JPH08122017A - Position recognition method for multiple chip elements - Google Patents

Abstract

PURPOSE: To obtain a position recognition method in which a connected series of rectangular multiple chip elements can be positioned easily by forming corners at end parts of the element to be right-angled and forming side faces, the surface and the rear of side-face electrodes at the end parts out of right- angled corners. CONSTITUTION: Cutouts 3 are formed in central parts on both side faces 2c of a ceramic substrate 2 whose plane shape is rectangular, and electrodes 4 which come into contact with the side faces 2c are formed on the surface 2a. The electrodes 4 are divided at the cutouts 3, resistors 5 are formed between the electrodes 4, and they are protected by, and covered with, an overcoat layer 6. Side-face electrodes 7 which come to the surface 2a and the rear 2b are formed on the side faces 2c, corners of the electrodes 7 are formed to be right-angled, and the surface 2a, the rear 2b and the side faces 2c are formed out of right-angled corners. A resistor 1 is positioned so as to be sandwiched between guides 8, and it is not sandwiched and held obliquely because its corners are right-angled. In addition, since the corners can be recognized as sharp feature points, a multiple chip elements can be positioned by optical measures.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a position recognition method for multiple chip elements such as multiple chip resistors and multiple jumper chips.

[0002]

2. Description of the Related Art There are various types of multiple chip elements,
For example, as prior arts, JP-A-52-135048, JP-A-62-256406 and JP-A-61-11-1.
No. 42402, Actual Kaihei 1-156509, Actual Kaisho 63
It is also described in No. 155270, No. Sho 63-3070 and the like.

FIG. 5A shows a conventional multiple (here, double) chip resistor as an example of a multiple chip element. This chip resistor 21 is a ceramic substrate 2
Resistors 25, 25 are formed on the surface 2 and covered with an overcoat layer 26. Side electrodes 27, ..., 27 connected to the resistors 25, 25 are formed on the side surface of the ceramic substrate 22. The side surface electrodes 27, 27 adjacent to each other are separated by a notch 23 (divided through hole).

[0004]

The above-mentioned conventional multiple chip element is positioned by being sandwiched by a pair of positioning guides 28, 28 as shown in FIG. 5B, and mounted on a printed circuit board. However, the notch 23 ′ has the ceramic substrate 2
Since there are also two corners, there is a problem that they are sandwiched between the guides 28, 28 in an inclined state as shown in FIG. In addition, even if an optical means such as a video camera is used for positioning, there is no sharp feature point and there is a problem that positioning is difficult.

On the other hand, in the conventional multiple chip element, since the area of each side electrode 27 cannot be made large, there is a problem that the adherence to the printed circuit board is poor. The side electrode 27 is
It is formed by plating solder or nickel, but there is also a problem that this plating property is poor. Such problems are also found in the above-mentioned prior arts, but at present the problems are not described or suggested and no solution is taken at all.

The present invention has been made in view of the above,
The purpose is to facilitate positioning, and improve adhesion and plating properties.

[0007]

In order to achieve the above object, the position recognizing method for a multiple chip element according to the present invention is such that two or more side surface electrodes are arranged on a pair of opposing side surfaces, and the side surface electrodes are arranged between adjacent side surface electrodes. A method for recognizing a rectangular multiple chip element separated by a notch, wherein the corners of the ends of the rectangular multiple chip element are right angles, and the side electrodes located at the ends are side surfaces and surfaces. It is characterized in that the right angle of the multiple chip element formed by forming up to the right angle on both the rear surface and the back surface is recognized, and the multiple chip element is positioned by this right angle.

According to this position recognition method, since the corners of the ends of the multiple chip element are right angles, the right angle corners can be recognized as sharp feature points, and the right angle corners can be recognized. Thus, the positioning of the multiple chip element can be facilitated. Further, since the side surface electrode located at the end portion has a large area, it is possible to improve the sticking property and the plating property.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIGS. Here, a double chip resistor is taken up as a multiple chip element for position recognition. FIGS. 1A and 1B are external perspective views of the double chip resistor 1 and Ib, respectively. The sectional view in the line -Ib is shown.

Reference numeral 2 is a ceramic substrate, which has a rectangular planar shape. Both sides 2 of the ceramic substrate 2
Notches 3 and 3 are formed at the centers of c and 2c.
Electrodes 4, ..., 4 are formed on the surface 2a of the ceramic substrate 2 so as to be in contact with the side surface 2c, and these electrodes 4, 4 are divided by notches 3, 3. A resistor 5 is formed so as to extend between the electrodes 4 and 4. These resistors 5 and 5 are covered and protected by the overcoat layer 6.

On the other hand, on the side surface 2c of the ceramic substrate 2,
The side electrode 7 is formed so as to wrap around the front surface 2a and the back surface 2b. The side surface electrode 7 is composed of a thick film electrode 7a formed by printing and firing a conductive paste, and a plating layer 7b formed by plating solder or nickel.
Since the ceramic substrate 2 is rectangular, the corners of the side electrodes 7 are also right angles. The side surface electrode 7 has a side surface 2c and a surface 2
Both a and the back surface 2b are formed to a right angle.

Next, the manufacturing process of the double chip resistor 1 of this embodiment will be described with reference to FIGS. First, a large ceramic substrate 12 is prepared, and as shown in FIG.
As shown in, the through hole 13 is formed and the slits 14 and 15 are formed to partition the surface of the ceramic substrate 12. Next, a conductive paste is screen-printed in each section, and the paste is baked to form the electrodes 4 and 4. Further, a resistance paste is screen-printed and fired to form a resistor 5 [see FIG. 2 (b)]. The resistor 5 is adjusted by laser trimming so that its resistance value becomes a predetermined value.

A glass paste is screen-printed on the ceramic substrate 12, and the glass paste is fired to form the overcoat layer 6 in each section. In this state, the ceramic substrate 12 is broken along the slits 14 to form a strip-shaped ceramic substrate 12 '[see FIG. 3 (a)]. A conductive paste is attached to the side surface 2c of each ceramic substrate 12 ', and the paste is fired to form the thick film electrode 7a. Further, the surface of the thick film electrode 7a is plated with solder or nickel to form a plating layer 7b, which is used as the side electrode 7 (see FIG. 3B). Finally, a break is made along the slit 15 to complete the double chip resistor 1.

The dual chip resistor 1 of this embodiment is shown in FIG.
As shown in (c), the guides 8 and 8 are sandwiched and positioned, but since the corners are right angles, they are not sandwiched and sandwiched. Also, by recognizing a right angle as a sharp feature point, for example, by optical processing,
It becomes possible to perform positioning. Further, since the outer shape of the side surface electrode 7 has a right angle, the area of the side surface electrode 7 becomes large, and the area where the side surface electrode 7 is connected to the soldering pad on the printed circuit board by soldering becomes large, and the side surface electrode 7 is fixed to the printed circuit board. Will be more likely. Further, since the area of the side surface electrode 7 is increased, the plating layer 7b can be easily formed.

It should be noted that the present invention is not limited to a double chip resistor, but may be a triple chip resistor, a quadruple chip resistor as shown in FIGS. The present invention can be applied not only to resistors but also to various multiple chip elements such as capacitors and jumpers.

[0016]

As described above, according to the position recognition method for a multiple chip element of the present invention, the multiple chip element is formed such that the corners of the ends are right angles and the side electrodes located at the ends are side surfaces and surfaces. And both the back surface and the right angle,
Since the right angle of this multiple chip element is recognized and the multiple chip element is positioned by this right angle, the positioning can be accurately and easily performed and the printed circuit board at the time of mounting can be mounted. It is possible to improve the sticking property of and the plating property during manufacturing.

[Brief description of drawings]

FIG. 1 is an external perspective view (a) of a dual chip resistor according to an embodiment of the present invention, a cross-sectional view (b) taken along line Ib-Ib of (a), and the dual chip resistor is a positioning guide. It is a figure (c) explaining the state positioned by.

FIG. 2 is a diagram illustrating a manufacturing process of the dual chip resistor.

FIG. 3 is a diagram for explaining the manufacturing process subsequent to FIG.

FIG. 4 is an external perspective view of a triple chip resistor according to another embodiment (a) and an external perspective view of a quad chip resistor (b).
Is.

FIG. 5A is an external perspective view of a dual chip resistor according to a conventional example, and FIG. 5B is a diagram illustrating a state in which the conventional dual chip resistor is correctly positioned.

FIG. 6 is a diagram illustrating a state in which the dual chip resistor is tilted and positioned.

[Explanation of symbols]

 2a Ceramic substrate front surface 2b Ceramic substrate back surface 2c Ceramic substrate side surface 3 Notch 7 Side electrode

Claims (1)

[Claims] 1. A method for recognizing a position of a rectangular multiple chip element, wherein two or more side surface electrodes are arranged on a pair of opposing side surfaces, and adjacent side surface electrodes are separated by a notch. The angle of the end of the multiple chip element is defined as a right angle, and the side electrode located at the end is formed up to the right angle on the side surface, front surface and back surface. A method for recognizing the position of a multiple chip element, characterized in that the multiple chip elements are positioned by the corners of the.