JPH08204055A - Structure of hybrid integrated circuit device - Google Patents
Structure of hybrid integrated circuit deviceInfo
- Publication number
- JPH08204055A JPH08204055A JP787595A JP787595A JPH08204055A JP H08204055 A JPH08204055 A JP H08204055A JP 787595 A JP787595 A JP 787595A JP 787595 A JP787595 A JP 787595A JP H08204055 A JPH08204055 A JP H08204055A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- insulating substrate
- hybrid integrated
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、絶縁基板に各種の電子
部品を搭載して成るハイブリッド集積回路装置のうち、
前記絶縁基板における表裏両面のうち少なくとも裏面に
電子部品を搭載して成るハイブリッド集積回路装置の構
造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device in which various electronic parts are mounted on an insulating substrate.
The present invention relates to a structure of a hybrid integrated circuit device in which electronic components are mounted on at least the back surface of both the front and back surfaces of the insulating substrate.
【０００２】[0002]
【従来の技術】一般に、このように、絶縁基板における
表裏両面のうち少なくとも裏面に電子部品を搭載して成
るハイブリッド集積回路装置を、プリント基板に対し
て、当該プリント基板における各種の回路パターンに電
気的に接続するようにして実装するに際しては、絶縁基
板の裏面に搭載した各種の電子部品が、前記プリント基
板の表面、又はこの表面に搭載されている各種電子部品
に接触しないように、当該ハイブリッド集積回路装置に
おける絶縁基板を、プリント基板の上面から適宜寸法だ
け浮かした状態に保持することが必要である。2. Description of the Related Art Generally, a hybrid integrated circuit device in which electronic components are mounted on at least the back surface of both sides of an insulating substrate is electrically connected to a printed circuit board in various circuit patterns on the printed circuit board. When mounting so as to be electrically connected, the various hybrid electronic components mounted on the back surface of the insulating substrate are prevented from coming into contact with the front surface of the printed circuit board or the various electronic components mounted on the front surface. It is necessary to hold the insulating substrate in the integrated circuit device in a state of being floated from the upper surface of the printed circuit board by an appropriate dimension.
【０００３】そこで、従来は、図８及び図９に示すよう
に、絶縁基板２′における表面に各種の電子部品３′を
搭載する一方、前記絶縁基板２′の裏面にも各種の電子
部品４′を搭載して成るハイブリッド集積回路装置１′
において、その絶縁基板２′の左右両端縁に、金属板製
にて先端を二股状に形成した外部リード端子５′の複数
本を、その先端の二股部を被嵌したのち絶縁基板２′の
表面及び裏面のうちいずれか一方又は両方に形成した各
外部接続用電極６′に対して半田付けすることによって
固着し、そして、前記各外部リード端子５′を、前記絶
縁基板２′の裏面から適宜寸法Ｈ′の部位で外向きに折
り曲げして、プリント基板７における電極パッド８に対
して半田付けするようにしている。Therefore, conventionally, as shown in FIGS. 8 and 9, various electronic components 3'are mounted on the front surface of the insulating substrate 2 ', and various electronic components 4 are also mounted on the back surface of the insulating substrate 2'. 'Integrated hybrid integrated circuit device 1'
At the left and right edges of the insulating substrate 2 ', a plurality of external lead terminals 5'made of a metal plate and having a bifurcated tip are fitted with the bifurcated portions of the tip, and then the insulating board 2'is It is fixed by soldering to each external connection electrode 6'formed on either or both of the front surface and the back surface, and the external lead terminals 5'from the back surface of the insulating substrate 2 '. It is bent outward at an appropriate dimension H'and soldered to the electrode pads 8 on the printed circuit board 7.
【０００４】[0004]
【発明が解決しようとする課題】しかし、この従来にお
けるハイブリッド集積回路装置では、その製造に際し
て、絶縁基板２′における表裏両面に対して各種の電子
部品３′，４′を半田付けにて実装する工程に加えて、
絶縁基板２′に複数本の外部リード端子５′を被嵌する
工程、この各外部リード端子５′を半田付けする工程、
及び各外部リード端子５′を外向きに折り曲げる工程を
必要とするから、製造コストが大幅にアップすると言う
問題がある。However, in this conventional hybrid integrated circuit device, various electronic components 3'and 4'are mounted by soldering on both front and back surfaces of the insulating substrate 2'when manufacturing the hybrid integrated circuit device. In addition to the process
A step of fitting a plurality of external lead terminals 5'on the insulating substrate 2 ', a step of soldering each external lead terminal 5',
Also, there is a problem in that the manufacturing cost is significantly increased because a process of bending the external lead terminals 5'to the outside is required.
【０００５】しかも、各外部リード端子５′が絶縁基板
２′の左右両端縁から外向きに突出する形態であるか
ら、輸送等の取扱い中に各外部リード端子５′に曲がり
変形が発生し易いのであり、その上、横幅寸法が外向き
に突出する各外部リード端子５′のために増大すること
により、当該ハイブリッド集積回路装置１′のプリント
基板７に対する専有面積が大きいから、プリント基板の
大型化、又は、プリント基板における電子部品の実装密
度の低下を招来すると言う問題もあった。Moreover, since each external lead terminal 5'projects outward from both left and right edges of the insulating substrate 2 ', the external lead terminals 5'are easily bent and deformed during handling such as transportation. In addition, since the lateral width of the hybrid integrated circuit device 1'is increased due to the external lead terminals 5'protruding outward, the area occupied by the hybrid integrated circuit device 1'with respect to the printed circuit board 7 is large. However, there is also a problem that it leads to a decrease in the packaging density of electronic components on the printed circuit board.
【０００６】本発明は、絶縁基板における表裏両面のう
ち少なくとも裏面に電子部品を搭載して成るハイブリッ
ド集積回路装置において、前記した各種の問題を解消で
きるようにした構造を提供することを技術的課題とする
ものである。It is a technical object of the present invention to provide a structure capable of solving the above-mentioned various problems in a hybrid integrated circuit device in which electronic components are mounted on at least the back surface of both sides of an insulating substrate. It is what
【０００７】[0007]
【課題を解決するための手段】この技術的課題を達成す
るため本発明は、「絶縁基板における表裏両面のうち少
なくとも裏面に各種の電子部品を半田付けにて実装して
成るハイブリッド集積回路装置において、このハイブリ
ッド集積回路装置における各外部接続用電極を、前記絶
縁基板における裏面に形成し、この各外部接続用電極の
各々に、半田接合性金属製の端子片、又は表面に半田接
合性の金属メッキを施した端子片を半田付けにて固着す
る。」と言う構成にした。In order to achieve this technical object, the present invention provides a "hybrid integrated circuit device in which various electronic components are mounted by soldering on at least the back surface of both sides of an insulating substrate. , Each external connection electrode in this hybrid integrated circuit device is formed on the back surface of the insulating substrate, and each of these external connection electrodes is provided with a solder-bondable metal terminal piece, or a surface with a solder-bondable metal. The plated terminal pieces are fixed by soldering. "
【０００８】[0008]
【作 用】このように構成すると、各端子片は、絶縁
基板の裏面から突出した形態になるから、この各端子片
を、プリント基板における各電極パッドに対して半田付
けにて固着することにより、ハイブリッド集積回路装置
を、プリント基板に対して、当該ハイブリッド集積回路
装置における絶縁基板をプリント基板から前記各端子片
の高さ寸法だけ浮かせた状態にして実装することができ
るのである。[Operation] With this structure, since each terminal piece projects from the back surface of the insulating board, each terminal piece is fixed to each electrode pad on the printed board by soldering. The hybrid integrated circuit device can be mounted on the printed circuit board with the insulating substrate in the hybrid integrated circuit device floating above the printed circuit board by the height dimension of each terminal piece.
【０００９】この場合において、前記各端子片を、絶縁
基板の裏面に形成した外部接続用電極に対して半田付け
したことにより、この各端子片が、従来における外部リ
ード端子のように、絶縁基板から外側に突出しないよう
に構成することができると共に、この各端子片の絶縁基
板に対する半田付けを、絶縁基板の裏面に対する各種の
電子部品の半田付けによる実装と同時に行うことができ
るのである。In this case, the terminal pieces are soldered to the external connection electrodes formed on the back surface of the insulating substrate, so that the terminal pieces are insulated from each other like the conventional external lead terminals. The terminal pieces can be soldered to the insulating substrate at the same time as various electronic components are soldered to the back surface of the insulating substrate.
【００１０】[0010]
【発明の効果】従って、本発明によると、絶縁基板にお
ける表裏両面のうち少なくとも裏面に各種の電子部品を
搭載して成るハイブリッド集積回路装置において、 ．各端子片を絶縁基板の裏面に形成した外部接続用電
極に対して半田付けすることにより、ハイブリッド集積
回路装置の製造に際して、従来のように、絶縁基板に対
して外部リード端子を被嵌する複数本の外部リード端子
を被嵌する工程、この各外部リード端子を半田付けする
工程、及び各外部リード端子を外向きに折り曲げる工程
を必要としないから、製造コストを大幅に低減できる。 ．前記各端子片が絶縁基板から外側に突出せず、従来
よりも小型化できることにより、ハイブリッド集積回路
装置のプリント基板に対する専有面積を小さくできるか
ら、プリント基板の小型化、又は、プリント基板に実装
する電子部品の高密度化を図ることができる。 ．前記各端子片が絶縁基板から外側に突出しないこと
により、輸送等の取扱い中において各端子片に変形が発
生することを確実に防止できる。 と言う効果を有する。Therefore, according to the present invention, in a hybrid integrated circuit device in which various electronic components are mounted on at least the back surface of both sides of the insulating substrate, By soldering each terminal piece to the external connection electrode formed on the back surface of the insulating substrate, a plurality of external lead terminals are fitted to the insulating substrate as in the conventional case when manufacturing a hybrid integrated circuit device. Since the step of fitting the external lead terminals of the book, the step of soldering the external lead terminals, and the step of bending the external lead terminals outward are not required, the manufacturing cost can be significantly reduced. ． Since each terminal piece does not protrude from the insulating substrate to the outside and can be made smaller than the conventional one, the area occupied by the hybrid integrated circuit device with respect to the printed circuit board can be reduced. It is possible to increase the density of electronic components. ． Since the terminal pieces do not project outward from the insulating substrate, it is possible to reliably prevent the terminal pieces from being deformed during handling such as transportation. Has the effect of saying.
【００１１】[0011]
【実施例】以下、本発明の実施例を、図１〜図６の図面
について説明する。この図において符号１は、絶縁基板
２の表面に各種の電子部品３を半田付けにて実装すると
共に、絶縁基板２の裏面にも各種の電子部品４を半田付
けにて実装して成る両面型のハイブリッド集積回路装置
を示す。Embodiments of the present invention will be described below with reference to the drawings of FIGS. In this figure, reference numeral 1 is a double-sided type in which various electronic components 3 are mounted on the front surface of the insulating substrate 2 by soldering, and various electronic components 4 are also mounted on the back surface of the insulating substrate 2 by soldering. 2 shows the hybrid integrated circuit device of FIG.
【００１２】なお、前記絶縁基板２の表面に対する各種
電子部品３の半田付けによる実装は、従来から良く知ら
れているように、絶縁基板２の表面に形成されている電
極パットの各々に、半田ペーストを塗布し、次いで、電
子部品３を載置したのち全体を加熱することによって行
なわれる。また、前記絶縁基板２の裏面に対する各種電
子部品４の半田付けによる実装も、同様に、絶縁基板２
の裏面に形成されている電極パットの各々に、半田ペー
ストを塗布し、次いで、電子部品４を載置したのち全体
を加熱することによって行なわれる。この場合におい
て、絶縁基板２の表面に対する電子部品３の半田付けの
ための加熱と、絶縁基板２の裏面に対する電子部品４の
半田付けのための加熱とを同時に行うようにしても良
い。The mounting of various electronic components 3 on the surface of the insulating substrate 2 by soldering, as is well known in the art, is performed by soldering each electrode pad formed on the surface of the insulating substrate 2. This is performed by applying a paste, then mounting the electronic component 3 and then heating the whole. Also, when mounting various electronic components 4 on the back surface of the insulating substrate 2 by soldering, the insulating substrate 2 is also similarly mounted.
This is performed by applying a solder paste to each of the electrode pads formed on the back surface of, and then mounting the electronic component 4 and then heating the whole. In this case, the heating for soldering the electronic component 3 to the front surface of the insulating substrate 2 and the heating for soldering the electronic component 4 to the back surface of the insulating substrate 2 may be simultaneously performed.
【００１３】そして、このハイブリッド集積回路装置１
における複数個の外部接続用電極６を、絶縁基板２にお
ける裏面のうち左右両端縁の部分に、左右両端縁に沿っ
て適宜ピッチの間隔で並べて形成し、この各外部接続用
電極６の各々に、適宜高さ寸法Ｈに構成した端子片５
を、半田付けにて固着する。この場合において、前記各
端子片５は、銅等のような半田接合性の良い金属にて構
成したり、或いは、炭素鋼等の適宜材料製にしてその表
面の全体に、図５に示すように、錫又は半田等の半田接
合性の良い金属メッキ５ａを施したものに構成する。And, this hybrid integrated circuit device 1
A plurality of external connection electrodes 6 are formed on the left and right edges of the back surface of the insulating substrate 2 at appropriate pitch intervals along the left and right edges, and each of the external connection electrodes 6 is formed on each of the external connection electrodes 6. , The terminal piece 5 configured to have an appropriate height dimension H
Are fixed by soldering. In this case, each of the terminal pieces 5 is made of a metal having a good solder joint property such as copper, or made of an appropriate material such as carbon steel so that the entire surface thereof is as shown in FIG. In addition, a metal plating 5a such as tin or solder having a good solder joint property is applied.
【００１４】また、この各端子片５の各外部接続用電極
６に対する半田付けは、絶縁基板２の裏面に対する各種
電子部品４の半田付けによる実装と同時に行う。すなわ
ち、絶縁基板２の裏面に形成されている各電極パット及
び各外部接続用電極６の各々に、半田ペーストを塗布
し、次いで、各電極パッドに対して電子部品４を、各外
部接続用電極６に対して端子片５を各々載置したのち全
体を加熱することによって行なわれる。The soldering of each terminal piece 5 to each external connection electrode 6 is performed simultaneously with the mounting of the various electronic components 4 on the back surface of the insulating substrate 2 by soldering. That is, solder paste is applied to each electrode pad and each external connection electrode 6 formed on the back surface of the insulating substrate 2, and then the electronic component 4 is attached to each electrode pad and each external connection electrode. This is done by placing the terminal pieces 5 on the respective 6 and then heating the whole.
【００１５】このように構成したハイブリッド集積回路
装置１は、各外部接続用電極６に半田付けにて固着した
各端子片５が、絶縁基板２の裏面から突出した形態にな
っているから、このハイブリッド集積回路装置１を、そ
の絶縁基板２の裏面における各端子片５を下向きにした
状態で、プリント基板７の上面に載置したのち、各端子
片５を、プリント基板７における各電極パッド８に対し
て半田付けすることにより、ハイブリッド集積回路装置
１を、プリント基板７に対して、当該ハイブリッド集積
回路装置１における絶縁基板２をプリント基板７から前
記各端子片５の高さ寸法Ｈだけ浮かせた状態にして実装
することができるのである。In the hybrid integrated circuit device 1 thus constructed, each terminal piece 5 fixed to each external connection electrode 6 by soldering is projected from the back surface of the insulating substrate 2. The hybrid integrated circuit device 1 is placed on the upper surface of the printed board 7 with the terminal pieces 5 on the back surface of the insulating board 2 facing downward, and then the terminal pieces 5 are attached to the electrode pads 8 on the printed board 7. By soldering the hybrid integrated circuit device 1 to the printed circuit board 7, the insulating substrate 2 in the hybrid integrated circuit device 1 is lifted from the printed circuit board 7 by the height dimension H of each terminal piece 5. It can be mounted in a closed state.
【００１６】この場合において、前記各端子片５を、絶
縁基板２の裏面に形成した外部接続用電極６に対して半
田付けしたことにより、この各端子片５が、絶縁基板２
から外側に突出することはないのである。なお、複数個
の端子片５を、前記実施例のように、絶縁基板２の左右
両端縁に沿って並べて配設した場合には、絶縁基板２
を、二列の端子片５にて支持することができるから、プ
リント基板７に対する実装強度をアップすることができ
る。また、複数個の端子片５を、絶縁基板２の端縁に沿
って並べて配設する場合において、その配置を、図７に
示すように、千鳥状の配列にすることにより、各端子片
５のピッチ間隔Ｐを狭くして、多ピン化を図ることがで
きる利点がある。In this case, the terminal pieces 5 are soldered to the external connection electrodes 6 formed on the back surface of the insulating substrate 2, so that the terminal pieces 5 are insulated from each other.
It does not project outward from. When a plurality of terminal pieces 5 are arranged side by side along the left and right edges of the insulating substrate 2 as in the above embodiment, the insulating substrate 2
Can be supported by the two-row terminal pieces 5, so that the mounting strength on the printed circuit board 7 can be increased. When a plurality of terminal pieces 5 are arranged side by side along the edge of the insulating substrate 2, the terminal pieces 5 are arranged in a staggered arrangement as shown in FIG. There is an advantage that the number of pins can be increased by narrowing the pitch interval P of.
【図１】本発明の実施例によるハイブリッド集積回路装
置を表面側から見たときの斜視図である。FIG. 1 is a perspective view of a hybrid integrated circuit device according to an embodiment of the present invention when viewed from the front side.
【図２】本発明の実施例によるハイブリッド集積回路装
置を裏面側から見たときの斜視図である。FIG. 2 is a perspective view of the hybrid integrated circuit device according to the embodiment of the present invention when viewed from the back side.
【図３】図１のIII −III 視拡大側面図である。3 is an enlarged side view taken along the line III-III of FIG.
【図４】図１のIV−IV視拡大側面図である。4 is an enlarged side view taken along line IV-IV of FIG.
【図５】端子片の縦断正面図である。FIG. 5 is a vertical sectional front view of a terminal piece.
【図６】絶縁基板の裏面を示す斜視図である。FIG. 6 is a perspective view showing the back surface of the insulating substrate.
【図７】別の実施例を示す要部拡大斜視図である。FIG. 7 is an enlarged perspective view of essential parts showing another embodiment.
【図８】従来におけるハイブリッド集積回路装置を表面
側から見たときの斜視図である。FIG. 8 is a perspective view of a conventional hybrid integrated circuit device as viewed from the front side.
【図９】図８のIX−IX視拡大側面図である。9 is an enlarged side view taken along the line IX-IX in FIG.
１ ハイブリッド集積回路装置 ２ 絶縁基板 ３，４ 電子部品 ５ 端子片 ６ 外部接続用電極 DESCRIPTION OF SYMBOLS 1 Hybrid integrated circuit device 2 Insulating substrate 3,4 Electronic component 5 Terminal piece 6 External connection electrode
Claims (1)
も裏面に各種の電子部品を半田付けにて実装して成るハ
イブリッド集積回路装置において、このハイブリッド集
積回路装置における各外部接続用電極を、前記絶縁基板
における裏面に形成し、この各外部接続用電極の各々
に、半田接合性金属製の端子片、又は表面に半田接合性
の金属メッキを施した端子片を半田付けにて固着したこ
とを特徴とするハイブリッド集積回路装置の構造。1. A hybrid integrated circuit device in which various electronic components are mounted by soldering on at least the back surface of both sides of the insulating substrate, wherein each external connection electrode of the hybrid integrated circuit device is connected to the insulating substrate. Characterized in that it is formed on the back surface of, and each of the external connection electrodes is fixed by soldering a terminal piece made of a solder-bonding metal, or a terminal piece whose surface is plated with a metal having a solder-bonding property. Structure of hybrid integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP787595A JPH08204055A (en) | 1995-01-23 | 1995-01-23 | Structure of hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP787595A JPH08204055A (en) | 1995-01-23 | 1995-01-23 | Structure of hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08204055A true JPH08204055A (en) | 1996-08-09 |
Family
ID=11677798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP787595A Pending JPH08204055A (en) | 1995-01-23 | 1995-01-23 | Structure of hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08204055A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007097212A (en) * | 2006-12-04 | 2007-04-12 | Kyocera Corp | Crystal oscillator |
-
1995
- 1995-01-23 JP JP787595A patent/JPH08204055A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007097212A (en) * | 2006-12-04 | 2007-04-12 | Kyocera Corp | Crystal oscillator |
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