JPH08204319A - Solder supply method and solder processing device - Google Patents

Abstract

(57) [Summary] [Object] The present invention provides a solder supply method and a solder supply method capable of significantly reducing the occurrence rate of bridging caused by mutual contact of spherical solder when heated and melted. It realizes a processing device. A spherical solder 5 is placed on a predetermined solder supply position 11 formed on the solder supply surface of a solder supply target 10 and coated with a flux 12, and then the pressure soldering means 27 and 28 are applied. By pressing the spherical solder 5 into contact with the spherical solder 5,
Can be pressed against. As a result, the spherical solder 5 can be temporarily fixed to the solder supply position 11 without being displaced, and thus, when the spherical solder 5 is heated and melted, the bridging caused by the mutual contact of the spherical solder 5 is generated. Can significantly reduce the incidence of.

Description

Detailed Description of the Invention

[0001]

[Table of Contents] The present invention will be described in the following order. Fields of Industrial Application Conventional Technology (FIGS. 7 to 9) Problem to be Solved by the Invention (FIG. 10) Means for Solving the Problem Action Example (1) First Example (FIGS. 1 to 4) (2) Second embodiment (Fig. 5) (3) Third embodiment (Fig. 6) (4) Other embodiment Effect of the invention

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder supplying method and a solder processing apparatus, and is suitable for application to, for example, supplying solder to a printed wiring board.

[0003]

2. Description of the Related Art Conventionally, as a method of supplying solder to a substrate,
A method for forming bumps on an external connection electrode of an integrated package that connects an IC chip and a substrate, and a so-called P-BGA
There is a bump forming method of (plastic ball grid array). In this method, after arranging the ball solder on the electrodes or lands previously coated with the flux, respectively,
By reflowing, the ball solder is semi-melted, and as a result, bumps or precoats are formed. By this method, a method of forming a solder precoat on a substrate at the time of fine pitch connection has been devised.

Practically, a method of forming a precoat by the precoating method by ball solder transfer is shown in FIGS. 7 (A) and (B) and FIGS. 9 (A) to 9 (C). The solder supply device 1 is provided with a laser-equipped tool 2 which is drive-controlled by a drive control device (not shown). The laser-equipped tool 2 is downward in the direction indicated by arrow a and in the opposite direction. And is supported so as to be movable in the upward direction, and the intensity of the laser light is controlled by the heating control means (not shown) of the laser.

A suction jig 3 is attached to the lower end of the laser-equipped tool 2, and a screen 4 is sucked onto the lower side surface of the suction jig 3. By applying a vacuum pressure to the suction jig 3, the screen 4 and the ball solder 5 are
A predetermined vacuum pump (not shown) capable of adsorbing and holding

Further, the screen 4 is provided with a plurality of suction holes 4A arranged in a predetermined pitch, and the arrangement state of the suction holes 4A matches the arrangement state of the lands on which the solder bumps are to be formed. Has been done. By the way,
3 shows a specific example of the arrangement state of the suction holes 4A of the screen 4, in which case a plurality of suction holes 4A are alternately arranged in two rows at 0.3 [mm] pitch on the outermost periphery of the screen 4.

A ball solder bath 6 is provided at a position facing the screen 4, and a plurality of ball solders 5 are spread on the surface of the ball solder bath 6 facing the screen 4. The ball solder 5 is all made of a solder having a spherical shape with a uniform diameter, and the width of the suction hole 4A formed in the screen 4 is smaller than the diameter of the ball solder 5.

Here, as shown in FIG. 7A, the solder supply device 1 positions the laser-equipped tool 2 on the ball solder bath 6 under the control of a driving device (not shown), and thereafter, By moving the attached tool 2 downward, the screen 4 adsorbed on the lower end of the adsorption jig 3 attached to the lower end of the laser attached tool 2 can be brought close to the upper surface of the ball solder bath 5. it can.

In this state, as shown in FIG. 7B, a vacuum pressure is applied to each suction hole 4A formed in the screen 4 by a predetermined vacuum pump (not shown). As a result, the ball solder 5 in the ball solder bath 6 is adsorbed and held in each of the suction holes 4A. After this, the ball solder 5 sucked and held in the suction holes 4A of the screen 4
Is moved to align with the printed wiring board (not shown), the tool with laser 2 is made to suck the ball solder 5 through the suction hole 4 under the control of the driving device (not shown).
It is moved upward while being adsorbed on A.

9A to 9C show a process of welding the ball solder 5 described above with reference to FIG. 7 to the printed wiring board 10 provided at a predetermined position apart from the ball solder bath 6. First, as shown in FIG. 9A, the solder supply device 1
By aligning the screen 4 with the printed wiring board 10 by moving the screen 4 adsorbed on the lower end of the adsorption jig 3 by drive control of a drive arm (not shown) provided in the Has been done. Therefore, the ball solder 5 is moved and controlled while being attracted to the suction holes 4A of the screen 4, and as a result, is aligned with the land 11 of the printed wiring board 10. A land 11 is provided on the upper side surface of the printed wiring board 10, and a flux 12 is applied to the surface of the land 11 to prevent oxidation.

In this state, as shown in FIG. 9B, the tool 2 with a laser is lowered to bring the ball solder 5 into contact with the land 11, and then the screen is controlled based on the control by a driving device (not shown). 4 suction holes 4A
Then, the attraction of the ball solder 5 is released. At this time, the flux 12 applied to the surface of the land 11
The ball solder 5 has a land 1
It can be temporarily fixed on 1.

Thereafter, as shown in FIG. 9C, the laser heating control means (not shown) radiates the laser light of the tool 2 with the laser through the suction jig 3 to form the ball solder 5. The ball solder 5 can be bonded to the land 11 by heating and melting. At that time, Frax 1
The solvent of No. 2 is thermally decomposed, vaporized, and evaporated from the surface of the printed wiring board 10 and the land 11. After that, by stopping the emission of the laser light, the ball solder 5 is solidified, and the tool 2 with laser is further moved up to complete the formation of the solder precoat 5A on the land 11.

[0013]

However, the ball solder 5A thus transferred onto each land 11 is semi-melted by reflowing. Along with this, the flux 12 coated on each land 11 is also heated, so that the viscosity of the flux 12 sharply decreases due to heating and fluidizes, and as a result, a predetermined number of ball solders 5 are formed.
May move from a predetermined position on the corresponding land 11 and the desired precoat 5A may not be formed. Such a defective formation of the precoat 5A is particularly likely to occur when the ball solder 5 placed on the land 11 is in a state of floating in the flux 12 without coming into contact with the land 11.

On the other hand, when each ball solder 5 is in contact with the corresponding land 11, when each land 11 is rapidly heated, the conduction heat from each land 11 is generated before the flux 12 is fluidized. As a result, the corresponding ball solder 5 is semi-melted and deformed, which makes it difficult for each ball solder 5 to move from a predetermined position on the corresponding land 11.

However, when all of the plurality of ball solders 5 are transferred by contacting the lands 11, the size of the ball solders 5 varies and the screen 4 of the suction jig 3 to be transferred is provided. This is difficult due to various causes such as variations in the height of the suction holes 4A formed, or variations in the height due to warpage of the printed wiring board 10. Therefore, it is conceivable to provide a plurality of suction heads (not shown) on the suction jig 3 and to provide a drive mechanism capable of independently adjusting the height of each suction head, but the overall structure is complicated. May be.

Furthermore, the coating amount of the flux 12 also affects the quality of the solder precoat 5A to be formed. For example, as shown in FIG. 10, when the coating amount of the flux 12 on the printed wiring board 10 is relatively large, a predetermined number of ball solders 5 correspond to the lands 1 at the time of reflow.
1 has moved from a predetermined position, and as a result, the adjacent ball solders 5 are flattened to such an extent that the ball solders 5 are in contact with each other, resulting in the occurrence of bridging (FIG. 10 (A)). . Further, when the amount of the flux 12 applied is relatively small, there is a problem that the wet spread of the ball solder 5 becomes insufficient (FIG. 10 (B)).

As one method for solving this problem, a ball-solder is heated together with the positioning mask by using a positioning mask (not shown) having a plurality of through holes in a predetermined arrangement. A method of melting is considered. However, according to such a method, when the semi-molten ball solder adheres to the front and back surfaces of the positioning mask or closes the through hole, there is a possibility that almost no solder remains on the land side. Further, when the flux is vapor-deposited on the positioning mask during heating and melting, it is necessary to wash the positioning mask particularly when the vapor is vapor-deposited a plurality of times.

Further, there is a risk that the positioning mask will thermally expand due to the heating and melting of the ball solder together with the positioning mask, which causes restrictions on the heating method and mechanism. For example, when the positioning mask is thermally deformed, the reliability of the product is adversely affected, and when the positioning mask comes into contact with the substrate, various problems such as extra space around the land may occur. is there.

The present invention has been made in consideration of the above points, and when the spherical solder is heated and melted, the occurrence rate of bridging caused by mutual contact of the spherical solder can be remarkably reduced. A solder supply method and a solder processing apparatus are proposed.

[0020]

In order to solve such a problem, in the present invention, spherical solder is formed on a predetermined solder supply position 11 formed on the solder supply surface of a solder supply target 10 and coated with a flux 12. In the solder supplying method for supplying 5 as mounted, the spherical solder 5 is placed on the solder supplying position 11 on the solder supplying surface.
And a second step of pressing the spherical solder 5 onto the solder supply position 11.

In the present invention, the solder supply target 1
In the solder processing apparatus 20 for processing the spherical solder 5 formed on the predetermined solder supply position 11 on which the flux 12 is applied and which is formed on the solder supply surface of 0, it is provided at the position opposite to the solder supply surface. Further, pressure contact means 27 and 28 for pressing the spherical solder 5 to the solder supply position 6 are provided.

[0022]

After the spherical solder 5 is placed on the predetermined solder supply position 11 formed on the solder supply surface of the solder supply target 10 and coated with the flux 12, the spherical solder 5 is supplied. By pressing the spherical solder 5 into contact with the spherical solder 5,
Can be pressed against. As a result, the spherical solder 5 can be temporarily fixed to the solder supply position 11 without being displaced, and thus, when the spherical solder 5 is heated and melted, the bridging caused by the mutual contact of the spherical solder 5 is generated. It is possible to significantly reduce the occurrence rate of.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

(1) First Embodiment In FIG. 1 in which parts corresponding to those in FIGS. 9 (A) to 9 (C) are designated by the same reference numerals, 20 indicates a solder precoat forming apparatus as a whole, and on a pedestal portion 21. Is provided with a belt conveyor 22, and the printed wiring board 10 is conveyed by the belt conveyor 22 until it is positioned by a positioning unit 23.

An x-direction moving table 24 is provided on the pedestal portion 21, and the y-direction moving table 25 is movably supported on the x-direction moving table 24 in the direction indicated by the arrow x and in the opposite direction. The support member 26 is supported on the y-direction moving table 25 so as to be movable in the direction indicated by the arrow y and in the opposite direction.

The support member 26 has a movable body 27 on its side surface, and the movable body 27 can be moved up and down in the direction indicated by arrow z and in the opposite direction. The movable head 27 holds a pressure head 28, and the pressure head 28
Is moved downward to bring the flat plate 28A formed on the lower side surface of the head into contact with the ball solder 5 placed on the land 11 of the printed wiring board 10.

Incidentally, the x-direction moving table 24 and the y-direction moving table 2
The 5 and the support member 26 are, for example, a drive mechanism using a ball screw, and can drive and control the pressure head 28 to a predetermined position set by a program.

Here, FIGS. 2A to 2D show a process of deforming the ball solder 5 under pressure, and FIGS.
A specific example of the step is shown in (C). First, Figure 2
In (A), the printed wiring board 10 is carried into the solder precoat forming apparatus 20 by the belt conveyor 22. In this case, lands 11 are provided on the upper side surface of the printed wiring board 10 in a predetermined arrangement state, and the flux 12 is applied to the surface thereof.

Ball solder 5 is placed on each land 11 (FIG. 3A). Further, the pressure head 28 is provided in the x-direction moving table 24 and the y-direction moving table 2.
5, the flat plate 28A on the lower end side of the pressure head 28 is aligned with the printed wiring board 10.

Here, the pressure head 28 is formed by inserting a compression spring 28B between the movable body 27 and the plane plate 28A, and the compression spring 28B is printed by the plane plate 28A when the movable body 27 moves downward. The ball solder 5 placed on each land 11 of the wiring board 10 is brought into contact with the land 11 to be compressed by being sandwiched between the movable body 27 and the flat plate 28A.

Further, in the flat plate 28A and the printed wiring board 10, the surfaces facing each other are in a parallel relationship with each other, so that even when the plurality of ball solders 5 are placed on the corresponding lands 11, the flat plate 28A and the printed wiring board 10 are in parallel with each other. By 28A, all the ball solders 5 are collectively and uniformly pressed. Therefore, it is particularly effective when the height of the printed wiring board 10 varies greatly due to warpage of the printed wiring board 10 or when the printed wiring board 10 is thin and easily deformed.

In this state, as shown in FIG. 2 (B), the movable body 27 is moved downward to move the flat plate 28A to the ball solder 5 placed on each land 11 of the printed wiring board 10. Abut, and thus each ball solder 5 abuts on the corresponding land 11.
When the movable body 27 is further moved downward from this state, a predetermined pressing force according to the repulsive force of the compression spring 28B is generated on the flat plate 28A, and the ball solder 5 is pressed and deformed accordingly. Therefore, by moving the movable body 27 downward with a predetermined stroke, the rate at which each ball solder 5 is deformed under pressure can be determined based on the stroke and the elastic force of the compression spring 28B.

After that, as shown in FIG. 2C, the movable body 27 is moved upward, so that the ball solders 5 deformed under pressure are temporarily placed on the lands 11 of the corresponding printed wiring board 10. It is fixed at the position (3) and is not displaced (FIG. 3 (B)). After this, as shown in FIG. 2D, non-contact heating such as reflow or laser light irradiation is performed to heat and melt all the ball solders 5, whereby the flux 12 is thermally decomposed and vaporized. , Is evaporated from above the land 11 of the printed wiring board 10. After this,
The ball solder 5 is solidified by stopping the non-contact heating, and thus the precoat solder 5A is formed on the land 11.
Can be formed (FIG. 3C).

Here, FIG. 4 shows the solder precoat 5A formed after the reflow soldering when the ball solder 5 is deformed under pressure (solder press) using the solder precoat forming device 20 and when not deformed under pressure. It shows the result of quality comparison. In this case, when the ball solder 5 is deformed under pressure, the rate of occurrence of bridging due to contact between the ball solders 5 during reflow is significantly lower than when the ball solder 5 is not deformed under pressure. are doing.

In the above structure, the solder precoat forming apparatus 20 aligns the pressure head 28 with the printed wiring board 10 on which the ball solder 5 is placed on each land 11 in advance. At this time, the printed wiring board 1
The flux 12 is applied on the surface of No. 0. Therefore, some of the ball solders 5 are not in direct contact with the land 11.

In this state, the movable body 27 is moved down to a predetermined position and the flat plate 28A is brought into contact with and pressed by the ball solders 5, whereby the respective ball solders 5 are deformed under pressure and the corresponding lands. 1
It can be temporarily fixed on the 1 without being displaced. After that, by heating and melting each of the ball solders 5, the occurrence rate of bridging caused by mutual contact of the ball solders 5 can be significantly reduced.

According to the above structure, each ball solder 5 is deformed under pressure before being heated and melted, and is temporarily fixed on the corresponding land 11 without being displaced. By doing so, after that, when each of the ball solders 5 is heated and melted, the occurrence rate of the bridging caused by the contact between the ball solders 5 can be significantly reduced.

(2) Second Embodiment FIG. 5 shows a second embodiment. As shown by attaching the same reference numerals to the parts corresponding to those in FIG. Instead, a movable body 30 and a pressure head 31 are provided respectively. Movable plate 30 of movable body 30
A has a pair of cylindrical bushes 30AX and 30A.
Y is inserted, and guide bushes 31BX or 31BY fixedly held on the upper surface of the flat plate 31A are vertically slidably attached to the bushes 30AX or 30AY.

Movable plate 30A and plane plate 31
Between A, the corresponding guide shafts 31BX and 31B
Compression springs 31CX and 31 respectively surrounding Y
In the state where the movable body 30 is lowered in such a manner that the CY is arranged, the plane plate 31A is attached to the printed wiring board
0 (FIG. 2 (A)) can be pressed against the upper surface.

According to the above-mentioned structure, similarly to the case described above with respect to the first embodiment, the respective ball solders 5 are deformed under pressure before the heating and melting of the respective ball solders 5, and the respective measures are taken. By temporarily fixing the land 11 without displacement,
After that, when each of the ball solders 5 is heated and melted, the rate of occurrence of bridging due to mutual contact of the ball solders 5 can be significantly reduced. Further, the flat plate 31A and the printed wiring board 10
The surfaces facing each other can be always kept in parallel relationship, and thus the ball solders 5 on the lands 11 can be collectively and uniformly pressed.

(3) Third Embodiment FIG. 6 shows a third embodiment. As shown by attaching the same symbols to the portions corresponding to FIG. 2 (A), the pressure head 28 is added. A pressure head 40 is provided. Pressure head 40
Has a plano-convex plate 40A formed on the lower surface of the head,
The convex portion 40AX is provided so as to protrude on the side facing the printed wiring board 10. This allows the plano-convex plate 40A to be brought into pressure contact with the upper surface of the printed wiring board 10 when the movable body 27 moves downward.

In this case, it is necessary to bring the convex portion 40AX into contact with the portion of the printed wiring board 10 where the land 11 is not provided. Further, by setting the length of the convex portion 40AX, that is, the interval between the lower flat surface portion 40AY of the plano-convex plate 40A and the printed wiring board 10, it is possible to determine the proportion of the ball solder 5 to be deformed under pressure. it can.

According to the above-mentioned structure, similarly to the case described above with respect to the first embodiment, each ball solder 5 is deformed under pressure before the heating and melting of each ball solder 5, and the respective measures are taken. By temporarily fixing the land 11 without displacement,
After that, when each of the ball solders 5 is heated and melted, the rate of occurrence of bridging due to mutual contact of the ball solders 5 can be significantly reduced.

Here, the plano-convex plate 40A is provided with a guide shaft (not shown) as in the case of the second embodiment, so that the surface facing the printed wiring board 10 is always parallel to the substrate. Held in. This makes it possible to prevent the plano-convex plate 40A from rotating or tilting in one direction, as in the case described above with respect to the second embodiment. Can be pressed.

(4) Other Embodiments In the first and second embodiments, the plurality of ball solders 5 are collectively pressed by using the flat plates 28A and 31A whose lower side surfaces are formed flat. Although the present invention is not limited to this, the present invention is not limited to this, and instead of the flat plates 28A and 31A, one or more ball solders 5 may be brought into contact with each other. It is also possible to provide a plate (not shown) formed as described above, and separately scrape the plate a plurality of times so that all the ball solders 5 can be deformed under pressure.

By the way, when there are a plurality of arrangement states of the lands 11 provided on the printed wiring board 10, a plate is provided which can collectively deform the ball solder 5 under pressure corresponding to the arrangement states of the plurality of types. However, in this case, there is a problem that the configuration becomes complicated. For this reason,
Even if the lands 11 are arranged in a plurality of types by using the plates formed so as to contact the ball solders 5 one by one or in units of two or more as described above Can be applied to the state,
The problem that the configuration becomes complicated can be solved.

In the above-described embodiment, the case where the flat plate 28A (31A, 40A) is used to deform the ball solder 5 under pressure has been described. However, the present invention is not limited to this, and the flat plate 28A is used. (31A, 40
A heater (not shown) for heating may be incorporated in A). As a result, the ball solder 5 is softened by bringing the flat plate heated at low temperature by the heating heater into contact with the ball solder 5, and thus the ball solder 5 is deformed under pressure with a relatively low pressure. be able to.

As a result, a plurality of ball solders 5 are placed on the land 11, and the driving force of the support member 26 currently programmed for the movable body 27 collectively pressurizes and deforms the plurality of ball solders 5. If the driving force cannot be increased and the printed wiring board 10 may be damaged if the driving force is further increased, damage to the substrate can be prevented.

Further, in the above-mentioned embodiment, the case where the printed wiring board 10 is conveyed by the belt conveyor 22 until it is positioned by the positioning unit 23 has been described, but the present invention is not limited to this. Instead, the printed wiring board 10 is not positioned by the positioning unit 23, but a reference pin (not shown) at a predetermined position.
May be positioned by a method of inserting into a positioning hole (not shown) formed in the printed wiring board 10.

Further, in the above-mentioned embodiment, the plane plate 28A (31) is used to deform the ball solder 5 under pressure.
Although the case where the compression spring 28B (31CX, 31CY, 40B) is used as a means for giving an elastic force to A, 40A) has been described, the present invention is not limited to this.
Various other elastic bodies such as rubber can be applied as a means for applying an elastic force to the flat plate 28A (31A, 40A).

Further, in the above-described embodiment, the case where one or two compression springs 28B (31CX, 31CY, 40B) are provided has been described, but the present invention is not limited to this.
Alternatively, three or more may be provided. In this case, the compression spring 28B (31CX, 31CY, 40B) can be adjusted in the number of turns and thickness, or can be increased or decreased in number to a predetermined number to adjust the rate of pressure deformation of the ball solder 5. . In addition, the flat plate 28A (31
A, 40A) without giving elastic force to the movable body 27
By adjusting the stroke of (30), it is possible to determine the proportion of the ball solder 5 to be deformed under pressure.

[0052]

As described above, according to the present invention, the spherical solder is supplied by being placed on the predetermined solder supply position formed on the solder supply surface of the solder supply target and coated with the flux. Thereafter, the spherical solder can be pressed against the solder supply position by pressing the spherical solder into pressure with the spherical solder. As a result, the spherical solder can be temporarily fixed at the solder supply position without being displaced, and thus the occurrence rate of bridging caused by the mutual contact of the spherical solder when the spherical solder is heated and melted. It is possible to realize a solder supply method and a solder processing apparatus that can be significantly reduced.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing an overall configuration of a solder precoat forming apparatus according to the present invention.

FIG. 2 is a partial schematic diagram for explaining a solder precoat forming step according to the present invention.

FIG. 3 is a plan view showing an example of forming a solder precoat on a substrate according to the present invention.

FIG. 4 is a diagram for explaining a comparison of quality of solder precoats after formation.

FIG. 5 is a partial sectional view showing a pressure head according to a second embodiment.

FIG. 6 is a partial sectional view showing a pressure head according to a third embodiment.

FIG. 7 is a partial cross-sectional view showing a conventional ball solder supply method.

FIG. 8 is a plan view showing an example of a suction hole shape of a conventional screen.

FIG. 9 is a partial cross-sectional view showing a conventional ball solder supply method.

FIG. 10 is a plan view for explaining the formation of a solder precoat based on the amount of flux applied.

[Explanation of symbols]

1 ... Solder supply device, 5 ... Ball solder, 10 ...
Printed wiring board, 11 ... Land, 12 ... Flask, 20 ... Solder precoat forming device, 22 ... Belt conveyor, 23 ... Positioning unit, 24 ... X-direction moving stand, 25 ... Y-direction moving stand, 26 ... a supporting member,
27, 30 ... Movable body, 30A ... Movable plate, 30
AX, 30AY ... bush, 28, 31, 40 ... pressure head, 28A, 31A ... flat plate, 28B,
31CX, 31CY ... Compression spring, 31BX, 31BY
...... Guide shaft, 40A …… Plano-convex plate.

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] May 9, 1995

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] 0003

[Correction method] Change

[Correction content]

[0003]

2. Description of the Related Art Conventionally, as a method of supplying solder to a substrate,
A method for forming bumps on an external connection electrode of an integrated package that connects an IC chip and a substrate, and a so-called P-BGA
There is a bump forming method of (plastic ball grid array). In this method, after arranging the ball solder on the electrodes or lands previously coated with the flux, respectively,
Reflowing melts the ball solder, resulting in the formation of bumps or precoats. By this method, a method of forming a solder precoat on a substrate at the time of fine pitch connection has been devised.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction content]

Furthermore, the coating amount of the flux 12 also affects the quality of the solder precoat 5A to be formed. For example, as shown in FIG. 10, when the coating amount of the flux 12 on the printed wiring board 10 is relatively large, a predetermined number of ball solders 5 correspond to the lands 1 at the time of reflow.
There is a problem that the ball solder 5 moves from a predetermined position on the No. 1 and as a result, the adjacent ball solders 5 are flattened at the time of melting so that the ball solders 5 contact each other (FIG. 10 (A)). )). Further, when the amount of the flux 12 applied is relatively small, there is a problem that the wet spread of the ball solder 5 becomes insufficient (FIG. 10 (B)).

[Procedure 3]

[Document name to be amended] Statement

[Name of item to be corrected] 0022

[Correction method] Change

[Correction content]

[0022]

After the spherical solder 5 is placed on the predetermined solder supply position 11 formed on the solder supply surface of the solder supply target 10 and coated with the flux 12, the spherical solder 5 is supplied. By pressing the spherical solder 5 into contact with the spherical solder 5,
Can be pressed against. As a result, the spherical solder 5 is surely brought into contact with the solder supply surface, not through the flux,
It is possible to fix, and thus the incidence of bridging and pre-coat unformation caused by contact due to movement of the spherical solder 5 when the spherical solder 5 is heated and melted can be significantly reduced.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0034

[Correction method] Change

[Correction content]

Here, FIG. 4 shows the solder precoat 5A formed after the reflow soldering when the ball solder 5 is deformed under pressure (solder press) using the solder precoat forming device 20 and when not deformed under pressure. It shows the result of quality comparison. In this case, when the ball solder 5 is deformed under pressure, the rate of occurrence of bridging due to mutual contact due to the movement of the ball solder 5 during reflow is significantly higher than when not deformed under pressure. Has fallen to.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Name of item to be corrected] 0037

[Correction method] Change

[Correction content]

According to the above structure, each ball solder 5 is deformed under pressure before being heated and melted, and is temporarily fixed on the corresponding land 11 without being displaced. By doing so, after that, when each of the ball solders 5 is heated and melted, the occurrence rate of the bridging caused by the mutual contact due to the movement of the ball solders 5 can be significantly reduced. .

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0040

[Correction method] Change

[Correction content]

According to the above-mentioned structure, similarly to the case described above with respect to the first embodiment, the respective ball solders 5 are deformed under pressure before the heating and melting of the respective ball solders 5, and the respective measures are taken. By temporarily fixing the land 11 without displacement,
After that, when each of the ball solders 5 is heated and melted, the rate of occurrence of bridging due to mutual contact due to movement of the ball solders 5 can be significantly reduced. Furthermore, the planes of the flat plate 31A and the printed wiring board 10 which face each other can always be maintained in a parallel relationship, and thus the ball solder 5 on each land 11 can be collectively and uniformly pressed.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0043

[Correction method] Change

[Correction content]

According to the above-mentioned structure, similarly to the case described above with respect to the first embodiment, each ball solder 5 is deformed under pressure before the heating and melting of each ball solder 5, and the respective measures are taken. By temporarily fixing the land 11 without displacement,
After that, when each of the ball solders 5 is heated and melted, the rate of occurrence of bridging due to mutual contact due to movement of the ball solders 5 can be significantly reduced.

[Procedure Amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0052

[Correction method] Change

[Correction content]

[0052]

As described above, according to the present invention, the spherical solder is supplied by being placed on the predetermined solder supply position formed on the solder supply surface of the solder supply target and coated with the flux. Thereafter, the spherical solder can be pressed against the solder supply position by pressing the spherical solder into pressure with the spherical solder. As a result, the spherical solder can be temporarily fixed at the solder supply position without being displaced, and thus when the spherical solder is heated and melted, the bridging and precoating caused by the mutual contact due to the movement of the spherical solder. It is possible to realize a solder supply method and a solder processing apparatus that can significantly reduce the occurrence rate of non-formation.

Claims (8)

[Claims] 1. A solder supply method for supplying spherical solder by placing it on a predetermined solder supply position formed on the solder supply surface of a solder supply target and coated with a flux. A first step of supplying the spherical solder onto the solder supply position, and a second step of pressing the spherical solder onto the solder supply position
And a solder supplying method. 2. The solder supply method according to claim 1, wherein in the second step, the spherical solder is pressed against the solder supply position while being heated. 3. A solder processing apparatus for processing spherical solder, which is formed on a solder supply surface of a solder supply target and is applied on a predetermined solder supply position coated with a flux, in a position facing the solder supply surface. A solder processing apparatus, comprising: a pressure contacting unit that is provided in a pressure contacting unit for pressing the spherical solder into the solder supply position. 4. The solder processing apparatus according to claim 3, wherein the solder supply target is a substrate, and the solder supply position is an electrode. 5. The press contacting means comprises a heating means for heating the abutted spherical solder, and presses the spherical solder at the solder supply position while heating the spherical solder. Solder processing device according to. 6. The pressing means includes an abutting member that abuts the spherical solder, and a driving means that drives the abutting member in a direction of abutting and separating from the solder supply surface. An elastic member that is interposed between the contact member and the driving means and presses the contact member in a direction of contacting the solder supply surface, and presses the spherical solder at the solder supply position. The solder processing device according to claim 3. 7. The pressure contact means includes an abutting member that abuts the spherical solder, and a driving means that drives the abutting member in a direction of abutting and separating from the solder supply surface. A shaft connected to the abutting member and the driving means for feeding the abutting member in a direction of abutting against the solder supplying surface, and pressing the spherical solder to the solder supplying position. The solder processing apparatus according to claim 6. 8. The pressing means comprises a protrusion in a direction of contacting the solder supply surface, and when the protrusion contacts the solder supply surface, the spherical solder is pressure-contacted at a predetermined portion other than the protrusion. The solder processing apparatus according to claim 3, wherein: