JPH081450A - Positioning confirming device and assembling device using it - Google Patents

Abstract

PURPOSE:To easily confirm the positioning accuracy of a transparent body and an object to be attached thereto. CONSTITUTION:A positioning condition of an object (electronic part) 10 with respect to the upper surface of a transparent body (LCD panel) 9 loaded on and fixed to a setting bed 2, can be confirmed through an image thereof pickup by a photographing means 42a. The setting bed 2 is made of a transparent material, or is formed therein with through-holes vertically piercing it, and accordingly, the image of the object 10 can be picked up underneath the setting bed by the photographing means through the through holes and the transparent body 9. Further, in an assembling device using this positioning confirming device, the object 10 is attached to the transparent body 9 after the positioning condition is confirmed by the positioning confirming device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is mainly applied to a transparent body when mounting an electronic component (object) such as an IC chip on the upper surface of a liquid crystal display (LCD) panel (transparent body). BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for confirming a positioning state of an object and an assembling device using the device.

[0002]

2. Description of the Related Art As shown in FIG. 8A, the above LCD has a peripheral portion (hereinafter referred to as a panel peripheral portion) 9b formed around a screen portion 9a of a glass LCD panel 9.
The IC chip 10 is assembled by pressure bonding to the upper surface of the. A large number of bumps (contact points) are formed on the lower surface of the IC chip 10 at an extremely small pitch (for example, 50 μm), and correspondingly, a large number of wiring patterns are printed on the upper surface of the panel peripheral portion 9b at a narrow pitch. Has been done. Therefore, when joining the two, it is necessary to perform accurate positioning so that the positions of the bumps and the positions of the wiring patterns match.

By the way, automation of such assembling work is in progress, and an automatic assembling apparatus 100 as shown in FIGS. 8B and 8C is used. This assembling apparatus includes a set base 1 for mounting and fixing an LCD panel 9.
02 and a heater chip 107 that adsorbs the IC chip 10 above the set table 102. In this assembling apparatus 100, as shown in FIG. 8 (B), first, a vertical field microscope 106 having both vertical field of view is inserted between the setting table 102 and the heater chip 107. The composite (superimposed) image of the wiring pattern and the bump taken by the microscope 106 is displayed on the monitor M.
The operator can confirm the positional deviation between the LCD panel and the IC chip by looking at this display, and adjusts the position (X, Y, θ) of the set table 102 so that this positional deviation disappears. The IC chip 10 thus positioned above the LCD panel 9 is pressed against the panel peripheral portion 9b and heated by the heater chip 107 moved downward as shown in FIG. 8C, and each bump B is connected to each wiring. It is joined to the pattern P.

[0004]

However, in the above assembling apparatus, the vertical field microscope itself is displaced from the installation position for accurate positioning confirmation, or the vertical axis of the vertical field microscope is tilted. However, there is a problem that the positioning accuracy is not reliable. It should be noted that after the IC chip is moved down, it is conceivable to use the microscope (with a lower field of view) again to confirm the positioning after the bonding is completed from the upper surface side of the IC chip, but the bonding state of the bump and the wiring pattern can be seen directly. It doesn't mean that it doesn't improve reliability so much.

The present invention has been made in view of the above problems, and a transparent body (LCD panel) and an object (IC) are provided.
It is an object of the present invention to provide a positioning confirmation device and a assembling device using the same so that the positioning accuracy with a chip can be easily confirmed.

[0006]

In order to achieve the above-mentioned object, the positioning confirmation apparatus of the present invention is an object (electronic component) on the upper surface of a transparent body (LCD panel) mounted and fixed on a set base. The positioning state of the can be confirmed by the image taken by the photographing means, and the setting table formed by the photographing means is used by using the setting table made of a transparent material or the setting table having through holes penetrating vertically. From below, the object is photographed through the transparent set table or the through hole and the transparent body.

Further, the assembling apparatus of the present invention is such that the set table as described above, a mounting means for moving and mounting the object on the upper surface of the transparent body mounted and fixed on the set table, and the object by the mounting means. When is moved to the upper surface of the transparent body,
Positioning confirmation means for photographing the object from the lower side of the setting table through the transparent setting table or the through hole and the transparent body, and for confirming the positioning state of these by the photographed image. In this assembly apparatus, the object can be attached to the transparent body after the positioning state is confirmed by the positioning confirmation means.

[0008]

In the positioning confirmation apparatus as described above, the photographing means directly photographs the positional deviation state (direction and amount) of the transparent body and the object from the lower side (back side) of the transparent body and displays it as an image.
For this reason, in the assembling apparatus equipped with this positioning confirming means, if the above-mentioned positioning confirmation is performed and then the position adjustment of the vertical field microscope is performed, the accuracy of the assembling apparatus can be confirmed easily and accurately. You can

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a positioning confirmation device according to the present invention. The positioning confirmation device 1 is incorporated in a part of an LCD assembling device, and includes an LCD setting table 2, a setting table position adjusting device 3, and a lower microscope 4.
And a TV monitor M.

The LCD set base 2 is shown in FIGS. 2 (A) and 2 (B).
As also shown in FIG. 3, it is formed in a rectangular plate shape with a transparent material such as quartz glass. An LCD panel 9 is mounted on such an LCD set base 2. This LCD
The panel 9 for use is the same as that shown in FIG. 8A, and has a screen portion 9a and an L-shaped peripheral portion 9b.
The LCD panel 9 can adsorb and fix the set base 2 by using negative air pressure.

As shown in FIG. 1, the setting table position adjusting device 3 has a pressure bonding table 31 on which the LCD setting table 2 is mounted and fixed, a turning table 32 for horizontally turning the pressing table 31, and a turning table. A Y-axis table 33 that moves the Y-axis table 32 in the front-back (Y) direction and an X-axis table 34 that moves the Y-axis table 33 in the left-right (X) direction. As shown in detail in FIG. 2 (A), the crimping table 31 has a body portion 31b formed in a hollow columnar shape and having a circular rectangular opening portion 31a (see FIG. 2 (B)) on the upper surface, and this opening portion. It is composed of a fixed plate 31c attached to the upper surface of the body 31b so as to cover 31a. As shown in FIG. 2B, through-holes (peep holes) 31d extending along the side edges of the fixed plate 31c are formed on the lower side (front side in FIG. 1) and the right side of the fixed plate 31c. There is.
The peep hole 31d is located inside the opening 31a.

On the upper surface of the fixing plate 31c thus formed, the above-mentioned LCD set base 2 is placed, as shown in FIG. 2 (A). In this state, the LCD set base 2 is fixed to the fixed plate 31c (pressure bonding table 31). On this occasion,
A peripheral portion 9b of the LCD panel 9 fixed to the LCD set base 2 is located above the peep hole 31d. Further, a camera insertion hole 31e into which a lower microscope 8 described later can be inserted is formed on the left side surface of the body portion 31b. Note that FIG.
As shown in (B), the width of the camera insertion hole 31e is slightly larger than the width of the panel 9 fixed to the set table 2.

As shown in FIG. 1, the lower microscope 4 is arranged on the left side of the setting table position adjusting device 3. The lower microscope 4 includes a moving table 40 that moves the base 41 in the left-right (X) direction, a television camera 42 that is mounted on the upper surface of the base 41 by extending a lens 42a to the right, and a lens on the base 41. It is composed of an insertion mirror 43 attached to the right side of 42a. The television camera 42 is a black-and-white type CCD camera, and the lens 42a can adjust the magnification between about 50 and 200 times. The insertion mirror 43 has a cylindrical cover 4 as shown in detail in FIG.
3a, and a mirror (ordinary mirror) 44 attached to the tip of the cover 43a facing the direction of the upper left 45 degrees. An opening 43b is formed in the cover 43a above the mirror 44. Therefore, the opening 43
The light L4 incident from above through b is reflected to the left by the mirror 44 and is incident on the lens 42a. By the operation of the moving table 40, the insertion mirror 43 is moved to the crimp table 31
It is possible to go in and out of the crimping table 31 through the camera insertion hole 31e formed in the.

The television monitor M is a 9-inch black and white television, and selectively displays an enlarged image taken by the lower microscope 7 and an enlarged image taken by the vertical field microscope 6 described later.

The assembling apparatus is provided with a vertical field microscope 6 and a heater press 7 in addition to the positioning confirmation apparatus thus constructed. Vertical field microscope 6
Is composed of two television cameras 62 and a beam splitter 63, as shown in FIG. TV camera 6
Reference numeral 2 is the same black-and-white type CCD camera used in the lower microscope 7, and the lens 62a is approximately 5
It is possible to adjust the magnification between 0 and 200 times.

The beam splitter 63 has a main body cover formed in a cross shape. The main body cover includes a first cover portion 64a that extends in the vertical direction and has upper and lower ends opened, and a second cover portion 64b that extends in the left-right direction and has both rear end portions opened.
Consists of Although not shown, the first cover portion 64
A portion where a and the second cover portion 64b are combined is open to each other, and these internal spaces communicate with each other. Also,
The beam splitter 63, as shown in detail in FIG.
Mirrors 65 to 68 arranged at predetermined positions in the body cover
Have. At the central portion in the vertical direction of the first cover portion 64a,
The first mirror 65 is arranged. This first mirror 65
Faces diagonally downward 45 degrees. The first mirror 65 is a so-called half mirror, and has a property of reflecting a part of the incident light beam and transmitting the rest. A second mirror (ordinary mirror) 66 that vertically rises from the same position as the lower end of the first mirror 65 and faces rearward is disposed at the center of the first cover portion 64a in the vertical direction.

On the other hand, two third mirrors (ordinary mirrors) 67, 67 are arranged at the center of the second cover portion 64b in the left-right direction. Each of these third mirrors 67, 67 faces forward and outward at an angle of 45 degrees with the center as a boundary. Further, fourth mirrors (ordinary mirrors) 68, 68 are arranged at both left and right ends of the second cover portion 64b. Each of the fourth mirrors 68, 68 faces rearward and inward at an angle of 45 degrees.

In the beam splitter 63 thus constructed, a part (L1, L1 ') of the light incident on the lower surface of the first mirror 65 from the lower end opening of the first cover portion 64a is reflected backward. The reflected light (L2, L2 ') is reflected by the third mirror 67 and travels leftward or rightward. Further, the reflected light (L3, L3 ') is reflected by the fourth mirror 68 and travels backward, and the lenses 62a, 62 of the television camera 62 are reflected.
It is incident on a (that is, the image captured by each fourth mirror 68 is captured by each television camera 62). On the other hand, a part (L4, L4 ') of the light incident on the upper surface of the first mirror 65 from the upper end opening of the first cover portion 64a is reflected forward. This reflected light is reflected by the second mirror 66 and travels backward. Then, a part (L5, L5 ') of this reflected light passes through the first mirror 65 and travels backward, is reflected by the third mirror 67 and the fourth mirror 68 (L6, L6'), and the lens 62a, 6
It is incident on 2a. Therefore, if there are objects above and below the first cover portion 64a, the respective left and right halves of these objects are captured by the respective television cameras 62.

The heater press 7 is, as shown in FIG.
It is arranged above the set table position adjusting device 3 and has a main body cover 71 fixed to a frame (not shown) of the assembling device. The heater press 7 is provided with a heater chip 74, which is heated by a pulse heater (not shown), at its lower end so as to be vertically movable. As shown in FIG. 6, the heater chip 74 can adsorb the IC chip 10 using negative air pressure. The IC chip 10
Is placed on the tray 51 of the chip supply device 5 shown in FIG. 6 and conveyed below the heater chip 74.

Next, the initial setting work of the assembling apparatus thus configured, that is, the precision setting work will be described. First, as shown in FIG. 7A, the heater press 7 having the IC chip 10 adsorbed thereon is moved downward to bring the IC chip 10 close to the peripheral portion 9b of the LCD panel 9 fixed to the set table 2. On the other hand, the lower microscope 4 is moved to the right (forward) to insert the insertion mirror 43 into the pressure bonding table 31. At this time, the opening 43b of the insertion mirror 43 is moved to just below the viewing window 31d. As a result, the viewing window 3 is formed on the mirror 44.
An image of the bump B and the wiring pattern P viewed from the back side is seen through the transparent substrate 1d and 1d. If this is photographed by the television camera 42 and displayed on the television monitor M, it is possible to confirm whether or not there is a positional deviation between the bump B and the wiring pattern P, as shown in FIG. 7B. If there is a position shift, the set base position adjusting device 3 is operated to move the LCD panel 9 to eliminate the position shift.

Next, the heater press 7 is moved upward and the vertical field microscope 6 is moved forward to move the upper and lower openings of the first cover portion 64a of the beam splitter 63 to the IC chip 10 as shown in FIG. 4 (A). The lower surface of the panel and the panel peripheral portion 9b. As a result, an image in which the IC chip 10 and the panel peripheral portion 9b overlap each other is captured by each television camera 62, and an enlarged composite image of the bump B and the wiring pattern P is displayed on the television monitor M as shown in FIG. 4B. Is displayed. The monitor image shown on the left side in FIG. 4B corresponds to the lower left field of view F1 in the wiring pattern P shown in FIG. 4C, and the monitor image shown on the right side is the upper right field of view F2. It corresponds to.

When the image of the wiring pattern P and the image of the bump B in these monitor images are deviated, it can be determined that the vertical field microscope 6 itself is misaligned or the vertical axis is tilted. The position of the vertical field microscope 6 is corrected so that the image of the pattern P and the image of the bump B overlap. In this way, the accuracy of the assembly device can be easily and accurately obtained.

After the accuracy of the assembling apparatus is completed, the positioning between the panel peripheral portion 9b and the IC chip 10 is first confirmed using the vertical field microscope 6, and then the heater press 7 is heated and moved downward. The IC chip 10 is pressure-bonded to the panel peripheral portion 9b to assemble the LCD.

In the above embodiment, the assembling apparatus for crimping the IC chip to the LCD panel has been described, but the assembling apparatus of the present invention is, for example, for attaching the IC chip to the printed wiring board. It may be.
Further, in the above-mentioned embodiment, the set table formed of the transparent material is used, but the set table formed of the opaque material and having the through hole overlapping the peep hole 31d shown in FIG. 2 and the like is used. You can also In this case, since the object can be photographed through the through hole and the transparent body, it is possible to obtain the same effect as in the case of using the transparent set table.

[0025]

As described above, in the positioning confirmation apparatus of the present invention, the transparent body and the object are photographed from the lower side (back side) of the transparent body. Therefore, it is possible to directly determine the positional deviation between the two from the captured image. Therefore, in the assembling apparatus using this positioning confirmation apparatus, the accuracy confirmation can be easily and accurately performed at the time of initial setting.

[Brief description of drawings]

FIG. 1 is a perspective view showing a positioning confirmation device according to the present invention and an assembly device using the same.

2A and 2B are a side sectional view and a plan view of a crimping table which constitutes the assembling apparatus.

FIG. 3 is a partial side view of a lower microscope which constitutes the positioning confirmation device.

FIG. 4 is an operation explanatory view of an up-down field microscope which constitutes the assembling apparatus.

FIG. 5 is a partial perspective view of the above vertical field microscope.

FIG. 6 is a conceptual diagram showing a heater press and a chip supply device that constitute the assembly device.

FIG. 7 is an operation explanatory view of the positioning confirmation device.

FIG. 8 is a perspective view of an LCD panel and an operation explanatory view of a conventional automatic assembly apparatus.

[Explanation of symbols]

 2,102 set stand 6,106 vertical field microscope 7 lower microscope 9 LCD panel 10 IC chip B bump P wiring pattern

Claims (4)

[Claims] 1. A positioning confirmation device capable of confirming a positioning state of an object with respect to an upper surface of a transparent body mounted and fixed on a set table by an image photographed by a photographing means, wherein the set table is transparent. The positioning confirmation apparatus is formed of a material, and the photographing means photographs the object from below the set table through the set table and the transparent body. 2. A positioning confirmation device capable of confirming a positioning state of an object with respect to an upper surface of a transparent body placed and fixed on a set table by an image photographed by a photographing means, wherein the set table has a vertical position. A positioning confirmation device is characterized in that a through hole penetrating in a direction is formed, and the photographing means photographs the object from below the set table through the through hole and the transparent body. 3. A set base made of a transparent material, a mounting means for mounting an object by moving it on the upper surface of a transparent body mounted and fixed on the set base, and the mounting means for mounting the object. From a positioning confirmation means for photographing the object through the set base and the transparent body from the lower side of the set base when moved to the upper surface of the transparent body and confirming the positioning state by the captured image. The assembly apparatus is characterized in that after the positioning state is confirmed by the positioning confirmation means, the object is attached to the transparent body by the attachment means. 4. A set base having a through hole formed therethrough in the vertical direction, a mounting means for moving and mounting an object on an upper surface of a transparent body mounted and fixed on the set base, and the mounting means for mounting the object. When the object is moved to the upper surface of the transparent body, the object is photographed from the lower side of the set table through the through hole and the transparent body, and the positioning confirmation is performed by the photographed image to confirm the positioning state. An assembling apparatus comprising: means for attaching the object to the transparent body by the attaching means after confirming the positioning state by the positioning confirming means.