JPH08186401A - Casing for high frequency signal transmission - Google Patents

Casing for high frequency signal transmission

Info

Publication number
JPH08186401A
JPH08186401A JP6328753A JP32875394A JPH08186401A JP H08186401 A JPH08186401 A JP H08186401A JP 6328753 A JP6328753 A JP 6328753A JP 32875394 A JP32875394 A JP 32875394A JP H08186401 A JPH08186401 A JP H08186401A
Authority
JP
Japan
Prior art keywords
partition plate
cover
conductive rubber
housing
frequency signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6328753A
Other languages
Japanese (ja)
Inventor
Masao Amano
雅夫 天野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP6328753A priority Critical patent/JPH08186401A/en
Publication of JPH08186401A publication Critical patent/JPH08186401A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To prevent the leak of a high frequency signal or the coupling of transmission lines at the casing to be used for transmitting the high frequency signal. CONSTITUTION: At a casing 1 whose one face is opened, a conductive rubber member 4 is integrated between the bottom surface of a partition plate 3 and the casing 1 and fixed onto the casing 1 by a screw 5. Further, projecting structure is provided at a contact part between the inside of a cover 2 and the upper surface of the partition plate 3. Thus, when the cover 2 is fixed on the casing 1, a projecting part 2a presses the partition plate 3 and shrinks the conductive rubber member 4 with pressure. Therefore, the partition plate 3 is pressed onto the cover 2 by the elasticity of the conductive rubber member 4 and tight adhesion can be kept.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、高周波信号伝送用筐体
に関し、特に、1GHz以上のマイクロ波伝送装置の筐
体に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing for high frequency signal transmission, and more particularly to a housing for a microwave transmission device of 1 GHz or higher.

【0002】[0002]

【従来の技術】従来、マイクロ波信号の伝送に用いられ
る筐体は、図4に示すように、筐体1′と一体的に作ら
れた仕切壁と、筐体周囲の壁の上面とカバー2′との間
に設けられた導電性ゴム材4′、4′とを有し、カバー
2′は筐体1′にねじ止めされる構造となっている。
2. Description of the Related Art Conventionally, as shown in FIG. 4, a housing used for transmitting a microwave signal has a partition wall integrally formed with a housing 1 ', an upper surface of a wall around the housing and a cover. The cover 2'has a structure to be screwed to the housing 1 '.

【0003】また他の従来例を図5(a)、(b)に示
す。本例では、シールド仕切板18b上面とシールドカ
バー10に弾性当接するアース用舌片12a、12bを
備えている(例えば実開平3−25295号公報)。本
例では、シールドカバー10とシールド仕切板18bと
の接触を、アース用舌片12a、12bで確実にしてい
る。
Another conventional example is shown in FIGS. 5 (a) and 5 (b). In this example, grounding tongues 12a and 12b elastically abutting on the upper surface of the shield partition plate 18b and the shield cover 10 are provided (for example, Japanese Utility Model Laid-Open No. 3-25295). In this example, the contact between the shield cover 10 and the shield partition plate 18b is ensured by the grounding tongues 12a and 12b.

【0004】さらに他の従来例を図6(a)、(b)に
示す。本例では、仕切壁22を有する筐体21と、この
仕切壁上部が嵌入される接続部を有し、筐体1の開口面
に嵌装されるシールド板25と、仕切壁22と接触する
シールド板上に設けられた棒状弾性体27と、この棒状
弾性体27を介してシールド板25を仕切壁22に押付
ける蓋体26から構成されている(例えば実公平2−7
508号公報)。本例では、蓋体26を筐体21へ密着
させることで、棒状弾性体27を通してシールド板25
を仕切壁22へ密着させている。
Still another conventional example is shown in FIGS. 6 (a) and 6 (b). In this example, the casing 21 having the partition wall 22 and the connecting portion into which the upper portion of the partition wall is fitted are provided, and the shield plate 25 fitted to the opening surface of the housing 1 is in contact with the partition wall 22. It is composed of a rod-shaped elastic body 27 provided on the shield plate and a lid body 26 that presses the shield plate 25 against the partition wall 22 via the rod-shaped elastic body 27 (for example, actual fair 2-7).
No. 508). In this example, the shield 26 is made to pass through the rod-shaped elastic body 27 by bringing the lid 26 into close contact with the housing 21.
Is closely attached to the partition wall 22.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、従来の
筐体、例えば図4に示す例では、筐体周囲の壁の高さ
が、仕切壁高さよりも導電性ゴム材の厚さ分だけ高くな
り、カバーをねじ止めした時にカバーが反り、電気特性
が不安定になったり、カバーの閉め方によって特性が変
化する等、再現性が悪いという問題があった。
However, in the conventional case, for example, the example shown in FIG. 4, the height of the wall around the case is higher than the height of the partition wall by the thickness of the conductive rubber material. However, there is a problem that the reproducibility is poor such that the cover warps when the cover is screwed, the electric characteristics become unstable, and the characteristics change depending on how the cover is closed.

【0006】また図5に示す例では、アース用舌片とシ
ールド仕切板との接触部に、ある程度以上の面積が必要
で、装置の小型化、あるいは伝送信号の高周波化に限界
があるという問題があるし、さらに、シールドカバーと
シールド仕切板が密着していないために間隙から高周波
信号が漏れるという問題がマイクロ波帯では生じる。
Further, in the example shown in FIG. 5, the contact portion between the grounding tongue and the shield partition plate needs to have a certain area or more, which limits the miniaturization of the device or the high frequency of the transmission signal. In addition, there is a problem that a high frequency signal leaks from the gap in the microwave band because the shield cover and the shield partition plate are not in close contact with each other.

【0007】さらに図6に示す例では、筐体と一体的に
作られている仕切壁の高さ寸法とシールド板の曲げ加工
寸法及び厚み、さらに蓋体の平面度あるいは棒状弾性体
の径を厳しく管理する必要があり、構造的に複雑で、さ
らにシールド板を内部に持つために、小型化の妨げにな
るという問題があった。
Further, in the example shown in FIG. 6, the height dimension of the partition wall integrally formed with the housing, the bending dimension and thickness of the shield plate, the flatness of the lid body or the diameter of the rod-shaped elastic body are set. There is a problem that it needs to be strictly managed, is structurally complicated, and has a shield plate inside, which hinders miniaturization.

【0008】本発明は従来の上記実情に鑑がみてなされ
たものであり、従って本発明の目的は、従来の技術に内
在する上記諸課題を解決することを可能とした新規な高
周波信号伝送用筐体を提供することにある。
The present invention has been made in view of the above-mentioned conventional circumstances, and therefore, the object of the present invention is to provide a novel high-frequency signal transmission capable of solving the above-mentioned problems inherent in the conventional technology. It is to provide a housing.

【0009】[0009]

【課題を解決するための手段】上記目的を達成する為
に、本発明に係る高周波信号伝送用筐体は、筐体と別構
造で作られた仕切壁と、仕切壁底面と筐体の間に設けら
れた導電性ゴム材と、導電性ゴム材の弾性を失うことな
く、仕切壁を筐体に固定する為のねじと、仕切壁上部に
密着するように作られた凸部を有するカバーとを備えて
構成される。
In order to achieve the above object, a high-frequency signal transmission case according to the present invention is provided with a partition wall having a structure different from that of the case, and between the bottom surface of the partition wall and the case. Cover provided with a conductive rubber material, a screw for fixing the partition wall to the housing without losing elasticity of the conductive rubber material, and a convex portion formed so as to closely adhere to the upper portion of the partition wall. And is configured.

【0010】[0010]

【実施例】次に本発明をその好ましい各実施例について
図面を参照しながら具体的に説明する。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be specifically described with reference to the drawings for each of its preferred embodiments.

【0011】図1(a)は本発明による高周波信号伝送
用筐体の第1の実施例を示す一部断面斜視図である。ま
た、図1(b)は図1(a)のb−b′線に沿って切断
し矢印の方向に見た断面図、図1(c)は図1(a)の
c−c′線に沿って切断し矢印の方向に見た断面図であ
る。
FIG. 1A is a partial sectional perspective view showing a first embodiment of a high-frequency signal transmission casing according to the present invention. 1B is a sectional view taken along the line bb 'of FIG. 1A and seen in the direction of the arrow, and FIG. 1C is the line cc' of FIG. 1A. It is sectional drawing cut | disconnected along and seen in the direction of the arrow.

【0012】図1(a)を参照するに、本発明による第
1の実施例は、一面が開口している筐体1上に伝送する
信号波長に対し適当な幅を有する仕切板3を有し、その
仕切板3の底面にコメリクス等の導電性ゴム材4を敷
き、仕切板3と導電性ゴム材4を一体としてねじ5(図
1(c)参照)で筐体1に固定されている。
Referring to FIG. 1 (a), the first embodiment according to the present invention has a partition plate 3 having an appropriate width for a signal wavelength to be transmitted, on a housing 1 having an opening on one side. Then, a conductive rubber material 4 such as comelix is laid on the bottom surface of the partition plate 3, and the partition plate 3 and the conductive rubber material 4 are integrally fixed to the housing 1 with screws 5 (see FIG. 1C). There is.

【0013】ねじ5の頭部が、仕切板3の上面より出っ
張らないように、仕切板3のねじ5が挿入される上部に
は凹部(ざぐり)3aが設けられている。尚、ねじ5で
固定する際には、導電性ゴム材4の弾性が失なわれない
ようにねじ5を締める強さを調節する。
In order to prevent the head of the screw 5 from protruding from the upper surface of the partition plate 3, a recess (counterbore) 3a is provided in the upper portion of the partition plate 3 into which the screw 5 is inserted. When fixing with the screw 5, the strength of tightening the screw 5 is adjusted so that the elasticity of the conductive rubber material 4 is not lost.

【0014】高周波伝送路は、サブキャリア6、6′上
にはんだ付けされた、アルミナ基板またはテフロングラ
ス基板などの誘電体基盤7、7′上に形成され、筐体1
と仕切板3及び導電性ゴム材4で形成される各部屋に配
置されている。さらに、筐体1上を覆うようにカバー2
が設けられている。
The high frequency transmission line is formed on a dielectric substrate 7, 7'such as an alumina substrate or a Teflon glass substrate soldered on the subcarriers 6, 6 ', and the housing 1
It is arranged in each room formed by the partition plate 3 and the conductive rubber material 4. Furthermore, the cover 2 covers the housing 1.
Is provided.

【0015】このカバー2の内側と、仕切板3が接触す
る部位には、接触を確実にする為に凸形状の凸部2aが
形成されている。
A convex portion 2a having a convex shape is formed at a portion where the inside of the cover 2 and the partition plate 3 are in contact with each other so as to ensure the contact.

【0016】以上の構成とすることで、カバー2を筐体
1にねじ止めすると、カバーの凸部2aが仕切板3を押
し、導電性ゴム材4が縮まる。従って、導電性ゴム材4
の弾性力により仕切板3をカバーに密着させることがで
きる。
With the above structure, when the cover 2 is screwed to the housing 1, the convex portion 2a of the cover pushes the partition plate 3 and the conductive rubber material 4 contracts. Therefore, the conductive rubber material 4
The partition plate 3 can be brought into close contact with the cover by the elastic force of.

【0017】図2は本発明による第2の実施例を示す斜
視図である。
FIG. 2 is a perspective view showing a second embodiment according to the present invention.

【0018】図2を参照するに、本発明による第2の実
施例においては、カバー2の両端面下部にもそれぞれ段
差部2b′を有する凸部2b、2bが形成されており、
この段差部2b′と、これに対応して筐体1の上部に設
けられた段差部1aとで形成された空隙部に導電性ゴム
材8が嵌合されている。この構成によれば筐体1とカバ
ー2との密着性が更に大きなものとなる。
Referring to FIG. 2, in the second embodiment according to the present invention, convex portions 2b and 2b each having a step portion 2b 'are formed on the lower portions of both end faces of the cover 2,
The conductive rubber material 8 is fitted in the void formed by the step portion 2b 'and the step portion 1a provided correspondingly on the upper portion of the housing 1. According to this structure, the adhesion between the housing 1 and the cover 2 is further increased.

【0019】この本発明による第2の実施例に加えて、
仕切板3の上部におけるカバー2の凸部2aに対応する
位置に凸部2aと接触する導電性ゴム材を介在させるこ
ともできる。
In addition to the second embodiment according to the present invention,
It is also possible to interpose a conductive rubber material in contact with the convex portion 2a at a position corresponding to the convex portion 2a of the cover 2 on the upper part of the partition plate 3.

【0020】図3は本発明による第3の実施例を示す要
部断面図である。
FIG. 3 is a sectional view of the essential parts showing a third embodiment of the present invention.

【0021】図3を参照するに、図3は仕切板3の長手
方向に沿って切断した図1(c)と同様の断面図であ
り、筐体1の仕切板3の下部と対応する長手方向の位置
に溝9が切設されており、この溝9内に導電性ゴム材4
が嵌合されている。この導電性ゴム材4が導電性ゴム材
4と仕切板3の接続面が溝9内に没入するように埋設さ
れた場合には更にその密着性が良好となる。
Referring to FIG. 3, FIG. 3 is a sectional view similar to FIG. 1 (c) taken along the longitudinal direction of the partition plate 3, and has a length corresponding to the lower portion of the partition plate 3 of the housing 1. A groove 9 is cut at a position in the direction, and the conductive rubber material 4 is inserted in the groove 9.
Are fitted. When the conductive rubber material 4 is embedded so that the connecting surface between the conductive rubber material 4 and the partition plate 3 is recessed in the groove 9, the adhesion is further improved.

【0022】上記いずれの実施例においても同様である
が、各構成要素の接続部に例えば接着剤、ガスケット等
を充填することも可能であり、そのようにすれば各要素
間の密着性は更に良好となる。
As in any of the above-mentioned embodiments, it is possible to fill the connecting portion of each constituent element with, for example, an adhesive, a gasket or the like, and by doing so, the adhesion between the respective elements is further improved. It will be good.

【0023】[0023]

【発明の効果】以上説明したように、本発明に係る筐体
によれば、過去の従来例と異なり仕切壁を筐体と一体化
せずに、導電性ゴム材により浮かせて高さ方向に可動構
造とすることで、図4に示す過去の従来例の様に厳しい
寸法精度を要求しなくても仕切板とカバーを密着できる
効果が得られる。
As described above, according to the case of the present invention, unlike the past conventional examples, the partition wall is not integrated with the case, but is floated by the conductive rubber material in the height direction. With the movable structure, the partition plate and the cover can be brought into close contact with each other without requiring strict dimensional accuracy as in the past conventional example shown in FIG.

【0024】本発明によればまた、仕切板を可動にして
も、筐体との間に導電性ゴム材を設けること、さらにカ
バー全面と密着させることで、図3に示す過去の従来例
と異なり、間隙が無いので、高周波信号が漏れることも
ない。
According to the present invention, even if the partition plate is movable, a conductive rubber material is provided between the partition plate and the case, and the partition plate is brought into close contact with the entire surface of the cover. In contrast, since there is no gap, high frequency signals will not leak.

【0025】更にまた本発明によれば、カバーあるいは
筐体に反り、ゆがみが生じても、仕切板が可動であれ
ば、カバーと仕切板を密着されることも可能であり、内
部シールド板またはカバーに弾性体を付けることもない
ので、小型化にも十分対応可能であるという効果も得ら
れる。
Furthermore, according to the present invention, even if the cover or the housing is warped or distorted, if the partition plate is movable, it is possible to bring the cover and the partition plate into close contact with each other. Since no elastic body is attached to the cover, it is possible to obtain an effect that it is possible to sufficiently cope with miniaturization.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による第1の実施例を示し、(a)は一
部断面斜視図、(b)は正面断面図、(c)は横断面図
である。
1 shows a first embodiment according to the present invention, (a) is a partial sectional perspective view, (b) is a front sectional view, and (c) is a lateral sectional view.

【図2】本発明による第2の実施例を示す一部断面斜視
図である。
FIG. 2 is a partial sectional perspective view showing a second embodiment according to the present invention.

【図3】本発明による第3の実施例を示す横断面図であ
る。
FIG. 3 is a cross sectional view showing a third embodiment according to the present invention.

【図4】第1の従来例を示す正面断面図である。FIG. 4 is a front sectional view showing a first conventional example.

【図5】第2の従来例を示し、(a)は平面図、(b)
は断面図である。
5A and 5B show a second conventional example, FIG. 5A is a plan view, and FIG.
Is a sectional view.

【図6】第3の従来例を示し、(a)は斜視図、(b)
は断面図である。
6A and 6B show a third conventional example, in which FIG. 6A is a perspective view and FIG.
Is a sectional view.

【符号の説明】[Explanation of symbols]

1、1′…筐体 2、2′…カバー 2a、2b…凸部 3…仕切板 3a…凹部 4、4′、8…導電性ゴム材 5…ねじ 6、6′…サブキャリア 7、7′…誘電体基板 9…溝 10…シールドカバー 12a、12b…一対のアース用舌片 18…シールド仕切板 18a、18b…仕切板端面 21…筐体 22…仕切壁 23、24…プリント基板 25…シールド板 25a、25b…シールド板コの字形部 26…蓋体 26a、26b…蓋体コの字形部 27…棒状弾性体 1, 1 '... Casing 2, 2' ... Cover 2a, 2b ... Convex part 3 ... Partition plate 3a ... Recessed part 4, 4 ', 8 ... Conductive rubber material 5 ... Screws 6, 6' ... Sub carrier 7, 7 ′ ... Dielectric substrate 9 ... Groove 10 ... Shield cover 12a, 12b ... A pair of grounding tongue pieces 18 ... Shield partition plates 18a, 18b ... Partition plate end face 21 ... Housing 22 ... Partition wall 23, 24 ... Printed circuit board 25 ... Shield plate 25a, 25b ... Shield plate U-shaped portion 26 ... Lid body 26a, 26b ... Lid-shaped U-shaped portion 27 ... Rod-shaped elastic body

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 一面が開口され内部に高周波回路を有す
る筐体と、該高周波回路間に設けられた仕切板と、該仕
切板の底面と該底面に対向する領域における前記筐体の
間に設けられた導電性ゴム材と、前記筐体の上部を被覆
するカバーとを備えることを特徴とする高周波信号伝送
用筐体。
1. A housing having a high-frequency circuit inside, one surface of which is open, a partition plate provided between the high-frequency circuits, a bottom surface of the partition plate, and the housing in a region facing the bottom surface. A case for high-frequency signal transmission, comprising: a conductive rubber material provided; and a cover that covers an upper part of the case.
【請求項2】 前記カバーの前記仕切板の上面との接触
部に凸部を形成したことを更に特徴とする請求項1に記
載の高周波信号伝送用筐体。
2. The high frequency signal transmission housing according to claim 1, further comprising a convex portion formed on a contact portion of the cover with the upper surface of the partition plate.
【請求項3】 前記カバーと前記仕切板の上面との接触
部に導電性ゴム材を設けたことを更に特徴とする請求項
1に記載の高周波信号伝送用筐体。
3. The high frequency signal transmission housing according to claim 1, further comprising a conductive rubber material provided at a contact portion between the cover and the upper surface of the partition plate.
【請求項4】 前記カバーの前記筐体の両側部上面との
接触部に凸部を形成したことを更に特徴とする請求項2
に記載の高周波信号伝送用筐体。
4. A projection is formed at a contact portion of the cover with upper surfaces of both sides of the housing.
The high-frequency signal transmission housing according to.
【請求項5】 前記カバーの前記各凸部と、前記仕切板
及び筐体の上面の各接触部との間にそれぞれ導電性ゴム
を設けたことを更に特徴とする請求項4に記載の高周波
信号伝送用筐体。
5. The high frequency wave according to claim 4, further comprising conductive rubber provided between each of the convex portions of the cover and each of the contact portions on the upper surface of the partition plate and the casing. Signal transmission housing.
【請求項6】 前記筐体の前記高周波回路間に溝を形成
し、該溝に前記導電性ゴムを埋設し、該導電性ゴムの上
に前記仕切板を載置したことを更に特徴とする請求項1
に記載の高周波信号伝送用筐体。
6. The method according to claim 6, further comprising: forming a groove between the high frequency circuits of the casing, embedding the conductive rubber in the groove, and mounting the partition plate on the conductive rubber. Claim 1
The high-frequency signal transmission housing according to.
【請求項7】 前記導電性ゴムと前記仕切板との接続部
が前記筐体内に埋設されていることを更に特徴とする請
求項6に記載の高周波信号伝送用筐体。
7. The housing for high frequency signal transmission according to claim 6, further comprising a connection portion between the conductive rubber and the partition plate embedded in the housing.
JP6328753A 1994-12-28 1994-12-28 Casing for high frequency signal transmission Pending JPH08186401A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6328753A JPH08186401A (en) 1994-12-28 1994-12-28 Casing for high frequency signal transmission

Applications Claiming Priority (1)

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JP6328753A JPH08186401A (en) 1994-12-28 1994-12-28 Casing for high frequency signal transmission

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JPH08186401A true JPH08186401A (en) 1996-07-16

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JP6328753A Pending JPH08186401A (en) 1994-12-28 1994-12-28 Casing for high frequency signal transmission

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008056705A1 (en) 2008-06-18 2009-12-31 Mitsubishi Electric Corp. Antenna device, radar and waveguide
DE102009035434A1 (en) 2008-12-26 2010-07-08 Mitsubishi Electric Corporation Waveguide structure, antenna device using the waveguide structure, and vehicle radar device using a waveguide structure or an antenna device
KR101032399B1 (en) * 2010-02-11 2011-05-03 주식회사 이너트론 Steel housing of band pass filter and manufacturing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01130593A (en) * 1987-11-16 1989-05-23 Mitsubishi Electric Corp Microwave integrated circuit
JPH0511501B2 (en) * 1987-07-09 1993-02-15 Enafukudo Jugen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0511501B2 (en) * 1987-07-09 1993-02-15 Enafukudo Jugen
JPH01130593A (en) * 1987-11-16 1989-05-23 Mitsubishi Electric Corp Microwave integrated circuit

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008056705A1 (en) 2008-06-18 2009-12-31 Mitsubishi Electric Corp. Antenna device, radar and waveguide
US8421699B2 (en) 2008-06-18 2013-04-16 Mitsubishi Electric Corporation Antenna apparatus, radar and waveguide
DE102008056705B4 (en) * 2008-06-18 2014-10-09 Mitsubishi Electric Corp. ANTENNA DEVICE AND USE OF THE SAME IN A RADAR
DE102009035434A1 (en) 2008-12-26 2010-07-08 Mitsubishi Electric Corporation Waveguide structure, antenna device using the waveguide structure, and vehicle radar device using a waveguide structure or an antenna device
US8633790B2 (en) 2008-12-26 2014-01-21 Mitsubishi Electric Corporation Waveguide structure, antenna apparatus that uses that waveguide structure, and vehicle radar apparatus in which a waveguide structure or an antenna apparatus is used
KR101032399B1 (en) * 2010-02-11 2011-05-03 주식회사 이너트론 Steel housing of band pass filter and manufacturing method

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