JPH0819964A - Two-layer grinding wheel for drill polishing - Google Patents

Two-layer grinding wheel for drill polishing

Info

Publication number
JPH0819964A
JPH0819964A JP17475994A JP17475994A JPH0819964A JP H0819964 A JPH0819964 A JP H0819964A JP 17475994 A JP17475994 A JP 17475994A JP 17475994 A JP17475994 A JP 17475994A JP H0819964 A JPH0819964 A JP H0819964A
Authority
JP
Japan
Prior art keywords
layer
grinding wheel
drill
polishing
thinning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17475994A
Other languages
Japanese (ja)
Inventor
Masafumi Horikoshi
雅史 堀越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP17475994A priority Critical patent/JPH0819964A/en
Publication of JPH0819964A publication Critical patent/JPH0819964A/en
Pending legal-status Critical Current

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  • Polishing Bodies And Polishing Tools (AREA)

Abstract

(57)【要約】 【目的】 ドリル上面研摩の切れ味を悪くすることな
く、シンニング加工時の偏摩耗を極力抑えられるように
した、ドリル研摩用2層砥石ホイールを提供する。 【構成】 比較的軟質の上面研摩用砥石層の外周に、硬
質のシンニング加工用砥石層を設けたドリル研摩用2層
砥石ホイールを形成する。
(57) [Summary] [Purpose] To provide a two-layer grinding wheel for drill polishing, which can suppress uneven wear during thinning processing as much as possible without deteriorating the sharpness of the upper surface of the drill. [Structure] A two-layer grinding wheel for drill grinding is formed in which a hard grinding wheel layer for thinning is provided on the outer periphery of a relatively soft top grinding wheel layer.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ドリル研摩用の2層砥
石ホイールに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a two-layer grinding wheel for drill polishing.

【0002】[0002]

【従来の技術】従来のドリル研摩用砥石ホイールは、例
えば図5(イ) 、(ロ) に示すようにアルミ等金属製の円盤
状基台Aの外周部にリング状砥石Bが取り付けられたも
ので、これを電動工具(図略)に装着し回転させてドリ
ルを研摩するようになっている。この砥石ホイールは、
図6に示すようにドリルCの上面研摩Dのみならず、ド
リルの食い込みを良くするために図7に示すように先端
部にシンニング加工Eを遂行する。
2. Description of the Related Art In a conventional grinding wheel for drill polishing, a ring-shaped grinding wheel B is attached to the outer peripheral portion of a disk-shaped base A made of metal such as aluminum as shown in FIGS. 5 (a) and 5 (b). It is attached to an electric tool (not shown) and rotated to polish the drill. This wheel is
As shown in FIG. 6, not only the upper surface polishing D of the drill C but also a thinning process E is performed on the tip end portion as shown in FIG. 7 in order to improve the biting of the drill.

【0003】[0003]

【発明が解決しようとする課題】前記のような従来のド
リル研摩において、シンニング加工Eを行うと砥石Bの
外周角部B′に偏摩耗が発生する欠点がある。この欠点
を防止するために、砥石Bのレジンボンドを摩耗の少な
い硬質組成にすると、シンニング加工時の偏摩耗は減少
するものの、上面研摩Dの切れ味が悪くなり焼けが発生
することになる。従って、上面研摩を考慮して比較的軟
質組成のレジンボンド砥石を使用せざるを得なくなり、
連続使用時間が短縮し且つ砥石ホイールの交換頻度が高
くなってしまう。 そこで、本発明は、上面研摩の切れ
味を悪くすることなく、シンニング加工時の偏摩耗を極
力抑えられるようにした、ドリル研摩用2層砥石ホイー
ルを提供することを課題とする。
When the thinning process E is performed in the conventional drill polishing as described above, there is a disadvantage that uneven wear occurs at the outer peripheral corner B'of the grindstone B. In order to prevent this defect, if the resin bond of the grindstone B is made of a hard composition with less wear, uneven wear during thinning is reduced, but the sharpness of the upper surface polishing D becomes poor and burns occur. Therefore, in consideration of top surface polishing, there is no choice but to use a resin bond grindstone with a relatively soft composition,
The continuous use time is shortened and the wheel wheel replacement frequency is increased. Therefore, it is an object of the present invention to provide a two-layer grinding wheel for drill polishing, which can suppress uneven wear during thinning processing as much as possible without deteriorating the sharpness of the upper surface polishing.

【0004】[0004]

【課題を解決するための手段】この課題を技術的に解決
するための手段として、本発明は、比較的軟質の上面研
摩用砥石層の外周に、硬質のシンニング加工用砥石層を
設けたドリル研摩用2層砥石ホイールを要旨とする。
As a means for technically solving this problem, the present invention provides a drill in which a hard thinning grinding wheel layer is provided on the outer periphery of a relatively soft upper grinding wheel layer. The main point is a two-layer grinding wheel for polishing.

【0005】[0005]

【作 用】ドリルの上面研摩は比較的軟質の砥石層を用
いるので切れ味を悪くすることはなく、シンニング加工
は硬質の砥石層を用いるので偏摩耗を極力抑えることが
出来る。つまり、2層の砥石層を使い分けることにより
砥石の連続使用時間を延ばすと共に、砥石ホイールの交
換頻度を低くすることが出来る。
[Operation] Since the top surface of the drill uses a relatively soft grindstone layer, it does not deteriorate sharpness, and the thinning process uses a hard grindstone layer, so uneven wear can be suppressed as much as possible. That is, it is possible to extend the continuous use time of the grindstone by using the two grindstone layers properly and to reduce the frequency of exchanging the grindstone wheel.

【0006】[0006]

【実施例】以下、本発明の実施例を添付図面に基づいて
詳説する。図1及び図2において、1はアルミ等金属製
の円盤状基台であり、その外周部1aの上面に比較的軟
質の上面研摩用砥石層2が設けられ、その外縁部には硬
質のシンニング加工用砥石層3が設けられる。
Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In FIGS. 1 and 2, reference numeral 1 denotes a disk-shaped base made of metal such as aluminum, a relatively soft upper surface grinding wheel layer 2 is provided on the upper surface of an outer peripheral portion 1a, and a hard thinning is provided at an outer edge portion thereof. A processing grindstone layer 3 is provided.

【0007】前記上面研摩用砥石層2は、例えばメッシ
ュ200/230のダイヤ砥粒を含むフェノール系ボン
ドを用い、シンニング加工用砥石層3としてはメッシュ
200/230のダイヤ砥粒を含むポリイミド系ボンド
を用いる。図3は製造方法の一例を示すもので、前記円
盤状基台1の外周部1aの上面に接着剤(フェノール
系)を塗布して金型4に組み込み、上金型8をセット
し、キャビティにダイヤ砥粒を含むフェノール系ボンド
を充填した後パンチ5を入れて例えば温度150°C、
圧力500kg/cm2 、時間20分のホットプレスに
て上面研摩用砥石層2を成形する。この場合、上面研摩
用砥石層2の外周部に沿って段部2aが形成される。
The top surface grinding wheel layer 2 uses, for example, a phenolic bond containing mesh 200/230 diamond abrasive grains, and the thinning wheel layer 3 for thinning uses a polyimide bond containing mesh 200/230 diamond abrasive grains. To use. FIG. 3 shows an example of a manufacturing method. An adhesive (phenolic type) is applied to the upper surface of the outer peripheral portion 1a of the disk-shaped base 1 and incorporated into the mold 4, and the upper mold 8 is set to set the cavity. After the phenolic bond containing diamond abrasive grains is filled in the punch 5, the punch 5 is put in, for example, at a temperature of 150 ° C,
The grindstone layer 2 for upper surface polishing is formed by hot pressing at a pressure of 500 kg / cm 2 for 20 minutes. In this case, the step portion 2a is formed along the outer peripheral portion of the grindstone layer 2 for upper surface polishing.

【0008】リング状のシンニング加工用砥石層3は、
図4に示すように別の金型6のキャビティ内にダイヤ砥
粒を含むポリイミド系ボンドを充填し、パンチ7を入れ
て例えば温度260°C、圧力800kg/cm2 、時
間20分のホットプレスにより成形される。
The ring-shaped grinding stone layer 3 for thinning is
As shown in FIG. 4, a polyimide-based bond containing diamond abrasive grains is filled in the cavity of another mold 6, a punch 7 is put therein, and the temperature is 260 ° C., the pressure is 800 kg / cm 2 , and the hot press is for 20 minutes. Is molded by.

【0009】このリング状のシンニング加工用砥石層3
は、サンドブラストした後にエポキシ樹脂等の接着剤で
前記上面研摩用砥石層2の段部2aに嵌着固定する。接
着前のサンドブラストは接着強度を増加させるためであ
り、この際上面研摩用砥石層2の段部2aの方もサンド
ブラストすることが好ましい。接着後に、仕上げ加工し
てドリル研摩用2層砥石ホイールが完成する。尚、円盤
状基台1には、電動工具(図略)への取付用孔1bが複
数個形成されている。
The ring-shaped grindstone layer 3 for thinning processing
Is sandblasted and then fitted and fixed to the step portion 2a of the upper surface grinding wheel layer 2 with an adhesive such as an epoxy resin. The sandblasting before bonding is for increasing the bonding strength, and at this time, it is preferable that the step portion 2a of the grinding wheel layer 2 for upper surface polishing is also sandblasted. After the adhesion, finish processing is performed to complete a two-layer grinding wheel for drill polishing. The disc-shaped base 1 is provided with a plurality of holes 1b for attachment to an electric tool (not shown).

【0010】このようにして形成された本発明に係るド
リル研摩用2層砥石ホイールは、従来と同様に電動工具
に装着してドリルを研摩するが、前記のようなドリルの
上面研摩Dは、比較的軟質の上面研摩用砥石層2を用い
て切れ味良く遂行することが出来、シンニング加工Eは
硬質のシンニング加工用砥石層3を用いて偏摩耗を極力
防止することが出来る。尚、実施例においては好ましい
構成を記載したがこれに限られるものではなく、上面研
摩用砥石層2は比較的消耗し易く、シンニング加工用砥
石層3は比較的消耗し難い構成であれば良い。例えば砥
粒のメッシュや集中度を変えることによって、又はレジ
ンボンドとメタルボンド、若しくはレジンボンドとビト
リファイドボンドの組み合わせ等によっても本発明の目
的を達成することが出来る。
The two-layer grindstone wheel for drill grinding according to the present invention thus formed is mounted on an electric power tool to grind a drill as in the conventional case. The relatively soft top grinding wheel layer 2 can be used to perform sharply, and the thinning E can prevent uneven wear as much as possible by using the hard thinning wheel layer 3. It should be noted that the preferred configuration is described in the embodiment, but the configuration is not limited to this, and the upper surface grinding wheel layer 2 is relatively easy to wear and the thinning wheel layer 3 is relatively hard to wear. . For example, the object of the present invention can be achieved by changing the mesh or concentration of abrasive grains, or by combining resin bond and metal bond, or resin bond and vitrified bond.

【0011】[0011]

【発明の効果】以上説明したように、本発明によれば、
ドリル研摩用ホイールにおいて比較的軟質の上面研摩用
砥石層の外周に、硬質のシンニング加工用砥石層を設け
たので、上面研摩の切れ味を悪くすることなく、シンニ
ング加工時の偏摩耗を極力防止することが出来る。従っ
て、砥石ホイールの連続使用時間を従来のものより4倍
以上も延ばし、且つ砥石ホイールの交換頻度を低下させ
る等の優れた効果を奏する。
As described above, according to the present invention,
In the wheel for drill polishing, a hard grinding wheel layer was provided around the relatively soft top grinding wheel layer, so uneven wear during thinning processing was prevented as much as possible without deteriorating the sharpness of top grinding. You can Therefore, it is possible to prolong the continuous use time of the grindstone wheel four times or more as compared with the conventional one and to reduce the frequency of exchanging the grindstone wheel.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明に係るドリル研摩用2層砥石ホイール
の平面図である。
FIG. 1 is a plan view of a two-layer grinding wheel for drill polishing according to the present invention.

【図2】 図1のX−X線断面図である。FIG. 2 is a sectional view taken along line XX of FIG.

【図3】 上面研摩用砥石層の成形状態を示す説明図で
ある。
FIG. 3 is an explanatory view showing a molding state of a grindstone layer for polishing an upper surface.

【図4】 シンニング加工用砥石層の成形状態を示す説
明図である。
FIG. 4 is an explanatory view showing a molding state of a grinding stone layer for thinning processing.

【図5】 従来のドリル研摩用砥石ホイールを示すもの
で、(イ) は半平面図、(ロ) は側面図である。
FIG. 5 shows a conventional grinding wheel for drill polishing, (a) being a semi-plan view and (b) being a side view.

【図6】 ドリルの表面研摩要領を示す説明図である。FIG. 6 is an explanatory diagram showing a surface polishing procedure of a drill.

【図7】 (イ) はシンニング加工要領を示す説明図、
(ロ) はドリルの先端シンニング加工を示す説明図であ
る。
[FIG. 7] (a) is an explanatory view showing the thinning processing procedure,
(B) is an explanatory view showing a tip thinning process of a drill.

【符号の説明】[Explanation of symbols]

1…円盤状基台 1a…外周部 1b…取付用孔
2…上面研摩用砥石層 3…シンニング加工用砥石
層 4…金型 5…パンチ 6…金型 7…パンチ 8…上金型
1 ... Disc-shaped base 1a ... Outer peripheral portion 1b ... Mounting hole
2 ... Grinding stone layer for upper surface polishing 3 ... Grinding stone layer for thinning processing 4 ... Mold 5 ... Punch 6 ... Mold 7 ... Punch 8 ... Upper mold

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 比較的軟質の上面研摩用砥石層の外周
に、硬質のシンニング加工用砥石層を設けたことを特徴
とするドリル研摩用2層砥石ホイール。
1. A two-layer grinding wheel for drill polishing, wherein a hard grinding wheel layer for thinning is provided on the outer periphery of a relatively soft grinding wheel layer for upper surface polishing.
JP17475994A 1994-07-04 1994-07-04 Two-layer grinding wheel for drill polishing Pending JPH0819964A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17475994A JPH0819964A (en) 1994-07-04 1994-07-04 Two-layer grinding wheel for drill polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17475994A JPH0819964A (en) 1994-07-04 1994-07-04 Two-layer grinding wheel for drill polishing

Publications (1)

Publication Number Publication Date
JPH0819964A true JPH0819964A (en) 1996-01-23

Family

ID=15984184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17475994A Pending JPH0819964A (en) 1994-07-04 1994-07-04 Two-layer grinding wheel for drill polishing

Country Status (1)

Country Link
JP (1) JPH0819964A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006255821A (en) * 2005-03-16 2006-09-28 Toyoda Van Moppes Ltd Wheel manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006255821A (en) * 2005-03-16 2006-09-28 Toyoda Van Moppes Ltd Wheel manufacturing method

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