JPH0822872A - Method for achieving connection between board and board-incorporating equipment - Google Patents

Abstract

PURPOSE:To make printed-board-incorporating equipment smaller and lightweight. CONSTITUTION:Printed boards 4 each having pads 10, and equipment frames 1 each made of a frame body having connections 2 that make electric contact with the pads are stacked alternately, and an upper plate 5 and a base plate 6 are provided at both upper and lower ends of the stack and held in place by bolts. The printed boards can thus be electrically connected to one another simply by the stacking of the equipment frames and the printed boards. Also, the space for the connections between the printed boards can be made smaller than would be with conventional techniques, so equipment can be made smaller and lightweight.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board-to-board connecting method using an equipment frame stack system, and more particularly to a board-to-board connecting method using a device frame stack method which is lightweight, space-saving and high density. The present invention also relates to a device with a built-in board configured by using this inter-board connection method.

[0002]

2. Description of the Related Art As shown in FIG. 4, a conventional device with a built-in board is provided with a device frame 41 which maintains the rigidity of the device with a built-in board and constitutes a housing, and a plurality of printed boards 44 are provided in the device frame 41. It is housed. Note that (a) is a perspective view of the device, (b) is a sectional view taken along line AA of (a), and (c) is a sectional view taken along line BB of (a). The plurality of printed circuit boards housed in the device frame 41 are connected by a connecting portion 42 using a multi-core electrical connector 43.

As described above, the conventional device with a built-in board has a structure in which the device frame and the printed circuit board connecting portion are independently provided.

[0004]

In the conventional structure in which the equipment frame and the connection portion between the printed circuit boards are independent, a space for the connection portion is required, and the size of the equipment frame is larger than the size of the printed circuit board. However, there is a drawback in that the size of the connection portion is increased and the weight is increased.

It is an object of the present invention to provide a device with a built-in substrate that eliminates such drawbacks and realizes a small size and light weight.

Another object of the present invention is to provide a board-to-board connecting method for realizing such a board built-in device.

[0007]

According to the present invention, in a device containing a plurality of printed circuit boards, the printed circuit boards and a device frame composed of a frame body are alternately stacked when electrically connecting the printed circuit boards. The device frame is provided with a printed circuit board connecting portion, and the printed circuit boards are electrically connected via the printed circuit board connecting portion.

Further, the device with a built-in board of the present invention is characterized in that a printed circuit board having a pad and a device frame composed of a frame body having a connecting portion electrically contacting the pad are alternately stacked. To do.

[0009]

The printed circuit board and the device frame of the frame body are alternately stacked, the printed circuit board connecting portion is formed in the frame body portion of the device frame, and the electric connection between the printed circuit boards is performed by the connecting portion. Since no connector is used, the size and weight can be reduced.

[0010]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 shows an apparatus 20 with a built-in substrate, which is an embodiment.
FIG. 2 is a perspective view and an exploded perspective view thereof. The device 20 with a built-in board has a structure in which an upper plate 5, a device frame 1, a printed circuit board 4, ..., A device frame 1, and a base plate 6 are stacked.

Upper plate 5 and base plate 6
Is a rectangular plate having the same size, and bolt holes 11 and 12 through which the fixing bolts 7 are inserted are provided at four corners, respectively.

FIG. 2 shows the equipment frame 1. The device frame 1 is a rectangular frame having the same outer size as the upper plate 5 and the base plate 6, and bolt holes 3 through which fixing bolts 7 are inserted are provided at four corners. A printed circuit board connecting portion 2 that is electrically connected to the pad 10 of the printed circuit board 4 is provided on one or both upper and lower surfaces of the frame body.

The printed circuit board 4 has a rectangular outer shape which is the same as the upper plate 5 and the base plate 6, pads 10 for electrical connection are provided at the ends, and bolt holes through which fixing bolts 7 are inserted at the four corners. 13 are provided.

FIG. 3 shows a printed circuit board 4 and a device frame 1.
FIG. 4 is a side view showing a positional correspondence between the printed circuit board connection portion 2 of the device frame 1 and the like, such as anisotropic conductive rubber.
Use one that is lightweight and enables high-density connection.

As shown in FIG. 2, two positioning projections 8 are provided on the upper and lower surfaces of the frame body of the equipment frame 1, and a recess (not shown) engaging with the projections 8 is formed. The upper plate 5, the printed circuit board 4, and the base plate 6 are provided respectively, and when the upper plate 5, the device frame 1, the printed circuit board 4, and the base plate 6 are stacked, their relative positions do not shift.

As shown in FIG. 1, the equipment frame 1, the printed circuit board 4, and the equipment frame 1 are repeatedly stacked in this order on the base plate 6 having the above-described structure (FIG. 1).
Then, an example in which five printed circuit boards 4 are stacked is shown), and finally the upper plate 5 is stacked.

At this time, as described above, the position shift of the stack occurs due to the engagement between the positioning projection 8 provided on the equipment frame 1 and the recesses provided on the upper plate 5, the printed circuit board 4, and the base plate 6. There is no such thing.

After the stack is finished, the fixing bolt 7
To the hole 11 of the upper plate 5 and the hole 1 of the equipment frame 1.
3, the base plate 6 is inserted into the hole 12 and fixed as a whole.

According to the apparatus 20 with a built-in board of this embodiment, the upper surface is constituted by the upper plate 5, the bottom surface is constituted by the base plate 6, and the side surfaces are constituted by the side surface of the equipment frame 1 and the side surface of the printed circuit board 4. Shaping the body. The external appearance is the same as the conventional equipment, but it is smaller and lighter because it does not use a multi-core electrical connector.

Although one embodiment of the present invention has been described above, the printed circuit board connecting portion 2 of the equipment frame 1 is not limited to the anisotropic conductive rubber, but is lightweight and capable of high density connection. As long as it is any,

[0022]

As described above, the board-to-board connecting method according to the present invention enables electrical connection between printed boards by simply stacking the device frame and the printed board, and thus the connections can be made. It will be extremely easy.

Further, the device with a built-in board according to the present invention has the connecting portion for electrically connecting the printed boards to the frame body constituting the device frame, so that the printed board can be simply stacked with the device frame. Since it is possible to electrically connect the two, it is possible to reduce the size and weight.

Further, the space of the connecting portion between the printed circuit boards can be reduced as compared with the case where a multi-core electrical connector is used.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a perspective view of a device frame.

FIG. 3 is a diagram showing a positional relationship between a printed circuit board and a device frame.

FIG. 4 is a diagram showing a structure of a conventional device with a built-in substrate.

[Explanation of symbols]

 1 Equipment Frame 2 Printed Circuit Board Connection Section 3 Frame Fixing Bolt Hole 4 Printed Circuit Board 5 Upper Plate 6 Base Plate 7 Fixing Bolt 8 Positioning Protrusion 9 Anisotropic Conductive Rubber 10 Pad 20 Equipment Frame

Claims (6)

[Claims] 1. In a device containing a plurality of printed circuit boards, when electrically connecting the printed circuit boards, the printed circuit boards and a device frame composed of a frame are alternately stacked and printed on the device frame. A board-to-board connecting method comprising providing a board connecting portion and electrically connecting the printed boards via the printed board connecting portion. 2. A device with a built-in board, characterized in that a printed circuit board having a pad and a device frame composed of a frame body having a connecting portion electrically contacting the pad are alternately stacked. 3. A structure in which a printed circuit board and a device frame are alternately stacked, and both surfaces are device frames, and plates are respectively stacked on the device frames on both surfaces. Board built-in equipment. 4. The board built-in device according to claim 3, further comprising means for fixing the printed circuit board, the device frame and the plate in a stacked state. 5. The board according to claim 4, wherein the fixing means comprises bolt holes provided in the printed board, the equipment frame and the plate, and fixing bolts inserted into the bolt holes. Built-in equipment. 6. The device with a built-in substrate according to claim 2, wherein the connection portion of the device frame is made of anisotropic conductive rubber.