JPH0819877A - Ultrasonic bonding equipment - Google Patents
Ultrasonic bonding equipmentInfo
- Publication number
- JPH0819877A JPH0819877A JP15470794A JP15470794A JPH0819877A JP H0819877 A JPH0819877 A JP H0819877A JP 15470794 A JP15470794 A JP 15470794A JP 15470794 A JP15470794 A JP 15470794A JP H0819877 A JPH0819877 A JP H0819877A
- Authority
- JP
- Japan
- Prior art keywords
- ultrasonic
- joined
- booster
- bonding apparatus
- maximum amplitude
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
(57)【要約】
【目的】 接合時における超音波のエネルギーロスを低
減せしめ、また装置自体の信頼性を向上せしめると共に
接合の利用範囲を広げるようにした超音波接合装置を提
供する。
【構成】 超音波の予め定めた周波数において少なくと
も１波長の長さを有し振動時に縦方向運動の３つの最大
振幅点を有する超音波ホーン２７と、超音波ホーン２７
の前記最大振幅点の１つに配置される被接合部材Ｗ1 ，
Ｗ2 と係合する係合用チップ３１と、超音波ホーン２７
の両端における最大振幅点の他の２つの各々に連結され
たブースタ２５，２９と、ブースタの一方に接続された
超音波振動子２３と、各ブースタ２５，２９におけるノ
ーダルポイントを機械的なクランプ手段でクランプした
支持部材１９Ｒ，１９Ｌと、この支持部材１９Ｒ，１９
Ｌと被接合部材Ｗ1 ，Ｗ2 を載置した受台５とを相対的
に移動せしめて被接合部材に係合用チップ３１を加圧せ
しめる加圧手段７と、を備えていることを特徴とする。
(57) [Abstract] [Purpose] To provide an ultrasonic bonding apparatus capable of reducing the energy loss of ultrasonic waves at the time of bonding, improving the reliability of the apparatus itself, and expanding the range of use of bonding. An ultrasonic horn 27 having a length of at least one wavelength at a predetermined frequency of ultrasonic waves and having three maximum amplitude points of longitudinal movement during vibration, and an ultrasonic horn 27.
A member to be welded W 1 arranged at one of the maximum amplitude points of
An engaging tip 31 that engages with W 2, and an ultrasonic horn 27
Of the maximum amplitude points at both ends of the booster 25, 29 connected to each of the two, the ultrasonic transducer 23 connected to one of the boosters, and the nodal points of the boosters 25, 29 are mechanically clamped. Support members 19R and 19L clamped by means, and the support members 19R and 19L
L and the pedestal 5 on which the members to be joined W 1 and W 2 are mounted are relatively moved, and a pressing means 7 for pressing the engaging chip 31 to the members to be joined is provided. And
Description
【０００１】[0001]
【産業上の利用分野】この発明は、被接合部材としての
例えば金属と金属とを超音波振動で接合するようにした
超音波接合装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic bonding apparatus for bonding, for example, metals as members to be bonded by ultrasonic vibration.
【０００２】[0002]
【従来の技術】従来、被接合部材としての例えば金属と
金属とを超音波振動で接合する超音波接合装置として
は、例えば特公昭５４−２３３４９公報などでよく知ら
れている。上記公報による超音波接合装置は超音波の予
め定めた周波数において少なくとも１波長の長さを有し
共振時に縦方向運動の３つの波腹領域を提供する細長い
共振器を設け、この共振器の波腹領域の１つに加工部材
と係合する加工部材係合チップを設けている。そして前
記共振器における波腹領域の他の２つの各々は１対の支
持部材を介して支持体に接続されている。2. Description of the Related Art Conventionally, an ultrasonic bonding apparatus for bonding metal as a member to be bonded, for example, with metal by ultrasonic vibration is well known, for example, from Japanese Patent Publication No. 54-23349. The ultrasonic bonding apparatus according to the above publication comprises an elongated resonator having a length of at least one wavelength at a predetermined frequency of ultrasonic waves and providing three antinode regions of longitudinal movement at resonance, A processing member engaging tip that engages with the processing member is provided in one of the belly regions. Each of the other two antinode regions in the resonator is connected to a support via a pair of support members.
【０００３】このように支持体に１対の支持部材を介し
て接続された共振器において加工部材を押圧して前記加
工部材係合用チップに接触させて超音波振動方向にほぼ
直角な加圧力を与えることにより被接合部材を接合せし
めている。[0003] In the resonator connected to the supporting member via the pair of supporting members, the processing member is pressed to come into contact with the processing member engaging tip to apply a pressing force substantially perpendicular to the ultrasonic vibration direction. The members to be joined are joined by giving.
【０００４】また、前記共振器に超音波振動を与える超
音波発振器では図６に示されているような２段階発振ス
タートで振幅を与えるようにしている。Further, in the ultrasonic oscillator for applying ultrasonic vibration to the resonator, the amplitude is applied by the two-stage oscillation start as shown in FIG.
【０００５】[0005]
【発明が解決しようとする課題】ところで、上述した従
来の超音波接合装置では、共振器が共振器の２つの波腹
領域すなわち最大振動振幅点で１対の例えば金属薄板な
どからなる支持部材に支持されているから、接合時にお
ける超音波のエネルギーロスが大きく、また接合のバラ
ツキが大きく、延いては不良品の発生が多くなって装置
自体の信頼性が劣るという問題があった。By the way, in the conventional ultrasonic bonding apparatus described above, the resonator is mounted on a pair of support members made of a pair of metal sheets at the two antinode regions of the resonator, that is, at the point of maximum vibration amplitude. Since it is supported, there is a problem that the energy loss of the ultrasonic wave at the time of joining is large, the variation of the joining is large, and the number of defective products is increased, and the reliability of the device itself is deteriorated.
【０００６】また、従来の超音波発振器では２段階発振
スタートにより共振器に振幅を与えているため、図７に
示されているようにスターティングストレスはランニン
グストレスの３００〜５００％のストレスがかかってし
まい、小さな負荷や小出力の場合には対応できるがそれ
以外には対応できないという問題があった。Further, in the conventional ultrasonic oscillator, the amplitude is given to the resonator by the two-stage oscillation start, so that the starting stress is 300 to 500% of the running stress as shown in FIG. Thus, there is a problem that it can cope with a small load or a small output, but cannot cope with other cases.
【０００７】この発明の目的は、接合時における超音波
のエネルギーロスを低減せしめ、また装置自体の信頼性
を向上せしめると共に接合の利用範囲を広げるようにし
た超音波接合装置を提供することにある。An object of the present invention is to provide an ultrasonic bonding apparatus that reduces the energy loss of ultrasonic waves during bonding, improves the reliability of the apparatus itself, and widens the range of use of bonding. .
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
にこの発明の超音波接合装置は、超音波の予め定めた周
波数において少なくとも１波長の長さを有し振動時に縦
方向運動の３つの最大振幅点を有する超音波ホーンと、
この超音波ホーンの前記最大振幅点の１つに配置される
被接合部材と係合する係合用チップと、前記超音波ホー
ンの両端における前記最大振幅点の他の２つの各々に連
結されたブースタと、このブースタの一方に接続された
超音波振動子と、前記各ブースタにおけるノーダルポイ
ントを機械的なクランプ手段でクランプされた支持部材
と、この支持部材と前記被接合部材を載置した受台とを
相対的に移動せしめて被接合部材に前記係合用チップを
加圧せしめる加圧手段と、を備えていることを特徴とす
るものである。In order to achieve the above object, the ultrasonic bonding apparatus of the present invention has a length of at least one wavelength at a predetermined frequency of ultrasonic waves and has three longitudinal motions when vibrating. An ultrasonic horn with a maximum amplitude point,
An engaging tip that engages with a member to be joined arranged at one of the maximum amplitude points of this ultrasonic horn, and a booster connected to each of the other two of the maximum amplitude points at both ends of the ultrasonic horn. An ultrasonic transducer connected to one of the boosters, a support member in which the nodal points of the boosters are clamped by mechanical clamping means, and a support member on which the support member and the member to be joined are placed. And a pressing means for pressing the engaging tip against the member to be joined by relatively moving the table.
【０００９】前記超音波接合装置において、リニア・ラ
ンプ・バリアブル・ソフト・スタートさせることのでき
る超音波発振器が前記超音波振動子に接続されているこ
と、前記機械的なクランプ手段は、各ブースタにおける
ノーダルポイントを中心にある巾で一体的に形成された
各凸部を、直接前記支持部材に締付部材で締付けて強靭
にクランプすべく構成されていること、また、前記加圧
手段が前記受台を固定し、前記支持部材を移動して被接
合部材に係合用チップを加圧せしめる加圧シリンダで構
成されていることが望ましいものである。In the ultrasonic bonding apparatus, an ultrasonic oscillator capable of linear ramp variable soft start is connected to the ultrasonic oscillator, and the mechanical clamping means is provided in each booster. Each convex portion integrally formed with a width centered on the nodal point is configured to be directly clamped to the supporting member with a clamping member to firmly clamp, and the pressing means is It is preferable that the pedestal is composed of a pressure cylinder that fixes the pedestal and moves the support member to press the engaging tip against the member to be joined.
【００１０】[0010]
【作用】以上のような超音波接合装置とすることによ
り、受台上に例えば金属と金属とからなる被接合部材を
載置する。そして超音波発振器より供給される超音波の
電気信号が超音波振動子で機械振動に変換される。その
機械振動がブースタを通じて超音波ホーンおよびもう一
方のブースタに伝達されてブースタ並びに超音波ホーン
が水平方向へ振動される。With the ultrasonic bonding apparatus as described above, a member to be bonded made of, for example, metal is placed on the pedestal. Then, an ultrasonic electric signal supplied from the ultrasonic oscillator is converted into mechanical vibration by the ultrasonic vibrator. The mechanical vibration is transmitted to the ultrasonic horn and the other booster through the booster, and the booster and the ultrasonic horn are vibrated in the horizontal direction.
【００１１】ブースタが支持された支持部材を例えば加
圧手段で振動方向と直交した方向へ移動せしめて超音波
ホーンに配置された係合用チップを被接合部材に接触せ
しめると共に加圧を与えながら加振して超音波接合が行
われる。このとき、各ブースタにおけるノーダルポイン
トで支持部材に機械的に強固に連結されているから、接
合時に被接合材と超音波ホーンの付着が従来よりも極力
抑えられるから、超音波ホーンの寿命が伸び、その上超
音波のエネルギーロスが低減し、装置自体の信頼性が向
上することに伴い接合の利用範囲が広がる。The support member supporting the booster is moved by, for example, a pressing means in a direction orthogonal to the vibration direction so that the engaging tip arranged on the ultrasonic horn is brought into contact with the member to be joined and pressure is applied. Ultrasonic bonding is performed by shaking. At this time, since it is mechanically and firmly connected to the support member at the nodal point in each booster, the adhesion of the material to be joined and the ultrasonic horn is suppressed as much as possible at the time of joining, so the life of the ultrasonic horn is shortened. In addition to the elongation, the energy loss of ultrasonic waves is reduced, and the reliability of the device itself is improved, so that the range of use of bonding is expanded.
【００１２】[0012]
【実施例】以下、この発明の実施例を図面に基いて詳細
に説明する。Embodiments of the present invention will be described in detail below with reference to the drawings.
【００１３】図１を参照するに、超音波接合装置１は例
えば箱形状の本体フレーム３を備えており、この本体フ
レーム３は下部フレーム３Ｄ、サイドフレーム３Ｒ，３
Ｌおよび上部フレーム３Ｕとで構成されている。前記下
部フレーム３Ｄ上には被接合部材Ｗ1 ，Ｗ2 を載置する
受台５が設けられている。Referring to FIG. 1, the ultrasonic bonding apparatus 1 includes, for example, a box-shaped main body frame 3, and the main body frame 3 includes a lower frame 3D and side frames 3R, 3R.
L and the upper frame 3U. A receiving table 5 on which the members W 1 and W 2 are placed is provided on the lower frame 3D.
【００１４】前記上部フレーム３Ｕの下部には加圧手段
としての例えば加圧シリンダ７を内蔵したシリンダベー
ス９が取付けられている。前記加圧シリンダ７に装着さ
れたピストンロッド１１の先端には複数のねじ１３で門
型形状の支持フレーム１５が固定されている。At the lower part of the upper frame 3U, a cylinder base 9 having, for example, a pressure cylinder 7 as a pressure means is mounted. A gate-shaped support frame 15 is fixed to a tip of a piston rod 11 mounted on the pressurizing cylinder 7 with a plurality of screws 13.
【００１５】この支持フレーム１５の下部には支持体１
７が一体化されていると共に、この支持体１７の下部に
は支持部材１９Ｒ，１９Ｌが一体化されている。前記シ
リンダベース９の下面と前記支持体１７の上面には弾機
としての例えば複数の引っ張りバネ２１が取付けられて
いる。前記サイドフレーム３Ｒ，３Ｌの下部には穴又は
切欠き３Ｈが形成されている。Below the support frame 15, the support 1 is provided.
7 is integrated, and support members 19R and 19L are integrated under the support 17. On the lower surface of the cylinder base 9 and the upper surface of the support 17, for example, a plurality of tension springs 21 as an elastic machine are attached. Holes or notches 3H are formed in lower portions of the side frames 3R and 3L.
【００１６】超音波発振器２２には超音波振動子２３が
接続されており、この超音波振動子２３には、図２，図
３によく示されているようにブースタ２５が連結されて
いると共にこのブースタ２５には超音波ホーン２７が連
結され、さらにこの超音波ホーン２７には別のブースタ
２９が連結されている。また、前記超音波ホーン２７の
下部には被接合部材Ｗ2 に係合する係合用チップ３１が
設けられている。An ultrasonic oscillator 23 is connected to the ultrasonic oscillator 22, and a booster 25 is connected to the ultrasonic oscillator 23 as well shown in FIGS. An ultrasonic horn 27 is connected to the booster 25, and another booster 29 is connected to the ultrasonic horn 27. Further, the engaging tip 31 that engages the workpieces W 2 in the lower portion of the ultrasonic horn 27 is provided.
【００１７】前記超音波発振器２２の構造は図４、図５
に示したような性能を有するリニア・ランプ・バリアブ
ル・ソフト・スタートさせることができるようになって
いる。なお、リニア・ランプ・バリアブル・ソフト・ス
タートの詳細はＵ．Ｓ．Ｐ４，２７７，７１０に記載さ
れているとおりで、必要であれば上記公報を参照するこ
とにより理解されるものである。The structure of the ultrasonic oscillator 22 is shown in FIGS.
A linear ramp variable soft start having the performance as shown in can be made. For details of the linear ramp variable soft start, see U.S.A. S. As described in P4, 277, 710, it can be understood by referring to the above publication if necessary.
【００１８】前記各ブースタ２５，２９には後述するノ
ーダルポイントを中心にある巾に削り出した凸部２５
Ｆ，２９Ｆが形成されている。この凸部２５Ｆ，２９Ｆ
が金属の前記支持部材１９Ｒ，１９Ｆに直接機械的に強
靭にクランプされている。例えば図２に示されているよ
うに、支持部材１９Ｒ，１９Ｌに段付穴３３Ｒ，３３Ｌ
が形成されていると共に、この段付穴３３Ｒ，３３Ｌの
大径部の内周面には雌ねじ３５が形成されている。しか
も段付穴３３Ｒ，３３Ｌにはブースタ２５，２９が入り
込まれ、金属の締付部材３７Ｒ，３７Ｌの外周面には雄
ねじ３９が形成されている。Each of the boosters 25 and 29 has a convex portion 25 cut to a width centered on a nodal point described later.
F, 29F are formed. These projections 25F, 29F
Are mechanically and strongly clamped directly to the metal support members 19R and 19F. For example, as shown in FIG. 2, stepped holes 33R, 33L are formed in support members 19R, 19L.
Are formed, and a female screw 35 is formed on the inner peripheral surface of the large-diameter portion of each of the stepped holes 33R and 33L. In addition, the boosters 25 and 29 are inserted into the stepped holes 33R and 33L, and external threads 39 are formed on the outer peripheral surfaces of the metal fastening members 37R and 37L.
【００１９】上記構成により、支持部材１９Ｒ，１９Ｌ
の雌ねじ３５に締付部材３７Ｒ，３７Ｌの雄ねじ３９を
螺合せしめて締付けることにより、各ブースタ２５，２
９の凸部２５Ｆ，２９Ｆが支持部材１９Ｒ，１９Ｌに強
靭にクランプされることになる。With the above configuration, the support members 19R, 19L
By screwing the male screw 39 of the tightening members 37R and 37L into the female screw 35 of the
The nine protrusions 25F, 29F are firmly clamped to the support members 19R, 19L.
【００２０】超音波発振器２２の超音波電気信号（パル
ス）が超音波振動子２３で機械振動に変換される。この
機械振動が図４、図５に示したようなリニア・ランプ・
バリアブル・ソフト・スタートで駆動せしめ、この機械
振動は、図３に示されているように、ブースタ２５を通
じて超音波ホーン２７およびもう一方のブースタ２９に
伝達される。The ultrasonic electric signal (pulse) of the ultrasonic oscillator 22 is converted into mechanical vibration by the ultrasonic vibrator 23. This mechanical vibration causes the linear ramp, as shown in Figs.
Driven by a variable soft start, this mechanical vibration is transmitted to the ultrasonic horn 27 and the other booster 29 through the booster 25 as shown in FIG.
【００２１】このブースタ２５、超音波ホーン２７およ
びブースタ２９に伝達される超音波の波長としては、超
音波ホーン２７の両端並びに中央で最大振動振幅点を有
すると共に応力が最小点となるように予め設定される。
また、ブースタ２５，２９の凸部２５Ｆ，２９Ｆでは振
動振幅のゼロ点（ノーダルポイントという）を有すると
共に応力が最大点となるように予め設定される。The wavelengths of the ultrasonic waves transmitted to the booster 25, the ultrasonic horn 27, and the booster 29 are such that the maximum vibration amplitude points are present at both ends and the center of the ultrasonic horn 27, and the stress becomes the minimum point in advance. Is set.
Further, the convex portions 25F and 29F of the boosters 25 and 29 have a zero point of vibration amplitude (referred to as a nodal point) and are set in advance so that the stress becomes the maximum point.
【００２２】このように超音波の波長を予め設定すると
共にブースタ２５，２９の凸部２５Ｆ，２９Ｆを支持部
材１９Ｒ，１９Ｌに機械的に強靭にクランプせしめるよ
うにした。この状態下において、受台５上に被接合部材
Ｗ1 ，Ｗ2 として例えば金属を載置せしめ、ブースタ２
５、超音波ホーン２７並びにブースタ２９に超音波振動
を図３において左右方向へ与えながら、加圧シリンダ７
を作動せしめてピストンロッド１１を下方へ伸ばすと、
支持フレーム１５、支持体１７および支持部材１９Ｒ，
１９Ｌを介してブースタ２５、超音波ホーン２７並びに
ブースタ２９が下方へ移動し、係合用チップ３１がまず
金属Ｗ2 に接触し、さらに下方へ移動して金属Ｗ2 ，Ｗ
1 に加圧が与えられる。As described above, the wavelength of the ultrasonic wave is set in advance, and the convex portions 25F, 29F of the boosters 25, 29 are mechanically and strongly clamped to the supporting members 19R, 19L. In this state, for example, metal is placed as the members W 1 and W 2 to be joined on the pedestal 5, and the booster 2
5, while applying ultrasonic vibration to the ultrasonic horn 27 and the booster 29 in the left-right direction in FIG.
And the piston rod 11 is extended downward,
Support frame 15, support 17 and support member 19R,
The booster 25, the ultrasonic horn 27, and the booster 29 move downward via 19L, and the engaging tip 31 first comes into contact with the metal W 2 and further moves downward to move the metal W 2 , W 2 .
Pressure is applied to 1 .
【００２３】すると、金属Ｗ1 と金属Ｗ2 の接触面の間
で、金属Ｗ1 ，Ｗ2 の表面を覆っている酸化膜が破壊さ
れ活性化した金属面が現われる。さらに摩擦による境界
での極部温度上昇が加わっているので、活性原子間の距
離が近づき金属接合が行われる。金属接合が行われた後
は、ピストンロッド１１を縮めると共に引っ張りバネ２
１のバネ力でブースタ２５、超音波ホーン２７並びにブ
ースタ２９が上昇して元の位置に戻されることになる。Then, between the contact surfaces of the metal W 1 and the metal W 2 , the oxide film covering the surfaces of the metals W 1 and W 2 is broken and an activated metal surface appears. Furthermore, since the temperature rise at the boundary at the boundary due to friction is added, the distance between the active atoms is reduced and metal bonding is performed. After metal joining is performed, the piston rod 11 is contracted and the tension spring 2
The spring force of 1 raises the booster 25, the ultrasonic horn 27, and the booster 29 to return them to their original positions.
【００２４】したがって、超音波ホーン２７の両端とブ
ースタ２５，２９との連結部を波長の最大振動振幅点、
最小応力点とすると共に支持部材１９Ｒ，１９Ｌに支持
されるブースタ２５，２９のフランジ２５Ｆ，２９Ｆを
波長の振動振幅のゼロ点（ノーダルポイント）、最大応
力点とすることにより、接合時に被接合部材Ｗ1 ，Ｗ2
と超音波ホーン２７の付着が従来よりも極力押さえられ
るから超音波ホーン２７の寿命が伸び、その上超音波の
エネルギーロスを極力低減せしめることができる。その
ため、ワンランク下のパワーの機種が使えるようにな
る。その上複雑な用途や大パワーの接合も実用化できる
ようになる。また接合のバラツキがなくなると共に不良
品の発生もなくなり、装置自体の信頼性が従来よりも向
上すると共に接合の利用範囲を広げることができる。Therefore, the connection between the both ends of the ultrasonic horn 27 and the boosters 25 and 29 is the maximum vibration amplitude point of the wavelength,
By setting the minimum stress point and setting the flanges 25F and 29F of the boosters 25 and 29 supported by the supporting members 19R and 19L to the zero point (nodal point) of the vibration amplitude of the wavelength and the maximum stress point, joining is performed at the time of joining. Members W 1 , W 2
Since the adhesion of the ultrasonic horn 27 is suppressed as much as possible, the life of the ultrasonic horn 27 is extended and the energy loss of ultrasonic waves can be reduced as much as possible. As a result, models with lower power levels can be used. In addition, complex applications and large power bonding can be put to practical use. Further, variations in joining are eliminated and defective products are not produced, so that the reliability of the apparatus itself is improved as compared with the conventional one and the range of utilization of joining can be expanded.
【００２５】本実施例における被接合部材Ｗ1 とＷ2 と
の接合は同種金属間だけでなく、異種金属間での接合も
可能である。特に銅やアルミなどの材料を接合するのに
適していると共に、アルミとセラミックスとの接合も可
能である。また、超音波振動子２３で電気信号を機械振
動に変換しているが、超音波振動子２３として電歪型Ｐ
ＺＴセラミックスを使用すると、変換効率を９５％以上
とすることができる。In the present embodiment, the members W 1 and W 2 can be joined not only between the same kind of metal but also between different kinds of metal. In particular, it is suitable for joining materials such as copper and aluminum, and is also capable of joining aluminum and ceramics. In addition, although the ultrasonic transducer 23 converts an electric signal into mechanical vibration, the ultrasonic transducer 23 is an electrostrictive type P.
If ZT ceramics are used, the conversion efficiency can be 95% or more.
【００２６】なお、この発明は、前述した実施例に限定
されることなく、適宜な変更を行うことにより、その他
の態様で実施し得るものである。The present invention is not limited to the above-described embodiments, but can be implemented in other modes by making appropriate changes.
【００２７】[0027]
【発明の効果】以上のごとき実施例より理解されるよう
に、この発明によれば、接合時に被接合部材と超音波ホ
ーンの付着が従来よりも極力抑えられるから超音波ホー
ンの寿命が伸び、その上超音波のエネルギーロスを極力
低減せしめることができる。そのため、ワンランク下の
パワーの機種が使えるようになる。その上複雑な用途や
大パワーの接合も実用化できるようになる。また、接合
のバラツキがなくなると共に不良品の発生もなくなり、
装置自体の信頼性を従来よりも向上せしめることができ
ると共に超音波接合の利用範囲を広げることができる。As will be understood from the above-described embodiments, according to the present invention, the adhesion of the member to be joined and the ultrasonic horn at the time of joining can be suppressed as much as possible, and the life of the ultrasonic horn is extended. Moreover, the energy loss of ultrasonic waves can be reduced as much as possible. As a result, models with lower power levels can be used. In addition, complex applications and large power bonding can be put to practical use. In addition, there will be no variation in joining and the occurrence of defective products will also disappear,
The reliability of the device itself can be improved more than before, and the range of application of ultrasonic bonding can be expanded.
【図１】この発明を実施する一実施例の超音波接合装置
の正面断面図である。FIG. 1 is a front sectional view of an ultrasonic bonding apparatus according to an embodiment of the present invention.
【図２】図１におけるＩＩ矢視部の拡大詳細図である。FIG. 2 is an enlarged detailed view of a portion indicated by an arrow II in FIG.
【図３】この発明の超音波の振動と超音波ホーン、ブー
スタとの関係を示した説明図である。FIG. 3 is an explanatory diagram showing the relationship between ultrasonic vibration of the present invention and an ultrasonic horn and a booster.
【図４】リニア・ランプ・バリアブル・ソフト・スター
トすることのできる超音波発振器における時間と振幅と
の関係を示した図である。FIG. 4 is a diagram showing a relationship between time and amplitude in an ultrasonic oscillator capable of linear ramp variable soft start.
【図５】リニア・ランプ・バリアブル・ソフト・スター
トすることのできる超音波発振器における時間とランニ
ングストレスとの関係を示した図である。FIG. 5 is a diagram showing a relationship between time and running stress in an ultrasonic oscillator capable of performing a linear ramp variable soft start.
【図６】従来の超音波発振器における時間と振幅との関
係を示した図である。FIG. 6 is a diagram showing a relationship between time and amplitude in a conventional ultrasonic oscillator.
【図７】従来の超音波発振器における時間とランニング
ストレスとの関係を示した図である。FIG. 7 is a diagram showing a relationship between time and running stress in a conventional ultrasonic oscillator.
１ 超音波接合装置 ５ 受台 ７ 加圧シリンダ（加圧手段） １９Ｒ，１９Ｌ 支持部材 ２１ 引っ張りバネ（弾機） ２２ 超音波発振器 ２３ 超音波振動子 ２５，２９ ブースタ ２５Ｆ，２９Ｆ 凸部 ２７ 超音波ホーン ３１ 係合用チップ Ｗ1 ，Ｗ2 被接合部材DESCRIPTION OF SYMBOLS 1 Ultrasonic joining device 5 Cradle 7 Pressurizing cylinder (pressurizing means) 19R, 19L Support member 21 Extension spring (ammo) 22 Ultrasonic oscillator 23 Ultrasonic vibrator 25,29 Booster 25F, 29F Convex part 27 Ultrasonic Horn 31 Engaging tip W 1 , W 2 Members to be joined
Claims (4)
くとも１波長の長さを有し振動時に縦方向運動の３つの
最大振幅点を有する超音波ホーンと、この超音波ホーン
の前記最大振幅点の１つに配置される被接合部材と係合
する係合用チップと、前記超音波ホーンの両端における
前記最大振幅点の他の２つの各々に連結されたブースタ
と、このブースタの一方に接続された超音波振動子と、
前記各ブースタにおけるノーダルポイントを機械的なク
ランプ手段でクランプされた支持部材と、この支持部材
と前記被接合部材を載置した受台とを相対的に移動せし
めて被接合部材に前記係合用チップを加圧せしめる加圧
手段と、を備えていることを特徴とする超音波接合装
置。1. An ultrasonic horn having a length of at least one wavelength at a predetermined frequency of ultrasonic waves and having three maximum amplitude points of longitudinal motion during vibration, and the maximum amplitude point of the ultrasonic horn. An engaging tip that engages with one member to be joined, a booster connected to each of the other two of the maximum amplitude points at both ends of the ultrasonic horn, and one of the boosters were connected. Ultrasonic transducer,
A supporting member whose nodal point in each booster is clamped by a mechanical clamping means and a pedestal on which the supporting member and the member to be joined are placed are relatively moved to engage the member to be joined. An ultrasonic bonding apparatus, comprising: a pressing unit that presses the chip.
スタートされることのできる超音波発振器が、前記超音
波振動子に接続されていることを特徴とする請求項１記
載の超音波接合装置。2. Linear lamp variable software
The ultrasonic bonding apparatus according to claim 1, wherein an ultrasonic oscillator that can be started is connected to the ultrasonic vibrator.
タにおけるノーダルポイントを中心にある巾で一体的に
形成された各凸部を、直接前記支持部材に締付部材で締
付けて強靭にクランプすべく構成されていることを特徴
とする請求項１記載の超音波接合装置。3. The mechanical clamp means strongly clamps each convex portion integrally formed with a width centered on a nodal point in each booster, directly to the support member with a clamping member. The ultrasonic bonding apparatus according to claim 1, wherein the ultrasonic bonding apparatus is configured to do so.
支持部材を移動して被接合部材に係合用チップを加圧せ
しめる加圧シリンダで構成されていることを特徴とする
請求項１記載の超音波接合装置。4. The pressurizing means is composed of a pressurizing cylinder that fixes the pedestal and moves the supporting member to press the engaging tip against the member to be joined. 1. The ultrasonic bonding apparatus according to 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6154707A JP2583398B2 (en) | 1994-07-06 | 1994-07-06 | Ultrasonic welding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6154707A JP2583398B2 (en) | 1994-07-06 | 1994-07-06 | Ultrasonic welding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0819877A true JPH0819877A (en) | 1996-01-23 |
| JP2583398B2 JP2583398B2 (en) | 1997-02-19 |
Family
ID=15590203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6154707A Expired - Fee Related JP2583398B2 (en) | 1994-07-06 | 1994-07-06 | Ultrasonic welding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2583398B2 (en) |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0957466A (en) * | 1995-08-22 | 1997-03-04 | Arutekusu:Kk | Ultrasonic bonding device and resonator |
| JPH11265915A (en) * | 1998-03-17 | 1999-09-28 | Matsushita Electric Ind Co Ltd | Bonding tool and bonding device for electronic components with bumps |
| JPH11307597A (en) * | 1998-04-20 | 1999-11-05 | Matsushita Electric Ind Co Ltd | Bonding tool and bonding device for electronic components |
| JPH11307583A (en) * | 1998-04-21 | 1999-11-05 | Matsushita Electric Ind Co Ltd | Bonding tool and bonding device for electronic components |
| JP2000070853A (en) * | 1998-08-31 | 2000-03-07 | Kyocera Corp | Ultrasonic transducer |
| JP2000077481A (en) * | 1998-09-02 | 2000-03-14 | Matsushita Electric Ind Co Ltd | Bonding tools and bonding equipment |
| JP2000093894A (en) * | 1999-10-15 | 2000-04-04 | Arutekusu:Kk | Supporting device for ultrasonic vibration resonator |
| JP2000228426A (en) * | 1999-02-09 | 2000-08-15 | Arutekusu:Kk | Ultrasonic vibration joining method |
| JP2001038291A (en) * | 1999-08-02 | 2001-02-13 | Arutekusu:Kk | Ultrasonic horn for ultrasonic vibration bonding |
| JP2001168142A (en) * | 1999-12-03 | 2001-06-22 | Arutekusu:Kk | Ultrasonic vibration bonding tool |
| JP2002329751A (en) * | 2002-04-30 | 2002-11-15 | Matsushita Electric Ind Co Ltd | Electronic component bonding tool |
| JP2002329752A (en) * | 2002-04-30 | 2002-11-15 | Matsushita Electric Ind Co Ltd | Electronic component bonding equipment |
| JP2002329750A (en) * | 2002-04-30 | 2002-11-15 | Matsushita Electric Ind Co Ltd | Electronic component bonding tool |
| JP2002359265A (en) * | 2002-04-30 | 2002-12-13 | Matsushita Electric Ind Co Ltd | Electronic component bonding tool |
| JP2003152035A (en) * | 2002-09-30 | 2003-05-23 | Matsushita Electric Ind Co Ltd | Electronic component bonding tool |
| JP2003188215A (en) * | 2002-09-30 | 2003-07-04 | Matsushita Electric Ind Co Ltd | Electronic component bonding tool |
| JP2004167492A (en) * | 2004-02-24 | 2004-06-17 | Kyocera Corp | Transducer for ultrasonic processing and processing equipment |
| JP2004330228A (en) * | 2003-05-06 | 2004-11-25 | Esb Kk | Ultrasonic welding equipment |
| WO2006074278A3 (en) * | 2005-01-05 | 2006-11-23 | Mitsunori Ono | Compositions for treating diabetes or obesity |
| JP2007253164A (en) * | 2006-03-20 | 2007-10-04 | Denso Corp | Ultrasonic bonding method, ultrasonic bonding apparatus and ultrasonic bonded pipe |
| US7854247B2 (en) | 2008-04-28 | 2010-12-21 | Ultex Corporation | Ultrasonic vibration bonding resonator |
| CN105832667A (en) * | 2016-04-29 | 2016-08-10 | 济南康和医药科技有限公司 | Olive oil containing long-chain fat emulsion injection and preparation method thereof |
| JP2018023997A (en) * | 2016-08-10 | 2018-02-15 | 日産自動車株式会社 | Ultrasonic bonding equipment |
| JP2020116641A (en) * | 2016-08-10 | 2020-08-06 | 株式会社エンビジョンＡｅｓｃジャパン | Ultrasonic bonding equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4626292B2 (en) * | 2004-12-17 | 2011-02-02 | 日本電気株式会社 | Ultrasonic horn and bonding device using the same |
| JP4311582B1 (en) | 2008-04-07 | 2009-08-12 | 株式会社アドウェルズ | Resonator support device |
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| JPS5423349A (en) * | 1977-07-22 | 1979-02-21 | Tokyo Electric Co Ltd | Display unit of meal-ticket selling system |
| JPS6490590A (en) * | 1987-10-01 | 1989-04-07 | Teruo Sannomiya | Connection of electronic component |
-
1994
- 1994-07-06 JP JP6154707A patent/JP2583398B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5423349A (en) * | 1977-07-22 | 1979-02-21 | Tokyo Electric Co Ltd | Display unit of meal-ticket selling system |
| JPS6490590A (en) * | 1987-10-01 | 1989-04-07 | Teruo Sannomiya | Connection of electronic component |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0957466A (en) * | 1995-08-22 | 1997-03-04 | Arutekusu:Kk | Ultrasonic bonding device and resonator |
| JPH11265915A (en) * | 1998-03-17 | 1999-09-28 | Matsushita Electric Ind Co Ltd | Bonding tool and bonding device for electronic components with bumps |
| JPH11307597A (en) * | 1998-04-20 | 1999-11-05 | Matsushita Electric Ind Co Ltd | Bonding tool and bonding device for electronic components |
| JPH11307583A (en) * | 1998-04-21 | 1999-11-05 | Matsushita Electric Ind Co Ltd | Bonding tool and bonding device for electronic components |
| JP2000070853A (en) * | 1998-08-31 | 2000-03-07 | Kyocera Corp | Ultrasonic transducer |
| JP2000077481A (en) * | 1998-09-02 | 2000-03-14 | Matsushita Electric Ind Co Ltd | Bonding tools and bonding equipment |
| JP2000228426A (en) * | 1999-02-09 | 2000-08-15 | Arutekusu:Kk | Ultrasonic vibration joining method |
| JP2001038291A (en) * | 1999-08-02 | 2001-02-13 | Arutekusu:Kk | Ultrasonic horn for ultrasonic vibration bonding |
| JP2000093894A (en) * | 1999-10-15 | 2000-04-04 | Arutekusu:Kk | Supporting device for ultrasonic vibration resonator |
| JP2001168142A (en) * | 1999-12-03 | 2001-06-22 | Arutekusu:Kk | Ultrasonic vibration bonding tool |
| JP2002329750A (en) * | 2002-04-30 | 2002-11-15 | Matsushita Electric Ind Co Ltd | Electronic component bonding tool |
| JP2002329752A (en) * | 2002-04-30 | 2002-11-15 | Matsushita Electric Ind Co Ltd | Electronic component bonding equipment |
| JP2002329751A (en) * | 2002-04-30 | 2002-11-15 | Matsushita Electric Ind Co Ltd | Electronic component bonding tool |
| JP2002359265A (en) * | 2002-04-30 | 2002-12-13 | Matsushita Electric Ind Co Ltd | Electronic component bonding tool |
| JP2003152035A (en) * | 2002-09-30 | 2003-05-23 | Matsushita Electric Ind Co Ltd | Electronic component bonding tool |
| JP2003188215A (en) * | 2002-09-30 | 2003-07-04 | Matsushita Electric Ind Co Ltd | Electronic component bonding tool |
| JP2004330228A (en) * | 2003-05-06 | 2004-11-25 | Esb Kk | Ultrasonic welding equipment |
| JP2004167492A (en) * | 2004-02-24 | 2004-06-17 | Kyocera Corp | Transducer for ultrasonic processing and processing equipment |
| WO2006074278A3 (en) * | 2005-01-05 | 2006-11-23 | Mitsunori Ono | Compositions for treating diabetes or obesity |
| JP2007253164A (en) * | 2006-03-20 | 2007-10-04 | Denso Corp | Ultrasonic bonding method, ultrasonic bonding apparatus and ultrasonic bonded pipe |
| US7854247B2 (en) | 2008-04-28 | 2010-12-21 | Ultex Corporation | Ultrasonic vibration bonding resonator |
| CN105832667A (en) * | 2016-04-29 | 2016-08-10 | 济南康和医药科技有限公司 | Olive oil containing long-chain fat emulsion injection and preparation method thereof |
| JP2018023997A (en) * | 2016-08-10 | 2018-02-15 | 日産自動車株式会社 | Ultrasonic bonding equipment |
| JP2020116641A (en) * | 2016-08-10 | 2020-08-06 | 株式会社エンビジョンＡｅｓｃジャパン | Ultrasonic bonding equipment |
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|---|---|
| JP2583398B2 (en) | 1997-02-19 |
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