JPH08220187A - Sample heating method and device - Google Patents

Abstract

PURPOSE: To achieve accurate and efficient heat conduction by directly contacting a sample to a heating body to conduct a specific high temperature. CONSTITUTION: A screw hole 5a is provided on a heating block 5, a fixing screw 15 is passed through a hole provided at the center of a sample mounting substrate 8, and the screw 15 is screwed to a hole 15a so that it can advance and retreat up and down. The pin of a sample 7 placed on the block 5 is fitted into the pin hole of the substrate 8 and the sample 7 is brought into contact with the block 5 without any space in that state, and the fixing screw 15 is clamped, thus fixing the substrate 8 onto the block 5. This constitution enables mounting of the sample 7 to the substrate 8 and retaining it so that it is adhered to the upper surface of the block 5 and efficiently and uniformly transferring high temperature from the block 5 to the sample 7. In this manner, the sample 7 retained on the block 5 can be measured by connecting a wire connected to a measuring instrument for measuring electrical characteristics to the pin fitted into the substrate 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for evaluating electrical characteristics while heating a sample.

[0002]

2. Description of the Related Art As an evaluation method for confirming the wiring design of a semiconductor element or the like, there is known a method of evaluating electrical characteristics while heating a sample. As a method of heating, conventionally, high temperature hot air is applied to the sample to heat it. However, since the hot air is circulated in the test chamber, it is difficult to control the temperature in the vicinity of the sample, and it is difficult to quickly transmit the accurate temperature to the sample.

[0003]

SUMMARY OF THE INVENTION The present invention was created in view of the above circumstances, and its main problem is to directly heat a sample and rapidly transmit an accurate temperature. To provide.

[0004]

In order to solve the above problems, the present invention of a sample heating method according to claim 1
(A) In a sample heating method for heating a sample when evaluating the electrical characteristics of the sample in the test chamber, (b) bringing the sample into direct contact with a heating body provided in the test chamber and consisting of a heated heat source. Therefore, the technical means of conducting heat at a predetermined high temperature is taken. Further, in the invention of the sample heating method according to claim 2, in addition to the above-mentioned configuration, (c) the sample pin is inserted and attached to the sample mounting substrate, and the tip of the pin and a measuring instrument for measuring the electrical characteristics are connected by wiring. Yes, (d) the sample mounting substrate is fixed to the heating body so that the height can be adjusted vertically, and the sample is positioned so as to contact the heating body. In the invention of the sample heating apparatus according to claim 3, (e) a heating block having a built-in heater is provided in the test chamber, (f) the sample is brought into direct contact with the heating block to conduct heat at a predetermined high temperature, I am taking the technical means of. Further, in the invention of the sample heating apparatus according to claim 4, (g) the pin of the sample is inserted and mounted on the sample mounting board, and the tip of the pin is connected to the measuring instrument for measuring the electrical characteristic by wiring (h). The sample mounting substrate is fixed to the heating body so that the height can be adjusted up and down, and the sample is positioned so as to contact the heating body.

[0005]

According to the sample heating apparatus of the present invention, the sample is brought into direct contact with the heated heating element to transmit the high temperature, so that the accurate high temperature can be transmitted. If the temperature of the heating element can be directly adjusted, the desired high temperature can be accurately supplied to the sample. In addition, the sample mounting substrate can be used to gently press the sample against the heating element to position the sample and hold it for efficient heat transfer.

[0006]

The preferred embodiments of the sample heating method and structure of the present invention will be described below with reference to the drawings. In the sample heating apparatus 1 shown in FIG. 1 to FIG. 3, a heating block 5 is fixedly provided as an example of a heating body composed of a heat source in a recess on the bottom surface of the test chamber 3 surrounded by a heat insulating wall.

The heating block 5 is a block in which the heater H is surrounded by a heater panel and is directly controlled by the temperature controller 6 to a desired high temperature.
Here, the heating block 5 is not limited to the above-described embodiment, but if the surface (the upper surface in the illustrated example) in contact with the sample 7 has a uniform temperature evenly, at least the heat insulating material containing the heater is housed in the casing. It is possible to use a structure, a structure in which a hole is formed in the block and a heater such as a nichrome wire is incorporated therein, or a structure of another known heating device.

Next, the upper surface of the heating block 5 has a contact side surface 7'of the sample 7 such that the contact side surface 7'of the sample 7 such as a semiconductor element is contacted without any gap and heat is directly conducted. The same plane (horizontal plane in this embodiment) is set accordingly. Here, a recess for fitting the sample 7 may be formed on the upper surface of the heating block 5 so that the sample 7 can be easily placed. In the figure, 2 is a controller, and 6, 13 and 14 are switches of a heating device and a heating block provided on the panel. 3A is the door of the test room.

Next, when the sample 7 is brought into contact with the heating block 5, the sample 7 is placed so as to be lightly pressed against the heating block 5 to improve the heat conduction efficiency. Therefore, the sample 7 can be effectively brought into contact with the heating block 5 by attaching the sample 7 to the support plate and abutting and fixing the support plate on the heating block 5. In the embodiment shown in FIGS. 4 and 5,
A sample mounting substrate 8 having a pin hole 8a into which the pin 7a of the sample 7 is inserted and to which the sample 7 can be mounted is used.

On the other hand, a screw hole 5 is formed on the heating block 5.
a is provided, the fixing screw 15 is passed through a hole 15a provided at the center of the sample mounting substrate 8, and the screw hole 5a is provided.
The fixing screw 15 can be screwed up and down so that it can be screwed up and down. Therefore, the pin hole 8a of this sample mounting substrate 8
Then, the pin 7a of the sample 7 placed on the heating block 5 is fitted and connected, and in that state, the sample 7 is abutted against the heating block 5 without a gap and the fixing screw 15 is tightened to heat the sample mounting substrate 8. Fix on block 5.

In the above embodiment, the sample mounting substrate 8 was attached to the heating block 5 using the fixing screws. However, one side is provided with a locking claw portion having one or a plurality of concaves and convexes, and the other side is engaged with the concaves and convexes. A support body provided separately in the side wall of the test chamber or in the test chamber has a structure in which a mating receiving hole or receiving portion is provided to enable engagement and disengagement, or a structure in which the heating member is fixed by other detachable fixing means. Regardless of whether it is fixed by a detachable fixing means, it is preferable that the sample mounting substrate is constrained at the position where the sample is mounted and the sample is pressed against the heating body. Alternatively, the sample mounting substrate may not be fixed or constrained as described above, but may have a structure in which the sample collides with the heating body only by its own weight.

As a result, the sample 7 is attached to the sample mounting substrate 8 and held in close contact with the upper surface of the heating block 5 so that the high temperature is efficiently and uniformly conducted from the heating block 5 to the sample 7. It The sample 7 thus held on the heating block 5 is the sample mounting substrate 8
It is possible to perform measurement by connecting a wire connected to a measuring instrument for measuring an electrical characteristic to the pin 7a inserted into the.

Here, the measuring instrument is connected to the pin 7a via wiring.
Although the measuring instrument may be provided outside the test chamber, since it has a structure for heating the sample 7 using the heating block 5, unlike the case where high heat is circulated, the measuring device is separated from the heating block 5. Since the temperature does not become high at the position, it is possible to install a measuring instrument or measuring element in the test chamber. However, in the present invention, the connection with the measuring instrument is not particularly limited, and various methods can be used.

[0014]

As described above, in this sample heating device,
Since the sample is directly brought into contact with the heated heating body to transmit the high temperature, it is possible to accurately transmit the high temperature. Further, if the sample mounting substrate is used, the sample can be positioned and abutted against the heating body and held, so that the sample can be heated more efficiently.

[Brief description of drawings]

FIG. 1 is an external view showing an embodiment of a sample heating apparatus of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a front view of FIG.

FIG. 4 is a view seen from the front when positioning a sample on a heating block.

FIG. 5 is a view seen from the same side.

[Explanation of symbols]

 1 ... Sample heating device 2 ... Control unit 3 ... Test chamber 4 ... Device body 5 ... Heating block 6 ... Temperature control unit 7 ... Sample 8 ... Sample mounting substrate 15-fixing screw

Claims (4)

[Claims] 1. A sample heating method for heating a sample when evaluating the electrical characteristics of the sample in the test chamber, in which the sample is brought into direct contact with a heating body provided in the test chamber and comprising a heated heat source. A method for heating a sample, which is characterized in that heat is conducted at a predetermined high temperature. 2. A sample pin is inserted and mounted on a sample mounting board, and the tip of the pin and a measuring instrument for measuring electrical characteristics are connected by wiring, so that the sample mounting board can be vertically adjusted in height with respect to a heating body. The sample heating method according to claim 1, wherein the sample is fixed and positioned so that the sample contacts the heating body. 3. A sample heating apparatus for heating a sample when evaluating the electrical characteristics of the sample in the test chamber, wherein a heating block containing a heater is provided in the test chamber, and the sample is brought into direct contact with the heating block. A sample heating apparatus, which is configured to conduct heat at a predetermined high temperature. 4. A sample pin is inserted into a sample mounting board to be mounted, and the tip of the pin and a measuring instrument for measuring electrical characteristics are connected by wiring, and the sample mounting board is vertically adjustable in height with respect to a heating body. The sample heating apparatus according to claim 3, wherein the sample is fixed and positioned so that the sample comes into contact with the heating body.