JPH0811259A - Method for manufacturing multi-layered multi-layer copper clad laminate - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a method for producing a multi-tiered multi-layered copper-clad laminate by which a large number of multi-layered copper-clad laminates can be laminated and formed with high dimensional accuracy by one-time heat and pressure forming. [Structure] In the method for producing a multi-layer, multi-layer, copper-clad laminate, the bottom and the top of the multi-layer are laminated laminates or copper-clad laminates of up to four layers, and between the bottom and the top. A method for producing a multi-layer, multi-layer, copper-clad laminate characterized in that the intermediate stage is a multi-layered copper-clad laminate having 6 or more layers.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a multi-layered copper clad laminate, and more particularly to a method for laminating a large number of sheets with high dimensional accuracy by one-time heat and pressure forming.

[0002]

2. Description of the Related Art In multi-layer copper-clad laminates, it is necessary to secure positional accuracy between layers when forming multiple layers. The allowable range of gap between layers becomes narrower, and if it exceeds the allowable range, it may cause a serious defect such as a short circuit when electrically connecting the layers by through-hole plating, and it is very important to secure the positional displacement accuracy between layers. It becomes an issue. In particular, the bottom and top layers of the method for producing a multi-layered copper-clad laminate in which multi-layered copper-clad laminate structures are combined in multiple stages with a mirror plate in between, and the whole is heat-pressed for lamination When a mirror surface plate is used on the outside of the copper clad laminate structure (without using a mold), the multilayer copper clad laminate laminated by heat and pressure at the lowermost and uppermost positions is located between the inner layers. There is a problem that the deviation is large. This problem may be possible to obtain a highly accurate multilayer copper clad laminate with little positional deviation between layers by heating and pressurizing for a long time, but there is a problem that productivity is extremely low. In view of the above-mentioned problems, the inventors of the present invention have made diligent studies with the object of obtaining a laminated molded product in which a large number of sheets are not misaligned between layers by one heating and pressurizing laminating molding without increasing the laminating molding time. The present invention has been completed while the user was there.

[0003]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a multilayer copper clad laminate structure in which materials for inner and outer layers for laminate molding are stacked on a mirror plate. In the manufacturing method of a multi-layered copper-clad laminate, a multi-layered copper-clad laminate is manufactured by stacking a mirror-finished plate in multiple stages, and then stacking the mirror-finished plate on top of it Is a laminated board structure or a copper clad laminated board structure having up to 4 layers, and an intermediate step between the lowermost step and the uppermost step is a copper clad laminated board structure having 6 or more layers. Each intermediate stage sandwiched between the lowermost stage and the uppermost stage includes at least a plurality of circuit boards for inner layers, prepregs for adhesion, and conductive foils for outer layers because of the structure of 6 layers or more, When a copper clad laminate structure of up to 4 layers is used in the bottom and top layers, it means that at least an adhesive prepreg is included, and the 0-layer laminate structure includes at least prepreg. Although this prepreg is solid at room temperature, it is necessary that the resin component be melted and softened by heating to react and cure. In each stage of the multi-stage set, the inner and outer layer lumber may be integrally positioned and fixed by pins or the like, or the inner and outer layer lumber may be individually positioned and fixed by eyelets or the like for each constituent of each stage.

[0004]

[Function] The temperature difference between each stage when the temperature rises when heating and pressurizing the multilayer copper clad laminate structure in a multi-stage assembly is the largest because the bottom and top are close to the heating plate, and becomes smaller toward the center. Since the lowermost layer and the uppermost layer are laminated plate structures or copper-clad laminated plate structures having up to four layers, the number of circuit boards for inner layers is one or less, and the problem of positional accuracy between layers of circuit boards for inner layers can be avoided. In addition, the intermediate stage having a small temperature difference between the lowermost stage and the uppermost stage is formed of a multilayer copper clad laminate structure of 6 layers or more, so that the temperature generated between two or more inner layer circuit boards in the temperature rising process can be improved. The time difference can be reduced, and this can reduce the displacement and rotation due to thermal expansion and pressure deviation in the time until the adhesive prepreg is melted and softened and hardened, and the positional displacement between the inner circuit boards can be reduced. it can. Since the copper clad laminate structure up to the four layers at the bottom and the top contains at least a prepreg that melts and softens once, and the (0-layer) laminate comprises a prepreg that melts and softens at least once, Since the mirror plate between the upper and lower stages, and the mirror plate between the uppermost stage and the lower stage become free to move due to the resin component of the prepreg that melts and softens, the pressure deviation is adjusted and the inner layer is adjusted. It is considered that the position shift of the is reduced.

[0005]

EXAMPLE 1 specular plate 1 ₁ of the positioning jig 2 on the outer periphery to place the pin 3 erected, inner double-sided circuit board 4 on the pin 3
While fixing only the position, three sets of inner and outer layer lumber for laminated molding are arranged on a plane, and 12 pieces are vertically arranged with a mirror plate between them.
Combining the stage, further placing a mirror plate 1 ₁₃ thereon, and laminate molding the entire heating pressurized by the upper and lower heating plates. still,
At this time, in the first-stage (lowermost) and twelfth (uppermost) multilayer copper-clad laminate structure, copper foil 6 and three 0.18 mm-thick prepregs 5 were stacked in this order. Thickness 0.54m
m for the double-sided copper-clad laminate, and the second to eleventh stages were for a 6-layer multilayer copper-clad laminate including two double-sided circuit boards. According to the method for manufacturing the 12-layered multi-layered copper-clad laminate, all the 30 sheets of the 6-layered copper-clad laminate from the 2nd to 11th tiers were non-defective. Also, all the double-sided copper-clad laminates of the first and twelfth layers having a thickness of 0.54 mm were all usable as the substrate for the inner layer circuit.

[0006]

[Comparative Example 1] specular plate 1 ₁ of the positioning jig 2 on the outer periphery to place the pin 3 erected, inner double-sided circuit board 4 on the pin 3
While fixing only the position, three sets of inner and outer layer lumber for laminated molding are arranged on a plane, and a mirror surface plate is interposed between them to make 10 layers in the vertical direction.
Combining the stage, further placing a mirror plate 1 ₁₁ thereon, and laminate molding the entire heating pressurized by the upper and lower heating plates. still,
At this time, the first stage (the lowest stage) to the tenth stage (the highest stage) were formed as a structure for a 6-layer multilayer copper clad laminate including two inner layer double-sided circuit boards 4. This method of manufacturing a multi-layered copper-clad laminate of 10 stages is one in which 6 of the 6-layered copper-clad laminates of the 1st and 10th stages are used.
All of the 24 sheets of the 6-layer copper-clad laminates in the 2nd to 9th layers were good without any layer deviation.

[0007]

[Comparative Example 2] specular plate 1 ₁ of the positioning jig 2 on the outer periphery to place the pin 3 erected, inner double-sided circuit board 4 on the pin 3
While fixing only the position, three sets of inner and outer layer lumber for laminated molding are arranged on a plane, and 12 pieces are vertically arranged with a mirror plate between them.
Combining the stage, further placing a mirror plate 1 ₁₃ thereon, and laminate molding the entire heating pressurized by the upper and lower heating plates. still,
At this time, 1st stage (bottom stage) and 12th stage (top stage) are 1.
A double-sided copper-clad laminate having a thickness of 0 mm was used, and the second to eleventh stages were made into a six-layer multilayer copper-clad laminate structure including two double-sided circuit boards. In the method of manufacturing a 12-stage multilayer copper-clad laminate, 3 out of 6 of the 6-layer copper-clad laminates of the 2nd and 11th layers cause a layer shift, and 6th of the 3rd to 10th stages. All of the 24 layer copper clad laminates were good products with no layer displacement. All the six double-sided copper-clad laminates in the first and twelfth stages were reusable.

[0008]

Industrial Applicability According to the present invention, a copper clad laminate having 6 or more layers without layer misalignment can be manufactured by an inexpensive method using a mirror surface plate without lowering the temperature rising rate and thus without lowering the productivity. There is an effect called.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part for explaining a manufacturing method of the present invention.

[Explanation of symbols]

1 ₁ to 1 ₁₃ Mirror plate 2 Positioning jig 3 Pin 4 Double-sided circuit board for inner layer 5 Prepreg 6 Copper foil

Claims (2)

[Claims] 1. A multi-layered copper clad laminate structure, which is obtained by stacking materials for laminating and forming inner and outer layers through a prepreg on a mirror surface plate, and stacking the multilayer copper clad laminate structure in multiple stages through the mirror surface plate. In the method for manufacturing a multi-stage multi-layered copper-clad laminate, which comprises stacking mirror-like plates on top of each other and heating and pressing the whole to form a laminate,
The lowermost and the uppermost of the multi-stage set are laminated plate constructions or copper-clad laminated board constructions up to 4 layers, and the intermediate step between the lowermost and uppermost layers is a multilayer copper-clad laminated board construction of 6 or more layers. A method for producing a multi-layer, multi-layer, copper-clad laminate, which is characterized in that 2. The method for producing a multi-layer, multi-layer, copper-clad laminate according to claim 1, characterized in that a prepreg that is melt-softened at least once is included in each of the lowermost and uppermost laminated plate constituents.