58 of the guide member 52, so that the chips rise up in the chip container 63 and the chip container 63 and the main body 53.
It is possible to prevent such a problem that the chips can be ejected to the outside from the gap or the chips can be caught in the gap and the chip container 63 cannot be pulled out.

Needless to say, the suction operation may be started after cutting. Further, the detecting means is not limited to the switch 4 described above, and a piezoelectric element may be provided in the gripping portions of the grips 22a and 22b to detect the pressure applied from the hand of the worker at the time of cutting, and a light receiving / emitting element or the like The cutting operation may be detected by using other means.

Furthermore, the present invention is not limited to the nippers 2,
It may be carried out with pliers or the like, and it can be suitably carried out for other processing tools such as a stripper for cutting off the coating of the lead wire.

[0044]

As described above, according to the present invention, a cover connected to a suction device is attached to a processing tool main body for performing processing such as cutting of lead terminals and the like of electronic parts and cutting of coating.
Since the chips cut by the processing are captured by the cover and are forcibly sucked into the suction device which is separate from the processing tool body, scattering of the chips can be prevented and the chips can be reliably captured. Further, the chips do not remain in the processing tool body, and therefore, even if the worker does not perform the work of removing the chips each time after finishing the cutting work, the chips in the pre-processing are Workability can be markedly improved without fear of being attached to an electronic component to be processed.

Further, according to the present invention, the suction device comprises a suction means, a decompression chamber, a chip container, and a guide member, and is constructed from chips and high-pressure air discharged from the suction means. , Between the decompression chamber that filters out only the high-pressure air and discharges it to the outside, and drops the chips into the lower chip container, and the chip container, projects downward, and becomes closer to the lower side. Since a guide member that is formed by combining guide plates that come close to each other is interposed, when the chips that are swirling in the decompression chamber fall into the chip container, the chips are guided by the guide member. The chips are collected near the predetermined position of the container, whereby the chips are fitted into the peripheral edge portion of the opening of the chip container, and the chip container cannot be attached or detached, or the gap between the chip container and the main body is eliminated. Jump out from It is possible to prevent problems such as Mau.

Further preferably, a detection means realized by a switch or the like is provided for detecting the cutting operation of the processing tool body, and the detection result of the detection means is provided during or immediately before the processing operation of the processing tool body. In response to, the drive means controls the drive of the suction means, so that the suction means is at rest when the machining is not performed, and when the chips are scattered when the machining is started, the suction means has already sucked. Since it has started, it is possible to suppress the air consumption, the electric power cost, the noise, etc., and reliably capture the chips.

[Brief description of drawings]

FIG. 1 is an overall configuration diagram of a processing tool according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view showing essential parts of a nipper 2 and a cover 3.

FIG. 3 is a bottom view of the cover 3.

FIG. 4 is a perspective view showing a part of a main body 53 of a suction device 6 for explaining the vicinity of a decompression chamber 51 and a chip container 63.

FIG. 5 is a plan view of a guide member 52 interposed between the decompression chamber 51 and a chip container 63.

FIG. 6 is a side view of the guide member 52.

7 is a plan view of the nipper 2 for explaining the operation of the switch 4. FIG.

8 is a cross-sectional view for explaining the operation of the switch 4 as seen from a section line BB in FIG.

FIG. 9 is an electric circuit diagram showing a specific configuration of a drive circuit 7.

FIG. 10 is a plan view of a nipper, which is a conventional processing tool.

[Explanation of symbols]

 1 Wiring Board 2 Nippers 3 Cover 4 Switch 5 Suction Hose 6 Suction Device 7 Drive Circuit 12 Electronic Component 13 Lead Terminal 51 Decompression Chamber 52 Guide Member 54 Filter 57 Guide Plate 61 Vacuum Device 62 Air Valve 63 Chip Container 64 Pressure Source 71 Power Source Input unit 72 DC power supply unit 73 Control unit

Claims (3)

[Claims] 1. A processing tool main body for processing a lead terminal or the like of an electronic component, a cover mounted on the processing tool main body for capturing chips of the electronic component cut out by the processing, and capturing inside the cover. A suction device for sucking the cut chips, the suction means for sucking the chips, the high-pressure air and the chips from the suction means are discharged, and the air is filtered and discharged and opened downward. A decompression chamber, provided detachably below the decompression chamber, and a chip container opened upward, and interposed between the decompression chamber and the chip container,
And a suction device having a guide member formed of a guide plate protruding downward and approaching each other toward the lower side. 2. A detection means that is mounted on the processing tool main body and detects a processing operation of the processing tool main body with respect to the electronic component; and a driving means that drives the suction means in response to a detection result of the detection means. The processing tool for an electronic component according to claim 1, further comprising: 3. The detection means, during or immediately before a processing operation of the processing tool body with respect to the electronic component,
The processing tool for electronic parts according to claim 2, wherein the processing tool is a switch that is sandwiched by a base end portion of a grip of the processing tool to close a contact.