JPH08178992A - Circuit board inspection method and apparatus - Google Patents

Abstract

(57) [Summary] [Object] An object of the present invention is to realize a circuit board inspection method and an apparatus therefor capable of facilitating an open short check of a circuit board having a land pattern of fine pitches. [Structure] A plurality of first lands formed by fine pitches in a wiring pattern of a circuit board are collectively shot, and then each first land and a second land corresponding to each first land. While conducting the open inspection for the wiring pattern by inspecting the conductivity with each of the first lands, the conductivity between the predetermined second lands is inspected without shorting each first land. The circuit board with a fine pitch land pattern can be opened and
It is possible to realize a circuit board inspecting method and an apparatus thereof that can facilitate the check check.

Description

Detailed Description of the Invention

[0001]

[Table of Contents] The present invention will be described in the following order. Industrial Application Conventional Technology (FIGS. 8 to 10) Problems to be Solved by the Invention (FIGS. 8 to 13) Means for Solving Problems (FIGS. 1 to 7) Actions (FIGS. 1 to 7) ) Example (1) Open short inspection method according to the example (Fig. 1
And FIG. 2) (2) Overall configuration of the circuit board inspection apparatus according to the embodiment (FIG. 3)
(FIG. 7) (3) Operation of the embodiment (FIGS. 1 to 7) (4) Effect of the embodiment (FIGS. 1 to 7) (5) Other embodiment (FIGS. 1 to 7) Effect of the invention

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for inspecting a circuit board, and is applied to a method and an apparatus for inspecting a circuit board for inspecting whether or not a wiring pattern of a circuit board is formed in a predetermined state. It is suitable.

[0003]

2. Description of the Related Art Conventionally, a wiring pattern formed on an insulating substrate (hereinafter referred to as a predetermined first
And the second land and the line electrically connecting the first and second lands are collectively referred to as a pattern, and all the patterns formed on the insulating substrate are collectively referred to as a wiring pattern). A so-called open short (o
/ S) There is a process called inspection.

Normally, as shown in FIG. 8, this type of process is carried out by each land 2A, 2B, 2 of the circuit board 1 to be inspected.
Probes 3A, 3B, 3C, 3D, 3E, which are electrically connected to C, 2D, 2E, and 2F and a resistance value measuring device (not shown),
3F are brought into contact with each other, and the electrical resistance values between the respective predetermined probes 3A to 3F are respectively measured to obtain the respective patterns 4
The presence or absence of disconnection (open) of A, 4B, 4C, and 4D and the presence or absence of short circuit (short) between the patterns 4A to 4D are detected. In practice, for example, the circuit board 1 of FIG.
In the open short inspection, the probes 3A to 3F are brought into contact with the respective lands 2A to 2F as described above, and then the resistance value between the probe 3A and the probe 3B to be conducted via the pattern 4A is first measured. taking measurement. At this time, if the pattern 4A is correctly formed as shown in FIG. 9A, a predetermined resistance value can be obtained which is determined by the material, thickness and length of the pattern 4A.

On the other hand, when the pattern 4A is open as shown in FIG. 9B, the probe 3A and the probe 3
The resistance value between B shows a much larger value than when the pattern 4A is formed correctly. Therefore, the presence or absence of the opening of the pattern 4A can be confirmed based on the resistance value between the probe 3A and the probe 3B. Then pattern 4
B, the resistance values between the probe 3C and the probe 3D that should be conducted through the through hole 5 and the pattern 4C, and between the probe 3E and the probe 3F that should be conducted through the pattern 4D are sequentially measured. As a result, an inspection for the presence / absence of an opening in each of the patterns 4B to 4D and the through hole 5 (hereinafter, this series of inspections is referred to as an open test) is performed.

Next, the resistance value between the probe 3A and the probe 3C which should not be conducted is measured. At this time, when the patterns 4A and 4B are correctly formed as shown in FIG. 10A, a very large value of several [MΩ] is obtained as the resistance value between the probe 3A and the probe 3C. On the other hand, between the pattern 4A and the pattern 4B is, for example, FIG.
In the case of shorting, the resistance value between the probe 3A and the probe 3B is much smaller than that when the patterns 4A and 4B are correctly formed (that is, when the pattern is not shorting). Indicates. Therefore, the probe 3A
The presence or absence of a short between the patterns 4A and 4B can be confirmed based on the resistance value between the probe 3C and the probe 3C.

Further, similarly, by measuring the resistance value between the probe 3C and the probe 3F which should not be conducted, the presence or absence of a short between the patterns 4C and 4D is inspected (hereinafter, these series of inspections will be referred to as a short test). Call). In this way, the open short test can be performed on the circuit board 1.

[0008]

By the way, in this kind of open short inspection, a predetermined inspection device called an o / s chietuka (open short chietka) is usually used. The o / s checker has a single or a plurality of measurement boards in which a plurality of probes 3A to 3F are arranged in an arrangement according to the land pattern of the circuit board 1 (FIG. 8) to be inspected. The tips of the probes 3A to 3F are brought into contact with the corresponding lands 2A to 2F of the circuit board 1 respectively, and then the resistance value between the predetermined probes 3A to 3F is set according to a program inputted in advance. Are sequentially measured, and whether or not the measurement results are within a predetermined range is sequentially determined, so that an open short test for the wiring pattern of the circuit board 1 can be performed.

However, in recent years, as shown in FIG. 11, the pitch H ₁ between the lands 10A, 10B and 10C formed on the circuit board has become narrower (for example, 0.3 [mm]) as the high density mounting technology has improved. It has become very difficult to create a measurement board in which each probe is arranged in a narrow pitch so as to correspond to each of these lands 10A to 10C. Further, in such a circuit board for high-density mounting, the size of each land 10A to 10C is inevitably small. However, as is clear from FIGS. 12A and 12B, the land 21 formed on the insulating substrate 20.
When A and 21B become smaller, the lands 21A and 21B
Since the permissible ranges W ₁ and W ₂ of the position of the probe 22 with respect to the area are also small (W ₁ > W ₂ ), there is a problem that it is difficult to align each probe 22 with the corresponding land 21B.

Further, it has been conventionally known that the surface property of the land becomes a problem when joining the component to the very small land of the circuit board. However, when a land to which the probe is applied is viewed microscopically, a small scratch is usually formed. In the case of a large land 21A as shown in FIG. 13A, a realistic problem caused by the scratch 21AX. 12 does not occur, but the small land 2 as shown in FIG.
In the case of 1B, since the proportion of the scratch 21BX on the surface of the land 21B is large, there is a problem that the component mounting is easily affected.

The present invention has been made in view of the above points, and proposes a circuit board inspection method and apparatus capable of facilitating open / short inspection of a circuit board having a fine pitch land pattern. Is.

[0012]

In order to solve such a problem, the present invention provides a circuit board inspection method for inspecting whether or not a circuit board (44) has a predetermined wiring pattern. Among them, after collectively shouting a plurality of first lands (40A to 40F) formed by fine pitches, each of the first lands (40A to 4A).
0F) and the respective second lands (43A to 43F) which should be electrically connected to the respective first lands (40A to 40F) via the corresponding lines of the wiring pattern, respectively. The first step of performing an open inspection on the wiring pattern by performing the above, and inspecting the electrical continuity between the predetermined second lands (43A to 43F) without shorting each first land (40A to 40F). Therefore, a second step of performing a short inspection on the wiring pattern is provided. Further, in the present invention, the operation of collectively shorting the first lands (40A to 40F) in the first step is performed by the first lands (40A to 40F).
The conductive means (50) which is in surface contact with F) at the same time is used.

Further, according to the present invention, in the circuit board inspecting device for inspecting whether or not the wiring patterns of the circuit boards (44) and (70) to be inspected are formed in a predetermined state, the circuit board (70) is predetermined. A substrate holding means (62) for positioning and holding in a state, and a plurality of first wiring patterns formed by fine pitches in the upper wiring pattern of the circuit board (70) positioned and held in a predetermined state by the substrate holding means (62). 1
Tool (67) for collectively shooting all lands (72A to 72C) and each first land (72A to 72C)
And a plurality of conductive members (65A to 65C) individually electrically contacting the respective second lands (71A to 71C) that should be electrically connected via the corresponding lines of the wiring pattern and the tool ( 50), (67) and the respective conductive members (65A to 65C) and the predetermined conductive members (65A to 65C). 70) each first land (72A to 72C) is collectively shorted by the tool (67), and each conductive member (65).
A to 65C) respectively corresponding second lands (71A)
To 71C) while conducting an open inspection on the wiring pattern by inspecting each conductivity between the tool (67) and each conductive member (65A to 65C) by the conductivity inspection means, Each first land (72
A to 72C) without shorting each conductive member (65A to
65C) respectively corresponding second lands (71A to 7A)
1C), the short circuit test is performed on the wiring pattern by inspecting each conductivity between the predetermined conductive members (65A to 65C) by the conductivity inspection means.

Further in the present invention, the tool (50)
Has an electrically conductive portion (67B) that is in surface contact with each of the first lands (72A to 72C) at once.

[0015]

In the wiring patterns of the circuit boards (44) and (70), the plurality of first lands (4) formed by fine pitches.
0A to 40F) and (72A to 72C) are collectively shot, and then the first lands (40A to 40F) and (7
2A to 72C) and each first land (40A to 40C)
F), (72A to 72C) and the second lands (4) that should be electrically connected to each other through the lines of the wiring pattern.
3A to 43F) and (71A to 71C), the open inspection is performed on the wiring pattern so as to inspect the conductivity between each of the first lands (40A to 40F).
F) and (72A to 72C) are not shorted, and the continuity between the predetermined second lands (43A to 43F) and (71A to 71C) is inspected to perform the short inspection on the wiring pattern. As a result, the measurement boat corresponding to the circuit boards (44) and (70) having the land pattern of the fine pitch, which has been difficult to produce in the past, does not require the highly accurate alignment when using the measurement board. A circuit board inspection method and device capable of performing an open short inspection on the circuit boards (44) and (70) of this type and thus facilitating the open short inspection of a circuit board having a fine pitch land pattern. Can be realized.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

(1) Open Short Inspection Method According to Embodiment FIG. 1 shows a process of an open short inspection of a circuit board according to the embodiment. For example, a plurality of fine pitches formed by fine pitches as shown in FIG. First lands (hereinafter referred to as fine pitch lands) 40A, 40
B, 40C, 40D, 40E, 40F, and the patterns 42A, 42 on the fine pitch lands 40A-40F.
Ordinary second lands (hereinafter, referred to as ordinary lands) 43A, 43B, 4 electrically connected through B, 42C, 42D, 42E, and 42F lines, respectively.
The circuit board 44 to be inspected having 3C, 43D, 43E and 43F formed on the pattern surface 44A is first aligned in a predetermined state (step SP1 in FIG. 1).

Subsequently, as shown in FIG. 2 (B), the fine pitch lands 40A to 40F of the circuit board 44 are brought into contact with the tools 50 which can collectively contact the fine pitch lands 40A to 40F. With
The probe 51 is individually provided on each of the normal lands 43A to 43F.
The tips of A, 51B, 51C, 51D, 51E and 51F are brought into contact with each other (step SP2 in FIG. 1). At this time, tool 5
0 means that all of the fine pitch lands 40A to be contacted
A material that can have conduction to 40F is used. Next, the resistance value between the tool 50 and each of the probes 51A to 51F is measured (step SP3 in FIG. 1). At this time, for example, when the corresponding patterns 42A to 42F are open, the resistance value between the tool 50 and the probes 51A to 51F shows a very large value as compared with the case where it is not open.
Therefore, it is possible to inspect whether each of the patterns 42A to 42F is open based on the resistance value obtained by the measurement.

Next, while keeping the respective probes 51A to 51F in contact with the corresponding normal lands 43A to 43F,
Only the tool 50 is used for each fine pitch land 4 of the circuit board 44.
After removing from 0A-40F (step SP of Figure 1
4), the resistance value between the probes 51A to 51F is measured (step SP5 in FIG. 1). At this time, if the patterns 42A to 42F of the circuit board 44 are correctly formed,
The resistance values between the probes 51A to 51F show extremely large values. On the other hand, when the patterns 42A to 42F are short, the corresponding probes 51A to 51F
The resistance value between F shows a very low value. Accordingly, based on the resistance value obtained by the measurement, each of the patterns 42A to 42A
Whether or not there is a short between F can be confirmed. Therefore, by using the tool 50 that collectively contacts the fine pitch lands 40A to 40F in this manner, the fine pitch lands that cannot be individually applied (contacted) with the probes 51A to 51F. The open short test can be correctly performed on the circuit board 44 having 40A to 40F.

(2) Overall Configuration of Circuit Board Inspection Apparatus According to Embodiments FIGS. 3 and 4 show a configuration example of a circuit board inspection apparatus 60 for performing the above-described open short inspection method. The circuit board is set on the stage 62 arranged on the pedestal 61. The stage 62 has a horizontal direction indicated by an arrow x (hereinafter, this direction is referred to as an x direction), a front-back direction indicated by an arrow y (hereinafter, this direction is the y direction), and a rotation direction indicated by an arrow θ (hereinafter, this direction will be referred to as the “direction”). It can be moved freely in the (θ direction), and the set circuit board can be moved to a predetermined inspection position and held at this inspection position.

Further, above the stage 62, a plate 64 is provided which is supported by a frame 63 so as to be movable in the vertical direction indicated by the arrow z (hereinafter referred to as the z direction). A plurality of probes 65A, 65B, and 65C are fixed to 64 so as to penetrate therethrough in a positional relationship according to the normal land formation position of the circuit board to be inspected, and each probe 65A to 65C is illustrated via a cord. Not electrically connected to the resistance measuring device. As a result, in the circuit board inspection apparatus 60, the plate 64 descends from the height position in the initial state in a state where the circuit board to be inspected is positioned and held at the inspection position. The tip portion can be brought into contact with the corresponding normal lands of the circuit board, and in this state, the resistance value between the probes 65A to 65C can be measured.

Further, the plate 64 is provided with openings 64A corresponding to the formation positions of a plurality of fine pitch lands provided on the circuit board, and the openings 64A of the plate 64 are inserted on the stage 62. So as to obtain the projection 61A of the pedestal 61 via the drive screw 66.
Tool 6 for fine pitch land supported by
7 are arranged. In this case, the drive screw 66 is adapted to be freely rotatable about its axis by a drive mechanism (not shown), thus allowing the threaded tool 67 to be freely moved in the z-direction separately from the plate 64 as required. It is designed to get you. As shown in FIG. 5, the tool 67 is configured such that a main body 67A is provided at its lower end with a conducting portion 67B that is a collection of gold wires, and the tip of the conducting portion 67B is provided through an opening 64A of the plate 64. The front end surface can be collectively brought into contact with each fine pitch land of the circuit board facing the surface. In this case, the conducting portion 67B of the tool 67 is electrically connected to the above-described resistance value measuring device via a cord.

Thus, in this circuit board inspection device 60,
If necessary, the tip surfaces of the conducting portions 67B of the tool 67 are brought into contact with the fine pitch lands of the circuit board positioned and held at the inspection position by the stage 62, thereby collectively shorting these fine pitch lands. Tool 67 and each probe 65A-65C
The resistance value between and can be measured by a resistance value measuring device. Therefore, in this circuit board inspection device 60,
In operation, first, the stage 62 is driven, so that FIG.
As shown in (A), the circuit board 70 to be inspected set on the stage 62 is moved to the inspection position. As a result, as shown in FIGS. 6B and 7A, the circuit board 70
The corresponding normal lands 71A, 71B, 71C and the fine pitch lands 72A, 72B, 72C are aligned with the corresponding probes 65A to 65C or the tool 50, respectively.

Subsequently, the pedestal 63 (FIG. 3) is lowered to lower the plate 64 and drive screw 66.
The tool 67 is lowered by driving the driving mechanism shown in FIG. 3 and thus, as shown in FIG.
5A to 65C are respectively brought into contact with the corresponding normal lands 71A to 71C of the circuit board 70, respectively, and the tool 6
The leading end surface of the conducting portion 67B of No. 7 is brought into contact with each of the fine pitch lands 72A to 72C of the circuit board 70 at once. Then, each of the probes 65A to 65C and the tool 6 is measured by a resistance measuring device.
The electric resistance value between 7 and 7 is sequentially measured. As a result, the normal land 71A and the fine pitch land 72 of the circuit board 70 are formed.
A pattern 73A for forming A, a pattern 73B for forming a normal land 71B and a fine pitch land 72B,
An open test is performed on the pattern 73C forming the normal land 71C and the fine pitch land 72C.

After completion of the open test, the drive screw 6
6 (FIG. 3) drives to raise the tool 67 as shown in FIG. 7 (C) so that each fine pitch land 7 is moved.
2A to 72C, the conductive portion 67B of the tool 67 is separated, and thereafter, the resistance value between the probe 71A and the probe 71B and the resistance value between the probe 71B and the probe 71C are sequentially measured, respectively. Perform a short test between ~ 73C. Furthermore, in this circuit board inspection device 60,
When this short test is completed, the pedestal 63 (FIG. 3) is driven to raise the plate 64 and thereby each probe 6
5A to 65C are the corresponding normal lands 71 of the circuit board 70.
Separated from A to 71C, and thus this circuit board 7
The open short test for 0 is completed.

In this embodiment, the plate 64 is made of a transparent material. A camera (not shown) is arranged above the plate 64, and the camera sends the image of the circuit board 70 captured through the plate 64 as an image signal to an image processing device (not shown). ing. The image processing apparatus drives and controls the drive mechanism of the stage 62 based on the position information of the circuit board 70 obtained based on the image signal. As a result, in the circuit board inspection device 60, the circuit board 70 to be inspected set on the stage 62 can be accurately positioned at the inspection position.

(3) Operation of the Embodiment With the above configuration, in the circuit board inspection device 60,
The conductive parts 67B of the tool 67 are collectively brought into contact with the fine pitch lands 72A to 72C having narrow pitches with respect to the circuit board 70 to be inspected, and the fine pitch lands 72A to 72C and the patterns 73A to 7 respectively.
As in the conventional case, the probe 65 is attached to each of the normal lands 71A to 71C having a large space between the pitches electrically connected to each other through the 3C line.
An open test is performed so that A to 65C are individually brought into contact with each other, and then the conductive portion 67B of the tool 67 is removed from each fine pitch land 72A to 72C to perform a short test.

Therefore, the measurement board in which the probe is arranged corresponding to each of the fine pitch lands 72A to 72C, which has been difficult to make conventionally, is also used in each of the fine pitch lands 72A to 72C when such a measurement board is used. With respect to the circuit board 70 having a land pattern of fine pitches, the fine pitch lands 72A to 72C and the tool 67 are aligned with a certain degree of accuracy without the need for highly precise alignment with the probe. An accurate open short test can be performed. At this time, the tool 67 makes a surface contact with each of the fine pitch lands 72A to 72C of the circuit board 70 instead of making a point contact like the conventional probe, so that the surface of each of the fine pitch lands 72A to 72C is damaged. hard. Therefore, the open short inspection can be performed without adversely affecting the component mounting performed thereafter.

(4) Effects of the Embodiments According to the above-described configuration, the open test for the circuit board 70 to be inspected is collectively performed on the fine pitch lands 72A to 72C having a narrow gap between the conductive portions 67B of the tool 67.
With each of these fine pitch lands 72A
.. to 72C and the patterns 73A to 73C, the probes 65A to 65C are individually brought into contact with the large normal lands 71A to 71C, which are electrically connected to each other, as in the conventional method. The short test for the circuit board 70 is performed for each normal land 7 without shorting each fine pitch land 72A to 72C.
The fine pitch land 72 is formed by bringing the probes 65A to 65C into contact with 1A to 71C.
It does not require a measurement board in which the probe is arranged corresponding to each of A to 72C, high-precision alignment when the measurement board is used, and does not adversely affect the component mounting, and the open short inspection can be performed. Open circuit board with a fine pitch land pattern.
It is possible to realize a circuit board inspection method and an apparatus thereof that can facilitate a short inspection.

(5) Other Embodiments In the above embodiment, the conductive portion 67 of the tool 67 is used.
Although the case where the gold wire is used as the material of B has been described, the present invention is not limited to this, and other fine pitch lands 72A of the circuit board 70 such as conductive rubber can be used.
Various materials can be applied as long as they have softness and electrical conductivity so as not to damage ~ 72C.

Further, in the above-described embodiment, in the circuit board inspection apparatus 60, the circuit board 7 to be inspected set on the stage 62 by the movement of the stage 62.
The normal lands 71A to 71C of 0 and the fine pitch lands 72A to 72C and the corresponding probes 65A to 65C or the tool 67 are aligned, but the present invention is not limited to this. , For example, by fixing the stage 62 and moving the plate 64 and the tool 67, each of the normal lands 71A to 7A of the circuit board 70 is moved.
1C and the fine pitch lands 72A to 72C may be aligned with the corresponding probes 65A to 65C and the tool 67.

Further, in the above embodiment, the case where the open test is performed prior to the short test in the open short test is described.
The present invention is not limited to this, and the short test may be performed prior to the open test.

Further, in the above-mentioned embodiment, the case where the electrically driven one linked with the camera and the image processing device is applied as the stage 62 of the circuit board inspection device 60 has been described, but the present invention is not limited to this. Instead, a manual one may be applied.

Further, in the above-described embodiment, the circuit board 70 is opened based on the resistance value between the lands 71A to 71C and 72A to 72C of the patterns 73A to 73C of the circuit board 70 or between the patterns 73A to 73C. Alternatively, the case in which the presence or absence of a short is inspected has been described, but the present invention is not limited to this, and each of the patterns 73A to 73A.
Based on the level of other conductivity (for example, current value or voltage value) between the lands 71A to 71C and 72A to 72C of C or between the patterns 73A to 73C, these patterns 73A are respectively formed.
Alternatively, the open inspection or the short inspection may be performed between the lands 71A to 71C and 72A to 72C of 73C to 73C or between the patterns 73A to 73C.

[0035]

As described above, according to the present invention, a plurality of first lands formed by fine pitches in the wiring pattern of the circuit board to be inspected are collectively shot using a predetermined tool. After that, the wiring pattern is inspected for the conductivity between each first land and each second land that should be electrically connected to each first land through the line of the wiring pattern. While the open inspection for the first land is performed, the short inspection for the wiring pattern is performed by inspecting the conductivity between the predetermined second lands without shorting each first land. This kind of circuit without the need for a measurement boat that corresponds to a circuit board with a difficult land pattern of fine pitches and high-precision alignment when using the measurement board. It can be performed open Shiyoto inspection of the plate, thus possible to realize a circuit board inspection method and apparatus for open Shiyoto inspection of the circuit board capable of facilitating with land pattern of fine pitch.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a process of an open short inspection method according to an embodiment.

FIG. 2 is a schematic diagram for explaining an open short inspection method according to an embodiment.

FIG. 3 is a schematic perspective view showing a configuration of a circuit board inspection device according to an embodiment.

FIG. 4 is a perspective view showing a state of each probe and tool.

FIG. 5 is a side view showing the configuration of the tool.

FIG. 6 is a plan view for explaining the operation of the circuit board inspection device.

FIG. 7 is a plan view for explaining the operation of the circuit board inspection device.

FIG. 8 is a perspective view for explaining a conventional open short inspection method.

FIG. 9 is a perspective view for explaining a conventional open short inspection method.

FIG. 10 is a perspective view for explaining a conventional open short inspection method.

FIG. 11 is a plan view for explaining a land of a circuit board for high-density mounting.

FIG. 12 is a schematic side view for explaining a difference in alignment tolerance due to a difference in land size.

FIG. 13 is a schematic side view for explaining an influence of a probe mark due to a difference in land size.

[Explanation of symbols]

40A-40F, 72A-72C ... Fine pitch land, 42A-42F, 73A-73C ... Pattern, 4
3A to 43F, 71A to 71C ... normal land, 44,
70 ... Circuit board, 50, 67 ... Tool, 51A-5
1F, 65A to 65C ... Probe, 60 ... Circuit board inspection device.

Claims (4)

[Claims] 1. A circuit board inspection method for inspecting whether or not a wiring pattern of a circuit board is formed in a predetermined state, wherein a plurality of first lands formed by fine pitches in the wiring pattern are grouped together. Then, the conductivity between each of the first lands and each of the second lands to be electrically connected to each of the first lands through each of the corresponding lines of the wiring pattern is set. A first step of performing an open inspection for the wiring pattern by inspecting the wiring patterns, and a short process for the wiring pattern by inspecting the continuity between predetermined second lands without causing the first lands to be shorted. A second step of inspecting, the method for inspecting a circuit board. 2. The operation of collectively shorting each of the first lands in the first step is performed by using a predetermined electrically conductive means that makes a surface contact with each of the first lands at once. The circuit board inspection method according to claim 1, wherein: 3. A circuit board inspecting apparatus for inspecting whether or not a wiring pattern of a circuit board to be inspected is formed in a predetermined state, a board holding means for positioning and holding the circuit board in a predetermined state, and the predetermined state. A plurality of first wiring patterns formed by fine pitches among the upper wiring patterns of the circuit board positioned and held by
And a tool for collectively shooting all the lands, and individually making electrical contact with each of the first lands and each of the second lands that should be electrically connected through the corresponding lines of the wiring pattern. A plurality of conductive members, and a conductivity inspecting unit that inspects each conductivity between the tool and each conductive member and each predetermined conductivity between the conductive members. All of the lands are collectively shot by the tool and the conductive members are brought into contact with the corresponding second lands, respectively. While conducting an open inspection on the wiring pattern by inspecting each of the conductivity, each of the conductive members is subjected to inspection without shorting each first land. While conducting contact with the corresponding second land, the conductivity inspection means inspects each conductivity between predetermined conductive members to perform a short inspection on the wiring pattern. Circuit board inspection device. 4. The circuit board inspecting device according to claim 3, wherein the tool includes a conductive portion that is in conductive contact with each of the first lands at once.