JPH0817865A - Semiconductor device - Google Patents

Abstract

(57) [Summary] [Purpose] To reduce the external dimensions of the resin encapsulant. [Structure] Inner leads 5 formed on carrier tape 1 at bumps 13 protruding from pads 12 of pellets 10
In a tape carrier type package IC17 in which the pellets are mounted on the carrier tape 1 by gang bonding, and the pellets and the inner lead groups are resin-sealed with the resin sealing body 15 formed in the tape body 2. The radial outer shape of 15 is regulated by the flow of the sealing resin 31 being stopped by the sealing resin outflow preventing hole 8 formed in the tape body 2. [Effect] Since the outer dimensions of the resin sealing body 15 can be controlled as desired by the sealing resin outflow prevention hole 8, the tape carrier type package 16 can be reduced in size.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing technique, and more particularly to a semiconductor device manufacturing technique provided with a tape carrier (or film carrier) type package. , Which are effectively used for manufacturing a semiconductor integrated circuit device (hereinafter referred to as IC).

[0002]

2. Description of the Related Art An IC having a tape carrier type package for realizing a thin and highly workable mounting.
As a semiconductor pellet (hereinafter, simply referred to as a pellet) and a carrier tape, tape automated bonding (Tape Automated B
There is one in which the resin encapsulation body is molded by the potting method, which is mechanically and electrically connected by an onding: TAB).

That is, a plurality of pads for taking out this circuit to the outside are formed on the first main surface of the pellet in which the semiconductor integrated circuit is formed, and the pads are formed on the outer peripheral portion of each pad. Bumps made of a conductor such as gold are provided on the surface of each of them. On the other hand, the carrier tape is constructed by forming an inner lead and an outer lead group on a tape body made of an insulating resin such as polyimide. Then, the pellets are arranged on the carrier tape so that the bumps are aligned with the inner leads, respectively, and the bumps and the inner leads are simultaneously bonded by a bonding tool, thereby being electrically and mechanically connected. After that, the sealing resin is potted on the tape body so as to seal the pellet and the inner lead group,
The resin sealing body is molded.

An example of a tape carrier type package using the TAB technology is shown in Japanese Patent Publication No.
No. 1-13379, and "Electronic Materials December 1988 Separate Volume" issued by the Industrial Research Institute Co., Ltd., December 13, 1988, P105 to P113.

[0005]

An IC having a tape carrier type package is an IC for driving a liquid crystal panel because it is thin and can be mounted with good workability.
Widely used as. In general, a liquid crystal panel is required to have a large-sized screen, and in response to this demand, high integration and relative relative to an IC having a tape carrier type package as an IC for driving a liquid crystal panel. Is required to reduce.

However, in the IC provided with the conventional tape carrier type package, since the resin encapsulant is molded by the potting method, the outer dimension of the resin encapsulant in the radial direction on the tape body is small. Since it depends on the viscosity of the sealing resin and the like, there is a problem that the outer diameter dimension of the tape carrier type package becomes large. In other words, even if the IC pellets are highly integrated and downsized, the outer shape of the IC as a whole provided with the tape carrier type package cannot be reduced because it is restricted by the outer dimension of the package.

An object of the present invention is to provide a semiconductor device capable of reducing the outer dimension of the resin sealing body in the radial direction.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, a plurality of pads for taking out the electronic circuit to the outside are formed on the first main surface of the semiconductor pellet in which the electronic circuit is built, and on the other hand, the inner lead and the tape are formed on the tape body of the carrier tape. Outer leads are formed, each pad and each inner lead are gang-bonded, and the pellets are electrically and mechanically connected to the carrier tape.The pellets and inner leads are potted to the area of the pellets in the tape body. In the semiconductor device resin-sealed by the resin sealing body, the radial outer shape of the resin sealing body on the tape is regulated by the sealing resin outflow prevention portion formed on the tape body. Characterize.

[0011]

According to the above-described means, when molding the resin encapsulant, the resin encapsulation is performed by potting the tape encapsulant on the tape body and outflowing radially outward along the surface of the tape body. The outflow prevention unit is in a state in which outflow is prevented. Therefore, the outer dimension of the resin sealing body in the radial direction is regulated by the sealing resin outflow prevention portion and does not expand further. In other words, the outer dimension of the resin encapsulant in the radial direction is controlled by the encapsulating resin outflow prevention portion, so that it can be reduced as desired.

[0012]

1 shows a semiconductor device according to an embodiment of the present invention, in which (a) is a partially omitted enlarged partially plan view and (b) is a partially omitted enlarged partially front view. . FIG. 2 is a partially omitted plan view. FIG. 3 and subsequent figures are explanatory views showing the manufacturing method.

In this embodiment, the semiconductor device according to the present invention is configured as an IC (hereinafter, simply referred to as IC) including a tape carrier type package used for driving a liquid crystal panel. Hereinafter, the structure of this IC will be described in detail by explaining its manufacturing method.

The pellet 10 used in the IC according to this embodiment is constructed as shown in FIG.
That is, in a so-called pre-process in the IC manufacturing process, after a semiconductor integrated circuit (not shown) for driving a liquid crystal panel is built in a silicon wafer (not shown) for each pellet portion, the silicon wafer is not formed. The pellets 10 are formed into small flat plate-like pieces each having a rectangular shape in a plan view by dicing each pellet part.
One end surface of the pellet 10 (hereinafter referred to as the first main surface).
A plurality of pads 12 for taking out the semiconductor integrated circuit to the outside are provided at 11 at the outer peripheral portion of the pellet, arranged annularly at appropriate intervals so as not to interfere with each other. The bumps 13 are formed on the pads 12 formed on the first main surface 11 of the pellet 10 in a substantially hemispherical shape using a gold (Au) -based material so as to project from the first main surface 11. There is.

In this embodiment, the carrier tape 1 constituting the tape carrier type package is constructed as shown in FIG. That is, the carrier tape 1 includes the IC pellet 10 and the inner lead group as a tape.
The tape main body 2 as a carrier having an insulating property is provided so as to be mechanically and electrically connected by automated bonding (TAB). The tape body 2 is made of an insulating resin such as polyimide, and is integrally formed so that the same pattern is continuous in the longitudinal direction. However, the description and illustration are given for only one unit. Feed holes 3 used for pitch feed are formed at equal pitches on both side edges of the tape body 2 in the width direction. Further, pellet accommodating holes 4 for accommodating the pellets 10 are formed in the central portion of the tape body 2 in the width direction so as to be arranged in a single-row column with equal pitches. Each pellet accommodating hole 4 is formed in a rectangular shape slightly similar to the outer shape of the pellet 10.

A plurality of inner leads 5 for electrically drawing the integrated circuit formed on the pellet 10 to the outside are provided.
It is formed by being arranged on the four sides of the pellet accommodating hole 4 on a flat surface (hereinafter, referred to as an upper surface) on one side of the tape body 2. As the inner lead 5, a thin plate made of a conductive material such as copper foil is fixed to the upper surface of the tape body 2 by an appropriate means such as welding or bonding, and this thin plate is etched into a desired pattern by a lithographic process. It is formed by The inner leads 5 are wired such that a plurality of them are divided into four sides in the pellet accommodation hole 4,
The tips of the inner leads 5 are projected into the pellet housing holes 4, respectively. The inner leads 5 are formed so as to be electrically disconnected from each other. Further, the same number of the inner leads 5 as the pads 12 in the pellet 10 are provided, and the tips of the inner leads 5 are provided in the respective pads 1.
It is arranged so as to match each of the two.

Outer leads 6 are similarly formed on the outer sides of the inner leads 5, and are mechanically and electrically connected to each other. That is, each inner lead 5 and each outer lead 6 are connected in series. The outer end of each outer lead 6 is appropriately routed on the upper surface of the tape body 2 and is wired outside both long sides of the pellet housing hole 4. An elongated hole 7 is formed in a rectangular shape on the outside of one long side of the pellet accommodating hole 4 in the tape body 2, and the outer lead 6 wired on this side is protruded outward across the elongated hole 7. ing. An outer lead 6a group on the input side is constituted by the outer leads that cross the elongated hole 7, and the outer lead 6a group on the input side is electrically connected to a controller (not shown) for driving a liquid crystal panel. become.

The outer ends of the outer leads wired to the other side of the pellet receiving hole 4 of the tape body 2 are fixed on the tape body 2, and the outer leads 6b on the output side are provided.
Is composed. Then, the outer lead 6 on the output side
b is connected to the terminal of the liquid crystal panel (not shown). A tin-plated film (not shown) is formed on the surfaces of the inner leads 5 and the outer leads 6 to cooperate with the bumps 13 to form a connection portion described later.

In this embodiment, the tape body 2 is provided with sealing resin outflow preventing holes 8 as sealing resin outflow preventing portions on the long side on the output outer lead 6a side of the pellet accommodating hole 4 and on both short sides thereof. It is formed in an elongated oval shape with a constant width so as to be closely adjacent. The pair of sealing resin outflow prevention holes 8, 8 opened respectively on both short sides of the pellet receiving hole 4 are provided at positions near the outer side of the inner leads 5 that are wired outside the short sides of the pellet receiving hole 4, respectively. Each of them is arranged, and the length thereof is set longer than the length of the short side of the pellet accommodation hole 4. On the other hand, the sealing resin outflow prevention hole 8 formed on the long side of the pellet accommodation hole 4
Is disposed slightly outside the straight line connecting the ends of both the sealing resin outflow prevention holes 8 on the short side, and is close to the long side of the pellet accommodation hole 4, and its length is The distance between the sealing resin outflow prevention holes 8 on both short sides is set to be equal to the distance.

Next, a mounting operation for electrically and mechanically connecting the pellets 10 to the carrier tape 1 having the above structure will be described. When the pellet 10 is inner lead bonded to the carrier tape 1, the carrier tape 1 is stretched between sprockets (not shown) and intermittently fed in one direction as shown in FIG. 5A. . Then, in the bonding stage disposed in the stretched carrier tape 1, the pellets 10 are accommodated in the pellet accommodating holes 4 from below, and the pads 12 are aligned with the inner leads 5, respectively. The bumps 13 are thermocompression-bonded to the tips of the inner leads 5 by the bonding tool 21 to perform gang bonding. At this time, a gold-tin eutectic is formed between the tin plating film deposited on the surface of the inner leads 5 and the bumps 13 made of a gold-based material. The tip portion of the inner lead 5 is electrically and mechanically connected by the connection portion 14 including the bump 13.

Around the pellet 10 thus tape-automated-bonded and the inner lead 5 group, a resin encapsulant 15 formed by potting an insulating resin such as epoxy-phenol resin is formed on the pellet 10. The inner lead 5 group is molded with resin. That is, as shown in FIG.
The encapsulating resin 31 is supplied from above the carrier tape 1 in a liquid state with good fluidity so as to be evenly applied to the pellet accommodation hole 4 as a center.
The liquid sealing resin 31 potted in this way goes around to the lower surface of the tape body 2 through the gap between the inner peripheral surface of the pellet housing hole 4 and the outer peripheral surface of the pellet 10, and the pellet 10 and the inner lead 5 group. Since the liquid encapsulating resin 31 is cured, the resin encapsulating body 15 encapsulating the pellet 10 and the inner lead 5 group is molded over the upper surface and the lower surface of the tape body 2 since the liquid encapsulating resin 31 is cured. Will be done. In addition, in this embodiment, the liquid sealing resin 31 is cured by a thermosetting reaction. However, it may be cured by a plastic resin or may be cured by another reaction.

When potting the resin encapsulant 15, the liquid encapsulating resin 31 potted on the tape body 2 flows radially outward along the upper and lower surfaces of the tape body 2. Then, when the sealing resin 31 flows radially outward and reaches the inner edge of the sealing resin outflow prevention hole 8, the sealing resin 31 comes into contact with the inner edge of the sealing resin outflow prevention hole 8 by the action of the surface tension and moves outward in the radial direction. Stop the spill. Therefore, the liquid sealing resin 31 does not flow out from the inner edge of the sealing resin outflow prevention hole 8 to the outside and is prevented from further spreading. That is, the outer dimension of the resin sealing body 15 in the radial direction is regulated and controlled by the sealing resin outflow prevention hole 8.

When the resin encapsulant 15 is molded in this way, a tape carrier type package 16 is formed. That is, the package 16 includes a resin encapsulant 15, a tape main body 2 in which the resin encapsulant 15 is molded, and a group of outer leads 6 protruding outward from the resin encapsulant 15 molded in the tape main body 2. It is composed of and.

The IC 17 on which the tape carrier type package 16 is formed is kept attached to the carrier tape 1, or is cut at a predetermined position and is separated from the carrier tape 1 individually. Is arranged at a predetermined position, and is electrically connected between the output side outer lead 6b and the panel side terminal (not shown). A controller (not shown) of the liquid crystal panel is electrically connected to the input side outer lead 6a.

According to the above embodiment, the following effects can be obtained. (1) When the resin encapsulation body 15 is molded, the liquid encapsulation resin 31 potted on the tape body 2 is prevented from further flowing out by the encapsulation resin outflow prevention hole 8. Since the outer diameter in the radial direction of 15 is controlled, the outer diameter in the radial direction of the tape carrier type package 16 can be reduced as desired.

(2) According to the above (1), the overall outer dimension of the IC 17 including the tape carrier type package 16 in the radial direction can be reduced, so that the IC 17 can be highly integrated and downsized. Can be promoted.

(3) By promoting the high integration and downsizing of the IC 17 having the tape carrier type package 16 which is thin and can be mounted with good workability, this is for driving a liquid crystal panel. When it is used as an IC, it is possible to promote the enlargement of the liquid crystal panel screen.

(4) By preventing the liquid sealing resin 31 from flowing out by the sealing resin outflow prevention portion, the resin sealing body 15 can be formed thick with a small amount of the sealing resin 31. Not only can the amount of the sealing resin 31 used be reduced, but the moisture resistance of the tape carrier type package 16 can be improved, and the workability of the potting work can be improved.

(5) By constructing the sealing resin outflow prevention portion by the group of holes 8, the sealing resin outflow prevention portion can be constructed without increasing the number of parts and the number of processing steps, thus increasing the cost. Can be avoided.

6A and 6B show a semiconductor device according to a second embodiment of the present invention, in which FIG. 6A is a partially omitted enlarged partially plan view and FIG. 6B is a partially omitted enlarged front sectional view. .

The second embodiment differs from the first embodiment in that
The sealing resin outflow prevention portion is configured by the minute unevenness group portion 9 formed on the surface of the tape body 2. That is, the minute unevenness group portion 9 as the sealing resin outflow prevention portion is
It is formed on the surface of the tape body 2 by etching, and is similar to the sealing resin outflow prevention hole 8 in the first embodiment, and is close to the long side on the output outer lead side of the pellet housing hole 4 and both short sides thereof. It is arranged in the shape of a narrow strip having a constant width so as to extend along.

In the second embodiment, when potting the resin encapsulant, the liquid encapsulating resin potted on the tape body 2 reaches the inner edge of the minute unevenness group portion 9, and then the minute unevenness group portion 9 is formed. The film is retained on the surface and stays there. At the same time as the staying, a film is formed on the surface, so that the film is stopped. Therefore, the liquid sealing resin hardly flows out from the inner edge side of the minute concavo-convex group portion 9 to the outside and is prevented from further spreading. That is, also in the second embodiment, the outer dimension of the resin sealing body in the radial direction is regulated and controlled by the minute unevenness group portion 9 as the sealing resin outflow prevention portion.

7A and 7B show a semiconductor device according to a third embodiment of the present invention. FIG. 7A is a partially omitted enlarged partially cutaway plan view, and FIG. 7B is a partially omitted enlarged partially front sectional view. .

The third embodiment differs from the first embodiment in that
The sealing resin outflow prevention convex portion 20 is formed by the sealing resin outflow prevention convex portion 20 protruding from the surface of the tape body, and the sealing resin outflow prevention convex portion 20 is below the thermosetting temperature of the sealing resin. It is formed by using a sublimation agent containing a sublimation substance that sublimes as a main component, and is formed so as to be sublimated at the time of thermosetting. That is, the sublimation agents are listed in Table 1 below.
The sublimation substance selected from the above is prepared as a paste by mixing fine particles of silicic acid anhydride in an adhesive prepared as a colloidal solution with water as a dispersion medium. The sublimation agent thus prepared is attached to the surface of the tape main body 2 by an appropriate means such as a screen printing method, and the sealing resin outflow prevention convex portion 20 has the same shape as the sealing resin outflow prevention hole 8 in the first embodiment. The pellets 4 are arranged in a long and narrow strip shape having a constant width so as to closely follow the long side and both short sides of the pellet 4 on the output outer lead side.

In the third embodiment, when potting the resin encapsulating body 15, the liquid encapsulating resin potted on the tape body 2 reaches the inner edge of the encapsulating resin outflow prevention convex portion 20 and is sealed. It is stopped by the resin outflow prevention convex portion 20. Therefore, the liquid sealing resin does not flow out from the inner edge of the sealing resin outflow prevention convex portion 20 to the outside, and further spread is prevented. That is, also in the third embodiment, the outer dimension of the resin sealing body in the radial direction is regulated and controlled by the sealing resin outflow prevention convex portion 20. In the third embodiment, since the sealing resin outflow prevention convex portion 20 is formed by the sublimation agent,
When the resin sealing body 15 is thermally cured, it is sublimated and automatically disappears from the tape body 2. For this reason,
The outer dimension of the resin sealing body 15 in the radial direction is not increased by the sealing resin outflow prevention convex portion 20. However,
The sealing resin fluid prevention convex portion 20 does not prevent formation with a substance other than the sublimation agent, and the sealing resin fluid prevention convex portion 2
When it is not necessary to eliminate 0, a substance other than the sublimation agent may be used.

[0036]

Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the above-mentioned embodiments, and species can be changed without departing from the scope of the invention. Needless to say.

Further, it is desirable to appropriately set the arrangement, size, etc. of the sealing resin outflow prevention portion depending on the necessity of regulating the outer dimension of the resin sealing body in the radial direction. At that time, the sealing resin outflow prevention portion is not limited to be uniformly arranged as a whole,
It can be arranged partially or predominantly.

The bump for bonding the pad and the inner lead is not limited to be provided on the pad side, but may be provided on the inner lead side. Further, the bump is not limited to be formed of a gold-based material, but may be formed of a material such as a solder material that can electrically and mechanically connect the pad and the inner lead.

In the above description, the case where the invention made by the present inventor is mainly applied to a tape carrier type IC for driving a liquid crystal panel, which is the field of application which is the background of the invention, has been described. However, the invention is not limited thereto. However, the present invention can be applied to all semiconductor devices including a tape carrier type package used for other purposes.

[0041]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

When potting the resin encapsulant,
Since the liquid sealing resin potted to the tape body is prevented from further flowing out by the sealing resin outflow prevention portion, the outer diameter dimension of the resin sealing body can be controlled as desired, The outer dimension of the tape carrier type package 16 in the radial direction can be reduced.

[Brief description of drawings]

1A and 1B show a semiconductor device according to an embodiment of the present invention, where FIG. 1A is a partially cutaway enlarged partial plan view, and FIG. 1B is an enlarged partial front view.

FIG. 2 is a partially omitted plan view.

FIG. 3 shows a pellet, (a) is a plan view,
(B) is a front sectional view.

FIG. 4 shows a carrier tape, (a) is a partially omitted plan view, and (b) is a sectional view taken along line bb of (a).

FIG. 5 shows a manufacturing process, (a) is a vertical sectional view showing an inner lead bonding step, and (b) is a vertical sectional view showing a packaging step.

6A and 6B show a semiconductor device according to a second embodiment of the present invention, in which FIG.
Is a partially omitted enlarged partial front sectional view.

7A and 7B show a semiconductor device according to a third embodiment of the present invention, in which FIG.
Is a partially omitted enlarged partial front sectional view.

[Explanation of symbols]

1 ... Carrier tape, 2 ... Tape body, 3 ... Feed hole, 4
... Pellet receiving hole, 5 ... Inner lead, 6 ... Outer lead, 7 ... Long hole, 8 ... Encapsulation resin outflow prevention hole (encapsulation resin outflow prevention part), 9 ... Micro unevenness group part (encapsulation resin outflow prevention part) ,
10 ... Pellet, 11 ... First main surface, 12 ... Pad, 13
... bumps, 14 ... connection parts, 15 ... resin encapsulant, 16 ... tape carrier type package, 17 ... IC (semiconductor device) equipped with tape carrier type package, 20 ...
Sealing resin outflow prevention convex portion (sealing resin outflow prevention portion), 21 ...
Bonding tool, 31 ... Sealing resin, 32 ... Potting device.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshiaki Ono 5-20-1 Kamimizuhoncho, Kodaira-shi, Tokyo Inside the Semiconductor Division, Hitachi, Ltd. (72) Inventor Ryo Haruta 5 Sanmizumoto-cho, Kodaira-shi, Tokyo No. 20-1 Stock Company Hitachi Ltd. Semiconductor Division

Claims (4)

[Claims] 1. A plurality of pads for taking out the electronic circuit to the outside are formed on a first main surface of a semiconductor pellet in which the electronic circuit is formed, and on the other hand, an inner lead and a tape are formed on a tape body of a carrier tape. Outer leads are formed, each pad and each inner lead are gang-bonded, and the pellets are electrically and mechanically connected to the carrier tape.The pellets and inner leads are potted to the area of the pellets in the tape body. In the semiconductor device resin-sealed by the resin sealing body, the radial outer shape of the resin sealing body on the tape is regulated by the sealing resin outflow prevention portion formed on the tape body. Characteristic semiconductor device. 2. The semiconductor device according to claim 1, wherein the sealing resin outflow prevention portion is formed by a through hole formed in the tape body. 3. The semiconductor device according to claim 1, wherein the sealing resin outflow prevention portion is composed of a group of minute irregularities formed on the surface of the tape body. 4. The semiconductor device according to claim 1, wherein the sealing resin outflow prevention portion is constituted by a convex portion protruding from the surface of the tape body.