JPH08112794A - Adsorption method, adsorption device, and transfer device - Google Patents

Abstract

PURPOSE: To surely suck various objects by a simple constitution, in a sucking method, sucker and a conveyer used in the case of sheet conveying a packaging- finished lead frame of LSI or the like sucked from a step piled condition. CONSTITUTION: A device is constituted of a primary pressure reducing chamber 10 connected to an exhaustt pump 5, sucker pad 15 coming into contact with a sucked object 2 to consitute a secondary pressure reducing chamber 14 and an elastic member 16 interposed between the primary/secondary pressure reducing chambers 10, 14 to be elastically deformed in accordance with pressure reducing the primary pressure reducing chamber 10 by the exhaust pump 5 and to pressure reduce the secondary pressure reducing chamber 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction device and an electronic component transfer device, and more particularly to a suction method and a suction device used to suck a packaged lead frame such as an LSI from a stacked state and convey the sheet. And a carrier device. In recent years, as semiconductor devices such as IC / LSI have been diversified in their lead frames, a suction device and a transport device suitable for each product type have been required for transport in the manufacturing process and the like.

[0002] However, if the suction and transfer device is modified for each product type, or if a dedicated device is provided, it is necessary to modify each product type and have a dedicated device for each product type. It becomes impossible to respond effectively to the variety.
For this reason, there is a need for a suction device and a transfer device that are compatible with each product type.

[0003]

2. Description of the Related Art ICs are used in the production of ICs (integrated circuits).
Adsorption devices using negative pressure air are often used to convey and hold the adsorbent in the next step. like this,
The step of using the suction device is, for example, used when a semi-finished product in which a plurality of packaged semiconductor devices before cutting the lead frame are integrally arranged on the lead frame is conveyed to, for example, the lead frame cutting step. There is.

FIG. 6 is an explanatory view of a suction method when a semi-finished product is conveyed. In the figure, 31 is a semi-finished product, and the semiconductor device 33 packaged integrally with the lead frame 32 is arranged in the semi-finished product. In order to adsorb the semi-finished product 31, the package 33a of some of the semiconductor devices 33 among the plurality of semiconductor devices 33 is removed by the exhaust pump 34.
It was adsorbed by the adsorption pad 35 exhausted by.

FIG. 7 shows a block diagram of a semi-finished semiconductor device. In FIG. 7 (A), the pitch P _{11 of the} packages 33a is arranged with a narrow pitch, and in FIG. 7 (B), the packages 33a are arranged.
Pitch P ₁₂ of are arranged at a large pitch. As shown in FIG. 7, the pitch of the semi-finished package 33a differs depending on the semiconductor device 33. Therefore, it is necessary to determine the pitch of the suction pads 35 according to the semiconductor device 33.

FIG. 8 shows a block diagram of a conventional conveying apparatus. In the figure, 41 indicates a suction head. Suction head 41
Is composed of a suction pad 42 and an exhaust pump 43, and is configured to be movable by a transport mechanism 44. The suction pads 42 are fixed at a pitch corresponding to the pitch P ₁₁ or P ₁₂ of the package 33a of the semi-finished product 31,
It is arranged so as to face 3a, and the exhaust pump 43 adsorbs the package 33a. Since the pitch of the suction pads 42 is constant in such a transfer device, the semi-finished product 3 in which the packages 33a are arranged at a constant pitch corresponding thereto
1 cannot be carried, and packages 33a at different pitches
The suction pad 4 is used to convey the semi-finished product 31 on which the
The position 2 was manually adjusted or the suction head 41 was replaced.

FIG. 9 shows a block diagram of another example of a conventional conveying apparatus. In the figure, 51 indicates a suction head. The suction head 51 has a suction pad 52 that sucks the package 33a, a pad moving mechanism 53 that moves the suction pad 52 in the direction of arrow A, and a package that stores data that moves the pad moving mechanism 53 according to the pitch d _{2 of the} package 33a. It is composed of a position database 54 and an exhaust pump 55 that exhausts the suction pad 52, and is movable by a transport mechanism 56 between a suction position and a transport position.

When the type of the semiconductor device 33 is determined by the detection device or the like for the suction pad 52, data corresponding to the pitch d _{2 of the} package 33a is supplied from the package position database 54 to the pad moving mechanism 53, and the package moving mechanism 53 packages 33a. The pitch is set according to the pitch d ₂ .

[0009]

However, according to the conventional method shown in FIG.
In the transfer device shown in (1), one dedicated machine is used for lead frames of the same pitch and size, or a suction pad is arranged on the IC package position with a replacement head. It is necessary to manually adjust the pad position or replace the head, which causes problems such as poor work efficiency. With the method shown in FIG. 9, it is necessary to have another package position database for various lead frames, and a mechanism for moving the suction pad is required, which makes the structure complicated and expensive. There was a point. Further, a suction method in which a large number of suction pads are arranged in advance and each has a vacuum generation source is conceivable, but in order to realize it, it is necessary to have a large number of pipes and a large number of vacuum generation sources, and the size of the device increases, In addition, there is a problem that the cost may increase and there is no merit to realize.

As disclosed in Japanese Laid-Open Patent Publication No. 60-85891, there is also a method of randomly arranging pads to close the communication passage when air of a predetermined flow rate or more flows in. Can happen,
There is a problem in that the negative pressure may decrease and the suction force of other vacuum pads may also decrease, and that it takes time to close the block and high-speed pickup is impossible.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a suction method, a suction device, and a transfer device that can reliably suck various objects with a simple structure.

[0012]

The present invention provides an adsorption method for adsorbing an object to be adsorbed by decompression by decompression means,
An elastic member is provided between the object to be adsorbed and the decompression means to isolate the object to be adsorbed and the decompression means, and the decompression means side of the elastic member is decompressed by the decompression means. The elastic member is elastically deformed to the pressure reducing means side according to the pressure reduction on the pressure reducing means side, and the pressure is reduced between the elastic member and the object to be attracted according to the elastic deformation of the elastic member on the pressure reducing means side. A space is created, and the object to be adsorbed is adsorbed to the depressurized space created between the elastic member and the object to be adsorbed.

According to a second aspect of the present invention, the elastic member is brought into direct contact with the object to be adsorbed, and a space decompressed between the elastic member and the object to be adsorbed is elastically deformed according to the decompression by the decompression means. The elastic member is formed and adsorbed to the elastic member. According to a third aspect of the present invention, in an adsorption device that adsorbs an object to be adsorbed by decompressing the decompression means, the adsorption device is provided between the object to be adsorbed and the decompression means, and separates the object to be adsorbed from the decompression means. The elastic member is elastically deformed in accordance with the reduced pressure due to and forms a reduced pressure space with the object to be adsorbed.

According to a fourth aspect of the present invention, there is provided a transportation means for transporting the elastic member, and the object to be attracted is attracted by the elastic member and transported.

[0015]

According to the first and third aspects of the present invention, since the object to be adsorbed and the depressurizing means can be separated by the elastic member, even if the object to be adsorbed side of the elastic member is in a leak state, the depressurizing means side of the elastic member is kept. It can be kept under reduced pressure. According to the second aspect, the attracted object is directly brought into contact with the elastic member, and the elastic member is elastically deformed by decompressing the decompressing means, and a directly decompressed space is formed between the attracted object and the elastic member. Since the object to be adsorbed is adsorbed, it can be realized with a simple structure.

According to the fourth aspect, since the object to be adsorbed can be adsorbed and conveyed by the above method, it can be surely adsorbed and conveyed,
The object to be adsorbed can be reliably conveyed.

[0017]

1 is a block diagram of the first embodiment of the present invention.
In this embodiment, a carrier device 3 for carrying a semiconductor device 2 in which a semiconductor chip is mounted on a lead frame 1, wire bonding is performed, and packaging is performed (state before cutting the lead frame) will be described.

The carrier device 3 of this embodiment is a semiconductor device 2.
A suction unit 4 for sucking the air, an exhaust pump 5 for reducing the pressure of the suction unit 5, a valve device 6 for controlling the connection between the suction unit 4 and the exhaust pump 5, an actuator 7 for driving the valve device 6, and a suction unit 4 for the suction position. The transport mechanism 8 is configured to move to and from the transport position, an actuator 7, and a controller 9 that controls the transport mechanism 8.

The suction part 4 is connected to an exhaust pump 5 via a valve device 6 and forms a primary decompression chamber 10 whose pressure is reduced by the exhaust pump 5 by a suction pad part 12 and a suction pad part 1.
2 is formed, the primary decompression chamber 10 is penetrated to the outside, and the communication holes 11 are formed at a predetermined pitch.
3, a suction pad 15 that is fixed to the communication hole 11 of the suction head plate 13 from the outside to form a secondary decompression space 14, and contacts the semiconductor device 2 to adsorb the semiconductor device 2; and a primary decompression chamber of the communication hole 11 Located on the 10th side, the primary decompression chamber 1
0 and the secondary decompression space 14 are isolated from each other, and elastically deformed according to the decompression of the primary decompression chamber 10 to form an elastic member 16 for decompressing the secondary decompression space 14 and a hole 17 corresponding to the communication hole 11,
The elastic member 16 is constituted by a fixing plate 18 which is sandwiched between the suction head plate 13 and fixed inside the primary decompression chamber 10.

The elastic member 16 is formed by forming a soft elastic body such as rubber into a film shape and is easily elastically deformed by air pressure. The suction pad 15 is formed of a conductive urethane resin or the like, and is configured to prevent accumulation of electric charges due to static electricity or the like and prevent damage to the semiconductor device 2 due to static electricity during adsorption.

The valve device 6 is composed of three ports. Of the three ports, the first port 6a is connected to the primary decompression chamber 10 of the adsorption head 4, the second port 6b is connected to the exhaust pump 5, and the third port Port 6c is open to the outside,
The actuator 7 allows the first port 6a and the second port 6b to communicate with each other, or the first port 6a
It is configured to switch whether or not the a and the third port 6c are communicated.

The actuator 7 is driven in response to a control signal from the control device 9 to drive the valve device 6 and
~ Controls the connection of the third ports 6a-6c. The transport mechanism 8 holds the suction head 4, and is driven according to a control signal from the control device 9 to move the suction head 4.
FIG. 2 shows an operation explanatory diagram of the suction head 4. As shown in FIG. 2A, when the primary decompression chamber 10 is decompressed in the state where the suction pad 15 is closed by the package 2a of the semiconductor device 2, the secondary decompression chamber 14 inside the adsorption pad 15 is at atmospheric pressure. Therefore, the pressure difference between the primary decompression chamber 10 and the secondary decompression chamber 14 elastically deforms the elastic member 16 that separates the primary decompression chamber 10 and the secondary decompression chamber 14 as shown in FIG. It is drawn into the decompression chamber 10 side.

Therefore, the volume inside the secondary decompression chamber 14 increases, the inside of the secondary decompression chamber 14 is decompressed, and the package 2a is adsorbed by the adsorption pad 15. FIG. 3 shows an operation flowchart of the first embodiment of the present invention. Here, an operation of transporting the semiconductor device 2 arranged at a predetermined suction position by the transport device 3 to a predetermined transport position will be described.

The controller 9 first drives and controls the transfer mechanism 8 to transfer the suction head 4 to the semiconductor device 2 to be transferred.
Is moved to the suction position where is placed, and the suction pad 15 is brought into contact with the upper surface of the package 2a of the semiconductor device 2 (step S1). Next, the control device 9 drives the actuator 7 so that the first port 6a and the second port 6b of the valve device 6 are connected, and the primary decompression chamber 10 and the exhaust pump 5 are made to communicate with each other to perform the primary decompression. The chamber 10 is depressurized (step S2).

When the primary decompression chamber 10 is decompressed, the opening 15a is closed by the package 2a of the semiconductor device 2 as described with reference to FIG. 16 is elastically deformed, the secondary decompression chamber 14 is decompressed accordingly, the package 2a is adsorbed by the adsorption pad 15, and the semiconductor device 2 is adsorbed and held by the adsorption head 4.

The controller 9 then controls the transport mechanism 8 to move the suction head 4 to a preset predetermined transport position (step S3). When the suction head 4 is moved to a predetermined transport position by the transport mechanism 8, the controller 9 drives the actuator 7 so that the first port 6a and the third port 6c of the valve device 6 communicate with each other, and the primary Decompression chamber 10
To atmospheric pressure (step S4).

When the primary decompression chamber 10 is brought to atmospheric pressure, the elastic member 16 elastically deformed by the decompression force restores, the decompression of the secondary decompression chamber 14 in the adsorption pad 15 is released, and the adsorption of the package 2a is released. Then, the semiconductor device 2 is separated from the suction head 4. As described above, steps S1 to S4 are repeated until the conveyance is completed (step S5). As described above, the semiconductor device 2 can be transported from a predetermined suction position to a transport position which is a working position for cutting the lead frame 1 in the next process.

According to the present embodiment, the pitch P ₁₁ of the package 2a of the semiconductor device 2 and the pitch P ₁ of the suction pads 15 of the suction head 4 are different, and even if some of the suction pads 15 are open. The primary decompression chamber 10 and the secondary decompression chamber 14 in the suction pad 15 are separated by the elastic member 16, and the pressure of the primary decompression chamber 10 and the repulsive force due to the elastic deformation of the elastic member 16 are different from the atmospheric pressure difference. Balance,
Since no leakage occurs, the pressure inside the primary decompression chamber 10 becomes stable, and the package 2a can be surely adsorbed by the adsorption pad 15 facing the package 2a.

Therefore, as shown in FIGS. 7A and 7B, semiconductor device sheets having different package pitches can be sucked by the same suction head 4 and conveyed. Therefore, it is not necessary to modify the semiconductor device sheet according to the sheet to be conveyed or to manufacture a dedicated device, and the conveying efficiency of the semiconductor device sheet can be improved.

FIG. 4 shows a block diagram of the second embodiment of the present invention. In the figure, the same components as those in FIG.
The description is omitted. This embodiment differs from the first embodiment shown in FIG. 1 in the structure of the suction head. The suction head 21 of this embodiment is connected to the exhaust pump 5 via a valve device 6,
A suction head portion 23 that constitutes the primary decompression chamber 22 and a communication hole 24 that communicates the primary decompression chamber 22 to the outside are formed, and are fixed in an airtight state at the opening of the adsorption head portion 23, together with the adsorption head portion 23, the primary decompression chamber. Suction plate 25 forming 22
Elastic member 2 fixed to the outside of the suction plate 25 in an airtight state
It is composed of 6.

The elastic member 25 is made of a thin elastic material such as rubber and separates the outside from the primary decompression chamber 22. FIG. 5 shows an operation explanatory diagram of the second embodiment of the present invention. When the primary decompression chamber 22 before adsorption is at atmospheric pressure, as shown in FIG. 5A, the elastic member 26 is flat and is in contact with the entire upper surface of the package 2a of the semiconductor device 2.

Next, when the pressure in the primary decompression chamber 22 is reduced, the elastic member 26 elastically deforms in the direction of the primary decompression chamber 22 via the communication hole 24 of the suction plate 25. At this time, as shown in FIG. 5B, the communication hole 24 exists in the upper part of the package 2a of the semiconductor device 2, and when the elastic member 26 is elastically deformed by the decompression of the primary decompression chamber 22, the elastic member 26 and the semiconductor device 2 are formed.
The secondary decompression chamber 27 having a substantially vacuum is formed between the package 2a and the package 2a, and the package 2a is adsorbed.

According to the present embodiment, in addition to the effect of the first embodiment, the structure is simpler than that of the first embodiment, and it can be manufactured at a low cost. In the above first and second embodiments,
Although the apparatus for conveying the semiconductor device sheet to the step of cutting the lead frame has been described, the object to be conveyed is not limited to the semiconductor device sheet, and the point is that the opening of the suction pad 15 or the communication hole 24 can be closed. If

The suction pads 15 and the communication holes 24 are not limited to one-dimensionally arranged ones, but may be two-dimensionally arranged ones.

[0035]

As described above, according to claim 1 of the present invention, the elastic member is provided between the pressure reducing means and the object to be adsorbed, and the elastic member is provided while separating the pressure reducing means and the object to be adsorbed. By depressurizing the adsorbent side, the adsorbent is adsorbed. Therefore, even if the adsorbent is not in close contact with the adsorbent side of the elastic member, a leak may occur on the decompression means side and the negative pressure may decrease. Therefore, when a plurality of suction ports are provided, even if a part of them leaks, the other suction ports can perform suction, and an object to be adsorbed can be surely adsorbed.

According to the second aspect of the present invention, the object to be attracted is brought into contact with the elastic member, and the pressure is reduced by the pressure reducing means to elastically deform the elastic member, so that a space directly depressurized is provided between the object to be attracted and the elastic member. Since it is formed and the substance to be adsorbed is adsorbed, it has a feature that it can be realized with a simple structure. According to the fourth aspect, since the object to be adsorbed can be adsorbed and conveyed by the above method, the object to be adsorbed and conveyed can be surely conveyed, and the object to be adsorbed can be surely conveyed.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of a suction operation according to the first embodiment of the present invention.

FIG. 3 is an operation flowchart of the first embodiment of the present invention.

FIG. 4 is a configuration diagram of a second embodiment of the present invention.

FIG. 5 is a drawing explaining the suction operation of the second embodiment of the present invention.

FIG. 6 is an explanatory diagram of a conventional adsorption method.

FIG. 7 is a diagram showing a state before cutting a lead frame of a semiconductor device.

FIG. 8 is a configuration diagram of a conventional example.

FIG. 9 is a configuration diagram of another example of the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 2 Semiconductor device 3 Transfer device 4 Suction head 5 Exhaust pump 6 Valve device 7 Actuator 8 Transfer mechanism 9 Control device 10 Primary decompression chamber 12 Adsorption head part 13 Adsorption plate 14 Secondary decompression chamber 15 Adsorption pad 16 Elastic member

Claims (4)

[Claims] 1. An adsorption method for adsorbing an object to be adsorbed by decompression by decompression means, wherein an elastic member is provided between the object to be adsorbed and the decompression means, the elastic member separating the object to be decompressed and the decompression means. The decompression means side of the elastic member is decompressed by the decompression means, and the elastic member is elastically deformed to the decompression means side in accordance with the decompression of the elastic member on the decompression means side. In accordance with elastic deformation, a decompressed space is generated between the elastic member and the adsorption target, and the adsorption target is adsorbed in the decompressed space generated between the elastic member and the adsorption target. An adsorption method characterized by: 2. The elastic member is brought into direct contact with the object to be adsorbed, and a pressure-reduced space is formed between the elastic member and the object to be adsorbed by elastic deformation according to the pressure reduction by the pressure reducing means. The adsorption method according to claim 1, wherein the object to be adsorbed is adsorbed to the elastic member. 3. An adsorption device for adsorbing an object to be adsorbed by decompressing the decompressing means, which is provided between the object to be adsorbed and the decompressing means to separate the object to be adsorbed and the decompressing means. An adsorption device having an elastic member that is elastically deformed in accordance with the decompression due to and forms a decompressed space between the object and the object to be adsorbed. 4. A transporting apparatus using the suction method according to claim 1, further comprising a transporting unit that transports the elastic member, wherein the target object is suctioned by the elastic member and transported. .