JPH08201839A - Liquid crystal panel structure and its manufacture and inspection method - Google Patents

Abstract

(57) [Abstract] [Purpose] The panel lighting test can be performed easily and at low cost without using a special connection device or lighting device, and the connection part can be formed with conductive particles having different particle sizes. A stable connection can be obtained with multiple points. In a structure of a liquid crystal panel comprising a flexible plastic film panel substrate, a plastic film which covers a transparent transparent electrode formed on the plastic film panel substrate of the liquid crystal panel and opposes the plastic film panel substrate. The counter substrate is fixed on the plastic film panel substrate with a sealing material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal panel structure, a method of manufacturing the same, and a method of inspecting the liquid crystal panel structure. More specifically, the present invention can be applied to a connection technique for electric circuit components (wiring boards), It can be applied to the connection technology with the external circuit of the display, and in particular, the panel lighting inspection can be performed easily and at low cost without using a special connecting device or lighting device. The present invention relates to a liquid crystal panel structure capable of obtaining a stable connection by using multiple conductive particles having different connection points, a manufacturing method thereof, and a liquid crystal panel structure inspection method.

[0002]

2. Description of the Related Art Conventionally, a method of interconnecting electrode terminals, in which conductive particles are selectively arranged on electrode terminals having an adhesive layer formed thereon, for interconnection, is disclosed in, for example, JP-A-3-28907.
There is one reported in Japanese Patent Publication No. 0. In this conventional method of interconnecting electrode terminals, the electrode terminals of the first electric circuit substrate and the electrode terminals of the second electric circuit substrate are electrically connected to each other through conductive particles and held by an adhesive. In the method of interconnecting fixed electrode terminals, an adhesive is formed on the electrode terminals of at least one of the electric circuit substrates protruding from the substrate surface, and conductive particles are attached to the adhesive, and then the first electric circuit substrate is formed. And the second electric circuit substrate are configured to be pressure-contacted and connected with each other by using an insulating adhesive.

Therefore, after the adhesive is attached to the protruding electrode terminals of the electric circuit substrate, the conductive particles are attached, and the other electric circuit substrate is electrically connected by using the insulating adhesive. This has the advantage that the electrode terminals arranged in high density can be connected while maintaining the electrical insulation of the adjacent electrode terminals. Next, a conventional probing device for mechanically and electrically connecting via a conductive particle on a termination pad of a probing substrate corresponding to a fine pitch has been reported in, for example, Japanese Patent Application Laid-Open No. 5-224228. There is.

In this conventional probing device, the contact pad formed in a layout corresponding to the inspection terminal of the circuit board and having the conductive particles disposed thereon and the termination pad for connecting the inspection circuit of the circuit board are drawn out. A probing substrate connected by wires is provided, and the probing substrate is configured to be mechanically and electrically connected to the circuit substrate via the conductive particles on the contact pads.

Therefore, even when the terminals are formed with a fine pitch, it is possible to prevent electrical connection between the contact pads, and the conductive particles serve as a cushioning material, so that probing is performed. There is an advantage that the inspection of the circuit board can be easily achieved without causing a probing mistake due to a poor connection between the board and the circuit board.

[0006]

However, in the conventional liquid crystal panel lighting inspection, the above-mentioned Japanese Patent Laid-Open No. 22422/1993 is used.
Is it due to the probing reported in Publication No. 8?
Since the method uses a conductive connector, any special connection device or lighting device must be used, which is costly and it is difficult to easily perform a lighting test on the panel.

Next, in the method of arranging the conductive particles reported in the above-mentioned Japanese Patent Laid-Open No. 3-289070, since the conductive particles are not fixed, the conductive particles can be arranged on the electrode, but probing is possible. However, there is a problem that it cannot be used as a bump for use and conductive particles having different particle diameters cannot be arranged at desired positions, making it difficult to obtain a stable connection.

Therefore, according to the present invention, the lighting inspection of the panel can be performed easily and at low cost without using a special connecting device or a lighting device, and the connecting portion is formed by the conductive particles having different particle diameters. It is an object of the present invention to provide a liquid crystal panel structure capable of obtaining stable connection at multiple points, a manufacturing method thereof, and a liquid crystal panel structure inspection method.

[0009]

According to the first aspect of the present invention,
In a structure of a liquid crystal panel composed of a flexible plastic film panel substrate, a plastic film counter substrate which covers the lead-out transparent electrode formed on the plastic film panel substrate of the liquid crystal panel and which opposes the plastic film panel substrate is provided. It is characterized by being fixed on the plastic film panel substrate by a sealing material.

According to a second aspect of the present invention, in the above-mentioned first aspect of the invention, up to the back surface of the plastic film panel substrate corresponding to the region where the connection portion of the lead-out transparent electrode is formed, the polarizing plate and the reflection plate are formed. At least one of them is formed by being extended. The invention according to claim 3 is the above-mentioned claim 1,
In the invention described in 2, between the connection portion of the extraction transparent electrode and the sealing material, and between the plastic film panel substrate and the plastic film counter substrate,
A panel protection seal portion for protecting the plastic film panel substrate from the plastic film counter substrate is provided.

A fourth aspect of the present invention is characterized in that, in the first to third aspects of the present invention, panel protection seal portions are provided at both ends of the area where the transparent transparent electrode is formed. Is. A fifth aspect of the present invention is characterized in that, in the third and fourth aspects of the invention, the Young's modulus of the panel protection seal portion is higher than that of the seal material.

A sixth aspect of the present invention is characterized in that, in the first to fifth aspects of the invention, bumps are provided on the lead-out transparent electrode. The invention according to claim 7 is the invention according to claim 6, wherein the bumps are made of conductive particles. The invention according to claim 8 is the invention according to claim 7, characterized in that the conductive particles have a solderable structure.

According to a ninth aspect of the present invention, in the above-described eighth aspect, the solderable structure is made of resin particles whose surfaces are metal-plated. According to a tenth aspect of the present invention, in a method for manufacturing a liquid crystal panel structure comprising a flexible plastic film panel substrate, a transparent transparent electrode formed on the plastic film panel substrate of the liquid crystal panel is covered, and the plastic film. It is characterized by including a step of fixing a plastic film counter substrate facing the substrate on the plastic film panel substrate with a sealing material.

The invention according to claim 11 is the above-mentioned claim 10.
In the invention described above, a step of printing a conductive paste only on the lead-out transparent electrode, a step of arranging conductive particles in accordance with the pitch of the lead-out transparent electrode, and then a step of arranging the arranged conductive particles After aligning the conductive particles so that they are on the transparent electrode, the conductive particles are pressed against the conductive paste, and the conductive paste is cured to fix the conductive particles to the conductive paste. The pre-treatment step of the plastic film panel substrate before the fixing step of claim 10 is performed.

The invention according to claim 12 is the above-mentioned claim 10.
In the invention described above, a step of printing and curing a conductive paste only on the extraction transparent electrode, a step of printing cream solder on the cured conductive paste, and then a conductive particle is extracted and transparent. The step of arranging according to the pitch of the electrodes, and then aligning the arranged conductive particles so as to come out on the transparent electrode, and then pressing the conductive particles onto the cream solder to form the conductive paste. 11. The plastic film panel substrate before the fixing step according to claim 10, wherein a step of bringing the conductive film into contact with the conductive paste is performed by melting the cream solder and then fixing the conductive particles in contact with the conductive paste. It is characterized in that it is carried out as a pretreatment step.

The invention according to claim 13 is the above-mentioned claim 10.
In the invention described above, a step of applying an insulating adhesive on the lead-out transparent electrode, a step of arranging conductive particles according to the pitch of the lead-out transparent electrode, and a step of arranging the arranged conductive particles. After aligning the conductive particles so that they are on the transparent electrode, the conductive particles are pressed against the insulating adhesive to bring them into contact with the transparent electrode, and then the insulating adhesive is cured to thereby The step of fixing the conductive particles in contact with the drawn transparent electrode is performed as a pretreatment step of the plastic film panel substrate before the fixing step of claim 10.

According to a fourteenth aspect of the present invention, in the above seventeenth to nineteenth aspects, large-diameter conductive particles are arranged at a position near the end face of the plastic film panel substrate of the lead-out transparent electrode, and It is characterized in that conductive particles having a small particle size are arranged at a position close to the seal portion. According to a fifteenth aspect of the present invention, in the invention according to the seventh to ninth and fourteenth aspects, the row of the conductive particles is arranged such that the particle diameters of the central portion of the connecting portion and the central portion of both end portions are larger. It is characterized by that.

The invention according to claim 16 is the above-mentioned claim 11.
In the inventions described in (a) to (13), metal masks having openings with different hole diameters on the same extraction transparent electrode are superposed on the array plate, and then large particles arranged in the largest openings are inserted on the metal mask. To arrange the particles, and then to insert and arrange the conductive particles having a smaller particle diameter than in the previous step into the opening having a diameter smaller than the maximum opening diameter, by repeating the particle diameter order on the array plate. The alignment is performed after the conductive particles are arranged.

According to a seventeenth aspect of the present invention, in the invention according to any one of the first to ninth, fourteenth and fifteenth aspects, an external circuit connector is provided so as to electrically connect the electrode of the external circuit connector to the lead-out transparent electrode. It is characterized in that it is inserted between the plastic film panel substrate and the plastic film counter substrate. Claim 18
The invention described in the above is a method for inspecting a liquid crystal panel structure according to any one of claims 1 to 9, 14 and 15, wherein a panel lighting inspection connector is provided between the plastic film panel substrate and the plastic film counter substrate. It is characterized in that the presence or absence of panel lighting is inspected by inserting an electrode so as to be electrically connected to the lead-out transparent electrode.

[0020]

According to the first aspect of the present invention, the plastic film counter substrate which covers the lead-out transparent electrode formed on the plastic film panel substrate of the liquid crystal panel and which opposes the plastic film panel substrate is sealed on the plastic film panel substrate. It is configured to be fixed by a material.

Therefore, by utilizing the flexibility of the plastic film substrate, it is possible to pressurize the transparent electrode of the liquid crystal panel and the connector electrode from the external circuit to bring them into contact with each other to obtain conduction. It can be performed easily and at low cost without using a special connecting device or a lighting device. According to the second aspect of the invention, at least one of the polarizing plate and the reflecting plate is formed so as to extend up to the back surface of the plastic film panel substrate corresponding to the region where the connection portion of the lead-out transparent electrode is formed. Configure.

For this reason, since at least one of the polarizing plate and the reflecting plate is formed so as to extend to the back surface of the plastic film panel substrate, the rigidity of the entire substrate should be made higher than in the case of only the plastic film panel substrate. Therefore, when the connector is inserted, the pressure applied to the conductive particles can be increased and a stable connection can be obtained.

According to the third aspect of the invention, a panel for protecting the plastic film panel substrate from the plastic film counter substrate between the connecting portion of the drawn transparent electrode and the sealing material and between the plastic film panel substrate and the plastic film counter substrate. It is configured such that a protective seal portion is provided. Therefore, by providing the panel protection seal part so as to join the upper and lower substrates between the connection part of the lead-out transparent electrode and the seal material, a connector such as an FPC is attached to the liquid crystal panel as compared with the case where the panel protection seal part is not provided. Since the tensile stress applied to the sealing material when the is inserted can be reduced, peeling of the sealing material from the upper and lower substrates can be suppressed.

According to the fourth aspect of the present invention, the panel protective seal portions are provided at both ends of the area where the transparent transparent electrode is formed. Therefore, by adhering the upper and lower substrates at both ends of the row of conductive particles arranged on the extraction transparent electrode with the panel protection seal part, the pressure applied to contact the conductive particles is stronger than in the case where the panel protection seal part is not provided. And a stable connection can be obtained.

According to the fifth aspect of the invention, the Young's modulus of the panel protection seal portion is higher than that of the seal material. Therefore, by setting the Young's modulus of the panel protection seal part higher than that of the seal material, the tensile stress from the upper and lower substrates can be absorbed on the panel protection seal part side, so even when the connector is inserted in the liquid crystal panel It is possible to reduce the tensile stress from the upper and lower substrates, reduce the elongation of the sealing material, and prevent the liquid crystal panel from being broken.

According to the sixth aspect of the invention, the bumps are provided on the lead-out transparent electrode. For this reason,
Since the bump is formed on the lead-out transparent electrode, the contact area between the lead-out transparent electrode and the connector electrode can be increased, and the resistance can be reduced and a stable connection can be obtained.

According to the seventh aspect of the invention, the bump is made of conductive particles. Therefore, the bumps can be formed more easily than in the case where a complicated process such as plating or etching is performed. In the invention described in claim 8, the conductive particles are configured to have a structure capable of being soldered.

Therefore, by making the conductive particles solderable, the conductive particles can be reliably drawn out and fixed on the transparent electrode by soldering, so that the connection resistance can be reduced and the reliability can be improved. Can be obtained. Next, the transparent electrode on the plastic substrate is brittle and cracks easily occur. In particular, when the pitch becomes fine and the width of the electrode terminal becomes narrow, the occurrence of cracks leads to disconnection and opening of the terminal, which is not preferable. Therefore, in the invention according to claim 9, the structure capable of being soldered is constituted so that the surface thereof is made of resin particles plated with metal.

For this reason, since the metal-plated resin particles can be deformed when pressed, cracks can be made less likely to occur as compared with metal particles made of a metal, so that the terminals can be opened efficiently. It can be well prevented. According to a tenth aspect of the present invention, a step of fixing a lead-out transparent electrode formed on the plastic film substrate of the liquid crystal panel and fixing a plastic film counter substrate opposing the plastic film substrate on the plastic film panel substrate with a sealing material. To include.

Therefore, the flexibility of the plastic film substrate can be used to pressurize the transparent electrodes of the liquid crystal panel and the connector electrodes from the external circuit to bring them into contact with each other to obtain electrical continuity. It can be performed easily and at low cost without using a special connecting device or a lighting device. In the invention according to claim 11, a step of printing the conductive paste only on the lead-out transparent electrode, a step of arranging the conductive particles according to the pitch of the lead-out transparent electrodes, and a step of drawing out the arranged conductive particles and making them transparent. The step of fixing the conductive particles to the conductive paste by pressing the conductive particles against the conductive paste after aligning the conductive particles so that they are on the electrodes, and fixing the conductive particles to the conductive paste. It is configured to be performed as a pretreatment process of the plastic film panel substrate before the process.

Therefore, since the conductive particles can be fixed to the conductive paste printed on the extraction transparent electrode, the conductive particles can be fixed to the conductive paste corresponding to various conductive particles without selecting the kind of the conductive particles. can do. According to the invention of claim 12, a step of printing and curing the conductive paste only on the extraction transparent electrode, and then,
A step of printing cream solder on the cured conductive paste, a step of arranging the conductive particles so as to match the pitch of the transparent electrodes, and a step of arranging the arranged conductive particles so that they are on the transparent electrode. After performing the adjustment, a step of pressing the conductive particles against the cream solder to bring them into contact with the conductive paste, and then a step of melting the cream solder to fix the conductive particles in contact with the conductive paste. It is configured to be performed as a pretreatment process of the plastic film panel substrate before the fixing process of claim 10.

Therefore, even if the conductive transparent particles cannot be fixed by soldering with cream solder while the conductive particles are in contact with the lead transparent electrode, the conductive paste is used as an intermediate layer between the lead transparent electrode and the cream solder layer. Therefore, it is possible to fix the conductive paste printed and hardened on the lead-out transparent electrode by soldering with cream solder in a state where the conductive particles are in contact with each other. Therefore, it is also possible to deal with a lead-out transparent electrode that cannot normally be soldered.

According to a thirteenth aspect of the present invention, a step of applying an insulating adhesive on the lead-out transparent electrode, a step of arranging the conductive particles in accordance with the pitch of the lead-out transparent electrodes, and then a arranged conductive particle. After aligning so as to come out on the transparent electrode, pressing the conductive particles against the insulating adhesive to bring it into contact with the transparent electrode, and then by curing the insulating adhesive,
The step of fixing the conductive particles in a state where the conductive particles are extracted and in contact with the transparent electrode is performed as a pretreatment step of the plastic film panel substrate before the fixing step of claim 10.

Therefore, since the conductive particles can be fixed to the lead-out transparent electrode in contact with the insulating adhesive, it is easier to fix the conductive particles to the lead-out transparent electrode through a printing process. It can be performed at low cost. According to the invention of claim 14, large-diameter conductive particles are arranged near the end surface of the plastic film panel substrate of the transparent electrode, and small-sized conductive particles are arranged near the seal portion. To be configured.

Therefore, by placing large-diameter conductive particles near the end surface of the plastic film panel substrate and placing small-sized conductive particles near the seal portion, the plastic film panel Since the particle size can be changed to follow the bending of the substrate,
The conductive particles and the connector electrode can be brought into contact with each other at multiple points, and the contact area can be increased to achieve stable and low resistance connection.

In the fifteenth aspect of the present invention, the conductive particles are arranged such that the particle diameters of the central portion of the connecting portion and the central portion of the both end portions are larger. Therefore, by arranging a row of conductive particles having a larger particle diameter at the central portion and both end portions of the connecting portion, the particle diameter can be changed so as to follow the bending of the plastic film panel substrate. Therefore, the conductive particles and the connector electrode can be brought into contact with each other at multiple points, and the contact area can be increased to achieve stable and low resistance connection.

In the sixteenth aspect of the present invention, a metal mask having openings with different hole diameters on the same extraction transparent electrode is superposed on the array plate, and then large particles are arranged on the metal mask at the maximum opening. To arrange the particles, and then to insert and arrange the conductive particles having a smaller particle diameter than the previous step into the opening having a diameter smaller than the maximum opening diameter, by repeating the particle diameter order on the array plate. After arranging the conductive particles, the alignment is performed.

For this reason, the conductive particles can be arranged on the array plate in the order of the particle size by using the metal mask in which the openings are appropriately formed in the order of the particle size. Therefore, it is possible to easily arrange the conductive particles having different particle sizes. You can According to a seventeenth aspect of the invention, the external circuit connector is inserted between the plastic film panel substrate and the plastic film counter substrate so that the electrode of the external circuit connector is drawn out and electrically connected to the transparent electrode. To do.

Therefore, the electrodes of the external circuit connector can be electrically connected to the lead-out transparent electrodes of the liquid crystal panel without tedious alignment, so that the external circuit connector can be easily inserted into the liquid crystal panel. Can be connected. According to the eighteenth aspect of the present invention, the panel lighting inspection connector is inserted between the plastic film panel substrate and the plastic film counter substrate so that the electrode of the panel lighting inspection connector is drawn out and electrically connected to the transparent electrode. It is configured to inspect for lighting.

Therefore, the panel lighting inspection connector can be inserted into the liquid crystal panel and the respective electrodes can be electrically connected without performing troublesome alignment and without using a pressurizing device. The lighting inspection of the liquid crystal panel can be performed at low cost.

[0041]

Embodiments of the present invention will be described below with reference to the drawings. (Embodiment 1) FIG. 1 is a diagram showing a liquid crystal panel structure of an embodiment according to the present invention. In this embodiment, first, PC, PE
The adhesive 10 which is an ultraviolet curable insulating adhesive is dispensed on the plastic film panel substrate 1 on which the extraction transparent electrode 2 (ITO) of S, PET or the like is patterned, and the thickness of the adhesive is set to 5 to 8 μm by a spinner. . It is necessary that this thickness be smaller than the particle diameter of the conductive particles 8 and that a part of the conductive particles 8 be exposed from the adhesive 10 layer after transfer / fixing.

The conductive particles 8 are arranged by providing a silicon resin layer on the glass substrate to a thickness of about 10 to 12 μm and closely contacting a metal mask. When the silicon resin layer is thinner than this, the conductive particles 8 move on the silicon resin layer when the metal mask is released, and when the silicon resin layer is thick, the adhesion to the metal mask is strong, and the conductive particles 8 are generated by the impact of releasing the metal mask. 8 moves. An opening is provided in the metal mask. For example, an opening of about 50 ± 1 μm is opened in the particle group in which the conductive particles 8 are classified to a particle size of about 40 ± 2 μm.

As a result, only one conductive particle 8 will enter one opening. In addition, even when the particle diameter is changed, the diameter of the opening is also changed so that only one particle is arranged. A group of particles having the largest particle size is placed on a metal mask, and the conductive particles 8 are moved by a squeegee or the like to be put into the largest opening. Next, the conductive particles 8 having a small particle size are similarly put into the corresponding openings. This is performed in the same manner with particles having a small particle diameter in the same manner at the opening, and after all the particles have entered, the metal mask is released. The particles are arranged on the silicone resin.

The conductive particles 8 are composed of resin spheres plated with metal (Ni /
Au) is preferable. Examples include Sekisui Fine Chemical's trade name; Micropearl. The thickness of the metal mask may be about the largest particle size of the conductive particles. Large conductive particles 8 and small conductive particles 8
If the difference in particle size is large, a plurality of small particles will enter one opening.

Next, the lead-out transparent electrode 2 of the plastic film panel substrate 1 coated with the adhesive 10 and the conductive particles 8 are aligned and irradiated with ultraviolet rays while being pressed to be cured. Pressure is about 2-4g per particle
f. The adhesive 10 has an integrated light amount of 1000 mJ / cm.
^Use one that completely cures at ² . The adhesive 10 is, for example, manufactured by Kyoritsu Kagaku Co., Ltd. under the trade name of World Rock.

Thereafter, the panel protection seal portion 9 is also provided and placed at the time of liquid crystal seal printing. The panel protection seal part 9 is manufactured by Toho Kasei Co., Ltd., and the trade name is Hi-Lock. After the printing, the panel is manufactured similarly to the conventional panel. Then, the lighting inspection after completion of the panel is performed by inserting the connector 5 from the external electric circuit into the place where the insertion openings of the panel substrates 1 and 3 are widened without performing alignment, and by simply closing the electrical connection. Perform lighting inspection. Even after the lighting inspection, the connector 5 is removed only by expanding the insertion port.

After the lighting inspection, the insertion opening is widened, the above-mentioned ultraviolet curable adhesive 10 is applied thereto, and the connector 5 is inserted again without alignment. Then, ultraviolet irradiation is performed to cure the adhesive 10. At that time, if further pressurization is required, it is performed. Thus, the present embodiment (claims 1, 1)
In 0), the plastic film counter substrate 3 that covers the lead-out transparent electrode 2 formed on the plastic film panel substrate 1 of the liquid crystal panel and faces the plastic film panel substrate 1 is a sealing material on the plastic film panel substrate 1. It is configured to be fixed by 4.

Therefore, the plastic film substrate 1,
3 can be used to pressurize and bring the transparent electrode 2 of the liquid crystal panel and the connector electrode 6 of the connector 5 from the external circuit into contact with each other to obtain continuity, so that a special connection for the lighting inspection of the liquid crystal panel is possible. It can be performed easily and at low cost without using a device or a lighting device. In this embodiment (claim 17), the external circuit connector 5 is inserted between the plastic film panel substrate 1 and the plastic film counter substrate 3 so that the electrode of the external circuit connector 5 is drawn out and electrically connected to the transparent electrode 2. It is configured to be.

For this reason, the connector electrode 6 of the external circuit connector 5 can be electrically connected to the lead-out transparent electrode 2 of the liquid crystal panel without tedious alignment, so that the external circuit connector 5 is attached to the liquid crystal panel. It can be easily inserted and connected to a liquid crystal panel. In this embodiment (claim 18), the panel lighting inspection connector 5 is drawn between the plastic film panel substrate 1 and the plastic film counter substrate 3, and the connector electrode 6 of the panel lighting inspection connector 5 is drawn out and electrically connected to the transparent electrode 2. The panel is inspected for the presence or absence of lighting of the panel by inserting as described above.

Therefore, the panel lighting inspection connector 5 can be inserted into the liquid crystal panel and the electrodes 2 and 6 can be electrically connected without tedious alignment and without using a pressurizing device. Therefore, the lighting inspection of the liquid crystal panel can be performed easily and at low cost. Next, in the present embodiment (claim 2), the polarizing plate 7 is formed so as to extend to the back surface of the plastic film panel substrate 1 corresponding to the region where the connecting portion of the lead-out transparent electrode 2 is formed. To do. In FIG. 1, a polarizing plate 7 is formed on the back surface of the plastic film counter substrate 3.

Therefore, since the polarizing plate 7 is formed to extend to the back surface of the plastic film panel substrate 1, the rigidity of the entire substrate 1 can be made higher than that of the case where only the plastic film panel substrate 1 is used, and the connector is It is possible to increase the pressure applied to the conductive particles 8 when 5 is inserted to obtain a stable connection. In the above embodiment,
The case where the polarizing plate 7 is formed by being extended to the rear surface of the plastic film panel substrate 1 at the connection portion of the lead-out transparent electrode 2 has been described, but the present invention is not limited to this, and the present invention (claim In 2), for example, the polarizing plate 7 and the reflection plate may be extended and formed, or only the reflection plate may be extended and formed.

Next, in this embodiment (Claim 3), the plastic film panel substrate is provided between the connecting portion of the lead-out transparent electrode 2 and the sealing material 4, and between the plastic film panel substrate 1 and the plastic film counter substrate 3. 1
A panel protection seal portion 9 for protecting the plastic film counter substrate 3 is provided. Therefore, by providing the panel protection seal part so as to join the upper and lower substrates 1 and 3 between the connection part of the lead-out transparent electrode 2 and the seal material 4, the liquid crystal is more protected than when the panel protection seal part 9 is not provided. When a connector such as an FPC is inserted in the panel, the tensile stress applied to the seal material 4 can be absorbed and reduced by the panel protection seal portion 9, so that peeling of the seal material 4 from the upper and lower substrates 1 and 3 is suppressed. be able to.

The panel protection seal portion 9 may be formed, for example, by printing simultaneously with the seal printing of the seal material 4. As described above, the panel protection seal portion 9 may be formed between the connection portion of the lead-out transparent electrode 2 and the seal material 4, but the present invention is not limited to this, and the present invention (claims) In 4), as shown in FIGS. 2 to 4, not only is it formed between the connecting portion of the lead-out transparent electrode 2 and the sealing material 4, but also panel protection is performed at both ends of the region where the lead-out transparent electrode 2 is formed. The seal portion 9 may be provided.

In this case, the upper and lower substrates 1 and 3 at both ends of the row of the conductive particles 8 arranged on the lead-out transparent electrode 2 are adhered to each other by the panel protection seal portion 9, so that the panel protection seal portion 9 is not provided. Therefore, it is possible to increase the pressure applied to the conductive particles 8 to obtain a stable connection. Figure 2
~ In Fig. 4, the connecting portion of the transparent electrode 2 and the sealing material 4
Although the case of arranging not only the space but also both ends of the region where the transparent transparent electrode 2 is formed is shown, the panel protection seal portion 9 may be arranged on either one.

In the present invention (Claim 5), the Young's modulus of the panel protection seal portion 9 is preferably higher than that of the seal material 4. In this case, by making the Young's modulus of the panel protection seal portion 9 higher than that of the seal material 4, the tensile stress from the upper and lower substrates 1 and 3 can be absorbed on the panel protection seal portion 9 side, so that the connector 5 is attached to the liquid crystal panel. Even when the is inserted, it is possible to reduce the tensile stress applied to the sealing material 4 from the upper and lower substrates 1 and 3,
The expansion of the sealing material 4 can be reduced to prevent the liquid crystal panel from being broken.

Next, when the connector is inserted, as shown in FIG. 3, on the panel side, the central portion opens larger than both end portions, so that the particle size of the conductive particles 8 is on the front side of the insertion port and on the electrode terminal row. When the center is larger and the inner side of the insertion port is smaller and the end of the row of the electrode terminals 8 is smaller, mechanically strong contact can be obtained against bending of the panel substrate. In order to obtain a reliable electrical connection, it is preferable to arrange the conductive particles 8 as shown in FIG.

As described above, in the present invention (Claim 14), the large-diameter conductive particles 8 are arranged at a position near the end surface of the plastic film panel substrate 1 of the lead-out transparent electrode 2 and the seal portion is provided. It is preferable that the conductive particles 8 having a small particle size are arranged in the vicinity thereof. In this case, the large-diameter conductive particles 8 are arranged near the end face of the plastic film panel substrate 1, and the small-sized conductive particles 8 are arranged near the seal portion. Panel board 1
Since the particle diameter can be changed so as to follow the bending of the connector, the conductive particles 8 and the connector electrode 6 can be brought into contact with each other at multiple points, and the contact area can be increased to achieve stable low resistance connection. .

In the present invention (claim 15),
It is preferable that the central portion and the both end portions of the connecting portion are arranged such that rows of the conductive particles 8 having a larger central portion are arranged. In this case, at the central part and both ends of the connecting part, by arranging rows of conductive particles 8 having a larger central part, the particle size is changed so as to follow the bending of the plastic film panel substrate 1. Because you can
The conductive particles 8 and the connector electrode 6 can be brought into contact with each other at multiple points, and the contact area can be increased to achieve stable low resistance connection.

Here, a method of arranging the conductive particles 8 having different particle diameters (claim 16) will be described with reference to FIGS. First, an opening 2 having a hole diameter in which one conductive particle 8 having a desired particle diameter is inserted.
The metal mask 21 provided with 1 is brought into close contact with the array substrate 23 such as a silicon resin (FIG. 5). Next, the conductive particles 8 having a large particle diameter are sequentially inserted into the opening portion 21 (FIGS. 6 and 7). Then, after all the conductive particles 8 have been put in, the metal mask 22 and the silicon resin array substrate 23 are separated, so that the conductive particles 8 are arrayed on the silicon resin array substrate 23 (FIG. 8). At this time, the conductive particles 8 are arranged in the same arrangement as the openings 21 of the metal mask 22 due to the tackiness of the silicon resin arrangement substrate 23.

Therefore, since the conductive particles 8 can be arranged on the array substrate 23 in the order of the particle size by using the metal mask 22 in which the openings 21 are appropriately formed in the order of the particle size, the conductive particles having different particle sizes can be easily obtained. 8 can be arranged. next,
In this embodiment (claim 6), as shown in FIG. 1, a bump made of conductive particles 8 is provided on the lead-out transparent electrode 2.

For this reason, since the lead-out transparent electrode 2 is composed of the bumps made of the conductive particles 8, the contact area between the lead-out transparent electrode 2 and the connector electrode 6 can be increased, and the resistance can be lowered and stable. You can get a connection. In the present embodiment (claim 7), since the bumps are made of the conductive particles 8, the bumps can be formed more easily than in the case where a troublesome process such as plating or etching is performed. Next, in this embodiment, as shown in FIGS. 1 and 9, the conductive particles 8 are drawn out and fixed to the transparent electrode 2 with the adhesive 10, but the present invention is not limited to this. Instead, in the present invention (claim 8), as shown in FIG. 10, the conductive particles 8 may be configured to be solderable, and in this case, the conductive particles 8 can be soldered. With this structure, the conductive particles 8 can be reliably drawn out and fixed on the transparent electrode 2 by soldering, so that the connection resistance can be reduced and the reliability can be increased.

In this embodiment (claim 13), as shown in FIGS. 1 and 9, an insulating adhesive 10 such as an ultraviolet curable material is applied onto the transparent electrode 2 for drawing so as to have a particle diameter smaller than that of the conductive particles 8. Are arranged in accordance with the pitch of the transparent electrodes 2, and then the arranged conductive particles 8 are drawn out.
After the alignment is performed so as to come to the top, the conductive particles 8 are pressed against the insulating adhesive 10 to be brought into contact with the transparent electrode 2, and then the insulating adhesive 10 is cured to pull out the conductive particles 8. A series of steps of fixing the transparent electrode 2 in contact with the transparent electrode 2 is performed as a pretreatment step of the plastic film panel substrate 1 before the fixing step of the plastic film panel substrate 1 and the plastic film counter substrate 3. .

Therefore, since the conductive particles 8 can be fixed to the lead-out transparent electrode 2 in contact with the insulating adhesive, the conductive particles 8 can be fixed to the lead-out transparent electrode 2 through a printing process. More easily and at lower cost. On the other hand, FIG. 10 shows a case where the conductive particles 8 are brought into contact with the conductive paste 11 transferred onto the lead-out transparent electrode 2 and fixed by the cream solder 12. Hereinafter, the manufacturing method will be described.

In FIG. 10 (claim 12), the conductive paste 11 is printed and cured only on the lead-out transparent electrode 2, then the cream solder 12 is printed on the cured conductive paste 11, and then the conductive paste 11 is electrically conductive. The particles 8 are drawn out and aligned according to the pitch of the transparent electrode 2, and then the aligned conductive particles 8 are drawn out and aligned so that they are on the transparent electrode 2. Of the conductive particles 8 is brought into contact with the conductive paste 11, and then the cream solder 12 is heated and melted to fix the conductive particles 8 in a state of being in contact with the conductive paste 11.

Therefore, even if the conductive transparent particles 2 cannot be soldered and fixed by the cream solder 12 with the conductive particles 8 in contact with the conductive transparent paste 2, the conductive paste 11
Since it is an intermediate layer between the transparent electrode 2 and the cream solder 12 layer, the conductive paste 8 printed and cured on the transparent electrode 2 is soldered with the cream solder 12 in a state of being in contact with the conductive particles 8. Can be fixed. Therefore, it is possible to deal with the lead-out transparent electrode 2 that cannot normally be soldered.

The method of fixing the conductive particles 8 here is specifically as follows. The conductive paste 11 is printed and cured on the patterned plastic film panel substrate 1 at the locations where the conductive particles 8 are arranged. Conductive paste 1
1 is manufactured by Asahi Chemical Research Institute; copper paste and the like can be mentioned. The curing is performed at a temperature lower than the softening point of the substrate 1. After that, the solder paste 12 is printed on the conductive paste 11 layer.

The cream solder consists of low temperature solder,
It melts at about 90 ° C. For example, Bi-based solder manufactured by Nippon Superior Co., Ltd. may be used. After the aligned conductive particles 8 and the drawn transparent electrode 2 are aligned, they are heated and connected at a melting temperature while being pressurized. In the present invention (claim 11), as shown in FIG. 11, the conductive paste 11 is printed only on the extraction transparent electrode 2, and then,
The conductive particles 8 are drawn out and aligned according to the pitch of the transparent electrodes 2, and then the aligned conductive particles 8 are drawn out and aligned so as to come to the transparent electrode 2,
Is pressed against the conductive paste 11, and the conductive paste 1
A series of steps of fixing the conductive particles 8 to the conductive paste 11 by curing 1 is performed as a pretreatment step of the plastic film panel substrate 1 before the fixing step of the plastic film panel substrate 1 and the plastic film counter substrate 3. It may be configured as follows.

In this case, since the conductive particles 8 can be fixed to the conductive paste 11 printed on the lead-out transparent electrode 2, it is possible to correspond to various conductive particles 8 without selecting the kind of the conductive particles 8. It can be fixed to the conductive paste 11. In the present invention (Claim 9), the solderable structure may be composed of resin particles whose surfaces are metal-plated. In this case, since the metal-plated resin particles can be deformed when pressed, cracks are less likely to occur as compared with metal particles made of metal or the like. Therefore, it is possible to efficiently prevent the terminal from opening.

[0069]

According to the present invention, the panel lighting inspection can be performed easily and at low cost without using a special connecting device or lighting device, and the connection can be made by using conductive particles having different particle sizes. There is an effect that it is possible to obtain a stable connection by using multiple parts.

[Brief description of drawings]

FIG. 1 is a diagram showing a liquid crystal panel structure of an embodiment according to the present invention.

FIG. 2 is a diagram showing an arrangement example of a panel protection seal portion and conductive particles applicable to the present invention.

FIG. 3 is a diagram showing an arrangement example of a panel protection seal part and conductive particles applicable to the present invention.

FIG. 4 is a diagram showing an arrangement example of a panel protection seal portion and conductive particles applicable to the present invention.

FIG. 5 is a diagram showing a method of arranging conductive particles having different particle diameters.

FIG. 6 is a diagram showing a method of arranging conductive particles having different particle diameters.

FIG. 7 is a diagram showing a method of arranging conductive particles having different particle diameters.

FIG. 8 is a diagram showing a method of arranging conductive particles having different particle diameters.

9 is a diagram showing a method of fixing conductive particles to the extraction transparent electrode shown in FIG.

FIG. 10 is a diagram showing a method of fixing the conductive particles to the extraction transparent electrode applicable to the present invention.

FIG. 11 is a diagram showing a method of fixing conductive particles to a lead-out transparent electrode applicable to the present invention.

[Explanation of symbols]

 1 Plastic Film Panel Substrate 2 Transparent Transparent Electrode 3 Plastic Film Counter Substrate 4 Sealing Material 5 Connector 6 Connector Electrode 7 Polarizing Plate 8 Conductive Particle 9 Panel Protective Sealing Part 10 Adhesive 11 Conductive Paste 12 Cream Solder 21 Opening 22 Metal Mask 23 Array board

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Satoshi Kuwazaki 1-3-6 Nakamagome, Ota-ku, Tokyo Inside Ricoh Co., Ltd.

Claims (18)

[Claims] 1. A structure of a liquid crystal panel comprising a flexible plastic film panel substrate, which covers a transparent transparent electrode formed on the plastic film panel substrate of the liquid crystal panel and opposes the plastic film panel substrate. A liquid crystal panel structure comprising a plastic film counter substrate fixed on the plastic film panel substrate with a sealing material. 2. At least one of a polarizing plate and a reflecting plate is formed so as to extend up to the rear surface of the plastic film panel substrate corresponding to the region where the connection portion of the lead-out transparent electrode is formed. The liquid crystal panel structure according to claim 1, which is characterized in that. 3. A panel for protecting the plastic film panel substrate from the plastic film counter substrate between the connection portion of the lead-out transparent electrode and the sealing material and between the plastic film panel substrate and the plastic film counter substrate. The liquid crystal panel structure according to claim 1, further comprising a protective seal portion. 4. The liquid crystal panel structure according to claim 1, wherein panel protection seal portions are provided at both ends of the area where the transparent transparent electrode is formed. 5. The liquid crystal panel structure according to claim 3, wherein Young's modulus of the panel protection seal portion is higher than that of the seal material. 6. The liquid crystal panel structure according to claim 1, wherein bumps are provided on the lead-out transparent electrode. 7. The liquid crystal panel structure according to claim 6, wherein the bumps are made of conductive particles. 8. The liquid crystal panel structure according to claim 7, wherein the conductive particles have a solderable structure. 9. The liquid crystal panel structure according to claim 8, wherein the solderable structure is composed of resin particles whose surfaces are plated with metal. 10. A method of manufacturing a liquid crystal panel structure comprising a flexible plastic film panel substrate, covering a lead-out transparent electrode formed on the plastic film panel substrate of the liquid crystal panel, and opposing the plastic film substrate. Plastic film counter substrate,
A liquid crystal panel structure comprising a step of fixing the plastic film panel substrate with a sealing material. 11. A step of printing a conductive paste only on the lead-out transparent electrode, a step of arranging conductive particles in accordance with the pitch of the lead-out transparent electrode, and a step of arranging the arranged conductive particles. After aligning the conductive particles so that they are on the transparent electrode, the conductive particles are pressed against the conductive paste, and the conductive paste is cured to fix the conductive particles to the conductive paste. 11. The method for manufacturing a liquid crystal panel structure according to claim 10, which is performed as a pretreatment step of the plastic film panel substrate before the fixing step of claim 10. 12. A step of printing and hardening a conductive paste only on the drawn transparent electrode, a step of printing cream solder on the hardened conductive paste, and a step of drawing conductive particles to the drawn transparent electrode. The step of arranging according to the pitch of the electrodes, and then aligning the arranged conductive particles so as to come out on the transparent electrode, and then pressing the conductive particles onto the cream solder to form the conductive paste. The step of contacting, and then the step of fixing the conductive particles in contact with the conductive paste by melting the cream solder,
11. The method of manufacturing a liquid crystal panel structure according to claim 10, which is performed as a pretreatment step of the plastic film panel substrate before the fixing step of No. 0. 13. A step of applying an insulating adhesive on the lead-out transparent electrode, a step of arranging conductive particles according to the pitch of the lead-out transparent electrode, and a step of arranging conductive particles.
After aligning the arranged conductive particles so as to be on the extraction transparent electrode, a step of pressing the conductive particles to the insulating adhesive to contact the extraction transparent electrode, and then the insulating adhesion The step of fixing the conductive particles in a state of being brought into contact with the transparent electrode by curing the agent is performed as a pretreatment step of the plastic film panel substrate before the fixing step of claim 10. The method for manufacturing a liquid crystal panel structure according to claim 10. 14. A conductive particle having a large particle size is arranged at a position near the end face of the plastic film panel substrate of the lead-out transparent electrode, and a conductive particle having a small particle size is arranged at a position near the seal portion. The liquid crystal panel structure according to claim 7, wherein the liquid crystal panel structure comprises: 15. A liquid crystal panel according to claim 7, wherein a row of said conductive particles having a larger particle diameter is arranged at the central portion of the connecting portion and at both end portions thereof. Construction. 16. A metal mask having openings having different hole diameters on the same extraction transparent electrode is stacked on an array plate, and then large particles arranged in the largest opening are inserted on the metal mask. The particles are arranged, and then the conductive particles having a smaller particle diameter than in the previous step are inserted and arranged in the opening having a diameter smaller than the maximum opening diameter, and the conductive particles are repeatedly arranged on the array plate in order of the particle diameter. 14. The method of manufacturing a liquid crystal panel structure according to claim 11, wherein the alignment is performed after the particles are arranged. 17. An external circuit connector is inserted between the plastic film panel substrate and the plastic film counter substrate so that the electrode of the external circuit connector is electrically connected to the lead-out transparent electrode. The liquid crystal panel structure according to any one of claims 1 to 9, 14, and 15. 18. A method for inspecting a liquid crystal panel structure according to any one of claims 1 to 9, 14 and 15, wherein a panel lighting inspection connector is provided between the plastic film panel substrate and the plastic film counter substrate. The method for inspecting a liquid crystal panel structure, wherein the presence or absence of panel lighting is inspected by inserting the above electrode so as to be electrically connected to the lead-out transparent electrode.