JPH0817992A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH0817992A JPH0817992A JP6149009A JP14900994A JPH0817992A JP H0817992 A JPH0817992 A JP H0817992A JP 6149009 A JP6149009 A JP 6149009A JP 14900994 A JP14900994 A JP 14900994A JP H0817992 A JPH0817992 A JP H0817992A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- circuit board
- printed circuit
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】
【目的】リードに照射されたレーザ光の熱がリードを通
じてプリント基板の電極パッドに十分に伝わらなくても
電極パッドの表面に塗布されたハンダを溶かすことがで
き、リードの接合不良を防止することのできる半導体装
置を提供する。
【構成】ガルウィング状に成形されたリード５の先端部
に通孔６を穿設し、この通孔６を通じてプリント基板の
電極パッドにレーザ光が直接当たるようにしたことを特
徴とする。
(57) [Abstract] [Purpose] The solder applied to the surface of the electrode pad can be melted even if the heat of the laser beam applied to the lead is not sufficiently transmitted to the electrode pad of the printed circuit board through the lead. Provided is a semiconductor device capable of preventing defective bonding. The present invention is characterized in that a through hole 6 is formed at a tip end of a lead 5 shaped like a gull wing, and a laser beam directly strikes an electrode pad of a printed circuit board through the through hole 6.
Description
【０００１】[0001]
【産業上の利用分野】この発明は、ガルウィング状に成
形されたリードを有する半導体装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a lead formed in a gull wing shape.
【０００２】[0002]
【従来の技術】ガルウィング状に成形されたリードを有
する半導体装置として、ＴＣＰ（Ｔａｐｅ Ｃａｒｒｉ
ｅｒ Ｐａｃｋａｇｅ）と称される半導体装置が知られ
ている。この半導体装置は、図６に示すように、サポー
トリング１の中央開口部２に半導体チップ３を配置し、
この半導体チップ３のバンプにインナ側のリード４をボ
ンディングした構成となっており、前記サポートリング
１の外縁部には、前記リード４の他端側である複数本の
アウタ側のリード５が所定ピッチで突設されている。2. Description of the Related Art As a semiconductor device having a lead formed in a gull wing shape, a TCP (Tape Carri) is used.
There is known a semiconductor device called "er package". In this semiconductor device, as shown in FIG. 6, a semiconductor chip 3 is arranged in a central opening 2 of a support ring 1,
An inner side lead 4 is bonded to the bump of the semiconductor chip 3, and a plurality of outer side leads 5, which are the other end side of the lead 4, are predetermined at the outer edge portion of the support ring 1. It is projected on the pitch.
【０００３】これらのアウタ側のリード５は、図示しな
いフィルムキャリアテープに銅箔パターンを形成し、そ
の一部をエッチングして形成されており、図７に示すよ
うにガルウィング状に成形されている。The leads 5 on the outer side are formed by forming a copper foil pattern on a film carrier tape (not shown) and etching a part of the copper foil pattern, and are formed in a gull wing shape as shown in FIG. .
【０００４】なお、前記サポートリング１はフィルムキ
ャリアテープを打ち抜いて形成されている。ところで、
このようなＴＣＰをプリント基板に実装する場合、ホッ
トバーによるハンダ付けが一般的な方法であるが、最近
ではプリント基板への高密度実装を実現するために、Ｔ
ＣＰのアウタ側のリードにレーザ光を照射し、このレー
ザ光の熱でハンダを溶かしてＴＣＰをプリント基板にハ
ンダ付けする方法が試みられている。The support ring 1 is formed by punching out a film carrier tape. by the way,
When mounting such a TCP on a printed circuit board, soldering with a hot bar is a common method, but recently, in order to realize high-density mounting on the printed circuit board, T
A method of irradiating the leads on the outer side of the CP with laser light and melting the solder by the heat of the laser light to solder the TCP to the printed circuit board has been attempted.
【０００５】[0005]
【発明が解決しようとする課題】しかし、上述した方法
を用いてＴＣＰをプリント基板へ実装しようした場合、
ＴＰＣのアウタリードは厚さが３０〜３５μｍと非常に
薄く、しかも幅が１００〜２００μｍと非常に細いた
め、例えばアウタリードをガルウィング状に成形した際
にアウタリードが図８に示すように変形することがあ
る。そして、図８に示すようなアウタリードをプリント
基板の電極パッドに載置すると、アウタリードの先端部
が電極パッドから離れた状態となり、このような状態で
アウタリードにレーザ光を照射すると、レーザ光の熱が
電極パッドに十分に伝わらず、電極パッドの表面に塗布
されたハンダが十分に溶融しないうちにレーザ光の照射
が終了してしまうため、接合不良が発生し易いという問
題があった。However, when TCP is mounted on a printed circuit board by using the above-mentioned method,
The outer lead of the TPC has a very thin thickness of 30 to 35 μm and a very narrow width of 100 to 200 μm, so that the outer lead may be deformed as shown in FIG. 8 when the outer lead is formed into a gull wing shape. . Then, when the outer lead as shown in FIG. 8 is placed on the electrode pad of the printed board, the tip of the outer lead is separated from the electrode pad. However, since the laser beam irradiation is terminated before the solder applied to the surface of the electrode pad is sufficiently melted and the solder applied to the surface of the electrode pad is not sufficiently melted, there is a problem that defective bonding is likely to occur.
【０００６】本発明は上述した問題点に鑑みてなされた
もので、その目的はアウタリードに照射されたレーザ光
の熱がアウタリードを通じてプリント基板の電極パッド
に十分に伝わらなくても電極パッドの表面に塗布された
ハンダを溶かすことができ、アウタリードの接合不良を
防止することのできる半導体装置を提供しようとするも
のである。The present invention has been made in view of the above-mentioned problems, and an object thereof is to prevent the heat of the laser beam applied to the outer leads from being sufficiently transmitted to the electrode pads of the printed circuit board through the outer leads. It is an object of the present invention to provide a semiconductor device capable of melting the applied solder and preventing the outer leads from being bonded poorly.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に、請求項１に係る発明は、ガルウィング状に成形され
たリードを有し、このリードにレーザ光を照射してプリ
ント基板にハンダ付けされる半導体装置において、前記
レーザ光を前記プリント基板に直接照射するための通孔
を前記リードに設けたことを特徴とするものである。In order to solve the above problems, the invention according to claim 1 has a lead formed in a gull wing shape, and the lead is irradiated with a laser beam to be soldered to a printed circuit board. In the semiconductor device described above, the leads are provided with through holes for directly irradiating the printed circuit board with the laser light.
【０００８】請求項２に係る発明は、ガルウィング状に
成形されたリードを有し、このリードにレーザ光を照射
してプリント基板にハンダ付けされる半導体装置におい
て、前記レーザ光を前記プリント基板に直接照射するた
めの切欠部を前記リードに設けたことを特徴とするもの
である。According to a second aspect of the present invention, in a semiconductor device having a lead formed in a gull wing shape, the lead is irradiated with a laser beam and soldered to a printed circuit board, the laser beam is applied to the printed circuit board. A notch for direct irradiation is provided in the lead.
【０００９】請求項３に係る発明は、ガルウィング状に
成形されたリードを有し、このリードにレーザ光を照射
してプリント基板にハンダ付けされる半導体装置におい
て、前記レーザ光を前記プリント基板に直接照射するた
めの通孔と切欠部を前記リードに設けたことを特徴とす
るものである。According to a third aspect of the present invention, there is provided a semiconductor device having a lead formed in a gull wing shape, the lead being irradiated with a laser beam to be soldered to a printed circuit board. The lead is provided with a through hole and a notch for direct irradiation.
【００１０】[0010]
【作用】このような構成において、レーザ光をアウタリ
ードに照射すると、アウタリードに照射されたレーザ光
がアウタリードに設けられた通孔または切欠部を通って
プリント基板に直接照射される。In this structure, when the outer lead is irradiated with the laser light, the laser light applied to the outer lead is directly applied to the printed circuit board through the through hole or the notch provided in the outer lead.
【００１１】[0011]
【実施例】以下、本発明の一実施例を図１ないし図３を
参照して説明する。なお、図６に示したものと同一部分
には同一符号を付して説明する。図１は本発明の一実施
例に係る半導体装置の要部を示しており、図１に示すよ
うに、本発明の一実施例に係る半導体装置は、ガルウィ
ング状に成形された複数本のリード５を有している。こ
れらのリード５はフィルムキャリアテープに印刷された
銅箔パターンの一部をエッチングして形成されており、
その先端部には通孔６が穿設されている。この通孔６は
例えばアウタリード５の形成と同時にエッチングするこ
とによって設けられる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. It should be noted that the same parts as those shown in FIG. FIG. 1 shows a main part of a semiconductor device according to an embodiment of the present invention. As shown in FIG. 1, a semiconductor device according to an embodiment of the present invention is provided with a plurality of leads formed in a gull wing shape. Have five. These leads 5 are formed by etching a part of the copper foil pattern printed on the film carrier tape,
A through hole 6 is formed at the tip thereof. This through hole 6 is provided by etching at the same time when the outer lead 5 is formed, for example.
【００１２】このような構成の半導体装置をレーザ光を
用いてプリント基板に実装する場合は、図２に示すよう
に、プリント基板７に形成された電極パッド８の上にリ
ード５を載置した後、リード５の先端部にレーザ光９を
照射する。When the semiconductor device having such a structure is mounted on a printed board by using a laser beam, the leads 5 are placed on the electrode pads 8 formed on the printed board 7, as shown in FIG. Then, the laser beam 9 is applied to the tip of the lead 5.
【００１３】このとき、リード５に照射されたレーザ光
９は、図３に示すように、リード５に穿設された通孔６
を通ってプリント基板７の電極パッド８にも直接照射さ
れる。At this time, the laser beam 9 applied to the lead 5 is, as shown in FIG. 3, a through hole 6 formed in the lead 5.
The electrode pad 8 of the printed circuit board 7 is also directly irradiated with the light.
【００１４】従って、リード５をプリント基板７の電極
パッド８に載置した際に、リード５の先端部が電極パッ
ド８から離れた状態にあっても電極パッド８の表面に塗
布されたハンダをレーザ光９によって直接溶かすことが
でき、リード５と電極パッド８との接合不良を防止する
ことができる。Therefore, when the lead 5 is placed on the electrode pad 8 of the printed circuit board 7, the solder applied to the surface of the electrode pad 8 is applied even if the tip of the lead 5 is separated from the electrode pad 8. It can be directly melted by the laser beam 9 and a defective joint between the lead 5 and the electrode pad 8 can be prevented.
【００１５】なお、上述した本発明の一実施例では、プ
リント基板７の電極パッド８にレーザ光９を直接照射す
るためにリード５に通孔６を穿設したが、図４に示すよ
うに、リード５の先端部に切欠部１０を設け（この切欠
部１０をアウタリード５の形成時に同時に設けても良
い。）、この切欠部１０を通じてプリント基板の電極パ
ッドにレーザ光を直接照射するようにしても良い。そし
て、上述した通孔６や切欠部１０はキャリアテープから
打ち抜く際に設けるようにしても良い。In the above-described embodiment of the present invention, the through hole 6 is formed in the lead 5 in order to directly irradiate the laser beam 9 on the electrode pad 8 of the printed board 7. However, as shown in FIG. A notch 10 is provided at the tip of the lead 5 (the notch 10 may be provided at the same time when the outer lead 5 is formed), and the electrode pad of the printed circuit board is directly irradiated with laser light through the notch 10. May be. The through hole 6 and the notch 10 described above may be provided when punching out from the carrier tape.
【００１６】さらに、図５に示すように、通孔６と切欠
部１０の両方をリード５に設け、リード５に設けられた
通孔６と切欠部１０を通じてプリント基板の電極パッド
にレーザ光を直接照射するようにしても良い。なお、本
発明はＴＣＰに限らず、例えばＱＦＰ（フラットパッケ
ージ）にも適用することができる。Further, as shown in FIG. 5, both the through hole 6 and the cutout portion 10 are provided in the lead 5, and laser light is applied to the electrode pad of the printed board through the through hole 6 and the cutout portion 10 provided in the lead 5. You may make it irradiate directly. The present invention is not limited to TCP, but can be applied to, for example, QFP (flat package).
【００１７】[0017]
【発明の効果】以上説明したように、本発明によれば、
リードに照射されたレーザ光の熱がアウタリードを通じ
てプリント基板の電極パッドに十分に伝わらなくても電
極パッドの表面に塗布されたハンダを溶かすことがで
き、リードの接合不良を防止することのできる半導体装
置を提供できる。As described above, according to the present invention,
A semiconductor that can melt the solder applied to the surface of the electrode pad even if the heat of the laser light applied to the lead is not sufficiently transmitted to the electrode pad of the printed circuit board through the outer lead, and can prevent lead joint failure. A device can be provided.
【図１】本発明の第１の実施例に係る半導体装置の要部
を示す斜視図。FIG. 1 is a perspective view showing a main part of a semiconductor device according to a first embodiment of the present invention.
【図２】同実施例に係る半導体装置のアウタリードをプ
リント基板の電極パッド上に載置した状態を示す図。FIG. 2 is a view showing a state in which outer leads of the semiconductor device according to the embodiment are mounted on electrode pads of a printed board.
【図３】同実施例に係る半導体装置のアウタリードに穿
設された通孔の作用を示す図。FIG. 3 is a view showing an action of a through hole formed in the outer lead of the semiconductor device according to the same embodiment.
【図４】本発明の第２の実施例に係る半導体装置のアウ
タリードを示す斜視図。FIG. 4 is a perspective view showing outer leads of a semiconductor device according to a second embodiment of the present invention.
【図５】本発明の第３の実施例に係る半導体装置のアウ
タリードを示す斜視図。FIG. 5 is a perspective view showing outer leads of a semiconductor device according to a third embodiment of the present invention.
【図６】ＴＣＰの概略構成を示す平面図。FIG. 6 is a plan view showing a schematic configuration of TCP.
【図７】図６のＡ−Ａ線に沿った断面図。7 is a cross-sectional view taken along the line AA of FIG.
【図８】ＴＣＰのアウタリードが変形した状態を示す
図。FIG. 8 is a view showing a state in which an outer lead of TCP is deformed.
１…サポートリング ３…半導体チップ ４…インナリード ５…アウタリード ６…通孔 ７…プリント基板 ８…電極パッド ９…レーザ光 １０…切欠部 1 ... Support ring 3 ... Semiconductor chip 4 ... Inner lead 5 ... Outer lead 6 ... Through hole 7 ... Printed circuit board 8 ... Electrode pad 9 ... Laser light 10 ... Notch
Claims (3)
し、このリードにレーザ光を照射してプリント基板にハ
ンダ付けされる半導体装置において、前記レーザ光を前
記プリント基板に直接照射するための通孔を前記リード
に設けたことを特徴とする半導体装置。1. In a semiconductor device having a lead formed in a gull wing shape, the lead being irradiated with a laser beam to be soldered to a printed circuit board, a pass for directly irradiating the printed circuit board with the laser beam. A semiconductor device, wherein a hole is provided in the lead.
し、このリードにレーザ光を照射してプリント基板にハ
ンダ付けされる半導体装置において、前記レーザ光を前
記プリント基板に直接照射するための切欠部を前記リー
ドに設けたことを特徴とする半導体装置。2. A notch for directly irradiating the printed circuit board with the laser beam in a semiconductor device having a lead formed in a gull wing shape and irradiating the lead with laser light to be soldered to the printed circuit board. A semiconductor device having a portion provided on the lead.
し、このリードにレーザ光を照射してプリント基板にハ
ンダ付けされる半導体装置において、前記レーザ光を前
記プリント基板に直接照射するための通孔と切欠部を前
記リードに設けたことを特徴とする半導体装置。3. A semiconductor device having a lead formed in a gull wing shape, the lead being irradiated with a laser beam to be soldered to a printed circuit board, and a lead for directly irradiating the printed circuit board with the laser beam. A semiconductor device characterized in that a hole and a cutout are provided in the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6149009A JPH0817992A (en) | 1994-06-30 | 1994-06-30 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6149009A JPH0817992A (en) | 1994-06-30 | 1994-06-30 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0817992A true JPH0817992A (en) | 1996-01-19 |
Family
ID=15465684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6149009A Pending JPH0817992A (en) | 1994-06-30 | 1994-06-30 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0817992A (en) |
-
1994
- 1994-06-30 JP JP6149009A patent/JPH0817992A/en active Pending
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