JPH08201466A - Inspection apparatus for ic socket - Google Patents

Abstract

PURPOSE: To detect the deformation at the tip of a contact pin easily in an IC socket being employed for the electrical characteristic test of an IC. CONSTITUTION: A board 3 fixed to a base 4 is arranged with electrodes 6 having width determined while taking account of the allowable deformation dimensions of contact pin. A pair of electrodes facing the contact pins 5 of an IC socket 18 are connected electrically and when all pins of in the socket are set in a same state, a closed circuit is formed and a current can be fed. If the contact pin 5 is deformed even at one point, the closed circuit is not formed and since no current is fed the deformation of the contact pin 5 in IC socket can not be detected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for inspecting an IC socket, and more particularly to a flat package type semiconductor integrated circuit (IC) provided with a large number of leads by contacting the contact pins with each other. The present invention relates to a device for inspecting the contact pin portion of a test IC socket used when performing an operation test.

As a flat package type of IC, S is
There are OP (Small Outline Package), QFP (Quad Flat Package), and the like.

[0003]

2. Description of the Related Art An IC, which has been packaged into a final product form, is tested as a single IC to see if it has the desired operation function at the final stage of the semiconductor manufacturing process or at the shipping stage. There is a need to.

At this time, an IC socket for testing is used. Since the test socket electrically connects the leads of the IC and the predetermined wiring of the printed wiring board,
It is fixed on this printed wiring board and is electrically connected to the tester from the printed wiring board via a connector. From the tester, a power supply voltage, a test pattern, etc. are applied to the IC, and an output pattern obtained from this IC is compared with an expected value pattern prepared in the tester to determine whether it is good or bad. When the judgment is completed, this IC is taken out, a new IC is newly mounted, and each lead is electrically connected to the contact pin of the test socket. The above operation is repeated many times.

As described above, it has been found that the test IC socket in which the IC is repeatedly attached and detached has its own problems as described below.

[0006]

The test IC socket as described above is different from the product IC socket used when it is incorporated into the final device, and is electrically and mechanically capable of withstanding repeated use as much as possible. However, due to fatigue phenomenon due to repeated stress, wear and deformation of the contact part, contact failure around the part that contacts the IC lead, contact outside the predetermined position, Accidents such as short-circuiting between pins and dropping of pins increase with the number of times the IC is tested. However, it is difficult to accurately predict when this accident will occur. Therefore, even if the IC is a good product, the IC socket may be defective and
Was sometimes determined as a defective product.

Although it is conceivable to discard all the test IC sockets that have been used a predetermined number of times, the service life of the IC socket varies greatly depending on the usage conditions such as the speed of attachment and detachment of the IC. There is a loss of even discarding it.

In addition, it is common for the number of leads of recent ICs to count 64, and it is not uncommon to count 100. The lead pitch of such an IC is 1.0 mm or less. Therefore, even if the pitch of the contact pins contacting the leads is deformed in the order of 100 μm, normal electrical contact can no longer be obtained. Moreover, there is a problem that such minute deformation cannot be immediately identified by the inner eye.

A technique related to the means for solving the above-mentioned various problems is strongly cited, and it is disclosed in JP-A-3-15877.
There is No. 2 publication. Referring to the publication, the IC socket to be inspected is a so-called product IC socket for "mounting electronic components such as IC elements", and is a lower end portion of the contact pin, that is, a connection portion with the substrate. It is an inspection device that checks breakage of the "legs" and height variations.

Such an IC socket is not a test IC socket to be tested according to the present invention, and a means for checking the deformation of the upper end portion of the contact pin, that is, the contact portion with the lead of the IC, which is a problem, is provided. It turned out that I didn't have any.

In view of the above knowledge and various problems, the present invention has the following problems. (1) A deformation or the like centering on a portion of the contact pin that comes into contact with the IC lead should be easily identified. (2) Immediately discover contact pins where normal electrical connection is no longer possible. (3) To prevent an accident such as a defective IC being determined as a defective IC. (4) It should be possible to easily detect even a slight deformation of the contact pin. (5) To improve the operational reliability of the test apparatus including the IC socket so that the good / bad judgment of the IC itself can be accurately judged. (6) Make it possible to check the IC socket as needed. (7) Even if the size of each part of the lead group such as the number of leads or the pitch of the IC is changed, it is possible to respond immediately. (8) The test equipment should be small in size and portable. (9) Three-dimensional deformation (pitch direction, a direction crossing the pitch direction, and a vertical direction) of the lead contact end of the contact pin of a predetermined value or more can be detected. (10) If even one of a large number of contact pins has a deformation defect, this IC socket can be determined to be defective.

[0012]

According to the structure of the present invention, electrodes are respectively brought into contact with the contact surfaces of an IC socket in which a large number of contact pins having contact surfaces respectively contacting the leads of a semiconductor integrated circuit device are arranged. In an IC socket inspection device for identifying whether or not the contact surface is within a predetermined position at various positions, the electrodes include a pair of electrodes,
Identification means for providing the pair of electrodes at spaced positions so as to be electrically connected to each other when the contact surface is interposed, a series connection circuit of the electrodes, and detecting a conduction state of the series connection circuit Is provided.

Particularly, the wiring board provided with the pair of electrodes is
A guide pin of the IC socket is inserted into the wiring board provided separately from the wiring board having the identification means and electrically connected to each other by a connector. A pair of alignment holes are provided, and in particular, an elastic member is provided so that the wiring board retracts when a pushing force of a predetermined value or more is applied to the lower surface of the wiring board having the pair of electrodes. Is provided.

Further, according to the present invention, it is particularly characterized in that it has an alarm means for a worker and a work stop signal output means.

In addition, a groove is formed between the pair of electrodes on the wiring board having the pair of electrodes.

Further, the IC socket to be inspected is particularly characterized in that it also serves as a flat package type IC.

[0017]

FIG. 1 shows an embodiment of the present invention.
The inspection apparatus 19 of this embodiment is shown in a sectional view and is set on the IC socket 18 to be inspected.

This IC socket 18 has 13
Books, 13 on the left and right, 19 on the left in the direction perpendicular to the page
Book, 19 contact pins are arranged on the right side in the direction perpendicular to the paper surface, and each of them is the third contact pin 1
The first contact pin 11 ', the fourth contact pin 11', the first contact pin 5, and the second contact pin 5'correspond to each array.
The first and second contact pins 5 and 5'have a symmetrical structure, and the third and fourth contact pins 11 and 11 'are provided.
Also have a symmetrical structure. The arrangement shape of all the contact pins is a plane upper shape, and a flat package type IC having a lead facing each of a total of 64 contact pins is not shown at the time of the test, but the inspection device 1
The holding plate 14 is rotated 90 degrees counterclockwise about the shaft 15 and is fixed by the stopper 17 in the position 9. At this time, the IC is aligned with the pair of guide pins 3 on the right side of the surface of the IC socket 18.
9 The pair of guide pins 39 is used by the inspection device 19
It is also used when positioning. The lower end of each contact pin is inserted into a contact hole of a printed wiring board or the like, or electrically connected to a test apparatus via a connector. The upper end of each contact pin is a portion to be brought into contact with the lead of the IC. First contact pin 5
When viewed from the side, there is a plate-shaped pin base 12, and this portion is necessary for fixing to the main body of the IC socket 18. The pin base 12 extends downward in a needle shape to form a lower end portion, that is, a leg portion. The pin base 12 extends upward, bends leftward, and further bends upward to form an upper end portion 13 having a contact surface with a lead. The upper part 13 is the main problem of the present invention described above. Such a bent portion is necessary to give the contact surface elasticity. The contact pin with such a shape
The spacers 54 are arranged at a predetermined pitch, and the spacers 54 are interposed therebetween. However, the spacers 14 having a sufficient thickness are provided so as not to hinder the upward movement of the upper end portion 13, the lateral movement, and the like. There is. Third and fourth contact pins 11 ', 11 in an arrangement crossing the arrangement of the first contact pins 5
Is provided with a pin having a common shape such that the upper end portion 13 is located inward, so that the pin base 12 of the contact pin 5 is prevented from colliding with each other.

The inspection device 19 of this embodiment for the IC socket 18 as described above has two printed wiring boards, which are the first board 3'and the second board 3, built in the base 4 and has an upper surface. Is provided with a handle 9 for gripping and pressing with one hand of an operator.

On the lower main surface of the second substrate 3, the electrodes 6 facing the upper end portions 13 of the 64 contact pins are provided.
Is further formed, and wiring for connecting these electrodes 6 to each other in series is formed, and is electrically connected to the first substrate 3'through a connector (not shown).

The first and second substrates 3'and 3 are provided with a lid 1 on the left side.
6 can be removed and each can be attached and detached. On the upper surface of the first substrate 3 ', a resistor 1 required as an inspection circuit
0, the battery 7, the light emitting diode 8 and the like are connected and wired. Various types of the second substrate 3 are prepared according to different types such as the number of contact pins of the IC socket 18 and the pitch arrangement shape. That is, a substrate that is compatible with the flat package type of the IC to be tested is mounted without the lid 16. To the right of this board 3,
The pin hole through which the guide pin 39 penetrates is opened, so that the contact pin and the electrode 6 are accurately aligned and contact with each other.

As a display LED, a light emitting diode 8 on the upper surface of the first substrate 3'is provided, and an opening is formed in the base 4 so as to be visible from the outside. The base 4 and the first substrate 3 ′ are formed with a pin hole with a margin so as to avoid the guide pin 39.
The pin hole for aligning with is opened in the second substrate 3.

Referring to the plan view of FIG. 2 showing the lower surface of the second substrate 3 shown in FIG. 1, the substrate 3 has a rectangular shape with a partial cutout 46, and along the insertion direction 50, the base 3 is formed. A connector (not shown) 41 mounted inside the base 4
And the lands 42, 43 and the like are electrically connected to each other. A pair of electrodes 5 corresponding to one contact pin
1, 52 are prepared. That is, the electrode 6 is composed of a pair of electrodes 51 and 52. Such a pair of electrodes 51, 5
All are connected in series with 2 as one electrode, and the ends thereof are wired to the lands 42 and 43. A pair of pin holes 40, 40 'are opened at the ends, and guide pins 39 are inserted and aligned. Notch 46 prevents reverse insertion.

Referring to the plan view of FIG. 3 showing the pair of electrodes 51 and 52 shown in FIG. 2, the dimension of the exposed surface of the electrode 51 is 0.2 mm to 0 in consideration of the positional deviation allowance b. 0.4 mm, d is 1.0 mm to 1.5 mm, and the distance a between the pair of electrodes 51 and 52 is 0.1 mm to 1.0 mm. A part of the electrodes 51 and 52 and the wiring are formed on the resist film 3
It is covered with 0, 30 ', and is a part that does not require electrical connection. In particular, the distance a is more preferably 0.1 mm to 0.2 mm in order to comply with various shapes of the upper end portion 13. A large number of such electrodes 51 and 52 are arranged in the arrangement direction 32.

Referring to the sectional view of FIG. 4 showing the upper end 13 of the contact pin of the IC socket 18 which contacts the electrodes 51, 52 of FIG. 3, this upper end 13 has a radius of 0.4 mm.
It has a semicircular shape with a thickness of 0.5 mm.

As the number of times of use increases, the semi-circular shape of the upper end portion 13 may be deformed, may be displaced in one of the left and right directions 33, or may be bent in the arrangement direction 32. There is. When the deviation in the left-right direction 33 increases, the upper surface of the upper end portion 13 that short-circuited the pair of electrodes 51 and 52 becomes open, and the electrodes 51 and 52 are electrically disconnected. Since such electrodes are connected in series, if they become non-conductive at only one place, they will be detected by the inspection circuit described later.

The upper end portion 13, which is bent in the direction of the arrangement direction 32 by a predetermined value or more, is disconnected from the electrodes 51 and 52, and the series circuit is also rendered non-conductive. Even if the semicircumferential surface of the upper end portion 13 is damaged, it becomes non-conductive as well. Of the deviations in the upward direction 34 of the upper end portion 13, the deviations in the downward direction are related to the electrode 5
1, 52 immediately become non-conductive and conductive in the upward displacement, but the substrate 3 is pushed up and the neighboring electrodes become non-conductive, and detection is also possible.

Even if the deformation, displacement, damage, etc. in the three-dimensional directions as described above are combined, the non-conduction state similarly occurs, and the defect of the contact pin can be detected with extremely high accuracy.

Referring to the plan view of FIG. 5 showing the lower surface of the second substrate 3'with the circuit for detecting the defective state shown in FIGS. 3 and 4, the lands 42 'and 43' are the lands of FIG. Four
2 and 43 are electrically connected by a connector (not shown), and a resistor 10, a light emitting diode 8 and a battery 7 are connected in series between the lands 42 'and 43'. If it becomes non-conductive,
The light emitting diode 8 illuminates, and when normal, electricity flows through this circuit and the light emitting diode 8 illuminates. The resistor 10 is necessary to prevent overcurrent during conduction.

The second substrate 3 has been described as being fixed to the base 4, but in addition to this, when the pressing force exceeds 1000 g, the base 4 moves upward by about 1.0 mm, and It is more preferable to insert an elastic member such as a coil spring. This is also necessary to make it easier to detect the upward displacement of the upper end portion 13 in FIG. The lower surface of the second substrate 3 is in contact with the upper surface 35 of the IC socket 18 so that the second substrate 3 does not contact at a deeper position.

Further, although the light emitting diode 8 is used, a buzzer may be used as an alarm means in addition to this, and a work stop signal output for stopping the automatic manufacturing apparatus may be provided, or these may be used together. May be.

For example, if a defective contact pin is detected, this IC socket is discarded and replaced with a new IC socket, so that the test is suspended.

Although the handle 9 is provided in the above embodiment, this is premised on manual operation. In addition to this, in the case of automatic operation, the base 4 is fixed to the tip of the handling. . In an automated process, this inspection device
You may flow in the process common to IC to be inspected. In this case, for every 100 or 1,000 ICs,
This inspection device is interposed. In this case, the external dimensions of the inspection device are preferably close to the IC shape.

Further, when it is desired to specify and detect the position of the defective pin among the contact pins within a predetermined range, a plurality of the above-mentioned detection circuits are prepared.

The IC socket 18 to be inspected is shown as having the pressing plate 14 and the stopper 17, but the IC socket 18 is not limited to such a structure, and may be an automatic handling means. Well, the case of 64 pins is shown, but since the second substrate 3 is prepared according to various numbers of contact pins, pitches, arrangement shapes, etc., any flat package type IC may be used. Versatility is secured.

Although contact pins corresponding to the electrode arrangement as shown in FIG. 2 are arranged, some contact pins are removed because some contact pins are unnecessary. When inspecting such an IC socket, it is sufficient to prepare the substrate 3 in which the electrodes 51 and 52 corresponding to the removed contact pins are short-circuited in advance.

The series wiring of the electrodes 51 and 52 in FIG. 2 has a zigzag pattern, but it is sufficient if the series connection is required, and through holes 60 and 60 'are formed as shown in FIG. It may be a series connection in which the left and right through holes are connected to each other.

Upper end 1 of the contact pin to be inspected
The shape of 3 is not limited to a semicircle, but may be a hemisphere, a parabola, an ellipse, or the like, in short, as long as the contact surface has a convex curve. It is more preferable to prepare the substrate 2 shown in FIG. 7 in order to prepare for the wide convex shape of the contact surface. This substrate 2 corresponds to the substrate 3 of FIG. 4, and is between 0.1 m to 0.
A groove 1 having a depth of 5 m is formed, and a pair of electrodes 5 is formed in a state where the uppermost end of the upper end portion 13 ′ enters the groove 1.
Short circuit occurs between 1 and 52. The groove 1 is formed by laser processing, grinding processing with a grinder, or the like.

A pair of electrodes that come into contact with the upper end of the contact pin are provided, and if a current flows through a circuit formed by connecting them in series, it is judged as good. If even one contact pin is defective, the current will not flow. However, the inspection method for determining this is not limited to the flat package type IC socket, and can be widely applied to general ICs.

[0040]

As described above, according to the present invention, a pair of electrodes corresponding to the contact surface are provided, a series connection circuit for simultaneous electrode provision is provided, and identification means for detecting the conduction state of this circuit is provided. Therefore, it is possible to identify the three-dimensional deformation of the contact pin and the like, to quickly detect the defect of the IC socket, and it is found that the yield of the IC is actually improved by 0.3% or more. Is 20 at a time
The effect of shortening by about a minute was obtained, and all the above-mentioned problems were achieved.

[Brief description of drawings]

FIG. 1 is a side view showing a usage state of an embodiment of the present invention.

FIG. 2 is a plan view showing a lower surface of a second substrate which constitutes an embodiment.

FIG. 3 is a plan view showing an enlarged main part of a second substrate.

FIG. 4 is a cross-sectional view showing a contact state between a second substrate and a contact pin.

FIG. 5 is a plan view showing a lower surface of a first substrate which constitutes an embodiment.

FIG. 6 is a plan view showing another wiring example of the second substrate.

FIG. 7 is a cross-sectional view showing a contact state between a second substrate and a contact pin having another shape.

[Explanation of symbols]

 1 Groove 2,3,3 'Substrate 4 Base 5.5', 11,11 'Contact Pin 6,51,52 Electrode 7 Battery 8 Light Emitting Diode 9 Handle 10 Resistor 12 Pin Base 13,13' Upper End 14 Holding Plate 15 Shaft 16 Lid 17 Stopper 18 IC socket 19 Detector 30, 30 'Resist film 32 Arrangement direction 33 Horizontal direction 34 Vertical direction 35 Top surface 39 Guide pin 41 Connector 42, 42', 43, 43 'Land 40, 40', 45 pin Hole 46 Notch 50 Insertion direction 60, 60 'Through hole

Claims (7)

[Claims] 1. An IC socket, in which a large number of contact pins each having a contact surface for contacting a lead of a semiconductor integrated circuit device are arranged, is placed at a position at which an electrode abuts on the contact surface, and the contact surface is predetermined. In the inspection device for an IC socket for identifying whether or not the position is within the position, the pair of electrodes are provided, and the pair of electrodes are electrically connected to each other when the contact surface is interposed. Is provided, a series connection circuit of the electrodes is provided, and identification means for detecting the conduction state of the series connection circuit is provided. 2. The wiring board having the pair of electrodes is provided separately from the wiring board having the identifying means, and is electrically connected to each other by a connector.
C socket inspection device. 3. The wiring board provided with the pair of electrodes,
The IC socket inspection device according to claim 2, wherein a pair of alignment holes into which the guide pins of the IC socket are inserted are provided. 4. The IC socket according to claim 2, wherein an elastic member is provided on the lower surface of the wiring board having the pair of electrodes so that the wiring board retracts when a pushing force of a predetermined value or more is applied. Inspection equipment. 5. The inspection device for an IC socket according to claim 1, wherein the identification means has an alarm means for a worker and a work stop signal output means. 6. The I according to claim 2, wherein a groove is formed between the pair of electrodes on a wiring board having the pair of electrodes.
C socket inspection device. 7. The IC socket inspection device according to claim 1, wherein the IC socket to be inspected has a contact pin for testing a flat package type semiconductor integrated circuit device.