JPH0817532A - IC socket - Google Patents

Abstract

(57) [Abstract] [Purpose] While ensuring highly reliable pressure contact between the contacts held in the socket body and the leads of the IC, the heat sink is firmly attached to the IC body to effectively generate heat from the IC. An IC socket to be removed is provided. The IC lead 7a is pushed down by a holding plate 10 provided with a heat dissipation plate 9 so that the contact 3 held in the socket body 1 and the IC lead 7a are brought into pressure contact with each other.
In the C socket, the IC body 7 is attached to the socket body 1
An IC socket provided with a support base 4 that elastically pushes up the lower surface of b and presses the upper surface of the IC main body 7b against the heat dissipation plate 9 by the pushing up force so as to be in close contact.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket in which an IC is pushed down by a holding cover provided in a socket body and brought into contact with a contact.

[0002]

2. Description of the Related Art FIG. 5 shows a conventional IC socket provided with an IC support.

The IC support base 2 has leg portions 3 extending vertically downward, and the leg portions 3 are fitted into guide holes 4 provided in the socket body 1 and are provided at the lower ends of the leg portions. Locking claw 3a
Is held in the hole wall to prevent it from coming out upward, and at the same time, the support 5 is cooperated with the spring 5 which urges the support 2 upward, and the support 2 is held up to the upper limit while the support 2 is held up against the spring 5. It is configured to allow movement and lateral movement. The support table 2 and the leg 3 are made of a single component integrally molded with synthetic resin.
When the holding plate 9 mounted on the socket main body 1 is closed to the main body 1 and the IC 10 is pushed down, the support base 2 resists the spring 5 and moves laterally while descending together with the leg portion 3. It has become.

On the other hand, the contact portion 7 of the contact 6 engages with a positioning hole 8 formed in the edge of the support 2 and is aligned with the leg 3 so that the support 2 is compatible with the IC 10 as described above. When laterally moved, the contact portion 7 is also displaced to follow and the IC lead 1 is displaced.
Correspondence with 0a can be obtained.

[0005]

Problems to be Solved by the Invention In recent years, IC sockets have been required to have highly reliable pressure contact between microminiature pitch IC leads and socket body contacts with the recent high integration and thinness and miniaturization of ICs. However, at the same time, depending on the type of the IC, it is necessary to equip the IC socket with a cooling radiator as a measure against heat generation. However, by closing the holding plate 9 attached to the socket body so as to be freely openable and closable to the socket body 1 as in the conventional example, the IC 10 mounted on the socket body 1 is pressed down by the holding force of the holding plate 9 to make contact with the IC lead 10a. In the case of an IC socket of a type in which the IC 6 is brought into pressure contact with the IC socket 6, the IC 10 is concealed by the holding plate 9, so that the presence of the holding plate becomes an obstacle, so that not only is it difficult to equip a heat sink, but also The IC 10 is attached to the holding plate 9 and the lower surface of the heat sink is exposed to the inner surface side of the holding plate 9 so that the IC may be in contact with the upper surface of the IC, depending on the play of the holding plate, the thickness of the IC, the installation position of the IC support, and the like. Was in a situation where the adhesion between the IC and the heat radiating plate was difficult to obtain, and it was difficult to expect efficient heat radiation.

[0006]

SUMMARY OF THE INVENTION The present invention provides an IC socket which is effective as IC protection while solving the above-mentioned problems. As its means, the IC lead is pushed down by a holding plate equipped with a heat dissipation plate. When forming an IC socket in which the contacts held in the socket body and the IC lead are brought into pressure contact with each other, the lower surface of the IC body is elastically pushed up by the socket body, and the pushing force of the IC body The structure is provided with a support base that presses the upper surface against the heat dissipation plate to bring them into close contact.

[0007]

According to the present invention, the I mounted on the socket body is
When the lead of C is pushed down and the IC is lowered, the lower surface of the IC main body is elastically pushed up by the support base along with this pushing down, and the upper surface of the IC main body is equipped with the holding plate by this pushing up force. The heat dissipation plate is pressed against the heat dissipation plate to achieve close contact between the IC body and the heat dissipation plate.
Cool C effectively.

At this time, the IC lead is pressed against the holding surface of the holding plate by the pushing force of the support table, and the holding surface is pressed against the holding surface.
The C leads can be aligned, sufficient frictional resistance can be generated between the IC leads and the pressing surface, and lead deviation (lateral deviation) can be suppressed, and the contact level between each IC lead and the contact can be made uniform and appropriate. It is possible to achieve pressure contact.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the embodiment shown in FIGS.

Reference numeral 1 denotes a socket body formed of a substantially rectangular insulating substrate. The socket body 1 is provided with a holding plate 10, and the holding plate 10 has an IC 7 to be described later on its closing surface.
Has a push-down portion 10a for pushing down the lead.

[0011] As shown in FIG.
A radiator plate 9 for contacting the upper surface of C7 with the upper surface of the main body and cooling the IC is provided. The radiator plate 9 is provided at the center of the holding plate 10.
The mounting lower surface is exposed to the inner surface of the holding plate 10 through the lower portion, and the upper portion of the heat radiating plate 9 is arranged to protrude above the outer surface of the holding plate 10. For example, IC on the closing surface (inner surface) of the holding plate 9
This space 1 is defined by defining a storage space 11 for the main body 7b.
1, the upper surface of the IC 7 is received, and the lower surface of the heat sink 9 is exposed in the space 11 so as to be in contact with the upper surface of the IC 7.

The socket body 1 is provided with a vertically movable first support base 2 at the center of its upper surface, which is not used for pushing down the leads of the IC, and extends along four or two sides of the outer periphery of the first support base 2. A large number of contacts 3 are arranged in parallel, and the first support 2
A second support 4 is disposed at the center of the second support 4 to resiliently push down the lower surface of the IC body 7b as the IC lead 7a is pushed down.

The second support base 4 is provided with an elastic leg 4.
a is extended in parallel downward, and a locking claw 4b which engages with the socket body 1 and prevents the second support 4 from coming off is provided on the free end side of the leg 4a. Have.
The socket body 1 has an opening 1 at the center just below the first support 2.
a, and the leg portion 4a is inserted into the central opening 1a while being contracted against elasticity, and the outward locking claw 4b is engaged with the lip by a restoring force.

The first support base 2 is elastically supported upward with a spring 5 interposed between the first support base 2 and the socket main body 1, and descends against the spring 5 when a lead of an IC described later is depressed. In addition, it is configured to rise according to the spring 5, and allows lateral movement and tilting as described below.

That is, the first support base 2 is provided with a central opening 2a at the center thereof, into which the leg portion 4a of the second support base 4 is loosely inserted, and the second support base passing through the central opening 2a. The locking claws 4b of 4 are restored and engage with the opening wall of the central opening 1a of the socket body 1, so that the second support base 4 is erected in the socket body 1, and as a result, the first support base 2 is spring-loaded. It is held at the upper limit position against 5, and the above vertical movement, lateral movement and tilting are possible. Around the center opening 2a of the first support 2,
The C positioning portion 2b is projected.

The second support base 4 and the leg portions 4a hold the first support base 2 against the elastic force of the spring 5 on the socket body 1 and hold it. At this time, the second support base 4 serves as a locking means for locking the first support base 2 to prevent the second support base 4 from moving upward, and the second support base 4 is provided with the leg portions 4a so that the second support base 4 has a central opening of the first support base 2. The second support is loosely engaged to allow lateral movement of the first support base. The second support 4 is a leg 4
a allows the socket body 1 to move up and down as described above.

The first support base 2 has a contact pitch on the four sides or two sides of the outer peripheral portion thereof, and therefore the IC leads 7a.
A number of positioning holes 6 having the same pitch as the pitch of the contact 3 are arranged in parallel.
Accept b and position.

The contact 3 is implanted in a socket body portion on the outer peripheral portion of the first support base 2, and a first contact is received from the implanted portion.
It has an elastic contact piece 3a extending toward the support base 2, and the contact portion 3b of the elastic contact piece 3a is inserted into the positioning hole 6 as described above. The elastic contact piece 3a restricts the lateral displacement of the contact portion 3b in the positioning hole 6, so that the first support base 2
When the first support base 2 moves back and forth or left and right, the elastic contact piece 3 of the contact 3 is set.
a is displaced following this, and is configured to maintain the relative position with respect to the first support base 2.

Thus, the first support 2 is movable up and down, right and left, and up and down, is tiltable, and is engaged with the second support 4 to restrict the ascending position.

The second support table 4 is elastically supported upward with a spring 8 interposed between the second support table 4 and the socket body 1. The second support table 4 descends against the spring 8 and rises according to the spring 8, and The lower surface of the IC body is resiliently pushed up by holding down the lead of the IC, which will be described later, while holding it at the upper limit position.

Thus, when the flat type IC 7 is mounted on the first support base 2, the first support base 2 synchronizes with the movement of the flat type IC 7 so that the free opening between the center opening 2a and the leg 4a is formed. , And the elastic contact piece 3a of the contact is displaced to follow the movement, and the relative position between the IC lead 7a and the contact portion 3b of the contact is maintained.

At this time, the first support 2 is mounted on the IC positioning portion 2b.
The IC lead 7a is supported on the upper surface of the positioning portion while the side edge of the IC body 7b is regulated and positioned by the IC support 7b, and at the same time, the IC body 7b is supported by the second support base 4 to make contact with the contact portion 3b of the contact 3. Plan.

The IC 7 is not supported by the second support 4 from the beginning, and the IC lead 7a is placed on the contact portion 3b of the contact 3 while floating from the third support 4, and when the IC 7 is pressed down, the first IC lead 7a
The IC is supported by the support 2, and likewise by the second support 4.
The body can be supported.

In any of the above-described embodiments, when the first support 2 for supporting the leads is pushed down by the pressing plate 10 and the IC 7 is lowered, the second support 4 moves the IC body 7b. In this case, the holding plate 10
The IC body 7b to be lowered is resiliently pushed up by the second support 4 so that the IC lead 7a is
Is pressed in cooperation with the first support table 2 in cooperation with the first support base 2 (removal of the vertical deviation of the lead), and the lateral deviation is suppressed well by the frictional resistance of the pressing surface, and the contact with the contact is provided. .

At the same time, as shown in FIG. 4, when the holding plate 10 having the heat radiating plate 9 is
The lead 7a is pressed together with the first support 2 to lower it against the spring 5, and the contact 3b of the contact 3
It is bent while being in contact with the C lead 7a to obtain a contact pressure by its restoring force. Further, by lowering the first support 2 and the IC 7,
The lower surface of the IC main body 7b is stably supported on the second support 4 and the lower surface of the IC main body 7b is pushed up by the elastic force of the spring 8 interposed between the socket main body 7b and the second support 4. The upper surface of the IC body 7b is brought into close contact with the lower surface of the heat sink 9.

That is, the second support 4 presses the IC body 7b against the heat radiating plate 9 regardless of the lowered position of the first support 2, and the IC 7
And the heat radiating plate 9 are surely adhered, and the heat radiating effect is improved.

[0027]

According to the present invention, when the lead of the IC mounted on the socket body is pushed down by closing the holding plate and the IC is lowered, the support base elastically held by the spring is pushed by the pushing. The lower surface of the IC body is elastically pushed up, and the pushing force is used to press the upper surface of the IC body against the lower surface of the heat radiating plate provided on the holding plate to firmly bring the IC body and the heat radiating plate into close contact with each other. Cool effectively.

At this time, the IC leads are pressed against the pressing surface of the pressing plate to be aligned by the elastic lifting force of the supporting base, and the deviation of the leads can be suppressed by the frictional resistance on the pressing surface, so that an appropriate load is applied. Pressure contact can be achieved.

[Brief description of drawings]

FIG. 1 is a plan view of an IC socket showing an embodiment of the present invention.

FIG. 2 is an IC socket cross-sectional view showing a state in which an IC lead is supported by a first support base before being pushed down.

FIG. 3 is a sectional view showing a state after the IC main body is pushed down by supporting the IC main body on a second support base.

FIG. 4 is a sectional view showing a state where the IC is pressed against a heat sink by a second support base in FIG. 3;

FIG. 5 is a sectional view of an IC socket showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket main body 2 1st support 3 Contact 4 2nd support 5,8 Spring 7 IC 7a IC lead 7b IC main body

Claims (1)

[Claims] 1. A contact and an IC held in a socket body by pressing down an IC lead by a holding plate provided with a heat dissipation plate.
An IC socket, which is brought into pressure contact with a lead, is provided with a support base that elastically pushes the lower surface of the IC body against the socket body and presses the upper surface of the IC body against the heat dissipation plate by the pushing force to closely contact the radiator plate. IC socket characterized by