JPH08210923A - Furnace temperature measuring device for heating furnace - Google Patents
Furnace temperature measuring device for heating furnaceInfo
- Publication number
- JPH08210923A JPH08210923A JP4130695A JP4130695A JPH08210923A JP H08210923 A JPH08210923 A JP H08210923A JP 4130695 A JP4130695 A JP 4130695A JP 4130695 A JP4130695 A JP 4130695A JP H08210923 A JPH08210923 A JP H08210923A
- Authority
- JP
- Japan
- Prior art keywords
- furnace
- temperature measuring
- measuring device
- furnace body
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 25
- 230000001681 protective effect Effects 0.000 claims abstract description 32
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000006837 decompression Effects 0.000 abstract description 6
- 239000010453 quartz Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000000758 substrate Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Chemical Vapour Deposition (AREA)
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Control Of Resistance Heating (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
(57)【要約】
【目的】 減圧加熱炉内が減圧状態であっても、炉内の
温度分布を測定することができる減圧加熱炉の炉内温度
測定器を提供する。
【構成】 減圧加熱炉の炉体11の外側に加熱ヒータ1
2と炉外温度測定器15を、炉体11の内部に炉内温度
測定器30を設け、予め加熱ヒータ12による加熱時の
炉体11内外の温度差等を校正データとして測定してお
き、実際の製造運転に際しては炉外温度測定器15の測
定温度を校正データにより校正し、この校正データのみ
に基づき炉内温度の制御が行われる減圧加熱炉であっ
て、炉内温度測定器30を、炉体11内に差し込まれ、
炉体11内の先端が閉止、炉体11外の基端が開口した
保護管31と、この保護管31の基端開口から移動自在
に挿入された支持管33と、この支持管33に挿通支持
した熱電対素線32a,32bとから構成した。
(57) [Abstract] [PROBLEMS] To provide an in-furnace temperature measuring instrument of a reduced pressure heating furnace capable of measuring a temperature distribution in the reduced pressure heating furnace even when the inside of the reduced pressure heating furnace is in a reduced pressure state. [Structure] A heater 1 is provided outside the furnace body 11 of the decompression heating furnace.
2 and the outside-of-furnace temperature measuring device 15, the inside-of-furnace temperature measuring device 30 is provided inside the furnace body 11, and the temperature difference between the inside and outside of the furnace body 11 at the time of heating by the heater 12 is previously measured as calibration data, In the actual manufacturing operation, the decompression heating furnace is a decompression heating furnace in which the temperature measured by the outside temperature measuring device 15 is calibrated by the calibration data, and the temperature inside the furnace is controlled based only on this calibration data. , Inserted into the furnace body 11,
A protective tube 31 having a closed front end inside the furnace body 11 and an open base end outside the furnace body 11, a support tube 33 movably inserted from the base end opening of the protective tube 31, and a support tube 33 inserted through the support tube 33. It is composed of the supported thermocouple wires 32a and 32b.
Description
【0001】[0001]
【産業上の利用分野】この発明は、半導体製造のCVD
装置や拡散装置等に用いられる加熱炉、特に、製造時の
計測が困難な炉内温度を予め測定して校正データを作成
しておき、製造時には炉外温度のみを測定して該炉外温
度を校正データに基づいて校正し、この校正された温度
に基づき炉内温度を制御する加熱炉用の炉内温度測定器
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to semiconductor manufacturing CVD.
Heating furnaces used in equipment and diffusers, etc., in particular, the temperature inside the furnace that is difficult to measure during manufacturing is measured in advance to create calibration data, and only the temperature outside the furnace is measured during manufacturing, and the temperature outside the furnace is measured. The present invention relates to an in-furnace temperature measuring device for a heating furnace, which calibrates the temperature in accordance with the calibration data and controls the in-furnace temperature based on the calibrated temperature.
【0002】[0002]
【従来の技術】例えば、CVD装置にあっては、減圧加
熱炉にシリコンウェーハ等の基板を収容し、この基板を
減圧下で所定の温度に加熱して薄膜を形成する。従来、
このようなCVD装置に用いられる減圧加熱炉として、
図4から図6に記載されるようなものが知られる。図4
において、11は炉体、12は炉体11の外周に設けら
れた加熱ヒータである。炉体11は、一端が開口した中
空状をなし、開口が炉口キャップ13により閉止され
る。周知のように、炉体11内には処理対象の基板が収
容され、減圧下で加熱ヒータ12により加熱して当該基
板に薄膜を形成する。加熱ヒータ12は、図外のコント
ローラに接続され、このコントローラにより制御されて
炉体11内を加熱する。2. Description of the Related Art For example, in a CVD apparatus, a substrate such as a silicon wafer is housed in a reduced pressure heating furnace, and this substrate is heated to a predetermined temperature under reduced pressure to form a thin film. Conventionally,
As a reduced pressure heating furnace used in such a CVD apparatus,
Those described in FIGS. 4 to 6 are known. FIG.
In the figure, 11 is a furnace body, and 12 is a heater provided on the outer periphery of the furnace body 11. The furnace body 11 has a hollow shape with one end opened, and the opening is closed by a furnace port cap 13. As is well known, the substrate to be processed is housed in the furnace body 11 and heated by the heater 12 under reduced pressure to form a thin film on the substrate. The heater 12 is connected to a controller (not shown) and is controlled by this controller to heat the inside of the furnace body 11.
【0003】加熱ヒータ12には熱電対からなる炉外温
度測定器15が、炉口キャップ13には炉内温度測定器
20が設けられ、これら温度測定器15,20が上記コ
ントローラに接続される。炉内温度測定器20は、図
5,6に示すように、炉口キャップ13にブッシュ13
aを固着し、このブッシュ13aに貫通して石英保護管
21を炉体11内に突没可能(突出長さを調節可能)に
設け、この石英保護管21内に複数の絶縁管23a,2
3bにより保護された一対の熱電対素線22a,22b
をそれぞれ配索して構成される。石英保護管21は、基
端外周にブッシュ13aと嵌合する大径部を有し、基端
開口がプラグ18で閉止される。このプラグ18と石英
保護管21との接続部分は収縮テフロンチューブ17に
より被覆、固定される。The heater 12 is provided with an out-of-furnace temperature measuring device 15 composed of a thermocouple, and the furnace mouth cap 13 is provided with an in-furnace temperature measuring device 20. These temperature measuring devices 15, 20 are connected to the controller. . As shown in FIGS. 5 and 6, the in-furnace temperature measuring device 20 includes a bush 13 on the furnace port cap 13.
The quartz protective tube 21 is fixed to the quartz protective tube 21 and penetrates through the bush 13a so that the quartz protective tube 21 can be projected and retracted in the furnace body 11 (the projecting length can be adjusted).
A pair of thermocouple wires 22a, 22b protected by 3b
It is configured by arranging each. The quartz protection tube 21 has a large diameter portion on the outer periphery of the base end that fits with the bush 13a, and the base end opening is closed by the plug 18. The connecting portion between the plug 18 and the quartz protection tube 21 is covered and fixed by the shrinkage Teflon tube 17.
【0004】絶縁管23a,23bは、図6(b)に詳
示するように、絶縁管23aの継ぎ目と絶縁管23bの
継ぎ目とが交互に位置するように設けられ、その継ぎ目
で各素線22a,22bが接触することが防止される。
熱電対素線22a,22bは、先端が溶着され、上記プ
ラグ18を通り石英保護管21から引き出される。石英
保護管21から引き出された熱電対素線22a,22b
は、テフロンスリーブ28により保護され、シリコンチ
ューブ(圧着端子)27により中継されてリード線29
と接続される。リード線29は、端子コネクタ26で前
記コントローラと接続される。As shown in detail in FIG. 6 (b), the insulating pipes 23a and 23b are provided such that the joints of the insulating pipe 23a and the joints of the insulating pipe 23b are alternately located, and each strand is connected at the joint. The contact between 22a and 22b is prevented.
The thermocouple wires 22a and 22b have their tips welded, and pass through the plug 18 and are pulled out from the quartz protection tube 21. Thermocouple wires 22a, 22b drawn from the quartz protection tube 21
Is protected by a Teflon sleeve 28 and relayed by a silicon tube (crimp terminal) 27 to form a lead wire 29.
Connected to The lead wire 29 is connected to the controller by the terminal connector 26.
【0005】このような減圧加熱炉にあっては、薄膜の
形成(製造運転)に先立って、炉体11を加熱ヒータ1
2により加熱し、この場合の炉体11外側の温度を炉外
温度測定器15により測定しつつ、併せて、図5の矢印
に示すように炉内温度測定器20を上下に移動させて炉
体11内の上下方向の温度分布を炉内温度測定器20に
より測定し、これら温度測定器15,20の測定データ
から校正データを予め作成しておくことが行われる(校
正データの作成)。そして、製造運転に際しては、炉内
温度測定器20を取り去ってブッシュ13a部分の孔を
塞ぎ、炉外温度測定器15のみで温度を測定する。そし
て、この炉外温度測定器15の測定温度を校正データに
基づいて炉体11内部の温度データに校正し、この校正
したデータにより加熱ヒータ12を制御する。In such a vacuum heating furnace, the furnace body 11 is heated by the heater 1 prior to the formation of the thin film (manufacturing operation).
2 and the temperature outside the furnace body 11 in this case is measured by the outside temperature measuring device 15, and at the same time, the inside temperature measuring device 20 is moved up and down as shown by the arrow in FIG. The temperature distribution in the vertical direction in the body 11 is measured by the in-furnace temperature measuring device 20, and calibration data is created in advance from the measurement data of these temperature measuring devices 15 and 20 (creating calibration data). Then, during the manufacturing operation, the in-furnace temperature measuring device 20 is removed to close the hole in the bush 13a, and the temperature is measured only by the out-of-furnace temperature measuring device 15. Then, the temperature measured by the outside temperature measuring device 15 is calibrated to the temperature data inside the furnace body 11 based on the calibration data, and the heater 12 is controlled by this calibrated data.
【0006】[0006]
【発明が解決しようとする課題】しかしながら、上述し
た減圧加熱炉にあっては、校正データの作成に際して、
炉内温度測定器20を下方に下げるとブッシュ13aと
石英保護管21との間に隙間が生じるため、炉体11内
部を減圧した状態での温度測定、或いは、気密状態を維
持しての温度測定が不可能で、実際の製造運転の条件に
合致する校正データを得られないという問題があった。However, in the above-mentioned reduced pressure heating furnace, when creating the calibration data,
When the in-furnace temperature measuring device 20 is lowered downward, a gap is created between the bush 13a and the quartz protection tube 21. Therefore, the temperature inside the furnace body 11 is measured under reduced pressure, or the temperature is maintained in an airtight state. There is a problem that measurement is impossible and calibration data that matches the conditions of the actual manufacturing operation cannot be obtained.
【0007】この発明は、上記問題に鑑みてなされたも
ので、減圧状態の炉体内部温度の測定が可能で、実際の
運転条件に合致した校正データを得ることができる加熱
炉用の炉内温度測定器を提供することを目的とする。The present invention has been made in view of the above problems, and it is possible to measure the temperature inside the furnace body in a depressurized state and to obtain calibration data that matches actual operating conditions. An object is to provide a temperature measuring device.
【0008】[0008]
【課題を解決するための手段】上記目的を達成するた
め、この発明にかかる加熱炉用の炉内温度測定器は、先
端が閉止、基端が開口し、炉体内に閉止端が挿入ポート
から気密的に差し込まれた保護管と、該保護管内にその
基端開口から挿入長さを調節可能に挿入された支持管
と、該支持管に配索され該支持管の先端で接合された一
対の熱電対素線とを備える。In order to achieve the above-mentioned object, a furnace temperature measuring instrument for a heating furnace according to the present invention has a tip closed and a base end opened, and a closed end from an insertion port in a furnace. A protective tube that is hermetically inserted, a support tube that is inserted into the protective tube so that the insertion length can be adjusted from the base end opening, and a pair that is installed in the support tube and joined at the tip of the support tube And a thermocouple wire.
【0009】[0009]
【作用】この発明の減圧加熱炉によれば、保護管が気密
性を維持して炉体内に突出し、この保護管内に熱電対素
線が配索された支持管を移動可能に挿入するため、炉体
内が減圧状態であっても、保護管を炉体に気密に取り付
けたままで支持管を保護管内で移動させることで、炉体
内の減圧状態を保ったままで炉体内の各層の温度、すな
わち、温度分布を測定でき、実際の製造条件に近い校正
データを得られる。According to the decompression heating furnace of the present invention, the protective tube projects into the furnace body while maintaining the airtightness, and the support tube having the thermocouple wire installed therein is movably inserted into the protective tube. Even if the furnace body is in a depressurized state, by moving the support tube in the protective tube while the protective tube is airtightly attached to the furnace body, the temperature of each layer in the furnace body while maintaining the depressurized state in the furnace body, that is, The temperature distribution can be measured, and calibration data close to actual manufacturing conditions can be obtained.
【0010】[0010]
【実施例】以下、この発明の実施例を図面を参照して説
明する。図1から図3はこの発明の一実施例にかかる加
熱炉用の炉内温度測定器を表し、図1がその要部である
炉内温度測定器の断面図、図2(a),(b)が同炉内
温度測定器の一部を拡大した斜視図、図3が作用を説明
するための断面図である。なお、前述した図4から図6
に示した減圧加熱炉と同一の部分には同一の符号を付し
て一部の説明と図示を省略する。Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show an in-furnace temperature measuring instrument for a heating furnace according to an embodiment of the present invention, and FIG. 1 is a cross-sectional view of the in-reactor temperature measuring instrument, which is a main part thereof, and FIGS. FIG. 3B is an enlarged perspective view of a part of the in-furnace temperature measuring device, and FIG. 3 is a sectional view for explaining the operation. In addition, FIG. 4 to FIG.
The same parts as those of the decompression heating furnace shown in FIG.
【0011】図1において、30は炉内温度測定器を示
し、炉内温度測定器30は、保護管31内に熱電対素線
32a,32bが配索された支持管33を移動可能に挿
通して構成される。保護管31は、石英、SiC(炭化
珪素)、アルミナあるいはセラミック等の高耐熱性材料
からなり、先端が閉止、基端が開口し、また、基端側に
外径が拡径した大径部31aと取付フランジ部31bと
が形成される。なお、炉内温度を1000℃以上とする
ようなかなりの高温条件下で用いる場合には、耐熱性の
高いSiCやアルミナで保護管31を形成するのが好ま
しい。この保護管31は、炉口キャップ13のブッシュ
13aを貫通して先端が炉体11内の上部まで突入し、
大径部31aがブッシュ13aに気密的に嵌合され、基
端が炉体11外に開口する。In FIG. 1, reference numeral 30 denotes an in-furnace temperature measuring device. The in-reactor temperature measuring device 30 is movably inserted through a support pipe 33 in which thermocouple wires 32a and 32b are installed in a protective pipe 31. Configured. The protection tube 31 is made of a highly heat-resistant material such as quartz, SiC (silicon carbide), alumina, or ceramics, has a closed front end, an open base end, and a large-diameter portion with an expanded outer diameter on the base end side. 31a and the attachment flange part 31b are formed. When the furnace is used under a considerably high temperature condition of 1000 ° C. or higher, it is preferable to form the protective tube 31 with SiC or alumina having high heat resistance. The protective tube 31 penetrates through the bush 13a of the furnace port cap 13 and its tip projects up to the upper part in the furnace body 11,
The large diameter portion 31a is airtightly fitted to the bush 13a, and the base end opens outside the furnace body 11.
【0012】支持管33は、セラミック等の絶縁性及び
高耐熱性を有する材料からなり、内部に2条の挿通孔3
3a,33bが互いに分離して形成される。また、支持
管33には、先端に保護部材35が設けられ、基端に略
円板状の取付フランジ36が固定される。この支持管3
3は、取付フランジ36と上述の保護管31の取付フラ
ンジ部31bを貫通したボルト41にナット42を螺着
させることで取り外し可能に保護管31に固定される。
保護部材35は、先端にV字状の溝35aが形成され、
後述するように、この溝35aの側面間に熱電対素線3
2a,32bの先端溶着部が位置する。The support tube 33 is made of a material having an insulating property and a high heat resistance such as ceramics, and has two insertion holes 3 inside.
3a and 33b are formed separately from each other. A protective member 35 is provided at the tip of the support tube 33, and a substantially disc-shaped mounting flange 36 is fixed at the base end. This support tube 3
3 is detachably fixed to the protective tube 31 by screwing a nut 42 onto a bolt 41 that penetrates the mounting flange 36 and the mounting flange portion 31b of the protective tube 31 described above.
The protective member 35 has a V-shaped groove 35a formed at its tip,
As will be described later, the thermocouple wire 3 is provided between the side surfaces of the groove 35a.
The tip welds of 2a and 32b are located.
【0013】熱電対素線32a,32bは、図2
(a),(b)に示すように、支持管33の挿通孔33
a,33bに互いに電気的に絶縁されて挿通され、支持
管33の先端から延出した先端部分が保護部材35を通
りその溝35a内において溶着される。これら熱電対素
線32a,32bは、取付フランジ36を通り外部へ配
索され、前述した従来例と同様に、リード線29や端子
コネクタ26を介して図外のコントローラに接続され
る。The thermocouple wires 32a and 32b are shown in FIG.
As shown in (a) and (b), the insertion hole 33 of the support tube 33 is formed.
The tip portions of the a and 33b electrically insulated from each other and extending from the tip of the support tube 33 pass through the protective member 35 and are welded in the groove 35a. These thermocouple wires 32a and 32b are routed to the outside through a mounting flange 36, and are connected to a controller (not shown) via lead wires 29 and terminal connectors 26, as in the above-described conventional example.
【0014】この実施例の炉内温度測定器30にあって
は、保護管31は炉体11内に挿入させて大径部31a
をブッシュ13aに嵌合させることにより、炉体11に
気密性を保持して取り付けられる。また、支持管33は
取付フランジ36と保護管31の取付フランジ部31b
とをボルト41及びナット42を結合することにより、
保護管31内に挿入させた状態で固定される。そして、
支持管33はボルト41及びナット42を外すことで保
護管31内を上下方向へ移動させることができ、熱電対
素線32a,32bの先端溶着部を保護管31内を炉体
11の上下方向へ移動させることができる。なお、この
支持管33の移動に際して、熱電対素線32a,32b
の先端溶着部が保護部材35のV字状溝35a内に位置
していることから、この先端溶着部が保護管31の内面
等に擦れてしまうような事態が防止されている。In the in-furnace temperature measuring device 30 of this embodiment, the protection tube 31 is inserted into the furnace body 11 and the large diameter portion 31a is formed.
Is fitted to the bush 13a, and is attached to the furnace body 11 while maintaining airtightness. In addition, the support pipe 33 includes a mounting flange 36 and a mounting flange portion 31b of the protective pipe 31.
By connecting and with the bolt 41 and the nut 42,
It is fixed in a state of being inserted into the protection tube 31. And
The support tube 33 can be moved vertically in the protective tube 31 by removing the bolts 41 and the nuts 42, and the tip welded portions of the thermocouple wires 32a and 32b can be moved in the protective tube 31 in the vertical direction of the furnace body 11. Can be moved to. When the support tube 33 is moved, the thermocouple wires 32a and 32b are moved.
Since the tip welded portion is located inside the V-shaped groove 35a of the protection member 35, it is possible to prevent the tip welded portion from rubbing against the inner surface of the protective tube 31 or the like.
【0015】したがって、前述した校正データの作成に
際しては、炉体11内を減圧しても、大径部31aとブ
ッシュ13aとが嵌合していることで炉体11内の気密
は保たれ、支持管33を自由に上下動させることができ
る。このため、炉内温度測定器30により炉体11内部
の温度分布を支障無く測定することができ、実際の製造
運転の条件に合致した校正データが作成できる。この結
果、実際の製造運転において、炉内温度測定器30を取
り去って炉外温度測定器15のみで温度測定を行って
も、この測定した温度データと校正データとに基づい
て、炉体11内部の温度を正確に把握して加熱ヒータ1
2の制御を的確に行える。Therefore, when creating the above-mentioned calibration data, even if the inside of the furnace body 11 is decompressed, the large-diameter portion 31a and the bush 13a are fitted to each other, so that the furnace body 11 is kept airtight. The support tube 33 can be freely moved up and down. Therefore, the temperature distribution inside the furnace body 11 can be measured by the in-furnace temperature measuring device 30 without any trouble, and the calibration data that matches the conditions of the actual manufacturing operation can be created. As a result, in the actual manufacturing operation, even if the temperature measuring device 30 inside the furnace is removed and the temperature is measured only by the temperature measuring device outside the furnace 15, the inside of the furnace body 11 is based on the measured temperature data and the calibration data. Accurately grasp the temperature of the heater 1
2 can be controlled accurately.
【0016】なお、上述した実施例では、保護管31に
大径部31aを形成してブッシュ13aと嵌合させるよ
うにしたが、保護管31を大径部31aと径寸法で一様
に構成することも可能である。また、上述した実施例で
は、炉内温度測定器30を校正データの作成にのみ用い
るものとして説明したが、製造運転時にも炉内温度測定
器30を炉体11内に挿入して取り付けておき、製造運
転時における炉内温度制御用として用いることも可能で
ある。また、上述した実施例では、炉内温度測定器30
を1つ設けたものとして説明したが、複数設けることも
可能である。In the above-described embodiment, the large diameter portion 31a is formed in the protective pipe 31 so as to be fitted to the bush 13a. However, the protective pipe 31 is configured to have the same diameter as the large diameter portion 31a. It is also possible to do so. Further, in the above-described embodiment, the furnace temperature measuring device 30 is described as being used only for creating the calibration data, but the furnace temperature measuring device 30 is inserted and attached in the furnace body 11 even during the manufacturing operation. It can also be used for controlling the temperature in the furnace during the manufacturing operation. Further, in the above-described embodiment, the furnace temperature measuring device 30
Although it has been described that one is provided, a plurality of may be provided.
【0017】また、上述した実施例では、炉体11内の
温度分布を測定する際の支持管33を移動させる方法に
ついて説明を省略したが、この支持管の移動は作業員が
手動により行なったり或いは駆動機構を用いて自動的に
行う等、種々の形態に構成することが可能である。ま
た、上述した実施例では、炉内温度測定器30を炉体1
1に立設して縦方向で使用する例を説明したが、炉内温
度測定器30は横方向或いは斜め方向等といった任意の
方向に設置して使用することも可能である。また、上述
した実施例では、炉内温度測定器30を縦型の減圧加熱
炉に適用した例を説明したが、炉内温度測定器30は、
炉内を減圧するか否か或いは炉が縦型か横型か等と行っ
た形式に係わりなく、CVD装置や拡散炉といった炉を
加熱する形式の装置に広く適用することができる。Further, in the above-mentioned embodiment, the description of the method of moving the support pipe 33 when measuring the temperature distribution in the furnace body 11 is omitted, but the movement of the support pipe is manually performed by an operator. Alternatively, it can be configured in various forms such as automatically using a drive mechanism. Further, in the above-described embodiment, the furnace temperature measuring device 30 is used as the furnace body 1.
Although the example in which the furnace temperature measuring device 30 is vertically installed and used in the vertical direction has been described, the in-furnace temperature measuring device 30 can be installed and used in any direction such as a horizontal direction or an oblique direction. Further, in the above-described embodiment, the example in which the furnace temperature measuring device 30 is applied to the vertical decompression heating furnace has been described.
The present invention can be widely applied to a furnace heating type apparatus such as a CVD apparatus or a diffusion furnace, regardless of whether the inside of the furnace is depressurized or whether the furnace is vertical type or horizontal type.
【0018】[0018]
【発明の効果】以上説明したように、この発明にかかる
加熱炉用の炉内温度測定器によれば、炉体内に保護管を
突入させて気密的に設けるとともに、炉体に気密的に保
護管を取り付け、この保護管内に一対の熱電対素線が電
気的に絶縁されて挿通された支持管を移動可能に設けて
構成したため、炉体内が減圧状態下であっても支持管を
移動させることで炉体内の温度分布を測定でき、校正用
データの作成等に際して、より実際の運転条件に合致し
た正確なデータの作成が可能になるという効果が得られ
る。この結果、半導体製造における温度制御を的確に行
うことができ、高品質の製品を歩留まり良く製造するこ
とができる。As described above, according to the in-furnace temperature measuring device for a heating furnace according to the present invention, a protective tube is thrust into the furnace body to be airtightly provided, and the furnace body is protected airtightly. The support tube was attached to the protection tube so that a pair of thermocouple wires were electrically insulated and inserted through the protection tube, so that the support tube was moved even when the furnace was under reduced pressure. As a result, it is possible to measure the temperature distribution in the furnace body, and it is possible to create accurate data that more closely matches actual operating conditions when creating calibration data. As a result, temperature control in semiconductor manufacturing can be accurately performed, and high quality products can be manufactured with high yield.
【図1】この発明の一実施例にかかる加熱炉用の炉内温
度測定器を示す全体断面図である。FIG. 1 is an overall sectional view showing an in-furnace temperature measuring instrument for a heating furnace according to an embodiment of the present invention.
【図2】同炉内温度測定器の支持管先端部分の拡大図で
あり、(a)が保護部材の取付状態を、(b)が保護部
材の未取付状態を示す。FIG. 2 is an enlarged view of a tip portion of a support tube of the in-furnace temperature measuring instrument, in which (a) shows a protective member attached state and (b) shows a protective member unattached state.
【図3】同炉内温度測定器の作動を示す作用説明図であ
る。FIG. 3 is an operation explanatory view showing an operation of the in-furnace temperature measuring device.
【図4】この発明が適用される加熱炉の全体構成を模式
的に示す図である。FIG. 4 is a diagram schematically showing an overall configuration of a heating furnace to which the present invention is applied.
【図5】従来の減圧加熱炉における炉内温度測定器の模
式図である。FIG. 5 is a schematic diagram of a furnace temperature measuring device in a conventional reduced-pressure heating furnace.
【図6】同従来の炉内温度測定器を示し、(a)がその
断面図、(b)が一部拡大図である。FIG. 6 shows the same conventional furnace temperature measuring instrument, in which (a) is a sectional view thereof and (b) is a partially enlarged view thereof.
11 炉体 12 加熱ヒータ 13a ブッシュ 15 炉外温度測定器 30 炉内温度測定器 31 保護管 32a,32b 熱電対素線 33 支持管 11 Furnace Body 12 Heater 13a Bush 15 Outer Temperature Measuring Device 30 Inner Temperature Measuring Device 31 Protective Tube 32a, 32b Thermocouple Element 33 Support Tube
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 G01K 1/14 J 7/00 321 C 15/00 H01L 21/205 21/22 501 N 21/324 D H05B 3/00 310 E Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI Technical indication location G01K 1/14 J 7/00 321 C 15/00 H01L 21/205 21/22 501 N 21/324 D H05B 3 / 00 310 E
Claims (1)
止端が挿入ポートから気密的に差し込まれた保護管と、
該保護管内にその基端開口から挿入長さを調節可能に挿
入された支持管と、該支持管に配索され該支持管の先端
で接合された一対の熱電対素線とを備えることを特徴と
する加熱炉用の炉内温度測定器。1. A protective tube having a closed front end, an open base end, and a closed end airtightly inserted from an insertion port into a furnace body,
A protective tube that is inserted into the protective tube from its base end opening so that the insertion length can be adjusted; and a pair of thermocouple wires that are routed to the supporting tube and joined at the tip of the supporting tube. Characteristic in-furnace temperature measuring device for heating furnace.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4130695A JPH08210923A (en) | 1995-02-06 | 1995-02-06 | Furnace temperature measuring device for heating furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4130695A JPH08210923A (en) | 1995-02-06 | 1995-02-06 | Furnace temperature measuring device for heating furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08210923A true JPH08210923A (en) | 1996-08-20 |
Family
ID=12604816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4130695A Pending JPH08210923A (en) | 1995-02-06 | 1995-02-06 | Furnace temperature measuring device for heating furnace |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08210923A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001092537A (en) * | 1999-09-22 | 2001-04-06 | Toyo Seiki Seisakusho:Kk | Method for controlling temperature of furnace body or the like and device provided with the furnace body or the like |
| KR20050019506A (en) * | 2003-08-19 | 2005-03-03 | 박진성 | Temperature control Technology of canister for Chemical Vapor Deposition system |
| WO2007018142A1 (en) * | 2005-08-09 | 2007-02-15 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus, method for processing substrate, and method for manufacturing semiconductor device |
| JP2009267359A (en) * | 2008-04-01 | 2009-11-12 | Hitachi Kokusai Electric Inc | Substrate processing apparatus |
| JP2013093618A (en) * | 2008-04-01 | 2013-05-16 | Hitachi Kokusai Electric Inc | Substrate processing apparatus, manufacturing method of semiconductor device and electrode |
| CN103292923A (en) * | 2013-06-07 | 2013-09-11 | 华陆工程科技有限责任公司 | Novel temperature measuring method for materials in rotary furnace |
| JP2014067766A (en) * | 2012-09-25 | 2014-04-17 | Hitachi Kokusai Electric Inc | Substrate processing device, method of manufacturing semiconductor device, and temperature detection method |
| US20150122179A1 (en) * | 2012-02-13 | 2015-05-07 | Fhr Anlagenbau Gmbh | Process roller for receiving and guiding substrates in strip form in vacuum coating installations |
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| CN111594352A (en) * | 2020-05-15 | 2020-08-28 | 北京航空航天大学 | Method and device for measuring the protruding length of alloy solder joint of tungsten-rhenium thermocouple |
| JP2021018074A (en) * | 2019-07-17 | 2021-02-15 | 国立研究開発法人産業技術総合研究所 | Temperature indicator |
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-
1995
- 1995-02-06 JP JP4130695A patent/JPH08210923A/en active Pending
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|---|---|---|---|---|
| JP2001092537A (en) * | 1999-09-22 | 2001-04-06 | Toyo Seiki Seisakusho:Kk | Method for controlling temperature of furnace body or the like and device provided with the furnace body or the like |
| KR20050019506A (en) * | 2003-08-19 | 2005-03-03 | 박진성 | Temperature control Technology of canister for Chemical Vapor Deposition system |
| WO2007018142A1 (en) * | 2005-08-09 | 2007-02-15 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus, method for processing substrate, and method for manufacturing semiconductor device |
| KR100950681B1 (en) * | 2005-08-09 | 2010-03-31 | 가부시키가이샤 히다치 고쿠사이 덴키 | Substrate Processing Apparatus, Substrate Manufacturing Method and Semiconductor Device Manufacturing Method |
| US7820118B2 (en) | 2005-08-09 | 2010-10-26 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus having covered thermocouple for enhanced temperature control |
| JP4887293B2 (en) * | 2005-08-09 | 2012-02-29 | 株式会社日立国際電気 | Substrate processing apparatus, substrate manufacturing method, semiconductor device manufacturing method, and substrate processing method |
| JP2009267359A (en) * | 2008-04-01 | 2009-11-12 | Hitachi Kokusai Electric Inc | Substrate processing apparatus |
| JP2013093618A (en) * | 2008-04-01 | 2013-05-16 | Hitachi Kokusai Electric Inc | Substrate processing apparatus, manufacturing method of semiconductor device and electrode |
| US20150122179A1 (en) * | 2012-02-13 | 2015-05-07 | Fhr Anlagenbau Gmbh | Process roller for receiving and guiding substrates in strip form in vacuum coating installations |
| US9637817B2 (en) * | 2012-02-13 | 2017-05-02 | Fhr Anlagenbau Gmbh | Process roller for receiving and guiding substrates in strip form in vacuum coating installations |
| JP2014067766A (en) * | 2012-09-25 | 2014-04-17 | Hitachi Kokusai Electric Inc | Substrate processing device, method of manufacturing semiconductor device, and temperature detection method |
| US10418293B2 (en) | 2012-09-25 | 2019-09-17 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support |
| US11049742B2 (en) | 2012-09-25 | 2021-06-29 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support |
| CN103292923A (en) * | 2013-06-07 | 2013-09-11 | 华陆工程科技有限责任公司 | Novel temperature measuring method for materials in rotary furnace |
| JP2019109215A (en) * | 2017-12-18 | 2019-07-04 | 國家中山科學研究院 | Device for measuring temperature field distribution inside crucible |
| JP2021018074A (en) * | 2019-07-17 | 2021-02-15 | 国立研究開発法人産業技術総合研究所 | Temperature indicator |
| CN111594352A (en) * | 2020-05-15 | 2020-08-28 | 北京航空航天大学 | Method and device for measuring the protruding length of alloy solder joint of tungsten-rhenium thermocouple |
| CN111594352B (en) * | 2020-05-15 | 2021-08-20 | 北京航空航天大学 | Method and device for measuring the protruding length of alloy solder joint of tungsten-rhenium thermocouple |
| CN116358740A (en) * | 2023-03-22 | 2023-06-30 | 广东中南钢铁股份有限公司 | Verification Furnace and Verification Method |
| DE102023125694A1 (en) * | 2023-09-21 | 2025-03-27 | centrotherm international AG | System and method for temperature measurement and calibration procedures |
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