JPH08111428A - Die bonding machine - Google Patents

Abstract

(57) [Summary] [Purpose] The purpose of the present invention is to improve the adhesiveness between the semiconductor chip and the die pad and to improve the adhesive force by uniformly kneading the adhesive. According to a die bonding apparatus 1A of the present invention, an ultrasonic transducer 10 is attached as a part of the arm 2 to a part of the arm 2 on the axis L of the arm 2 to which the die collet 3 is attached, and the wire is connected to the ultrasonic transducer 10. Connect to the ultrasonic oscillator 11 through 12, apply ultrasonic vibration to the die collet 3,
The semiconductor chip S adsorbed by the die collet 3 and transferred onto the die pad D coated with the adhesive is moved in the direction of arrow X,
For example, a vibration of 60 KHz is used for instant vibration.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding device for adhering a semiconductor chip to a die pad of a lead frame.

[0002]

2. Description of the Related Art A die bonding device is a dicing process which is a pre-process in a series of semiconductor device manufacturing processes.
This is a device in which semiconductor chips individually cut from a semiconductor wafer are picked up one by one from a state in which they are attached to a die tray or an adhesive sheet, and bonded to a die pad of a lead frame or a position of a substrate.

First, the conventional die bonding apparatus will be described with reference to FIG. FIG. 2 is a schematic view showing a part of a conventional die bonding apparatus. In FIG. 2, reference numeral 1 generally indicates a die bonding apparatus. In this die bonding apparatus 1, a die collet 3 is attached to a lower portion of a tip of an arm 2 on an axis L so that a suction force works in a direction perpendicular to the axis, and the die collet 3 is attached.
However, as indicated by the arrow R, the base end of the arm 2 is attached to the die bonding head 4 so that it can rotate in the Z-axis direction.
The die bonding head 4 is inserted into and attached to a vertically long hole 6 of a box 5 provided inside the die 9, and the die bonding head 4 moves on the base 9 by an arrow X.
And is mounted on an XY table 7 that can be moved in the direction of arrow Y. The base end of the arm 2 is the box 5
The shaft of the motor 8 is connected to the inside by a cam mechanism or the like, and is configured to be rotatable in the vertical direction of the arrow R according to the rotation of the motor 8.

The die bonding apparatus 1 having such a configuration
When the semiconductor chip S is bonded and fixed to the die pad D of the lead frame by using, for example, silver paste is applied to the surface of the die pad D as an adhesive, and the motor 8 and the XY table 7 are attached. The semiconductor chip S that is driven and adsorbed by the die collet 3 is transferred onto a die pad D coated with an adhesive of a predetermined lead frame, and the semiconductor chip S adsorbed by the die collet 3 is illustrated. A drive unit that does not move the XY table 7 and the bonding head 4 in the X-axis direction, for example, 80 to 1
A method of adhering and fixing after reciprocating about 20 μm or rotating and performing so-called scrubbing is adopted. The symbol H indicates a suspension lead, which is a component of the lead frame, and the symbol I also indicates a plurality of inner leads.

[0005]

The die-bonding system using mechanical drive has the following problems.
That is, 1. The tact time of the scrub is, for example, 0.2 to 0.
Take a long time of 3 seconds 1. Familiarity with silver paste 3. The deterioration of mechanical components such as the ball screw and the link mechanism of the drive device due to the scrubbing operation can be mentioned. Therefore, the present invention aims to solve the above-mentioned problems with the main object of improving the adhesiveness between the semiconductor chip and the die pad and improving the adhesive strength by uniformly kneading the adhesive.

[0006]

Therefore, in the die bonding apparatus of the present invention, a die collet is attached to the lower end of the end of the arm on the axis of the arm so that a suction force acts in the direction perpendicular to the axis, and the arm is mounted on the die collet. The ultrasonic transducer is attached to a part of the arm on the axis line of, and the base end of the arm is attached to the die bonding head so as to be rotatable in the Z-axis direction, and this die bonding head is placed on the XY table. The above-mentioned problem is solved by being mounted and configured by connecting the ultrasonic transducer to an ultrasonic oscillator.

[0007]

Therefore, the adhesive is uniformly kneaded to improve its familiarity, while the life of the mechanical parts of the XY table is extended. Moreover, the tact time for adhering and fixing the semiconductor chip S to the die pad D can be shortened.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the die bonding apparatus of the present invention will be described with reference to FIG. FIG. 1 is a schematic view showing a part of an embodiment of a die bonding apparatus of the present invention. The same components as those of the conventional die bonding apparatus are designated by the same reference numerals, and the description of those components will be omitted.

Referring to FIG. 1, in the die bonding apparatus 1A of the present invention, the die collet 3 is mounted on the lower end of the arm 2 along the axis L so that a suction force acts in a direction perpendicular to the axis. Similar to that of the technique, in the present invention, ultrasonic vibration is applied to a part of the arm 2 on the axis L of the arm 2, that is, to the arm 2 immediately before the box 5 in this embodiment, as a part of the arm 2. Child 1
I wore 0. Then, the ultrasonic transducer 10 is connected to the conductor 12
Through to the ultrasonic oscillator 11.

The die bonding apparatus 1A of the present invention having the above structure drives the motor 8 and the XY table 7 to adsorb the semiconductor chip S by the die collet 3.
Is transferred onto a die pad D to which a predetermined lead frame adhesive has been applied, and the ultrasonic oscillator 11 is used for ultrasonic vibration.
Is driven to instantaneously apply and vibrate the die collet 3 and the semiconductor chip S in the direction of the arrow X at a vibration of, for example, 60 KHz.

[0011]

As described above, the die bonding apparatus 1A of the present invention can uniformly apply the adhesive on the die pad D in a short time by the scrubbing operation by the ultrasonic transducer 10. In addition, since it does not vibrate the XY table itself, the mechanical parts of the XY table 7 are not aged more than necessary.

[Brief description of drawings]

FIG. 1 is a schematic view showing a part of an embodiment of a die bonding apparatus of the present invention.

FIG. 2 is a schematic diagram showing a part of a conventional die bonding apparatus.

[Explanation of symbols]

 1A Die bonding apparatus of this invention 2 Arm 3 Die collet 4 Box 6 Vertical hole 7 XY table 8 Motor 9 Base 10 Ultrasonic vibrator 11 Ultrasonic oscillator S Semiconductor chip D Die pad L Arm 2 axis

Claims (1)

[Claims] 1. A die collet is attached to the lower end of the end of the arm on the axis of the arm so that an attraction force works in the direction perpendicular to the axis, and an ultrasonic transducer is attached to a part of the arm on the axis of the arm. , The base end of the arm is mounted on a die bonding head so as to be rotatable in the Z-axis direction, the die bonding head is mounted on an XY table, and the ultrasonic transducer is connected to an ultrasonic oscillator. A die bonding apparatus characterized by being configured as follows.