JPH081528A - Scissors for physics and chemistry and manufacturing method thereof - Google Patents
Scissors for physics and chemistry and manufacturing method thereofInfo
- Publication number
- JPH081528A JPH081528A JP16448194A JP16448194A JPH081528A JP H081528 A JPH081528 A JP H081528A JP 16448194 A JP16448194 A JP 16448194A JP 16448194 A JP16448194 A JP 16448194A JP H081528 A JPH081528 A JP H081528A
- Authority
- JP
- Japan
- Prior art keywords
- surface layer
- alloy
- physicochemical
- sandwiching
- physics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Abstract
(57)【要約】
【目的】 高価なPtやPt合金の使用量を必要最小限
として十分な特性を備えた理化学用挟持器具を提供す
る。
【構成】 挟持部2の少なくとも相対向する面に、Pt
又はPt合金を析出堆積した表面層3が形成されている
ことにより、表面層を厚さ方向へ緻密な結晶組織構造を
有したPt又はPt合金とする。
(57) [Summary] [Purpose] To provide a physicochemical clamping device having sufficient characteristics by minimizing the amount of expensive Pt or Pt alloy used. [Structure] Pt is formed on at least opposite surfaces of the sandwiching portion 2.
Alternatively, since the surface layer 3 is formed by depositing and depositing a Pt alloy, the surface layer is made of Pt or a Pt alloy having a dense crystallographic structure in the thickness direction.
Description
【0001】[0001]
【産業上の利用分野】本発明は、理化学用るつぼや分析
試料等を挟んで電気炉やバーナ炉へ入れたり、出した
り、あるいは移動したりするのに用いるトングやピンセ
ット等の理化学用挟持器具及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sandwiching tool for physics and chemistry, such as tongs and tweezers, which is used for inserting, unloading, and moving a physics and chemistry crucible, an analytical sample, and the like into an electric furnace or a burner furnace. And a manufacturing method thereof.
【0002】[0002]
【従来の技術】従来、この種の理化学用挟持器具は、被
挟持物の汚染を防止するため、耐熱性、耐食性及び化学
的安定性に優れたPt又はPt合金からなる被膜又はさ
やによって挟持部(掴み部)を被覆して構成されてい
る。上記被膜やさやによる挟持部の被膜は、被膜のろう
付や分割されたさやの溶接によって行われている(特開
平3−92284号公報、特開平3−92285号公報
参照)。2. Description of the Related Art Conventionally, this type of physics and chemistry clamping device uses a coating or sheath made of Pt or a Pt alloy which is excellent in heat resistance, corrosion resistance and chemical stability in order to prevent contamination of the object to be clamped. (Gripping part) is covered. The coating of the sandwiched portion with the coating sheath is performed by brazing the coating or welding divided sheaths (see Japanese Patent Laid-Open Nos. 3-92284 and 3-92285).
【0003】[0003]
【発明が解決しようとする課題】しかしながら、従来の
理化学用挟持器具及びその製造方法では、挟持部の被覆
を必要最小限のPt又はPt合金で行うことが望ましい
ものの、被膜等を別途パーツとして作製する必要がある
ので、薄さや大きさに限界がある。又、別ピースの取付
け作業となるので、接合しにくかったり、剥がれたりあ
るいは平坦でない等の不具合がある。そこで、本発明
は、高価なPt又はPt合金の使用量を必要最小限とし
て十分な特性を備えた理化学用挟持器具、及び長寿命で
精度良く容易に製造し得る理化学用挟持器具の製造方法
を提供することを目的とする。However, in the conventional clamping device for physics and chemistry and the manufacturing method thereof, it is desirable to cover the clamping part with the minimum necessary amount of Pt or Pt alloy, but the coating film and the like are produced as separate parts. Therefore, there is a limit in thinness and size. Further, since it is a work of attaching another piece, there are problems that it is difficult to join, peels off, or is not flat. Therefore, the present invention provides a physics and chemistry clamping device having sufficient characteristics with a necessary minimum amount of expensive Pt or Pt alloy, and a method for manufacturing a physics and chemistry clamping device that can be manufactured easily with long life and with high accuracy. The purpose is to provide.
【0004】[0004]
【課題を解決するための手段】前記課題を解決するた
め、本発明の理化学用挟持器具は、挟持部の少なくとも
相対向する面に、Pt又はPt合金を析出堆積した表面
層が形成されていることを特徴とする。前記挟持部を有
するものが、トングであることが好ましい。又、前記挟
持部を有するものが、ピンセットであってもよい。前記
表面層の厚さが、10〜 100μmであることが好ましい。
一方、本発明の理化学用挟持器具の製造方法は、挟持部
の少なくとも相対向する面に、無電解めっきにより下地
層を形成した後、電気めっきによりPt又はPt合金の
表面層を形成することを特徴とする。前記下地層が、P
t、Ni又はCuであることが好ましい。In order to solve the above problems, the physicochemical clamping device of the present invention has a surface layer formed by depositing and depositing Pt or a Pt alloy on at least opposite surfaces of the clamping part. It is characterized by The tongue preferably has the sandwiching portion. Moreover, what has the said clamping part may be tweezers. The thickness of the surface layer is preferably 10 to 100 μm.
On the other hand, in the method for manufacturing a physicochemical sandwiching device of the present invention, after forming a base layer by electroless plating on at least opposite surfaces of the sandwiching portion, a surface layer of Pt or Pt alloy is formed by electroplating. Characterize. The underlayer is P
It is preferably t, Ni or Cu.
【0005】[0005]
【作用】本発明の理化学用挟持器具においては、表面層
が厚さ方向へ緻密な結晶組織構造を有したPt又はPt
合金となる。表面層の厚さが、10μm未満であると、P
t又はPt合金の特性が有効に発揮されず、 100μmを
超えると、コスト高になると共に、厚さに見合う効果が
なく形成時間が長くなる。又、本発明の理化学用挟持器
具の製造方法においては、所要の厚さの表面層の形成が
容易になり、かつその密着(接合)強度が十分となる。
下地層をPt、Ni又はCuとすることにより、安定し
た電気めっきが可能となる。In the physicochemical sandwiching device of the present invention, Pt or Pt whose surface layer has a dense crystallographic structure in the thickness direction.
Become an alloy. If the thickness of the surface layer is less than 10 μm, P
If the characteristics of t or Pt alloy are not effectively exhibited and the thickness exceeds 100 μm, the cost becomes high, and there is no effect commensurate with the thickness, and the formation time becomes long. Further, in the method for manufacturing a physicochemical sandwiching device of the present invention, it becomes easy to form a surface layer having a required thickness, and the adhesion (bonding) strength thereof becomes sufficient.
By using Pt, Ni, or Cu for the underlayer, stable electroplating can be performed.
【0006】[0006]
【実施例】以下、本発明の実施例について図面を参照し
て説明する。図1、図2は本発明の理化学用挟持器具の
1実施例を示すトングの斜視図、要部の拡大図である。
このトング1は、挟持部2の表面にPt又はPt合金を
析出堆積した厚さ10〜100μmの表面層3が形成されて
なる。挟持部2を覆う表面層3のPt又はPt合金は、
上記析出堆積により、厚さ方向へ緻密な結晶組織構造を
有している。ここで、表面層3の厚さが10μm未満であ
ると、Pt又はPt合金の特性が十分に発揮されず、
又、 100μmを超えると、コスト高になると共に、それ
に見合う効果が得られず、かつ形成時間が長くなった。
したがって、上記構成のトング1によれば、高価なPt
又はPt合金の使用量を最小限にすることができると共
に、接合強度が十分で長寿命のものとすることができ
る。Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are a perspective view of a tongue showing one embodiment of the physicochemical clamping device of the present invention, and an enlarged view of the main part.
The tongue 1 has a surface layer 3 having a thickness of 10 to 100 μm formed by depositing and depositing Pt or a Pt alloy on the surface of the holding portion 2. The Pt or Pt alloy of the surface layer 3 covering the sandwiching portion 2 is
Due to the above deposition and deposition, it has a dense crystallographic structure in the thickness direction. Here, when the thickness of the surface layer 3 is less than 10 μm, the characteristics of Pt or Pt alloy are not fully exhibited,
On the other hand, if it exceeds 100 μm, the cost becomes high, the effect commensurate with it is not obtained, and the forming time becomes long.
Therefore, according to the tongs 1 having the above-mentioned configuration, the expensive Pt
Alternatively, the amount of Pt alloy used can be minimized, and the bonding strength can be sufficient and the life can be long.
【0007】上記構成のトングに際しては、ステンレス
鋼からなるトングを脱脂した後、挟持部以外をマスキン
グし、Pt、Ni又はCuの無電解めっきにより厚さ
0.1μmの下地層を形成した後、所要のめっき浴(例え
ばプラチナート 100(Pt;10g/l ):日本エレクトロ
プレイティング・エンジニヤース(株)製)を用いて厚
さ 300μmの表面層を形成した。得られたトングにおけ
る挟持部の表面層は、ビッカース硬さ 300を有している
と共に、ピンホールやクラック等の欠陥が無く、かつ良
好な平坦度と外観を呈した。比較のために、トングにお
ける挟持部の相対向する面に、厚さ 500μmのPtをろ
う付したところ、ビッカース硬さ50となると共に、良好
な平坦度が得られなかった。When the tongue having the above structure is degreased, the tongue made of stainless steel is degreased, the portions other than the sandwiching portion are masked, and the thickness is obtained by electroless plating of Pt, Ni or Cu.
After forming a 0.1 μm underlayer, a 300 μm thick surface layer was formed using the required plating bath (eg Platinate 100 (Pt; 10 g / l): Nippon Electroplating Engineering Co., Ltd.). . The surface layer of the sandwiching portion of the obtained tongs had a Vickers hardness of 300, had no defects such as pinholes and cracks, and exhibited good flatness and appearance. For comparison, when Pt having a thickness of 500 μm was brazed to the opposing surfaces of the sandwiching portion of the tongue, Vickers hardness was 50 and good flatness was not obtained.
【0010】なお、上記実施例においては、トングにつ
いて述べたが、ピンセットに本発明を適用しても同様の
作用効果が得られる。又、表面層は、挟持部の全表面に
形成する場合に限らず、被挟持物と接触する少なくとも
相対向する面に形成されていればよい。Although the tongs have been described in the above embodiments, the same effect can be obtained by applying the present invention to the tweezers. Further, the surface layer is not limited to being formed on the entire surface of the sandwiching portion, but may be formed on at least opposite surfaces that contact the object to be sandwiched.
【0009】[0009]
【発明の効果】以上説明したように、本発明の理化学用
挟持器具によれば、表面層が、厚さ方向へ緻密な結晶組
織構造を有したPt又はPt合金となるので、従来に比
して高価なPt又はPt合金の使用量を必要最小限とし
て十分な特性を備えたものとすることができる。又、理
化学用挟持器具の製造方法によれば、表面層の密着(接
合)強度が十分となり、かつその所要の厚さの形成が容
易となるので、従来に比して長寿命とし得、かつ精度良
く容易に製造することができる。As described above, according to the physicochemical sandwiching device of the present invention, the surface layer is made of Pt or Pt alloy having a dense crystallographic structure in the thickness direction. Thus, the amount of expensive Pt or Pt alloy used can be minimized to provide sufficient characteristics. Further, according to the method for manufacturing a physicochemical sandwiching device, the adhesion (joining) strength of the surface layer becomes sufficient and the required thickness can be easily formed, so that the life can be made longer than in the past, and It can be manufactured accurately and easily.
【図1】本発明の理化学用挟持器具の一実施例を示すト
ングの斜視図である。FIG. 1 is a perspective view of a tongue showing an embodiment of a physicochemical clamping device of the present invention.
【図2】図1のトングの要部の拡大図である。FIG. 2 is an enlarged view of a main part of the tongue shown in FIG.
1 トング 2 挟持部 3 表面層 1 tongs 2 clamping part 3 surface layer
Claims (6)
t又はPt合金を析出堆積した表面層が形成されている
ことを特徴とする理化学用挟持器具。1. A P is provided on at least opposite surfaces of the sandwiching portion.
A physicochemical sandwiching device having a surface layer formed by depositing and depositing t or Pt alloy.
ることを特徴とする請求項1記載の理化学用挟持器具。2. The clamping device for physics and chemistry according to claim 1, wherein the one having the clamping portion is a tongue.
であることを特徴とする請求項1記載の理化学用挟持器
具。3. The physicochemical clamping device according to claim 1, wherein the one having the clamping part is tweezers.
ることを特徴とする請求項1、2又は3記載の理化学用
挟持器具。4. The clamping device for physics and chemistry according to claim 1, 2 or 3, wherein the surface layer has a thickness of 10 to 100 μm.
解めっきにより下地層を形成した後、電気めっきにより
Pt又はPt合金の表面層を形成することを特徴とする
理化学用挟持器具の製造方法。5. A method of manufacturing a physicochemical sandwiching device, which comprises forming a base layer by electroless plating on at least opposing surfaces of the sandwiching portion, and then forming a surface layer of Pt or Pt alloy by electroplating. .
ることを特徴とする請求項5記載の理化学用挟持器具の
製造方法。6. The method of manufacturing a physicochemical sandwiching device according to claim 5, wherein the underlayer is Pt, Ni or Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16448194A JPH081528A (en) | 1994-06-23 | 1994-06-23 | Scissors for physics and chemistry and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16448194A JPH081528A (en) | 1994-06-23 | 1994-06-23 | Scissors for physics and chemistry and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH081528A true JPH081528A (en) | 1996-01-09 |
Family
ID=15793997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16448194A Pending JPH081528A (en) | 1994-06-23 | 1994-06-23 | Scissors for physics and chemistry and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH081528A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010110838A (en) * | 2008-11-04 | 2010-05-20 | Pearl:Kk | Method of processing eye glasses |
| JP2014101575A (en) * | 2012-10-23 | 2014-06-05 | Sumitomo Metal Mining Co Ltd | Cathode hanger correction instrument |
-
1994
- 1994-06-23 JP JP16448194A patent/JPH081528A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010110838A (en) * | 2008-11-04 | 2010-05-20 | Pearl:Kk | Method of processing eye glasses |
| JP2014101575A (en) * | 2012-10-23 | 2014-06-05 | Sumitomo Metal Mining Co Ltd | Cathode hanger correction instrument |
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