JPH0818280A - Alignment jig of pin - Google Patents

Abstract

PURPOSE:To realize good sliding property of an inner surface of a pin insertion hole and to improve abrasion resistance and release property by coating an inner wall of the aligned pin insertion hole of a jig board with a fluorine high polymer film. CONSTITUTION:An inner wall 3 of a pin insertion hole 2 of a jig board 1 is coated with a fluorine high polymer film 4. A conductor pin 9 is inserted to the pin insertion hole 2 by an inserter with an attraction hole corresponding to a hole of a semiconductor package by using an alignment jig wherein the inner wall 3 of the pin insertion hole 2 is coated with the fluorine high polymer film 4 and the conductor pin 9 is further inserted to a printed wiring board by pressure by using the alignment jig. When the fluorine high polymer film 4 is applied to the inner wall 3 of the pin insertion hole 2 of the jig board 1 in this way, the inner wall 3 of the pin insertion hole 2 has lubricity and good non adhesiveness, and it can be therefore inserted and removed easily because of its small friction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin alignment jig such as a conductor pin used in a semiconductor package such as a pin grid array used in electronic equipment, electric equipment, communication equipment and the like.

[0002]

2. Description of the Related Art When attaching a conductor pin to a semiconductor package having a conductor pin, the conductor pin is mechanically taken out from a case accommodating a large number of conductor pins and attached to an aligned hole of an alignment jig constituting the semiconductor package. The method of press-fitting is used. To use this method, the conductor pins housed in the case must be aligned in advance so as to correspond to the holes of the semiconductor package.

As a method of arranging the conductor pins, as shown in FIG. 7, a diaphragm 7 having holes 6 is tilted, and a plurality of conductor pins 9 are arranged on the aligned surface 8 of the tilted diaphragm 7.
A method of applying horizontal and vertical vibrations to the vibrating plate 7 while sliding is used. According to this method, for example, the leg below the flange of the conductor pin 9 that has slipped down is completely inserted into the hole 6 due to the vibration and the weight of the conductor pin 9, and the flange of the conductor pin 9 stops at the entrance of the hole 6. , The conductor pins 9 are normally aligned with the upper part of the head protruding from the flange.

Next, the conductor pins 9 aligned on the diaphragm 7 are
As shown in FIG. 4, suction is performed by the transfer machine 11 having the suction holes 10 corresponding to the holes of the semiconductor package, and the alignment jig 12 is used.
It is inserted into the pin insertion hole 2 of. Then, as shown in FIG.
A printed wiring board 13 constituting a semiconductor package is formed by using an alignment jig 12 having conductor pins 9 inserted in the pin insertion holes 2.
The conductor pin 9 is press-fitted into the hole 15.

As shown in FIG. 2, the alignment jig 12 is composed of a jig plate 1 which is a metal plate having a pin insertion hole 2 corresponding to the hole 15 of the semiconductor package. Since the pin insertion hole 2 of the jig plate 1 shown in FIG. 8 needs to be processed with high precision, it is drilled by electrical discharge machining or the like. But,
When a metal plate is machined by electric discharge machining, the surface roughness of the machined surface increases, and the inner wall 3 of the pin insertion hole 2 also increases in surface roughness. Therefore, when the conductor pin 9 is inserted into the pin insertion hole 2 by the transfer machine 11, the surface of the conductor pin 9 comes into contact with the inner wall 3 of the pin insertion hole 2, and the surface of the conductor pin 9 is scratched or the pin is inserted. There is a problem that dust and foreign matter of the conductor pin 9 are likely to adhere to the inner wall 3 of the hole 2.

[0006]

The present invention has been made in view of the above circumstances, and its object is to:
Another object of the present invention is to provide a pin alignment jig that can be easily inserted into a pin insertion hole without damaging the surface of the conductor pin and that does not allow dust or foreign matter to adhere to the inner wall of the pin insertion hole.

[0007]

The alignment jig according to claim 1 of the present invention comprises a jig plate 1 and a fluorine-containing polymer film 4 on an inner wall 3 of a pin insertion hole 2 aligned with the jig plate 1. Furthermore, the alignment jig according to claim 2 of the present invention is a jig plate 1 and a nickel coating 5 on the inner wall 3 of the pin insertion hole 2 aligned with the jig plate 1. And a fluoropolymer is dispersed in the nickel film 5.

[0008]

The alignment jig according to claim 1 of the present invention is the jig plate 1
Since the inner wall 3 of the aligned pin insertion hole 2 is coated with the fluorine-based polymer film 4, the inner surface of the pin insertion hole 2 has good smoothness, excellent wear resistance, and is highly non-adhesive. Therefore, the releasability is greatly improved.

Further, in the aligning jig according to the second aspect of the present invention, the nickel film 5 is formed on the inner wall 3 of the aligned pin insertion hole 2 of the jig plate 1, and the fluorine film is formed on the nickel film 5. Since they are dispersed, the sliding property of the inner surface of the pin insertion hole 2 is good, the wear resistance is excellent, and the non-adhesiveness is rich, so the releasability is greatly improved. Also, it has good non-electrostatic properties and excellent durability.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0011]

FIG. 2 is a perspective view of an alignment jig according to an embodiment of the present invention, and FIG. 3 is a partially cutaway side view of the alignment jig.

As an example of the alignment jig according to the present invention, there is an alignment jig corresponding to a pin grid array (hereinafter referred to as PGA). This alignment jig is provided on the surface of the jig plate 1.
A pin insertion hole 2 is formed at a position corresponding to the GA lead pin.

The opening 13 at the center of this alignment jig is
It serves as a guide when the conductor pin 9 is press-fitted.

The pin insertion hole 2 has an insertion opening 14 having a diameter with which the flange of the introduction pin is locked in order to support the conductor pin 9 having a cross-shaped cross section.

Embodiment 1 FIG. 1 is a sectional view of a main part of an alignment jig according to an embodiment of the present invention.

As shown in FIG. 1, the inner wall 3 of the pin insertion hole 2 of the jig plate 1 is coated with a fluoropolymer film 4 having a thickness of 10 μm. In this example, a polytetrafluoroethylene film was coated.

Next, using the above-mentioned alignment jig in which the inner wall 3 of the pin insertion hole 2 is coated with the fluorine-containing polymer film 4, as shown in FIG. 4, a transfer machine having suction holes corresponding to the holes of the semiconductor package is used. The conductor pin 9 was inserted into the pin insertion hole 2 and, as shown in FIG. 5, the conductor pin 9 was press-fitted into the printed wiring board constituting the PGA using this alignment jig.

As described above, when the inner wall 3 of the pin insertion hole 2 of the jig plate 1 is coated with the fluoropolymer film 4, the inner wall 3 of the pin insertion hole 2 has lubricity and is excellent in non-adhesiveness. So
It was easy to insert and remove with little friction.

Embodiment 2 FIG. 6 is a sectional view of a main part of an alignment jig according to an embodiment of the present invention.

As shown in FIG. 6, the inner wall 3 of the pin insertion hole 2 of the jig plate 1 was coated with a nickel coating 5 having a thickness of 10 μm and a coating in which a fluoropolymer was dispersed.

This coating has a fluorine-based polymer particle size of 0.
At 3 to 1.0 mm, the content of the fluoropolymer is 10 to 45 vol /%.

Next, as shown in FIG. 4, using an alignment jig in which the inner wall 3 of the pin insertion hole 2 is coated with a film in which a fluorine-containing polymer is dispersed in a nickel film 5, as shown in FIG. The conductor pin 9 was inserted into the pin insertion hole 2 by the transfer machine having the above, and the conductor pin 9 was press-fitted into the printed wiring board constituting the PGA using this alignment jig as shown in FIG.

As described above, when the inner wall 3 of the pin insertion hole 2 of the jig plate 1 is coated with a nickel coating 5 having a thickness of 10 μm and a fluorine polymer dispersed therein, the inner wall 3 of the pin insertion hole 2 is covered.
Since it has lubricity and excellent non-adhesiveness, it can be easily inserted and removed with little friction. Furthermore, since it is excellent in non-electrostatic properties, dirt, dust and foreign matter are less attached. Further, since it is composed of the nickel film 5, it has excellent durability.

[0024]

As described above, according to the pin alignment jig of the present invention, when the conductive pin is inserted into the pin insertion hole aligned on the jig plate, the inner wall of the pin insertion hole is lubricated. Since it has and has excellent non-adhesiveness, it can be easily inserted and removed with little friction. Further, in addition to the above effects, according to the pin alignment jig of the second aspect of the present invention, the inner wall of the pin insertion hole is excellent in non-electrostatic property, so that dirt, debris, and adhesion of foreign matter are reduced. It also has excellent durability.

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part of an alignment jig according to an embodiment of the present invention.

FIG. 2 is a perspective view of an alignment jig according to an embodiment of the present invention.

FIG. 3 is a partially cutaway side view of an alignment jig of one embodiment according to the present invention.

FIG. 4 is a cross-sectional view of a transfer machine and an alignment jig for explaining an alignment step of aligning pins.

FIG. 5 is a side cross-sectional view illustrating a step of press-fitting pins into a printed wiring board using the alignment jig according to the embodiment of the present invention.

FIG. 6 is a cross-sectional view of an essential part of an alignment jig of another embodiment according to the present invention.

FIG. 7 is a side sectional view illustrating a step of inserting a pin into the diaphragm.

FIG. 8 is a sectional view of a main part of a conventional alignment jig.

[Explanation of symbols]

 1 jig plate 2 pin insertion hole 3 inner wall 4 fluoropolymer film 5 nickel film

Claims (2)

[Claims] 1. A jig plate (1) and a pin insertion hole (2) aligned with the jig plate (1) are provided, and a fluoropolymer is provided on an inner wall (3) of the pin insertion hole (2). A pin alignment jig characterized by being coated with a film (4). 2. A jig plate (1) and a pin insertion hole (2) aligned with the jig plate (1) are provided, and a nickel film (5) is formed on an inner wall (3) of the pin insertion hole (2). ) Is formed, and a fluorine-based polymer is dispersed in the nickel coating (5).