JPH0823063A - IC package plating frame and its removal method - Google Patents

Abstract

(57) [Summary] [Object] To provide a plating frame for an IC package and a method for removing the plating frame, which does not damage the pins when the pins are removed from the IC package after the plating process. A plating frame for an IC package, which has a large number of pin holding portions in which pin insertion holes for inserting and holding the pin tip portions are formed at positions corresponding to the pins of the IC package, A slot which communicates with the pin insertion hole is formed on the outer peripheral side of the pin insertion hole, and a small hole is formed in the middle of the slot.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating frame for an IC package and a method for removing the same, and more particularly, to a plating frame used in a plating process for pins of an IC package such as a PGA substrate, and the like. The present invention relates to a method for removing a plating frame after plating.

[0002]

2. Description of the Related Art In an IC package such as a PGA (pin grid array) substrate, the pins attached to the bottom of the package have good electrical continuity with an external circuit, and the surface of the pin is oxidized and corroded. In order to prevent this, a conductive metal such as gold or nickel is plated.

By the way, conventionally, in order to plate the surface of the pin, the following method has been taken. That is, the tip of a package pin is brought into contact with an elastically deformable wire mesh electrode, and the package and the wire mesh electrode are clamped with a clip, immersed in a plating solution, and the wire mesh is formed by a plating rack. A structure in which the above pins are plated by energizing the electrodes (actual flat 1
-119058), a holding plate having holes instead of the wire net electrode,
A configuration using an elastic thin metal plate having a pin contact portion formed by a spiral spring formed by a spiral cutout or a cutout at a position corresponding to the hole of the holding plate (see Japanese Patent Application No. 4-48688). After obtaining a planted array pin in which a large number of pins are planted on a conductive metal plate made of a Ni-containing Fe alloy plate, and after brazing the pins of the planted array pin to the metallized layer of the package with a brazing material, A structure in which plating is performed through the implanted arrangement pins, and then the leg portions of the pins are cut at a required position (Japanese Patent Laid-Open No. 1-115153, 1-115153).
168049 gazette) etc. are taken.

However, in the case of the above-described structure, when a thin plate electrode such as a wire mesh or a metal plate is pressed against the pin of the package to perform plating treatment, poor electrical contact is liable to occur between the pin and the thin plate electrode. However, there is a problem in that it is necessary to prepare the implanted arrangement pins and align them with the pin positions of the IC package, which is troublesome.

Therefore, the present applicant has previously described that "a hole is made of a conductive material and has a diameter smaller than the tip diameter of the pin at a position corresponding to the pin of the IC package, and a plurality of holes are provided around the hole. It has individual notches, the pin holding part is formed by the notch, the pin of the IC package is inserted into the small hole, the pin holding part is expanded and deformed, the pins are joined, and plating processing is possible. Frame for IC package plating ”(see Japanese Patent Application No. 5-92540).

[0006]

However, in the case of the plating frame in which the pins of the above-mentioned conventional IC package are inserted into the pin insertion holes of the plating metal plate to perform plating,
There are problems such as "when the plating frame is pulled out from the pins of the IC package after the plating process, the pins are easily scratched by the contact between the pin insertion holes of the plating frame and the pins of the IC package."

The present invention has been made in response to the above-mentioned problems, and its purpose is to prevent damage to the pins of the IC package when the pins are removed from the IC package after plating. It is an object to provide a plating frame for an IC package and a method for removing the same.

[0008]

The plating frame of the IC package of the present invention as a means for achieving the above object inserts and holds the pin tip portion at a position corresponding to the pin of the IC package. A plating frame for an IC package having a large number of pin holding portions formed with pin insertion holes, wherein the pin holding portion has a slot formed on the outer peripheral side of the pin insertion holes and communicating with the pin insertion holes. A small hole is formed in the middle of splitting.

Further, according to the method for removing the plating frame of the IC package of the present invention, a large number of pin holding portions having pin insertion holes for inserting and holding the pin tips are formed at positions corresponding to the pins of the IC package. The plating frame of the IC package has the I
A method for removing a plating frame of an IC package to be removed from a C package, wherein a wedge is formed in a small hole provided in the pin holding hole formed in the outer peripheral side of the pin holding portion in the middle of a slot. Insert the shaped member,
After the pin insertion hole is expanded, the pins of the IC package are pulled out from the pin insertion hole.

[0010]

In the plating frame for an IC package and the method of removing the same according to the present invention, a slot communicating with the pin insertion hole is formed on the outer peripheral side of the pin insertion hole of the pin holding portion, and a small hole is formed in the middle of the slot. Since the pin insertion hole is expanded by inserting the wedge-shaped member into the small hole, the pin of the IC package is easily disengaged from the pin insertion hole to damage the pin. Disappears.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. Here, FIG. 1 to FIG.
1 shows an embodiment of the present invention, FIG. 1 is a plan view, FIG. 2 is an enlarged view of an essential part of FIG. 1, FIG. 3 is a side sectional view of FIG. 2, FIG. 5 is an enlarged view of a main part of FIG.

The plating frame of the IC package of this embodiment is a PGA ceramic package pin, and is a plating frame used when a plating process is performed on a conductor pattern, and roughly corresponds to the pin 2 of the IC package 1. Has a large number of pin holding portions 3 each having a pin insertion hole 4 for inserting and holding the pin tip portion, and a slot 5 and a small hole 6 are formed on the outer peripheral side of the pin insertion hole 4. I am trying.

The IC package 1 has conductor patterns (not shown) electrically connected to the semiconductor chip on the inner and outer layers.
And a large number of pins (external terminals) 2 made of metal such as Kovar, 42 alloy, and copper are brazed on the back surface, and the conductor pattern and the pins 2 are electrically conductive through-holes filled with metal conductors. It is connected to the. Here, the tip of the pin 2 is formed in a spherical shape (see FIG. 5). And IC
When the conductor pattern of the package 1 and the pin 2 are electrolytically plated, the plating frame 7 is attached to the pin 2.

The plating frame 7 has a horizontal frame 7a and a vertical frame 7b formed by punching or etching a thin plate such as Kovar, 42 alloy, stainless steel plate, and steel plate. Part 8
It is a metal frame provided with. A large number of pin holding portions 3 are formed on the horizontal frame 7a of the metal frame corresponding to the positions of the pins 2 of the IC package 1.
Further, a pin insertion hole 4 is formed in the pin holding portion 3, and four holding pieces 10 are formed by notches 9 on the inner peripheral surface of the pin insertion hole 4. These four holding pieces 10
The space 11 formed on the inner peripheral side of the is smaller than the diameter of the pin 2 of the IC package 1, and the four holding pieces 10 are
It is thinly formed with respect to other portions of the frame 7 by half etching. In the present embodiment, the thickness of the holding piece 10 is set to about 0.1 mm, and the other portions have a thickness of 0.
It is about 2 mm.

Further, a notch 9 between the holding pieces 10 and 10 is formed on the outer peripheral side of the pin insertion hole 4 of the pin holding portion 3 in both directions.
Slot 5, 5 leading to this pin insertion hole 4
That is, a notch is formed, and in the middle of the slot 5, a small hole 6 into which a wedge-shaped member can be inserted is formed. Here, the slot 5 is in the shape of a slit, and the tip of the slot 5 is positioned so as to cover the vertical frame 7b.
On the other hand, the frame removing jig 21 for removing the plating frame 7 from the pins 2 of the IC package 1 after the plating process has a conical shape that can be inserted into the small holes 6 and 6 of the pin holding portion 3 of the plating frame 7. Wedge-shaped projections 22 are formed (see FIG. 5).

Next, the operation of the plating frame of the IC package of this embodiment will be described. First, the pins 2 of the IC package 1 are connected to the pin holding portions 3 of the plating frame 7 by using a frame set device (not shown). After inserting into the pin insertion hole 4 and bringing four holding pieces 10 into contact with the outer peripheral surface of the pin 2 to join the pin 2 of the IC package 1 and the plating frame 7, the conductor pattern of the IC package 1, The pin 2 is plated.

After the plating process, the wedge-shaped projection 22 of the frame removing jig 21 is inserted into the small hole 6 formed in the slot 5 provided in the pin holding portion 3 of the plating frame 11. Then, the wedge-shaped projection 22 widens the slot 5 to widen the pin insertion hole 4, the holding piece 10 of the pin insertion hole 4 separates from the outer peripheral surface of the pin 2 (the grip is released), and the IC package 1 The pin 2 acts so that the plating frame 7 is removed from the pin 2 without being damaged.

In this way, when the plating frame of the IC package of this embodiment is used to perform a predetermined plating process, the pins 2 of the IC package 1 and the plating frame 7
However, since they are securely joined by the holding piece 10 formed inside the pin insertion hole 4, the plating process can be performed with high accuracy, and after the plating process, the pin 2 and the plating frame 7
In order to separate and separate the pin insertion holes 4, since the slits 5 and 5 are provided in the left and right direction of the pin insertion hole 4, and the small holes 6 and 6 are provided in the middle of the slits 5 and 5, the small holes 6 and 6 are provided. This can be done simply by inserting the wedge-shaped projection 22 of the frame removing jig 21 into the.

It should be noted that the present invention is not limited to the above-described embodiments, but includes configurations that can be modified and implemented within the scope of the present invention. Incidentally, in the above-described embodiment, the description has been made with the configuration in which the holding pieces of the plating frame are four, but the number of holding pieces is not limited to this. Alternatively, the holding piece may not be provided. Further, the pin holding portion may be provided not only in the horizontal frame but also in the vertical frame. Further, in the above-mentioned embodiment,
Although the wedge-shaped member that is inserted into the slotted hole of the pin holding portion is a conical protrusion, it may be a polygonal wedge-shaped member.

[0020]

As is apparent from the above description, according to the plating frame for an IC package and the method for removing the same of the present invention, the slot which communicates with the pin insertion hole is formed on the outer peripheral side of the pin insertion hole of the pin holding portion. Is formed, and a small hole is provided in the middle of the slot, and by inserting a wedge member into the small hole of the slot, the pin insertion hole is expanded and I
Since the plating frame is removed from the C package pin, the plating frame can be easily removed without damaging the IC package pin.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is an enlarged view of a main part of FIG.

FIG. 3 is a side sectional view of FIG.

FIG. 4 is an explanatory diagram of an operation of a plating frame of an IC package.

FIG. 5 is an enlarged view of a main part of FIG. 4;

[Explanation of symbols]

1 ... IC package, 2 ... pin, 3 ... pin holding part, 4 ... pin insertion hole, 5 ... slit, 6 ...
..Slit small holes, 7 ... Plating frame, 7a
... Horizontal frame, 7b ... Vertical frame, 8 ... Opening, 9 ... Notch, 10 ... Holding piece, 11 ...
・ Space, 21 ・ ・ ・ Frame removal jig, 22 ・ ・ ・
Wedge-shaped protrusion

Claims (2)

[Claims] 1. A plating frame for an IC package, comprising a plurality of pin holding portions each having a pin insertion hole for inserting and holding the pin tip end portion at a position corresponding to the pin of the IC package. A plating frame for an IC package, characterized in that a slot is formed on an outer peripheral side of the pin insertion hole, the slot being in communication with the pin insertion hole, and a small hole is formed in the middle of the slot. 2. A plating frame for an IC package, which has a plurality of pin holding portions in which pin insertion holes for inserting and holding the pin tips are formed at positions corresponding to the pins of the IC package. A method for removing a plating frame of an IC package to be subsequently removed from the IC package, the small frame being provided in the middle of a slot leading to the pin insertion hole formed on the outer peripheral side of the pin insertion hole of the pin holding portion. An IC characterized in that a wedge-shaped member is inserted into the hole to expand the pin insertion hole, and then the pin of the IC package is extracted from the pin insertion hole.
How to remove the package plating frame.