JPH0457119B2 - - Google Patents
Info
- Publication number
- JPH0457119B2 JPH0457119B2 JP6589985A JP6589985A JPH0457119B2 JP H0457119 B2 JPH0457119 B2 JP H0457119B2 JP 6589985 A JP6589985 A JP 6589985A JP 6589985 A JP6589985 A JP 6589985A JP H0457119 B2 JPH0457119 B2 JP H0457119B2
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- layer printed
- board
- multilayer board
- printed boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- -1 Cyanoacrylic acid ester Chemical class 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
［発明の技術分野］
本発明は、位置ずれや反り等のない高品質の多
層板を製造することのできる製造方法に関する。
［発明の技術的背景］
近年、多層板は、各種電子機器の複合化、シス
テム、多機能化が進む赤で、高密度実装可能な配
線板としてその重要性がますます高まつてきてお
り、量産化、低価格化への対応も強く求められて
きている。
この多層板は、一般に次のような方法で製造さ
れている。
すわなち、まず第６図に示すように、外層プリ
ント板と、予め回路パターンを形成した複数枚の
内層プリント板を、プリプレグを介挿させつつ積
層し、この積層体１を一組として、複数組を各積
層体１間の中間板２を挾んで積重し、金型３にセ
ツトする。その際、プリント板相互の位置合せの
ために、予め金型３の内壁、中間板２および積層
体１のそれぞれの対応する所定位置に穿設してお
いた数個の基準孔４に基準ボルト５を挿入する。
しかる後、これを加熱プレスの熱板６，６間に
挿入して所定の条件で加熱加圧成形して一体化さ
せる。
［背景技術の問題点］
しかしながら、このような従来の方法では、製
品の成形サイズや成形枚数が、金型により制約さ
れるうえに、加熱プレスへの仕込みにも時間がか
かり、生産性の向上が紡げられるという問題があ
つた。
［発明の目的］
本発明はこのような従来の難点を解消するため
になされたもので、上記難点を有する金型および
基準ボルトを使用することなく内層プリント板間
の位置ずれや反り等のない高品質の多層板を製造
でき、生産性を向上させることのできる多層板の
製造方法を提供しようとするものである。
［発明の概要］
すなわち本発明の多層板の製造方法は、外層プ
リント板と予め回路パターンを形成した複数枚の
内層プリント板とを各プリント板間にプリプレグ
を挾んで積層する第１の工程と、これらの積層体
を一体に加熱加圧成形する第２の工程よりなる多
層板の製造方法において、前記第１の工程が、前
記複数枚の内層プリント板相互を回路パターンの
位置合せを行ないつつ、接着固定させることから
なることを特徴としている。
以下本発明方法を図面を参照しながら説明す
る。
本発明方法においては、例えば第１図に示すよ
うに、まずガラスクロス−エポキシ樹脂、ガラス
クロス−ポリイミド樹脂等の銅張積層板の銅箔面
に、所定の内層回路パターンを形成した内層プリ
ント板１ａの所定枚数を、上記銅張積層板と同材
質のプリプレグ１ｂを介挿させつつ積層するが、
このとき各内層プリント板相互を例えばその周縁
部でスペーサＰの両面に接着剤Ｓを塗布した接着
用ブロツク１ｃを介して部分的に接着しておく。
なお、接着用ブロツク１ｃに用いるスペーサＰ
としては、プレス時の圧力で変形可能なもの等が
適している。
また内層プリント板相互の位置決めは、例えば
第２図に示すように平板７上に内層プリント板の
基準穴の位置に位置決めピン８を突設した位置出
し治具を用いて行なう。９は接着位置を示してい
る。
次いで接着固定された内層プリント板の外側に
同様のプリプレグ１ｂを介して銅箔または内層プ
リント板に用いられた銅張積層板と同材質の同張
積層板を外層プリント板１ｄとして重ね合せる。
しかる後この積層体１の１組を複数組、第３図に
示すように、中間板２を介して加熱プレスの熱板
６，６間にそのまま挿入し、所定の条件で加熱加
圧成形して一体化させる。
なお、上記接着剤Ｓとしては、エポキシ系、エ
ポキシフエノール系、シアノアクリル系、ポリイ
ミドアミド系、ポリイミド系、トレニース（商品
名）系、メタロキサン系等の耐熱性接着剤を使用
することができ、特にシアノアクリル酸エステル
系接着剤は作業性および経済性の点で好ましい。
このようなアクリル酸エステル系接着剤の市販品
としては、例えばアロンアルフア＃301（東亜合成
化学社製）、ビスカ77M（マツモト交商社製）、パ
ーマボンド922（カネボウ、NSC社製）、ダイアボ
ンドSGシリーズ（ハニームーン接着剤）等があ
る。
なお本発明方法は、大型多段加熱プレスを使用
するマスラミネーシヨン方式による多層板の製造
にも同様に適用することができる。
［発明の実施例］
以下本発明の実施例および比較例について記載
する。
実施例 １
ガラスクロス−エポキシ樹脂両面銅張積層板の
銅箔面に所定の内層回路パターンを形成して得た
内層プリント板２枚の間に、ガラスクロス−エポ
キシ樹脂プリプレグを介挿させるとともに、第１
図に示す位置出し治具を用いて、４隅に、両面に
接着剤を塗布したスペーサ片を配置して内層プリ
ント板を積層固定した。
次いでその両面にガラスクロス−エポキシ樹脂
プリプレグを介して銅張積層板を銅箔を外側に向
けて重ね合せ、これを一組として、第２図に示し
た方法で、各組間に中間板を介挿させつつ積重し
て加熱プレスに挿入した。しかる後、加熱加圧し
て多層板を製造した。
実施例 ２
第４図に示すように、ガラスクロス−エポキシ
樹脂両面銅張積層板１０の銅箔面の区画された12
面内に、同一の内層回路パターン１１を形成し
て、多面取りの内層プリント板を得た。
次にこの多面取りの内層プリント板を用いて、
実施例１と同様の方法で大型多段式加熱プレスを
用いてマスラミネーシヨン方式による多層板を製
造した。
比較例
実施例１と同じ内層プリント板、外層プリント
板およびプリプレグを使用し、内層プリント板相
互を接着しない点を除いて実施例１と同様に積層
し、これを一組として、第５図に示す従来方法に
従い、金型および基準ボルトを使用して加熱プレ
スに挿入した。しかる後、実施例１と同一条件で
加圧加熱成形を行ない、多層板を製造した。
これらの実施例１、実施例２および比較例につ
いて、内層プリント板間の位置ずれ、寸法収縮変
化および反りを測定した。その結果を次表に示
す。
なお、測定枚数は各多層板５枚とし、その平均
値で示した。
また、第５図に、位置ずれおよび寸法収縮変化
の測定のための原点a0および測定点a1〜a4のおお
よその位置を示す。
[Technical Field of the Invention] The present invention relates to a manufacturing method capable of manufacturing a high quality multilayer board without misalignment, warpage, etc. [Technical Background of the Invention] In recent years, multilayer boards have become increasingly important as wiring boards that can be mounted in high density, as various electronic devices become more complex, systems, and multifunctional. There is also a strong demand for mass production and lower prices. This multilayer board is generally manufactured by the following method. That is, as shown in FIG. 6, first, an outer layer printed board and a plurality of inner layer printed boards on which a circuit pattern has been formed in advance are laminated with prepreg interposed therebetween, and this laminate 1 is set as one set. A plurality of sets are stacked with intermediate plates 2 between each laminate 1 interposed, and set in a mold 3. At that time, in order to align the printed boards with each other, reference bolts are inserted into several reference holes 4 that have been previously drilled at corresponding predetermined positions on the inner wall of the mold 3, the intermediate plate 2, and the laminate 1. Insert 5. Thereafter, this is inserted between hot plates 6, 6 of a hot press, and heated and pressed under predetermined conditions to be integrated. [Problems with the background technology] However, with such conventional methods, the molding size and number of molded products are limited by the mold, and it takes time to prepare the heated press, making it difficult to improve productivity. There was a problem that it could be spun. [Purpose of the Invention] The present invention has been made to solve the above-mentioned problems of the conventional technology, and it is possible to eliminate misalignment and warpage between inner printed boards without using a mold and a reference bolt that have the above-mentioned problems. The present invention aims to provide a method for manufacturing a multilayer board that can produce a high quality multilayer board and improve productivity. [Summary of the Invention] That is, the method for manufacturing a multilayer board of the present invention includes a first step of laminating an outer layer printed board and a plurality of inner layer printed boards on which a circuit pattern has been formed in advance, with a prepreg interposed between each printed board. , a method for manufacturing a multilayer board comprising a second step of integrally heating and press-molding these laminates, wherein the first step includes aligning the circuit patterns of the plurality of inner layer printed boards with each other; , is characterized by being adhesively fixed. The method of the present invention will be explained below with reference to the drawings. In the method of the present invention, as shown in FIG. 1, first, a predetermined inner layer circuit pattern is formed on the copper foil surface of a copper-clad laminate made of glass cloth-epoxy resin, glass cloth-polyimide resin, etc. A predetermined number of sheets 1a are laminated while interposing a prepreg 1b made of the same material as the copper clad laminate,
At this time, the inner printed boards are partially adhered to each other, for example, at their peripheral edges via an adhesive block 1c in which adhesive S is applied to both sides of the spacer P. In addition, the spacer P used for the adhesive block 1c
A suitable material is one that can be deformed by pressure during pressing. Further, the mutual positioning of the inner layer printed boards is carried out using, for example, a positioning jig having positioning pins 8 protruding from a flat plate 7 at the positions of the reference holes of the inner layer printed boards, as shown in FIG. 9 indicates the bonding position. Next, a copper foil or a same-clad laminate made of the same material as the copper-clad laminate used for the inner layer printed board is superimposed on the outer side of the adhesively fixed inner layer printed board via a similar prepreg 1b as an outer layer printed board 1d.
Thereafter, as shown in FIG. 3, a plurality of sets of this laminate 1 are inserted as they are between the hot plates 6, 6 of a heat press via the intermediate plate 2, and heated and pressed under predetermined conditions. and integrate it. As the adhesive S, heat-resistant adhesives such as epoxy, epoxyphenol, cyanoacrylic, polyimide amide, polyimide, TRENICE (trade name), and metalloxane can be used, and in particular Cyanoacrylic acid ester adhesives are preferred in terms of workability and economy.
Commercially available acrylic ester adhesives include, for example, Aron Alpha #301 (manufactured by Toagosei Kagaku Co., Ltd.), Vizca 77M (manufactured by Matsumoto Kosho Co., Ltd.), Permabond 922 (manufactured by Kanebo, NSC), and Diabond SG. series (Honey Moon Adhesive), etc. Note that the method of the present invention can be similarly applied to the production of a multilayer board by a mass lamination method using a large multi-stage hot press. [Examples of the Invention] Examples and comparative examples of the present invention will be described below. Example 1 A glass cloth-epoxy resin prepreg was inserted between two inner layer printed boards obtained by forming a predetermined inner layer circuit pattern on the copper foil surface of a glass cloth-epoxy resin double-sided copper-clad laminate, and 1st
Using the positioning jig shown in the figure, spacer pieces coated with adhesive on both sides were arranged at the four corners, and the inner layer printed boards were laminated and fixed. Next, copper-clad laminates were stacked on both sides with glass cloth-epoxy resin prepreg interposed therebetween, with the copper foil facing outward, and this was combined into one set. An intermediate plate was inserted between each set using the method shown in Figure 2. They were stacked and inserted into a heated press. Thereafter, the mixture was heated and pressed to produce a multilayer board. Example 2 As shown in FIG.
The same inner layer circuit pattern 11 was formed in the plane to obtain a multi-sided inner layer printed board. Next, using this multi-sided inner layer printed board,
A multilayer board was manufactured by mass lamination in the same manner as in Example 1 using a large multi-stage heated press. Comparative Example The same inner layer printed board, outer layer printed board, and prepreg as in Example 1 were used, and they were laminated in the same manner as in Example 1 except that the inner layer printed boards were not bonded to each other. The mold and reference bolts were used to insert into a heated press according to the conventional method shown. Thereafter, pressure and heat molding was performed under the same conditions as in Example 1 to produce a multilayer board. Regarding these Example 1, Example 2, and Comparative Example, the positional deviation between the inner layer printed boards, dimensional shrinkage change, and warpage were measured. The results are shown in the table below. The number of sheets measured was 5 for each multilayer board, and the average value is shown. Further, FIG. 5 shows the approximate positions of the origin a 0 and measurement points a 1 to a 4 for measuring positional deviation and dimensional shrinkage changes.
【表】
表からも明らかなように、位置ずれおよび寸法
収縮変化については３者間に差はなく良好な結果
が得られた。また、多層板の反りについては実施
例のものが比較例のものに比べ良好な結果が得ら
れており、これは基準ボルトを使用しないために
成形時に無理な力がかからず、内部応力が小さく
なるためと考えられる。
［発明の効果］
以上説明したように本発明によれば、予め内層
プリント板相互をその積層段階で接着固定してお
くので、加熱プレスへの仕込み時に金型や基準ボ
ルトが不要となり、作業性および生産性が向上す
るとともに品質のよい多層板が得られる。また、
マスラミネーシヨン方式にも適用可能で一層生産
性を高めることができる。[Table] As is clear from the table, there was no difference in positional deviation and dimensional shrinkage change among the three, and good results were obtained. In addition, with regard to warpage of the multilayer board, better results were obtained in the example than in the comparative example, and this is because no standard bolts are used, so no excessive force is applied during forming, and internal stress is reduced. This is thought to be due to the smaller size. [Effects of the Invention] As explained above, according to the present invention, since the inner layer printed boards are adhesively fixed to each other in advance at the stage of lamination, there is no need for a mold or reference bolt when loading into a hot press, and work efficiency is improved. In addition, productivity is improved and a multilayer board of good quality can be obtained. Also,
It can also be applied to mass lamination methods, which can further increase productivity.
第１図は本発明における外層プリント板と内層
プリント板の積層状態を模範的に示す断面図、第
２図は本発明方法に使用される位置出し治具の一
例を示す斜視図、第３図は本発明方法における加
熱プレスへの仕込み状況の一例を示す断面図、第
４図は本発明の他の実施例における内層プリント
板の多面取りした回路パターンを示す上面図、第
５図は本発明方法により得られた多層板の特性を
調べるための測定点の位置を示す上面図、第６図
は従来方法における加熱プレスへの仕込み状況の
一例を示す断面図である。
１……積層体、１ａ……内層プリント板、１ｂ
……プリプレグ、１ｃ……接着用ブロツク、１ｄ
……外層プリント板、３……金型、６……熱板。
FIG. 1 is a sectional view exemplary showing the laminated state of an outer printed board and an inner printed board in the present invention, FIG. 2 is a perspective view showing an example of a positioning jig used in the method of the present invention, and FIG. 3 4 is a cross-sectional view showing an example of the state of charging into a hot press in the method of the present invention, FIG. 4 is a top view showing a multi-sided circuit pattern of an inner layer printed board in another embodiment of the present invention, and FIG. FIG. 6 is a top view showing the positions of measurement points for examining the characteristics of the multilayer board obtained by the method, and a cross-sectional view showing an example of the state of charging into a hot press in the conventional method. 1... Laminated body, 1a... Inner layer printed board, 1b
...Prepreg, 1c...Adhesive block, 1d
... Outer layer printed board, 3... Mold, 6... Hot plate.
Claims (1)
た複数枚の内層プリント板とを各プリント板間に
プリプレグを挾んで積層する第１の工程と、これ
らの積層体を一体に加熱加圧成形する第２の工程
よりなる多層板の製造方法において、前記第１の
工程が、前記複数枚の内層プリント板相互を回路
パターンの位置合せを行ないつつ、接着固定させ
ることからなることを特徴とする多層板の製造方
法。 ２ 内層プリント板間の接着は接着剤を用いて行
なわれる特許請求の範囲第１項記載の多層板の製
造方法。[Claims] 1. A first step of laminating an outer printed board and a plurality of inner printed boards on which a circuit pattern has been formed in advance with a prepreg sandwiched between each printed board, and heating these laminates together. In the method for manufacturing a multilayer board, which includes a second step of pressure molding, the first step consists of bonding and fixing the plurality of inner layer printed boards while aligning the circuit patterns with each other. Characteristic multilayer board manufacturing method. 2. The method for manufacturing a multilayer board according to claim 1, wherein the inner printed boards are bonded using an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6589985A JPS61224497A (en) | 1985-03-29 | 1985-03-29 | Manufacture of multilayer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6589985A JPS61224497A (en) | 1985-03-29 | 1985-03-29 | Manufacture of multilayer board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61224497A JPS61224497A (en) | 1986-10-06 |
| JPH0457119B2 true JPH0457119B2 (en) | 1992-09-10 |
Family
ID=13300269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6589985A Granted JPS61224497A (en) | 1985-03-29 | 1985-03-29 | Manufacture of multilayer board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61224497A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61256696A (en) * | 1985-05-08 | 1986-11-14 | 松下電工株式会社 | Manufacture of multilayer printed wiring board |
| US4918812A (en) * | 1988-06-29 | 1990-04-24 | International Business Machines Corporation | Processing of cores for circuit boards or cards |
| JP4591181B2 (en) * | 2005-04-25 | 2010-12-01 | 三菱電機株式会社 | Printed wiring board |
| JP2009181985A (en) * | 2008-01-29 | 2009-08-13 | Sharp Corp | Multilayer printed wiring board manufacturing method and temporary fixing device |
-
1985
- 1985-03-29 JP JP6589985A patent/JPS61224497A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61224497A (en) | 1986-10-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111565523A (en) | Manufacturing method of second-order copper block-buried circuit board | |
| JPH0457119B2 (en) | ||
| CA1224884A (en) | Method of producing multilayer circuit boards, a fixed layered structure produced by this method, and the use of this layered structure in this production method | |
| JPS6313395A (en) | Manufacture of multilayer printed interconnection board | |
| JP2609298B2 (en) | Manufacturing method of multilayer laminate | |
| JPS6156495A (en) | Method of producing multilayer printed circuit board | |
| JPS6210190B2 (en) | ||
| JPS6356995A (en) | Manufacture of multilayer circuit laminated board | |
| JPS62269391A (en) | Manufacturing method of printed wiring board | |
| JPH03261195A (en) | Multilayer flex and rigid printed wiring board and fabrication thereof | |
| KR200267933Y1 (en) | Multilayer printed circuit board | |
| JP3473994B2 (en) | Manufacturing method of multi-stage multilayer copper-clad laminate | |
| JPH03257892A (en) | Manufacture of multilayer printed wiring board | |
| JPS6156494A (en) | Method of producing multilayer printed circuit board | |
| JPH07142864A (en) | Manufacture of multilayer board | |
| JPS63153895A (en) | Manufacture of multilayer interconnection board | |
| JPS62181128A (en) | Preparation of multi-layer printed-wiring board | |
| JPS6235844A (en) | Manufacture of multilayer printed wiring board | |
| JPH11163521A (en) | Production of multilayer printed wiring board | |
| JPH04152597A (en) | Manufacture of multilayer printed circuit board | |
| JPH0210888A (en) | Manufacture of multilayer circuit board | |
| KR20020023888A (en) | Multilayer printed circuit board and manufacturing method | |
| JPH11220259A (en) | Manufacture of multilayered printed wiring board | |
| JPH0564098B2 (en) | ||
| JPH09135079A (en) | Method of manufacturing multilayered board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |