JPH08202843A - Ground spring fixing structure - Google Patents

Abstract

(57) [Summary] [Object] The present invention relates to a fixing structure for a ground spring,
It is an object of the present invention to realize a fixing structure of a grounding spring in a C card, in which the degree of freedom of component arrangement and board wiring pattern is increased, and stable electric connection between the board and front and back panels is obtained. [Structure] A substrate 12 having an electric circuit, a frame 10 for holding the substrate 12 to define an outer shape, and the frame 1
In an IC card having electrically conductive panels 15 and 15 'installed on the front and back sides of 0, a ring-shaped member 17 for guiding a spring 16 for electrically connecting between the front panel 15 and the substrate 12 is provided. The spring 16 is provided on the substrate 12, and the spring 16 is inserted and arranged in the hole of the ring-shaped member 17.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fixing structure for a ground spring of an IC card.

[0002]

2. Description of the Related Art IC cards are personal computers,
It is connected to a word processor and used for data communication. As shown in FIG. 5A, a conventional IC card includes a frame 1 molded of an insulating material, a substrate (not shown) supported so as to be protected by the frame 1,
It is composed of a connector 2 for electrically connecting an actual machine such as a personal computer or a word processor to a circuit on the board, and conductive panels 3, 3'which cover the front and back surfaces of the frame 1. Reference numeral 4 is a clip for electrically connecting the front and back panels 3 and 3 '.

In handling such an IC card, it is necessary to protect the integrated circuit on the substrate from static electricity discharged from the human body or the like. Therefore, a method is adopted in which the potential difference between the front and back panels is set to 0 "V" by electrically connecting the front and back panels with a conductive spring to protect the integrated circuit device inside the IC card. Another method is also provided in which a circuit connected to a ground circuit on the main body side of a personal computer or the like is provided in the IC card, and the electric charge charged in the IC card is discharged through this circuit to protect the integrated circuit device.

That is, as shown in the exploded perspective view of FIG. 6, a through hole 5 is provided in the frame 1, and a pad 7 connected to a ground terminal is provided on the substrate 6 corresponding to the hole 5, and the panel is further provided. The double-sided tape 8 for adhering 3 to the frame 1 is also provided with holes 8a at positions corresponding to the through holes 5 of the frame 1, the substrate 6 is assembled to the frame 1, and at the same time, the spring 9 is attached to the through hole 5 of the frame 1. After the insertion, the conductive front and back plates 3 and 3'on the front and back are adhered with double-sided adhesive tapes 8 and 8 '. With this structure, the pad 7 connected to the ground terminal and the conductive plate 3 on the upper surface are electrically connected by the spring 9 as shown in the sectional view of FIG. 5B.

[0005]

The above-mentioned conventional IC card has the following problems. In recent years, as the functionality of IC cards has increased, the number of parts has increased, and it is often necessary to move the spring mounting position due to restrictions on the area for mounting parts. However, in the conventional IC card, the hole position for spring attachment is fixed, so that the component mounting position is restricted.

In addition, when the necessary parts are mounted, it is obviously advantageous to move the spring position, or when the spring position has to be moved due to the restriction of the wiring area, the ground pad is moved. When manufacturing a substrate and assembling the same into an IC card, a frame having different spring insertion hole positions cannot be used, and a frame in which the spring insertion hole position is newly changed must be manufactured again. For this reason, it costs a lot to make a mold, which increases the cost of the IC card.

The present invention intends to realize a fixing structure of an earth spring in an IC card in which the degree of freedom of component arrangement and board wiring pattern is increased and stable electrical connection can be obtained.

[0008]

In a structure for fixing a spring for grounding according to the present invention, a board 12 having an electric circuit, a frame 10 for holding the board 12 to define an outer shape thereof, and a frame 10 of the frame 10 are provided. Conductive panels 15 installed on the front and back,
In the IC card including 15 ', a spring 16 for electrically connecting the front panel 15 and the substrate 12 to each other.
A ring-shaped member 17 for guiding the
The spring 16 is inserted and arranged in the hole of the ring-shaped member 17.

A substrate 12 having an electric circuit, a frame 10 for holding the substrate 12 to define the outer shape, and conductive panels 15, 1 installed on the front and back of the frame 10, respectively.
In the IC card including 5 ', a ring-shaped member 17 for guiding a spring 16 for electrically connecting the front panel 15 and the rear panel 15' is provided on the substrate 12, and the substrate 12 is provided on the substrate 12. A through hole 24 having an inner diameter equal to that of the ring-shaped member 17 is provided, and the spring 16 is arranged so as to pass through the hole 24 and the hole of the ring-shaped member 17.

In addition to that, the ring-shaped member 1 is also provided.
7 is made of an insulating material. The ring-shaped member 17 is fixed to the substrate 12 with an adhesive. By adopting this configuration, it is possible to obtain a fixing structure of a grounding spring that can increase the degree of freedom of component arrangement and board wiring pattern and can obtain stable electrical connection.

[0011]

In the present invention, as shown in FIG. 2, the ring-shaped member 16 for guiding the grounding spring 15 can be adhered and fixed to an arbitrary position on the substrate 12, which hinders the mounting of circuit components on the substrate 12. Ground pad 18 at a position that does not become
Is provided, the ring-shaped member 16 is bonded and fixed at that position, the substrate 12 having the spring 15 inserted in the hole of the ring-shaped member 16 is assembled to the frame 10, and then the conductive panels 14 and 14 are provided on the upper and lower surfaces thereof. By bonding and fixing ′ with the double-sided adhesive tapes 13 and 13 ′, the substrate 12 and the conductive panel 14 can be electrically connected by the spring 15 as shown in FIG. As a result, the conductive panel 14 is grounded by the ground terminal via the spring 15 and the ground pad 18.

[0012]

1 is an exploded perspective view showing a first embodiment of the present invention. In the figure, 10 is a frame made of an insulating material, 11 is a connector for electrically connecting to a personal computer, a word processor or the like, 12 is a substrate on which an integrated circuit 13 is mounted, and 14 and 14 'are double-sided adhesive tapes.
Reference numerals 15 and 15 'are conductive front and rear panels, 16 is a spring for grounding, 17 is a ring-shaped member which is the essential point of the present invention, and 18 is a washer-shaped double surface having substantially the same size as the ring-shaped member It is an adhesive tape. The frame 10 has a hole (for inserting a grounding spring) like the conventional example described in FIG.
Instead, the board 12 is provided with a ground pad 19 connected to a ground terminal at a desired position. The upper double-sided adhesive tape 14 is provided with a hole 14a through which the spring 16 is inserted.

The respective members are assembled as shown in FIGS. 2 (a) and 2 (b). Note that FIG. 2A is a perspective view shown without the conductive panel and the double-sided adhesive tape on the upper surface.
(B) is a sectional view of a main part. As shown in FIG.
A ring-shaped member 17 is adhered and fixed to the position of the ground pad 19 by a washer-shaped double-sided adhesive tape 18, and a spring 16 is inserted into the hole of the ring-shaped member 17.

Then, the substrate 12 is assembled to the frame 10, and the front panel 14 and the back panel 14 'are adhesively fixed to the upper and lower sides of the substrate 12 by the double-sided adhesive tapes 14 and 14'. In this embodiment, the double-sided adhesive tape is used to bond the front and back panels and the ring-shaped member, but an adhesive may be used instead of the double-sided adhesive tape.

In this embodiment having such a structure, the ring-shaped member for guiding the spring for grounding can be bonded and fixed to the substrate at an arbitrary position, so that the frame is changed every time the design of the substrate is changed. There is no need, and therefore there is no need to remake the resin mold for manufacturing the frame, so that cost increase can be suppressed.

In the above embodiment, the ring-shaped member 17
Although a ring-shaped member made of a simple cylindrical insulating material is used for the above, other members such as those shown in FIGS. 3 (a) to 3 (c) can be used. The ring-shaped member 17 shown in FIG.
Is provided with a flat surface portion for adhesion on its side surface, and a double-sided adhesive tape 20 is sandwiched between the surface and the frame 10 for adhesive fixation. The ring-shaped member 17 shown in FIG. 3B is provided with a metal disk 21 having a terminal 21a under a ring-shaped insulator, and the terminal 21a is connected to a ground circuit 22 provided on the substrate 12 for use. It was done like this.

The ring-shaped member 17 shown in FIG.
Is a metal disk 23 having a pair of legs 23a provided on the lower surface thereof, and by connecting the legs 23a to the ground pad 19, the metal disc 23 can be mounted over the wiring 24. Is.

FIG. 4 is a sectional view showing a second embodiment of the present invention. In the figure, the same parts as those in FIG. 2B are denoted by the same reference numerals. This embodiment is basically the same as the first embodiment, and is different from the first embodiment in that the ring-shaped member 17 is adhered and fixed to the substrate 12, and the ring-shaped member 17 has the same diameter as the hole at the same position as the hole. A through hole 24 is provided, and a hole is also provided in the double-sided adhesive tape 14 ′ on the lower portion, like the substrate 12.

In this embodiment thus constructed, the spring 16 inserted in the ring-shaped member 17 contacts the front panel 15 at the upper portion and the rear panel 15 'at the lower portion,
Both panels can be electrically connected. In this case, if one panel is connected to the ground terminal of the substrate 12, both front and back panels can be grounded.

[0020]

According to the present invention, it is not necessary to remanufacture a new frame when the position of the spring insertion hole is changed in accordance with the change of the circuit mounting position on the board. The spring can be moved to an arbitrary position and fixed and used, and stable spring installation and stable grounding of front and back panels can be performed. As a result, the reliability of the IC card with respect to the static electricity problem can be improved, and the cost increase due to the new manufacturing of the frame can be avoided, which greatly contributes to the cost reduction of the IC card.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of the present invention.

FIG. 2 is an assembly view showing a first embodiment of the present invention, (a)
Is a perspective view with the front cover removed, and FIG.

FIG. 3 is a diagram showing another example of the ring-shaped member in the first embodiment of the present invention.

FIG. 4 is a sectional view showing a second embodiment of the present invention.

5A and 5B are views showing a conventional IC card, in which FIG. 5A is a perspective view and FIG. 5B is a sectional view taken along line bb in FIG.

FIG. 6 is an exploded perspective view showing a conventional IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Frame 11 ... Connector 12 ... Substrate 13 ... Integrated circuit 14, 14 '... Double-sided adhesive tape 15 ... Front panel 15' ... Back panel 16 ... Spring 17 ... Ring-shaped member 18 ... Washer-shaped double-sided adhesive tape 19 ... Ground pad 20 ... Double-sided adhesive tape 21, 23 ... Metal disk 24 ... Through hole

Claims (4)

[Claims] 1. A substrate (12) having an electric circuit, and a frame (10) for holding the substrate (12) and defining its outer shape.
And an electrically conductive panel (15, 15 ') installed on the front and back of the frame (10), electrically connecting the front panel (15) and the substrate (12). A ring-shaped member (17) for guiding the spring (16) is provided on the substrate (12), and the spring (16) is inserted and arranged in the hole of the ring-shaped member (17). Fixed structure of the spring for earth. 2. A substrate (12) having an electric circuit, and a frame (10) for holding the substrate (12) and defining its outer shape.
And an electrically conductive panel (15, 15 ') installed on the front and back sides of the frame (10), the front panel (15) and the back panel 15' are electrically connected to each other. A ring-shaped member (17) for guiding a spring (16) is provided on the substrate (12), and a through hole (24) having the same inner diameter as the ring-shaped member (17) is provided in the substrate (12), A structure for fixing an earth spring, characterized in that the spring (16) is arranged by inserting the hole (24) and the hole of the ring-shaped member (17). 3. The fixing structure for the earth spring according to claim 1, wherein the ring-shaped member (17) is made of an insulating material. 4. The ring-shaped member (17) is a substrate (1).
The structure for fixing the earth spring according to claim 1 or 2, wherein the structure is fixed to 2) with an adhesive.