JPH054028U - Chip type terminals for checkers - Google Patents

Abstract

(57) [Summary] (Corrected) [Purpose] Chip-type terminals for checkers used in high-density mounting boards with chip parts mounted. The soldering area is small, and wiring patterns are placed under the chip-type terminals for checkers. (EN) Provided is a chip type terminal for a checker which can be arranged and can be used also as a bus chip. [Structure] A top plate 12 having a substantially flat plate shape is provided, and the top plate 12 has first and second side plates 13 and 14 that are substantially equal in depth to each other and that are vertically connected at two edge portions. A bottom plate 11 having a recess substantially parallel to the top plate 12 at a substantially central portion and having a depth and a width substantially the same as those of the top plate 12 and the edge portions of the two side plates 13 and 14 connected to each other substantially vertically is provided. Must be provided and 2
A notch 13 that is substantially parallel to the top plate 12 on one of the side plates 13 and 14.
The checkered chip-type terminal is provided with a and 14a, respectively, and the bottom plate 11 is provided with a recessed portion having a depth substantially equal to the depth of the top plate 12 by recessing the center part of the bottom plate 11 toward the top plate 12.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a chip-type terminal used as a checker terminal of a circuit board for high-density mounting on which chip parts are mounted.

[0002]

[Prior Art]

 A conventional checker-type chip terminal (hereinafter referred to as a checker terminal) will be described with reference to FIGS. 4 and 5. FIG. 4 is a conceptual diagram showing a first example of a conventional checker terminal. In FIG. 4, the checker terminal 1 is made up of two sets of parallel metal plates and has a substantially box shape. When it is predicted that inspection or adjustment of the high-density mounting circuit board 3 is necessary, the checker terminal 1 is also soldered onto the circuit board 3 when soldering general chip components to the board 3. Soldered. Since the bottom plate of the checker terminal 1 is a flat plate, the entire bottom surface of the bottom plate is soldered to the circuit board 3. The actual inspection and adjustment is performed after the soldering and assembling of the circuit board 3 is completed or in the middle of the process. At that time, the probe 4 of the measuring instrument is connected to the checker terminal 1. It is done by hooking on.

FIG. 5 is a conceptual diagram showing a second example of a conventional checker terminal. In FIG. 5, the checker terminal 1a is composed of a horizontal metal plate 1h and a vertical metal plate 1v. When it is predicted that inspection or adjustment of the high-density mounting circuit board 3 is necessary, when the general chip component is soldered to the board 3, the checker terminal 1a is also soldered to the circuit board 3 by solder 2a. Soldered. Since the horizontal plate 1h of the checker terminal 1a is a flat plate, the entire bottom surface thereof is soldered to the circuit board 3. When the inspection or adjustment is actually performed, the probe 4 of the measuring device is hooked on the hole provided in the vertical plate 1v of the checker terminal 1a.

In the conventional checker terminal as described above, the stress applied to the probe 4 of the measuring instrument is directly applied to the checker terminal 1a at the time of measurement, and this stress causes the checker terminal 1a to move to the circuit board. It acts like peeling from 3. Therefore, it is necessary to increase the adhesion area between the checker terminal 1a and the circuit board 3 to keep the adhesion strength high. For the above reasons, in the conventional checker terminal 1a, it is necessary to solder the entire lower surface, and at the bonding surface between the checker terminal 1a and the circuit board 3, a wiring pattern is formed on the circuit board 3. It was impossible to provide it.

Further, when the soldering surface is made small, the adhesion strength between the checker terminal 1a and the circuit board 3 is lowered as described above. Therefore, it is necessary to increase the soldering area, and the circuit board 3 is inevitable. Was one of the causes of the decrease in wiring density. Furthermore, since the wiring pattern is not provided on the soldering surface, it is impossible to use the checker terminal as a jumper (bus chip), which is also a factor that reduces the wiring density of the circuit board 3. It was. In recent years, the tendency toward miniaturization and high density of electronic circuits has been urgent, and various improvements and improvements have been made. However, it is also desired to improve the checker terminals having the above-mentioned problems.

[0006]

[Problems to be solved by the device]

 The present invention has been devised in view of the above problems, and is a checker terminal used in a high-density mounting board on which chip parts are mounted, which has a small soldering area and can be provided with a wiring pattern under the checker terminal. The purpose is to provide a checker terminal that can also be used as a bus chip.

[0007]

[Means for Solving the Problems]

 The present invention has been made to solve the above-mentioned problems, and in a chip type terminal for a checker used in a circuit board for high-density packaging, a substantially flat top plate is provided, A first side plate having a depth substantially equal to that of the top plate and connected substantially vertically at one edge of the top plate is provided, and the depth of the top plate is substantially equal to that of the other top edge of the top plate. A connected second side plate is provided, and a recessed portion substantially parallel to the top plate is provided at a substantially central portion. A depth and a width of the top plate are substantially equal to each other. A bottom plate connected substantially vertically is provided, and notches parallel to the top plate are provided on the two side plates, respectively, and a substantially central portion of the bottom plate is recessed to the top plate side. The recess is formed to have a depth substantially equal to the depth.

[0008]

[Action]

 In a checker terminal formed in a substantially box shape, the stress applied to the checker terminal through the measuring probe is directly soldered due to the effect of the notches provided in the two side plates of the checker terminal. Don't focus on the face. Therefore, the adhesion strength between the checker terminal and the circuit board can be reduced, and the soldering surface of the bottom plate can be divided into two parts, and the center part of the bottom plate can be floated above the circuit board. Can be placed.

[0009]

【Example】

 An embodiment of the present invention will be described below with reference to FIGS. 1, 2, and 3. FIG. 1 is a perspective view showing a first embodiment of the present invention. In FIG. 1, the checker terminal 10 is formed of a highly elastic metal member, and has a substantially box shape including a bottom plate 11, a top plate 12, and side plates 13 and 14. The side plate 13 is provided with a notch 13a, and the side plate 14 is provided with a notch 14a. The bottom plate 11 is composed of a central plate 11c and two end plates 11a and 11b. These two end plates are on an extended surface of one plane and are half-bonded to the flat circuit board 3a. It The center plate 11c is connected to the end plates 11a and 11b, but is bent toward the top plate so that it is substantially parallel to the two end plates and is positioned higher than the two end plates. It is a plate.

As described above, the side plates 13 and 14 are substantially parallel plates, and the top plate 12, the center plate 11c, and the end plates 11a and 11b are also substantially parallel plates. Further, the top plate 12 and the side plate 14 are substantially vertical surfaces. The top plate 12, the side plates 13 and 14, and the bottom plate 11 have substantially the same depth, and the top plate 12 and the bottom plate 11 have substantially the same width. As shown in FIG. 1, in the bottom plate 11, the end plate 11a is arranged on the left side, the center plate 11c is arranged on the right side thereof one step higher than the end plate 11a, and the end plate 11b is arranged on the right side thereof. It is arranged at the same height as the end plate 11a, and these plates have substantially the same length in the depth direction.

The side plate 13 is provided with a notch 13 a in the depth direction from the front side, that is, substantially parallel to the top plate 12. The notch 13a is not cut to the innermost part of the side plate 13, but the part closest to the innermost part is left as a non-notch part 13b. Similarly, the side plate 14 is also provided with a notch portion 14a. However, the notch portion 14a is not cut to the innermost portion of the side plate 14, and the portion closest to the innermost portion is a non-notched portion. It is left as 14b.

The inspection and measurement of the circuit board 3a are performed after the soldering and assembly of the circuit board 3a are completed or in the middle of the process. It is performed by hooking on the top plate 12 of the checker terminal 10. At this time, the stress applied to the top plate 12 via the probe 4 is absorbed by the elasticity of the non-cutout portions 13b and 14b, and the stress concentrates on the soldered portions of the end plate and the circuit board 3a. Hard to do. Therefore, even if the area of the end plates 11a and 11b of the bottom plate 11 is reduced and the adhesive strength by soldering with the circuit board 3a is reduced, the checker terminal 10 is not likely to be peeled from the circuit board 3a. ..

Further, since the center plate 11c floats from the circuit board 3a and is not soldered, the wiring pattern 7 is provided on the portion of the circuit board 3a facing the center plate 11c. It is possible to dispose them, and the portions of the circuit board 3a facing the end plates 11a and 11b are electrically coupled by soldering the checker terminals 10. That is, the result is equivalent to that the lower side of the end plate 11a and the lower side of the end plate 11b are electrically coupled using a jumper or a bus chip.

As described above, when the checker terminal of the present invention is used as a checker chip in a high-density mounting board, the soldering area on the circuit board can be reduced and the checker terminal Since the wiring pattern can be passed through, it can also be used as a bus chip, which can contribute to a reduction in the number of chip components used and an improvement in the mounting density in a high-density mounting board.

FIG. 2 is a perspective view showing a second embodiment of the present invention. The checker terminal 20 shown in FIG. 2 is composed of a bottom plate 11, a top plate 12, side plates 13 and side plates 24, and only the side plates 14 and 24 are different from the checker terminal 10 shown in FIG. The side plate 24 shown in FIG. 2 has a cutout portion 24a whose length is substantially equal to the depth of the top plate 12 and which is substantially parallel to the side plate 13. The cutout portion allows the side plate 24 to move to the upper side. It is divided into a plate 24b and a lower plate 24c. In this case, the probe 4 (not shown) of the measuring device is hooked on the top plate 12 for measurement, and the stress from the probe is concentrated on the non-notch portion 13b via the top plate 12, Stress is less likely to be concentrated on the soldering surface between the checker terminal 20 and the circuit board 3a. This effect is almost the same as that described in the first embodiment.

FIG. 3 is a perspective view showing a third embodiment of the present invention. The checker terminal 30 shown in FIG. 3 includes a bottom plate 11, a top plate 12, side plates 13, and a side plate 34, and only the side plates 14 and 34 are different from the checker terminal shown in FIG. The side plate 34 shown in FIG. 3 has a cutout portion 34a. The cutout portion is formed from the innermost side to the front side of the side plate 34, but a non-cutout portion 34b is formed near the frontmost portion. Is becoming In this case, the probe 4 (not shown) of the measuring device is hooked on the top plate 12 to perform the measurement. The stress of the probe is concentrated on the non-notch portion 13b via the top plate 12, and the checker Stress is unlikely to concentrate on the soldering surface between the terminal 30 and the circuit board 3a. This effect is almost the same as that described in the first embodiment.

[0017]

[Effect of the device]

 According to the checker terminal of the present invention, it is possible to reduce the soldering area on the circuit board and to pass the wiring pattern under the checker terminal, which enables it to be used as a bus chip. As a result, it is possible to contribute to the reduction of the number of chip components used and the improvement of the mounting density in the high-density mounting board.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention.

FIG. 2 is a perspective view showing a second embodiment of the present invention.

FIG. 3 is a perspective view showing a third embodiment of the present invention.

FIG. 4 is a conceptual diagram showing a first example of a conventional checker terminal.

FIG. 5 is a conceptual diagram showing a second example of a conventional checker terminal.

[Explanation of symbols] 3 circuit board 4 measuring instrument probe 7 wiring pattern 10 checker terminal 11 of the present invention 11 bottom plate 11a end plate 11b end plate 11c center plate 12 top plate 13 side plate 13a side plate notch 13b side plate 13 notch 14 Side plate 14a Side plate notch 14b Side plate 14 non-notch 20 Checker terminal 24 of the present invention 24 Side plate 24a Notch 30 Checkerer terminal 34 of the present invention 34 Side plate 34a Notch 34b Non-notch

Claims (1)

[Claims for utility model registration] [Claim 1] In a chip type terminal for a checker used in a circuit board for high-density mounting, a substantially flat top plate is provided, and the depth is substantially equal to that of the top plate. A first side plate is provided that is connected substantially vertically at one edge of the top plate, and a second side plate that is approximately the same depth as the top plate and is substantially vertically connected at the other edge of the top plate. A side plate is provided, and a concave portion substantially parallel to the top plate is provided at a substantially central portion, and the edge portions of the first and second side plates are connected to each other in a substantially vertical manner with the depth and width being substantially the same as the top plate. A bottom plate is provided, and notches that are substantially parallel to the top plate are provided on the two side plates, respectively, and a substantially central portion of the bottom plate is recessed toward the top plate so that a depth substantially equal to the depth of the top plate is provided. A chip-type terminal for a checker, characterized in that the recess is formed.