JPH08126860A - Line drawing coating application and device therefor - Google Patents
Line drawing coating application and device thereforInfo
- Publication number
- JPH08126860A JPH08126860A JP26761394A JP26761394A JPH08126860A JP H08126860 A JPH08126860 A JP H08126860A JP 26761394 A JP26761394 A JP 26761394A JP 26761394 A JP26761394 A JP 26761394A JP H08126860 A JPH08126860 A JP H08126860A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- coating
- adhesive
- coated
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 title claims abstract description 67
- 238000000576 coating method Methods 0.000 title claims abstract description 65
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000005491 wire drawing Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 21
- 230000001070 adhesive effect Effects 0.000 abstract description 21
- 238000007599 discharging Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ノズルを介して被塗布
物に塗布剤を線引き塗布する線引き塗布方法及び装置に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire-drawing coating method and apparatus for wire-drawing a coating material onto an object to be coated through a nozzle.
【０００２】[0002]
【従来の技術】この種の従来技術としては図７に示すよ
うに被塗布物としてのケース３の被塗布位置に対して垂
直にノズル４０を配置して、ノズル４０より塗布剤とし
てのシリコン系樹脂から成る接着剤Ｗを吐出させながら
該ノズル４０を水平移動させて塗布位置に接着剤Ｗを線
引き塗布していた。2. Description of the Related Art As a conventional technique of this type, as shown in FIG. 7, a nozzle 40 is arranged perpendicularly to a coating position of a case 3 as a coating object, and a silicon-based coating agent is applied from the nozzle 40. The nozzle 40 was horizontally moved while discharging the adhesive W made of resin to draw and apply the adhesive W at the application position.
【０００３】このような線引き塗布するには、ノズルと
被塗布面とのクリアランスが接着剤粘度やチクソ性と共
に塗布幅（太さ）、厚みをコントロールする重要要素で
ある。ノズルと被塗布面とのクリアランスが小さいと塗
布された接着剤は被塗布面に接着され易いが、ノズル先
端で押し潰されてしまう。そのため、塗布幅、厚みを所
望の形に塗布し難い。In such wire drawing coating, the clearance between the nozzle and the surface to be coated is an important factor for controlling the coating width (thickness) and thickness together with the adhesive viscosity and thixotropy. When the clearance between the nozzle and the surface to be coated is small, the applied adhesive is easily adhered to the surface to be coated, but is crushed at the tip of the nozzle. Therefore, it is difficult to apply the desired coating width and thickness.
【０００４】また、クリアランスが大きいと接着剤がノ
ズルから吐出されて被塗布面に接着するまでの時間的ラ
グにより、接着剤粘度やチクソ性が高いと、接着剤がノ
ズルに引張られて塗布面に接着できないか、または塗布
位置、幅、厚みにバラツキが生じる。従って、この塗布
作業でのノズルと被塗布面とのクリアランスに対するク
リアランス許容値が±０．１ｍｍ程度である。そのた
め、本方法で長い距離を安定して線引き塗布するのは非
常に難しかった。If the clearance is large, the adhesive is discharged from the nozzle and adheres to the surface to be coated. If the viscosity or thixotropy of the adhesive is high, the adhesive will be pulled by the nozzle and the surface to be coated will be lagged. Cannot be adhered to, or the application position, width, and thickness vary. Therefore, the clearance allowance value for the clearance between the nozzle and the surface to be coated in this coating operation is about ± 0.1 mm. Therefore, it was very difficult to stably apply the wire drawing over a long distance by this method.
【０００５】[0005]
【発明が解決しようとする課題】従って、本発明は塗布
剤の線引き塗布状態の調節範囲を広げることを目的とす
る。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to widen the adjustment range of the drawing application state of the coating agent.
【０００６】[0006]
【課題を解決するための手段】そこで請求項１の発明
は、ノズルを介して被塗布物に塗布剤を線引き塗布する
線引き塗布方法に於いて、前記被塗布物に対して前記ノ
ズルを斜めにした状態で線引き塗布するようにしたもの
である。また請求項２の発明は、ノズルを介して被塗布
物に塗布剤を線引き塗布する線引き塗布方法に於いて、
前記ノズルから吐出された塗布剤がノズルと被塗布物と
で押し潰されないように少なくとも吐出部下面の高さを
塗布進行方向側の吐出部下面の高さに比して反対側の吐
出部下面の高さをより高くした状態で線引き塗布するよ
うにしたものである。Therefore, the invention of claim 1 is a drawing coating method for drawing a coating agent onto a coating object through a nozzle, wherein the nozzle is slanted with respect to the coating object. In this state, the wire is applied by drawing. A second aspect of the present invention is a drawing coating method for drawing a coating agent onto a coating object through a nozzle.
In order to prevent the coating material discharged from the nozzle from being crushed by the nozzle and the object to be coated, at least the height of the lower surface of the discharging portion is lower than the height of the lower surface of the discharging portion on the coating advancing direction side, and the lower surface of the discharging portion is opposite. It is designed such that the wire is applied while the height of is higher.
【０００７】更に請求項３の発明は、ノズルを介して被
塗布物に塗布剤を線引き塗布する線引き塗布装置に於い
て、前記被塗布物に対して前記ノズルを斜めに配置させ
たことによりノズルと被塗布面とのクリアランス許容値
範囲がノズルを垂直に配置させたものに比して広がるよ
うにしたものである。Further, the invention of claim 3 is a drawing coating apparatus for drawing and coating a coating material onto a coating object through a nozzle, wherein the nozzle is arranged obliquely with respect to the coating object. The permissible clearance range between the coated surface and the coated surface is wider than that in the case where the nozzles are arranged vertically.
【０００８】[0008]
【作用】請求項１の発明では、斜めに配置されたノズル
から吐出される塗布剤が被塗布物に線引き塗布される。
また請求項２の発明では、少なくとも吐出部下面の高さ
を塗布進行方向側の吐出部下面の高さに比して反対側の
吐出部下面の高さをより高くしたノズルから吐出される
塗布剤が被塗布物に線引き塗布される。According to the first aspect of the present invention, the coating material ejected from the obliquely arranged nozzles is drawn and coated on the object to be coated.
Further, in the invention of claim 2, the coating is discharged from the nozzle in which at least the height of the lower surface of the discharging portion is higher than the height of the lower surface of the discharging portion in the coating advancing direction side. The agent is drawn and applied to the object to be coated.
【０００９】更に請求項３の発明では、被塗布物に対し
てノズルを斜めに配置させたことによりノズルと被塗布
面とのクリアランス許容値範囲がノズルを垂直に配置さ
せたものに比して広がる。Further, in the invention of claim 3, since the nozzle is obliquely arranged with respect to the object to be coated, the allowable clearance range between the nozzle and the surface to be coated is smaller than that when the nozzle is vertically arranged. spread.
【００１０】[0010]
【実施例】以下、本発明の一実施例を図面に基づき詳述
する。図１は混成集積回路２（図２参照）を構成するケ
ース３に後述する回路基板８を接着するための塗布剤と
しての接着剤を線引き塗布する線引き塗布装置４を示す
図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a diagram showing a wire-drawing coating device 4 for wire-coating an adhesive as a coating agent for bonding a circuit board 8 described later to a case 3 constituting a hybrid integrated circuit 2 (see FIG. 2).
【００１１】該線引き塗布装置４の４０はケース３の所
望被塗布位置に対して斜めに所定角度を存して配置され
たノズルで、上部には接着剤が収納されている。尚、ノ
ズル４０の傾き角度はノズルホルダ４２に穿設された長
穴４３の範囲内で所望位置にネジ４４止めすることによ
り調整可能である。本実施例ではおよそ１０乃至２０度
を採用している。また、上下調整ボルト４５を調整する
ことにより上下位置が調整可能である。これらの調整に
より後述する線引き塗布時に接着剤の塗布幅、厚みを調
節できる。Reference numeral 40 of the wire-drawing coating device 4 is a nozzle arranged obliquely at a predetermined angle with respect to a desired coating position of the case 3, and an adhesive is stored in the upper portion thereof. The inclination angle of the nozzle 40 can be adjusted by fixing the screw 44 at a desired position within the range of the elongated hole 43 formed in the nozzle holder 42. In this embodiment, about 10 to 20 degrees is adopted. Further, the vertical position can be adjusted by adjusting the vertical adjustment bolt 45. By these adjustments, the coating width and thickness of the adhesive can be adjusted at the time of applying the wire drawing described later.
【００１２】図２の８は導電路６の上に半導体チップ７
が固着された回路基板で、前記塗布装置４によりその外
枠周辺溝部３Ａに接着剤が塗布されたケース３に該溝部
３Ａに入り込んだ状態で接着される。２１は回路基板８
の裏面に接着される絶縁基板である。以下、動作につい
て説明する。In FIG. 2, numeral 8 indicates a semiconductor chip 7 on the conductive path 6.
The circuit board to which is adhered is adhered to the case 3 in which the adhesive is applied to the outer frame peripheral groove portion 3A by the application device 4 while being inserted into the groove portion 3A. 21 is a circuit board 8
Is an insulating substrate adhered to the back surface of the. The operation will be described below.
【００１３】図示しない搬送コンベアによりケース３が
線引き塗布装置４による塗布位置に搬送されてくると、
ケース３の所望被塗布位置に接着剤が線引き塗布され
る。このとき、図１に示すようにノズル４０を被塗布位
置に対して斜めに傾斜させて配置させているため、従来
のノズルを被塗布位置に対して垂直に配置させたものに
比して線引きの幅（細さ）、厚みを幅広く調節できる。
即ち、例えば細く、厚く線引きしたい場合でも従来では
ノズルとケースの被塗布面との間隔を狭める必要があ
り、吐出された接着剤がノズルにより押し潰されてしま
い、所望の線引きができないといったことがあったが、
本発明ではノズル４０から吐出された接着剤はノズル４
０の斜め前方に吐出されるため、押し潰されるというこ
とがなく、所望の線引き塗布が行える。尚、本発明のノ
ズル４０によればクリアランス許容値をおよそ±０．２
乃至０．３ｍｍとすることができ、機械調整上のシビア
な関係が比較的ラフにでき、より安定した作業が可能と
なる。即ち、本発明のノズルでは図５に示すようにｂ点
を従来のノズルを示す図６のｘ、そしてａ点をｙまで変
化させても塗布作業が行えクリアランス許容値の範囲が
広がる。When the case 3 is conveyed to a coating position by the wire drawing coating device 4 by a conveyor not shown,
The adhesive is drawn and applied to the desired application position of the case 3. At this time, as shown in FIG. 1, since the nozzle 40 is obliquely arranged with respect to the coating position, the line drawing is performed as compared with the conventional nozzle in which the nozzle is arranged vertically with respect to the coating position. Wide width (thinness) and thickness can be adjusted.
That is, for example, even when thin and thick drawing is desired, conventionally, it is necessary to narrow the gap between the nozzle and the surface to be coated of the case, and the ejected adhesive is crushed by the nozzle and desired drawing cannot be performed. There was,
In the present invention, the adhesive ejected from the nozzle 40 is the nozzle 4
Since the ink is discharged diagonally forward of 0, the desired wire drawing application can be performed without being crushed. In addition, according to the nozzle 40 of the present invention, the clearance allowable value is about ± 0.2.
The thickness can be set to 0.3 mm, and the severe relationship in machine adjustment can be made relatively rough, and more stable work can be performed. That is, in the nozzle of the present invention, as shown in FIG. 5, even if the point b is changed to x in FIG. 6 showing the conventional nozzle and the point a is changed to y, the coating operation can be performed and the range of the clearance allowable value is widened.
【００１４】以上のようにして接着剤が塗布されたケー
ス３に後工程で回路基板８、絶縁基板２１が接着された
後、ケース３の基板８の上から樹脂を注入し、硬化炉で
該樹脂を硬化させて混成集積回路が完成される。尚、本
実施例ではノズルを被塗布物に対して斜めに配置した例
を示したがこれに限らず例えば図３のノズル４０Ａのよ
うに斜めに配置したノズルの吐出部を斜めに切断した形
のものや図４のノズル４０Ｂのように垂直に配置したノ
ズルの吐出部を斜めに切断した形のものでも良く、即ち
ノズルから吐出された接着剤がノズルと被塗布物とで押
し潰されないように少なくとも吐出部下面の高さを塗布
進行方向側の吐出部下面の高さに比して反対側の吐出部
下面の高さをより高くした状態で線引き塗布できるもの
であれば本願の効果が得られる。しかし、ノズル先端を
切断することは、先端加工作業が必要となると共に塗布
作業が不安定となるおそれがある。After the circuit board 8 and the insulating substrate 21 are adhered to the case 3 coated with the adhesive as described above in a later step, a resin is injected from above the board 8 of the case 3 and the resin is injected in a curing furnace. The resin is cured to complete the hybrid integrated circuit. In the present embodiment, the example in which the nozzles are arranged obliquely with respect to the object to be coated is shown, but the present invention is not limited to this, and the discharge portion of the obliquely arranged nozzles such as the nozzle 40A in FIG. 4 or a nozzle 40B in FIG. 4 in which the discharge portion of a vertically arranged nozzle is cut obliquely, that is, the adhesive discharged from the nozzle is not crushed by the nozzle and the object to be coated. At least the height of the lower surface of the discharge portion is higher than the height of the lower surface of the discharge portion on the coating advancing direction side, and the effect of the present invention is obtained as long as the height of the lower surface of the discharge portion on the opposite side is higher. can get. However, cutting the tip of the nozzle requires a tip working operation and may make the coating operation unstable.
【００１５】[0015]
【発明の効果】以上、本発明によれば吐出部下面の高さ
を塗布進行方向側の吐出部下面の高さに比して反対側の
吐出部下面の高さをより高くした状態で線引き塗布する
ようにしたため、ノズルから吐出される塗布剤は斜め前
方に吐出されるため、従来の被塗布位置に対してノズル
が垂直に配置されたもののように吐出された接着剤がノ
ズルにより押し潰されるということがなくなり、線引き
塗布される塗布剤の塗布幅、厚みの調節範囲が広がる。
また、ノズルが斜めに取り付けられることによりノズル
と被塗布面とのクリアランス許容値がラフに設定できる
ため、被塗布面の長い先引き表面に凹凸があったとして
も十分に作業が行える。As described above, according to the present invention, the drawing is performed with the height of the lower surface of the discharge portion being higher than that of the lower surface of the discharge portion on the coating advancing direction side. Since the coating material is applied, the coating material discharged from the nozzle is discharged diagonally forward, so that the discharged adhesive is crushed by the nozzle as if the nozzle was arranged perpendicular to the conventional coating position. And the range of adjusting the coating width and thickness of the coating agent to be drawn is expanded.
Further, since the nozzle is obliquely attached, the clearance allowance between the nozzle and the surface to be coated can be roughly set, so that the work can be sufficiently performed even if there is unevenness on the long drawing surface of the surface to be coated.
【図１】本発明の線引き塗布装置を示す図である。FIG. 1 is a diagram showing a wire drawing coating apparatus of the present invention.
【図２】混成集積回路の分解斜視図である。FIG. 2 is an exploded perspective view of a hybrid integrated circuit.
【図３】他の実施例のノズル先端部を示す図である。FIG. 3 is a view showing a nozzle tip portion of another embodiment.
【図４】他の実施例のノズル先端部を示す図である。FIG. 4 is a view showing a nozzle tip portion of another embodiment.
【図５】従来技術と本発明でのクリアランス許容値の違
いを説明するための図である。FIG. 5 is a diagram for explaining a difference in clearance allowable value between the conventional technique and the present invention.
【図６】従来技術と本発明でのクリアランス許容値の違
いを説明するための図である。FIG. 6 is a diagram for explaining a difference in clearance allowable value between the conventional technique and the present invention.
【図７】従来技術を説明するための図である。FIG. 7 is a diagram for explaining a conventional technique.
２ 混成集積回路 ３ ケース ４ 線引き塗布装置 ４０ ノズル ４０Ａ ノズル ４０Ｂ ノズル 2 hybrid integrated circuit 3 case 4 wire drawing applicator 40 nozzle 40A nozzle 40B nozzle
───────────────────────────────────────────────────── フロントページの続き (72)発明者 上岡 義雄 大阪府守口市京阪本通２丁目５番５号 三 洋電機株式会社内 (72)発明者 豊岡 伸一 大阪府守口市京阪本通２丁目５番５号 三 洋電機株式会社内 (72)発明者 松村 直哉 大阪府守口市京阪本通２丁目５番５号 三 洋電機株式会社内 (72)発明者 酒井 紀泰 大阪府守口市京阪本通２丁目５番５号 三 洋電機株式会社内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Yoshio Ueoka 2-5-5 Keihan Hondori, Moriguchi City, Osaka Prefecture Sanyo Electric Co., Ltd. (72) Shinichi Toyooka 2-5 Keihan Hondori, Moriguchi City, Osaka Prefecture No. 5 Sanyo Electric Co., Ltd. (72) Inventor Naoya Matsumura 2-5-5 Keihan Hondori, Moriguchi City, Osaka Prefecture Sanyo Electric Co., Ltd. (72) Inventor Noriyasu Sakai Keihan Hondori, Moriguchi City, Osaka Prefecture 2-5-5 Sanyo Electric Co., Ltd.
Claims (3)
き塗布する線引き塗布方法に於いて、前記被塗布物に対
して前記ノズルを斜めにした状態で線引き塗布するよう
にしたことを特徴とする線引き塗布方法。1. A drawing coating method for drawing a coating agent onto a coating object through a nozzle, wherein the nozzle is inclined with respect to the coating object. Wire drawing application method.
き塗布する線引き塗布方法に於いて、前記ノズルから吐
出された塗布剤がノズルと被塗布物とで押し潰されない
ように少なくとも吐出部下面の高さを塗布進行方向側の
吐出部下面の高さに比して反対側の吐出部下面の高さを
より高くした状態で線引き塗布するようにしたことを特
徴とする線引き塗布方法。2. A drawing coating method for drawing a coating agent onto a material to be coated through a nozzle so as to prevent the coating material discharged from the nozzle from being crushed between the nozzle and the material to be coated. A line-drawing coating method characterized in that the height of the lower surface is higher than the height of the lower surface of the discharge section on the coating advancing direction side, and the height of the lower surface of the discharge section on the opposite side is higher.
き塗布する線引き塗布装置に於いて、前記被塗布物に対
して前記ノズルを斜めに配置させたことによりノズルと
被塗布面とのクリアランス許容値範囲がノズルを垂直に
配置させたものに比して広がるようにしたことを特徴と
する線引き塗布装置。3. A wire-drawing coating device for wire-drawing and coating a coating material onto a coating object through a nozzle, wherein the nozzle and the coating surface are separated by arranging the nozzle obliquely with respect to the coating object. The wire drawing coating device is characterized in that the allowable clearance value range is wider than that in the case where the nozzles are arranged vertically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26761394A JPH08126860A (en) | 1994-10-31 | 1994-10-31 | Line drawing coating application and device therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26761394A JPH08126860A (en) | 1994-10-31 | 1994-10-31 | Line drawing coating application and device therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08126860A true JPH08126860A (en) | 1996-05-21 |
Family
ID=17447147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26761394A Pending JPH08126860A (en) | 1994-10-31 | 1994-10-31 | Line drawing coating application and device therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08126860A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6117490A (en) * | 1996-10-02 | 2000-09-12 | Matsushita Electric Industrial Co, Ltd. | Coating material application method and an apparatus for use in such a method |
| JP2003031234A (en) * | 2001-07-11 | 2003-01-31 | Honda Motor Co Ltd | Method of applying sealant for fuel cell separator |
| JP2004167432A (en) * | 2002-11-21 | 2004-06-17 | Shin Etsu Polymer Co Ltd | Adhesive coater and adhesive coating method |
| WO2013146581A1 (en) * | 2012-03-26 | 2013-10-03 | 兵神装備株式会社 | Tactile printer |
| JP2021087930A (en) * | 2019-12-06 | 2021-06-10 | ローランドディー．ジー．株式会社 | Dispenser device |
| JPWO2022107263A1 (en) * | 2020-11-19 | 2022-05-27 | ||
| JP2022169804A (en) * | 2020-11-19 | 2022-11-09 | スターテクノ株式会社 | Coating applicator |
-
1994
- 1994-10-31 JP JP26761394A patent/JPH08126860A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6117490A (en) * | 1996-10-02 | 2000-09-12 | Matsushita Electric Industrial Co, Ltd. | Coating material application method and an apparatus for use in such a method |
| JP2003031234A (en) * | 2001-07-11 | 2003-01-31 | Honda Motor Co Ltd | Method of applying sealant for fuel cell separator |
| JP2004167432A (en) * | 2002-11-21 | 2004-06-17 | Shin Etsu Polymer Co Ltd | Adhesive coater and adhesive coating method |
| WO2013146581A1 (en) * | 2012-03-26 | 2013-10-03 | 兵神装備株式会社 | Tactile printer |
| JP2013199079A (en) * | 2012-03-26 | 2013-10-03 | Heishin Engineering & Equipment Co Ltd | Tactile printer |
| JP2021087930A (en) * | 2019-12-06 | 2021-06-10 | ローランドディー．ジー．株式会社 | Dispenser device |
| JPWO2022107263A1 (en) * | 2020-11-19 | 2022-05-27 | ||
| WO2022107263A1 (en) * | 2020-11-19 | 2022-05-27 | スターテクノ株式会社 | Coating device |
| JP2022169804A (en) * | 2020-11-19 | 2022-11-09 | スターテクノ株式会社 | Coating applicator |
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