JPH0821777A - Pressure-detecting apparatus - Google Patents

Abstract

PURPOSE:To provide a pressure-detecting apparatus which can fully meet the need of making a welding work easy, improving an assembling workability and miniaturization. CONSTITUTION:The apparatus is provided with a pressure sensor 2, a pressure receiver 10, and a printed board 23. The pressure sensor 2 has a cylindrical housing 3 with a built-in semiconductor pressure-converting element, and a pressure introduction pipe 4 on a circumference of a smaller diameter than a diameter of the housing 3 at the central part of the lower end face of the housing 3. An input/output terminal 5 of the semiconductor pressure-converting element is projected at the outer peripheral part of a pipe at the lower end face of the housing. The pressure receiver 10 is set at the pressure introduction pipe 4 of the pressure sensor 2 to receive pressure and function as an electric insulator. The printed board 23 is formed out of a semi-flexible material mounting a plurality of electronic parts 23 which compensate a temperature of the semiconductor pressure-converting element, adjust an input/output level, etc. The pressure sensor 2 is directly assembled onto the printed board 23, and an electronic circuit of the printed board 23 is electrically directly connected with the input/output terminal 5 of the semiconductor pressure-converting element.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure detecting device having a pressure sensor containing a semiconductor pressure converting element and a printed board on which a plurality of electronic parts are mounted.

[0002]

2. Description of the Related Art An example of using the pressure detecting device as described above is a pressure detecting device for a refrigerator. In recent years, inverters, heat pumps and room air conditioners have become widespread.

Among them, the multi-room multi-air conditioner has a complicated refrigeration cycle and has a very wide range of capacity control. Even if a combination of indoor units of different types and different capacities (cooling / heating capacity) is operated, the required amount of refrigerant is always supplied properly and optimal operation can be performed to achieve comfortable air conditioning. Semiconductor pressure sensing devices for refrigerants play an important role especially in frequency control of air conditioners.

The pressure data of the pressure detecting device and the separately detected temperature data are fed back to the microcomputer,
By determining the load condition of the air conditioner, proper inverter speed control of the compressor is performed without excess or deficiency.

According to the data of the pressure detecting device, for example, even when the operation of the indoor unit changes from one room to two rooms or from two rooms to one room, the rotation speed of the compressor is immediately changed to cool or heat the room. Can be adjusted.

By the way, FIG. 4 shows a pressure sensor 2 having a built-in semiconductor pressure converting element 1 and a printed circuit board 14 having a plurality of electronic components 13 mounted thereon in a conventional pressure detecting device having the above-mentioned function. As described above, the flexible lead wire 15 is used for electrical connection.

The pressure sensor 2 is a semiconductor pressure conversion element 1.
Has a cylindrical housing 3 in which a cylindrical pressure introduction pipe 4 having a diameter smaller than the housing diameter is projected at the center of the lower end surface of the housing 3, and a semiconductor is provided on the pipe outer circumference of the lower end surface of the housing. The pressure conversion element 1 has a structure in which the input / output terminal 5 is projected as shown in FIG. 5, and the pressure sensor 2 has a pipe fitting hole 6a, a terminal fitting hole 6b, and a lead wire connecting terminal 6a. A disk-shaped hard board 6 is assembled, and the input / output terminals 5 of the semiconductor pressure conversion element 1 are connected to the wiring terminals of the hard board 6 by soldering, and the lead wire connection terminals 6a of the hard board 6 and the printed board. A flexible lead wire 15 is connected to the circuit terminals 14 as shown in FIG.

Further, the pressure introducing pipe 4 is provided with a pressure receiver 10 for receiving pressure and electrically insulating, and the pressure receiver 10 is welded at a joint 12 to form a pressure chamber 7. It is composed of a body 8 and a lid body 9. A pressure introducing capillary tube 10a is joined to the receiving body 8, and the lid body 9 is sealed by a sealing glass 11 to ensure electrical insulation from the pressure sensor 2. There is.

[0009]

According to the above-mentioned conventional pressure detecting device, a flexible lead wire 15 connecting the hard board 6 and the printed board 14 is required, and the lead wire 15 and the receiving body 8 are required. In order to avoid thermal influence by welding the lid 9, the pressure receiver 2 must be connected after being assembled to the pressure sensor 2, and automatic assembly is difficult because of the non-planar structure. Further, since the hard substrate 6 is assembled to the pressure sensor 2, it is difficult to set the receiving body 8 and the lid body 9 on a welding jig when welding. The present invention has been devised to solve the above-mentioned problems, and its purpose is to facilitate welding work and sufficiently cope with needs for improvement of assembly workability and miniaturization by eliminating flexible lead wires. An object of the present invention is to provide a pressure detecting device capable of performing the above.

[0010]

In order to achieve the above object, the pressure detecting device of the present invention comprises a semiconductor pressure converting element 1
Has a cylindrical housing 3 containing
A cylindrical pressure introducing pipe 4 having a diameter smaller than the housing diameter is provided at the center of the lower end surface of the, and the input / output terminal 5 of the semiconductor pressure converting element 1 is provided at the pipe outer circumference of the lower end surface of the housing.
Of the pressure sensor 2, a pressure receiver 10 provided in the pressure introducing pipe 4 of the pressure sensor 2 for receiving pressure and electrically insulating, and temperature compensation and input of the semiconductor pressure conversion element 1. A plurality of electronic components 13 for adjusting the output level, etc.
And a printed circuit board 23 formed of a semi-flexible material, the pressure sensor 2 is directly attached to the printed circuit board 23, and an electronic circuit of the printed circuit board 23 and an input / output of the semiconductor pressure conversion element 1 are provided. The terminal 5 is electrically connected directly.

[0011]

In the pressure detecting device of the present invention, the printed circuit board 23 is formed of a semi-flexible material having an intermediate property between the flexible circuit board and the hard circuit board, and the pressure sensor 2 is directly attached to the printed circuit board 23, and the printed circuit board 23 is printed. Since the electronic circuit of the substrate 23 and the input / output terminal 5 of the semiconductor pressure converting element 1 are directly connected by soldering or the like, the lead wire 15 and the hard substrate 6 as in the conventional case are not required, and the pressure detecting device is It has a simple and compact shape, and assembly workability has been improved.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

In the pressure detecting device of this embodiment, a pressure sensor 2 having a semiconductor pressure converting element 1 incorporated therein, a pressure receiver 10 for receiving pressure and electrically insulating, and temperature compensation of the semiconductor pressure converting element 1. And a printed circuit board 23 on which a plurality of electronic components 13 (such as the hybrid IC 29 and the capacitors 30 and 30a shown in FIG. 3) for adjusting input / output levels are mounted.

The pressure sensor 2 has a cylindrical housing 3 containing the semiconductor pressure converting element 1, and a cylindrical pressure introducing pipe 4 having a diameter smaller than the housing diameter is projected from the central portion of the lower end surface of the housing 3. I / O terminals 5 of the semiconductor pressure conversion element 1 are provided on the outer circumference of the pipe on the lower end surface of the housing.
It has the same structure as the conventional pressure sensor shown in FIG.

The pressure receiver 10 comprises a receiving body 8 and a lid body 9 which are welded to each other at a joint portion 12 to form a pressure chamber 7.
The receiving body 8 has a capillary tube 10a for introducing pressure.
Is fixed by brazing, and the lid 9 is sealed by a sealing glass 11 filled between the lid projecting opening and the hollow pipe 22 in order to ensure electrical insulation from the pressure sensor 2.

The printed circuit board 23 is a semi-flexible material having a thickness between 0.25 and 0.6 mm (preferably a thickness of about 0.3 mm to 0.4 mm) having an intermediate property between a flexible substrate and a hard substrate. The electronic component 13 such as the hybrid IC 29 and the capacitors 30 and 30a for performing temperature compensation and input / output level adjustment of the semiconductor pressure conversion element 1 is formed on the printed circuit board 23. It is implemented as shown in 3. The printed circuit board 23 used in the present invention is
It is possible to maintain a predetermined shape without being deformed even if the weight of the plurality of electronic components 13 is applied.

The pressure sensor 2 is directly assembled to the printed circuit board 23, and the electronic circuit of the printed circuit board 23 and the input / output terminal 5 of the semiconductor pressure conversion element 1 are electrically directly connected by soldering. However, the pressure introducing pipe 4 is inserted into the printed circuit board 23 so that the printed circuit board 23 is assembled after the pressure sensor 10 including the receiving body 8 and the lid body 9 is assembled to the pressure sensor 2. No. 1 slot 24 and slot central round hole 25, a plurality of small holes 28 into which the input / output terminals 5 of the semiconductor pressure conversion element 1 are inserted, and a second slot parallel to the first slot 24. Split portion 26,
An elastically deformable substrate tongue piece 27 formed between the first and second slotted portions 24 and 26 is provided, and a chamfered portion 24a is provided at an outer edge portion of the first slotted portion 24. .

Therefore, the pressure introducing pipe 4 of the pressure sensor 2
Assembling by sliding from the chamfered portion 24a,
The substrate tongue piece 27 between the first slotted portion 24 and the second slotted portion 26 is elastically deformed and can be easily assembled. In this assembled state, the pressure introducing pipe 4 is the first
The input / output terminal 5 of the semiconductor pressure converting element 1 is inserted into the small hole 28 of the printed circuit board 23, which is placed in the central round hole 25 of the slot portion 24. By soldering and on the opposite side, the electric connection between the pressure sensor 2 and the printed circuit board 23 can be easily and surely made.

[0019]

Since the pressure detecting device of the present invention is constructed as described above, the welding work of the pressure receiver 10 is facilitated, and the flexible lead wire is eliminated, so that the assembling workability is improved and the size is reduced. It is possible to adequately meet the needs for downsizing (reducing the relay lead wire can reduce the number of processes and reduce the size).

In particular, when the printed circuit board 23 is provided with the slotted portions 24 and 26 and the slotted central round hole 25, and the board tongue piece 27 and the small hole 28 as specified in claims 2 and 3, By using the flexibility of the printed board 23 and the slot portions 24 and 26, the pressure sensor 2 can be post-assembled to the printed board 23 (easy to set on the welding jig), and the printed board The appropriate hardness of 23 makes it possible to withstand the mounting weight of the electronic component 13 and maintain a predetermined shape.

[Brief description of drawings]

FIG. 1 is a plan view of a pressure detection device according to an embodiment of the present invention.

FIG. 2 is an external front view of a part of the pressure detection device in section.

FIG. 3 is an external perspective view showing a printed circuit board on which electronic components of the pressure detection device are mounted.

4A and 4B are explanatory views showing a conventional pressure detecting device, in which FIG. 4A is a plan view and FIG.

FIG. 5 is an exploded perspective view of a pressure sensor and a hard substrate according to the conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor pressure conversion element, 2 ... Pressure sensor, 3 ... Housing, 4 ... Pressure introduction pipe, 5 ... Input / output terminal, 7 ... Pressure chamber, 8 ... Receptor, 9 ... Lid, 10 ... Pressure receiver, 10a ... Capillary tube, 23 ... Printed circuit board, 24 ... First slotted portion, 25 ... Slotted central round hole, 26 ... Second slotted portion, 27 ... Substrate tongue piece, 28 ... Small hole, 13 (29,
30, 30a) ... Electronic components.

Claims (3)

[Claims] 1. A cylindrical pressure-introducing pipe having a diameter smaller than the housing diameter is provided at the center of the lower end surface of the housing having a cylindrical housing containing a semiconductor pressure conversion element, and a pipe outer circumference of the lower end surface of the housing. A pressure sensor having an input / output terminal of the semiconductor pressure converting element projecting from a portion, a pressure receiver provided in a pressure introducing pipe of the pressure sensor for receiving pressure and electrically insulating, and the semiconductor pressure converter. In a pressure detection device comprising a printed circuit board mounted with a plurality of electronic components for temperature compensation of elements and input / output level adjustment, the printed circuit board is formed of a semi-flexible material, and the pressure sensor is mounted on the printed circuit board. A pressure detector characterized by being directly assembled and electrically connecting the electronic circuit of the printed circuit board and the input / output terminals of the semiconductor pressure converting element directly. . 2. The printed board is provided with a first slotted portion into which a pressure introduction pipe is inserted and a central slotted hole, and a plurality of small holes into which input / output terminals of a semiconductor pressure conversion element are inserted. The pressure detecting device according to claim 1, wherein 3. A second slotted portion parallel to the first slotted portion is provided on the printed board, and an elastically deformable substrate tongue is formed between the first and second slotted portions. The pressure detecting device according to claim 2, wherein