JPH08263172A - Electronic equipment housing structure and its manufacture - Google Patents

Abstract

(57) [Summary] [Object] The present invention provides a resin molding means using a solid molding die in which a non-ferrous metal layer formed of a sheet-shaped material is integrally formed on at least a part of the surface of a base made of a conductive resin. By adopting this, a stable and highly reliable shield effect can be provided, and at the same time, a part of the non-ferrous metal sheet can be inflated by the injection pressure of the resin to form a logo mark or the like three-dimensionally. [Structure] Inside the solid molding dies 21a, 21b,
A roll-shaped non-ferrous metal sheet (13) is supplied, and the outer peripheral shape required after molding is punched out at the stage of closing the mold. The non-ferrous metal sheet (13) punched out inside the solid molding dies 21a, 21b is then injected with a high-pressure thermoplastic thermoplastic resin (12) from the injection port,
A shape is formed inside the molds 21a and 21b along the concave shape of the molds. The resin injection pressure at this time forms a display such as a logo in a convex shape.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a casing structure of a portable electronic device and a method for manufacturing a portable electronic device casing in a handy type information processing device equipped with an electronic pen or the like.

[0002]

2. Description of the Related Art In recent years, various small-sized personal word processors, personal computers, handy terminals and the like having a pen input mechanism which are easy to carry such as book size and notebook size have been developed.

In these small electronic devices, a tablet board for pen input is provided on the upper surface of the device main body, and a pen case is provided on the back (rear surface) part of the device main body to release the lid (protective cover). As a result, a device having a structure in which the pen stored in the pen case can be taken out and used is developed. 5 and 6 show a structural example of a conventional electronic device casing of this type.
Shown in

In the figure, reference numeral 51 is a cover forming a part of the housing, 52 is a base forming a part of the housing together with the cover 51, and 53 is an input display section 54 provided on the top surface of the housing. Is a lid (protective cover) for protecting the.

As shown in FIG. 6, an input display section 54, which is a combination of an electromagnetic tablet 54a and a liquid crystal display device (LCD) 54b with a backlight, is provided on the upper surface of the housing consisting of the cover 51 and the base 52. . Further, inside the housing, a P mounting electronic circuit parts including a CPU chip is mounted.
A CB (printed wiring board) 60 is fixed in a fixed position with a screw S and stored.

A cover 51 and a base 52 which form a housing
Respectively, as shown in FIG.
And the surface treatment layer 6 formed on the surface of the thermoplastic resin 63
2 and the coating layer 61 for makeup. That is,
Each of the thermoplastic resins 63, 63 of the cover 51 and the base 52
Conductive coating or plating treatment of aluminum, nickel or the like is formed on the surface of the to form the surface treatment layers 62, 62,
Further, a coating material for makeup is applied to the surface of the coating layer 6 for makeup.
1, 61 are formed.

At this time, the surface treatment layers 62, 6 are formed between a part of the base 52 and the cover 51 during the coating process.
The two surface treatment layers 62 of the base 52 and the surface treatment layer 62 of the cover 51 need to be electrically conductive to shield each other.
It is a condition that masking is applied to a part that is partially meshed with and with a tape or the like to expose the conductive part on the surface.

The cover 51 and the base 52 are integrated by screwing in a state where the surface treatment layers 62 are in electrical contact with each other on the outer peripheral portion, and the surface treatment layer 62 of the cover 51 and the surface treatment layer 62 of the base 52 are integrated. Forms a shield space inside the housing.

Due to the shielded space formed by the surface treatment layer 62, a PCB (printed wiring board) 6 housed inside the housing is provided.
It prevents the interference wave radiated from the electronic circuit on the outside of the housing from leaking. In the housing, the surface treatment layer 62 is a PCB (printed wiring board) via, for example, a screw S.
It is connected to the ground line (ground pattern) of 60.

The conventional casing structure as described above has various problems as described below. That is,
There is a problem in that the masking process using a tape or the like is required after the plating process to form the conductive portion, and therefore a lot of man-hours are required, resulting in an increase in cost.

Also in the quality after the surface treatment, the surface hardness is low because of the structure of coating on the resin,
This product does not have sufficient quality for abrasion resistance in products that emphasize portability, and requires a separate process such as silk screen printing for logos. It was also an expensive member.

Further, since the shielded space is formed in the housing only after the masked portions of the surface treatment layer 62 are brought into electrical contact with each other reliably,
There is a problem that product unevenness easily occurs and reliability is poor.

As described above, conventionally, each processing work step such as masking processing with tape or the like after plating processing, printing processing of logos and the like in another step is required, and in addition, abrasion resistance, reliability and the like are required. There was a problem in terms of workability, product cost, quality, etc. that satisfactory quality could not be obtained.

[0014]

As described above, in the conventional portable electronic equipment casing structure, masking treatment with tape or the like after plating treatment, printing treatment of logo or the like in a separate process, etc. Each processing work step is required, and there are problems in terms of workability and product cost. Moreover, there is a problem that satisfactory quality cannot be obtained in terms of abrasion resistance and the like. Further, there is a problem that reliability is poor in forming a shield.

The present invention has been made in view of the above circumstances,
(EN) Provided are a portable electronic device housing which can be manufactured easily and inexpensively, can have a highly reliable shield effect, and can obtain satisfactory quality in terms of abrasion resistance, and a manufacturing method of the housing. The purpose is to

[0016]

According to the present invention, in a portable electronic equipment casing structure, a non-ferrous metal layer formed of a sheet material is integrally formed on at least a part of the surface of a base made of a conductive resin. It is characterized by being configured.

Further, according to the present invention, in a portable electronic equipment casing constructed by combining a cover portion and a base portion, a base body made of a heat-plasticizable conductive resin constituting the base portion, and this base body. Base-side non-ferrous metal layer integrally formed on at least a part of the surface of the base, a base made of a heat-plasticizable conductive resin forming the cover, and a cover-side non-ferrous metal integrally formed on at least a part of the surface of the base. And a means for electrically connecting the non-ferrous metal layers to each other through the base body.

Furthermore, the present invention is characterized in that, in the above-mentioned electronic equipment housing structure, the non-ferrous metal layer forming the housing surface is formed of a sheet-like material having a thickness of 600 μm or less. .

Further, the present invention is the above electronic device housing structure, wherein the non-ferrous metal layer forming the housing surface is a plastic sheet on the surface of which silkscreen, offset printing is used for decorative printing, or similar treatment. It is characterized in that it is formed of a bonded material.

Further, the present invention is characterized in that, in the above-mentioned electronic equipment housing structure, a non-ferrous metal surface is subjected to a makeup treatment, and further an ultraviolet curing treatment is applied to the surface. Further, the present invention is a method of manufacturing a portable electronic device housing, in which a non-ferrous metal sheet is supplied to a solid molding machine, and the sheet is punched into a required shape by press working before injection of a thermoplastic resin, and thereafter. The thermosetting resin is injected into the molding machine, and the non-ferrous metal sheet is three-dimensionally formed into a predetermined mold shape by the injection pressure.

Further, the present invention is characterized in that, in the above-mentioned manufacturing method, a conductive thermoplastic resin is injected into a molding machine, and a nonferrous metal sheet is three-dimensionally formed into a predetermined mold shape by its injection pressure. To do.

Further, in the above-mentioned manufacturing method according to the present invention, a non-ferrous metal sheet is engraved by engraving a display character such as a logo mark on a part of a mold forming a solid molding machine by engraving, and by the injection pressure of the thermoplastic resin. It is characterized by inflating a part of the so that a logo mark or the like is three-dimensionally formed.

Further, according to the present invention, in the above-mentioned manufacturing method, a plurality of housing parts formed by solid molding are assembled with a fastening member, and then brought into surface contact with each other, and are internally mounted by the shielding effect. It is also characterized by preventing the leakage of interfering radio waves emitted from the electronic circuit section.

[0024]

As described above, according to the present invention, the plating treatment is performed by using the resin molding means in which the non-ferrous metal layer formed of the sheet-shaped material is integrally formed on at least a part of the surface of the base made of the conductive resin. It is possible to have a stable and highly reliable shield effect without the need for a masking process with tape etc. afterwards, and with the injection pressure of resin without the need for a separate printing process such as printing a logo. A part of the non-ferrous metal sheet can be inflated to form a logo mark or the like three-dimensionally. As a result, it is possible to easily and inexpensively manufacture a portable electronic device casing having a shield effect, which is obtained by subjecting an uneven surface treatment such as a logo.

[0025]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an external configuration of a portable information input device equipped with an electronic pen in one embodiment of the present invention, and FIG. 2 is a line AA of the information input device shown in FIG. FIG.

In FIGS. 1 and 2, reference numeral 1 is a cover which constitutes a part of a housing made of a thermo-plasticizing conductive resin as a base, and 2 is a part of a housing made of a thermo-plasticizing conductive resin as a base. It is the base that composes.

Reference numeral 3 denotes a lid (protective cover) rotatably provided on the back surface (rear surface) of the housing via a hinge mechanism. Reference numeral 4 denotes an input display unit provided on the upper surface of the housing composed of the cover 1 and the base 2, and as shown in FIG. 2, an electromagnetic tablet 4a and a liquid crystal display device with a backlight (LC).
D) 4b and are overlapped.

Reference numeral 5 is the electromagnetic tablet 4 of the input display section 4.
The electronic pen operated on a is housed in a pen case provided on the rear surface of the housing, and is taken out from the pen case for use.

Inside the housing consisting of the cover 1 and the base 2, the electronic circuit parts including the CPU chip are mounted P
A CB (printed wiring board) 11 is fixed and stored in place with a screw S. By tightening the screw S at this time, the PCB
The circuit (GND pattern) on the ground (GND) side of the (printed wiring board) 11 is electrically connected (grounded) to the base 2 made of a conductive resin.

The cover 1 and the base 2 constituting the casing are
As shown in FIG. 2, respectively, the thermoplastic conductive resin 12
And a surface treatment layer 13 made of a non-ferrous metal sheet integrally formed on the surface of the resin 12, an external cosmetic printing layer 14 formed on the surface, and a curing treatment layer 15 with ultraviolet rays or the like. The display portion 16 for a logo or the like is formed at a predetermined portion. The molding means (integral molding means using a solid molding die) for the surface treatment layer 13 made of the non-ferrous metal sheet and the display portion 16 such as a logo at this time will be described later with reference to FIGS. 3 and 4.

The cover 1 and the base 2 which form the above-mentioned housing
Both of them are made of a heat-plasticizing conductive resin mixed with metal powder such as copper or stainless steel. Therefore, when they are integrally assembled by tightening a screw or the like, an electromagnetic shield space is formed in the housing. Further, at this time, each non-ferrous metal sheet layer (surface-treated layer of the non-ferrous metal sheet) 1 via the heat-plasticizable conductive resin 12, 12 of the cover 1 and the base 2
Since 3 and 13 are conductively connected to each other, a double (two-layer) shield space is formed in the housing in the non-ferrous metal sheet portion. At this time, the cover 1 and the base 2
Is not an electrically conductive connection between the electrical contact pieces, but is electrically contacted by direct joining of the end faces, so that a conventional masking process using a tape or the like is not required,
A double shield is applied to the main part, and a highly reliable and stable shield effect can be obtained.

Further, the non-ferrous metal sheet layer (the surface-treated layer of the non-ferrous metal sheet) 13 and the display portion 16 for a logo or the like.
Since they are simultaneously formed in a single solid molding step, it is possible to easily and inexpensively manufacture a portable electronic device housing having a shield effect, which is provided with an uneven surface treatment such as a logo.

The solid molding process of the portable electronic device casing according to the present invention in this case will be described with reference to FIGS. 3 and 4. FIG. 3 is a view showing a pressed state of a sheet inside a mold for explaining an example of a method for manufacturing a casing structure according to the present invention.

It is necessary after the molding at the stage where the non-ferrous metal sheet (13) having a thickness of about 300 μ is supplied into the solid molding dies 21a and 21b and the mold 21a (or 21b) is closed. Punch out the outer peripheral shape.
At this time, the thermoplastic conductive resin (1
2) is not fired.

That is, in FIG. 3, the non-ferrous metal sheet (1) supplied inside the solid molding dies 21a, 21b.
In 3), at the same time when the molds 21a and 21b are almost closed, the peripheral edges of the molds 21a and 21b are pressed (punched) to form a solidly required shape after solid molding. At this time, the molds 21a and 21b are completely closed, and the non-ferrous metal sheet (13) is set in the molds 21a and 21b.
They are located in the gap formed by each other.

FIG. 4 is a view showing a solid molding state after the press working step in FIG. The non-ferrous metal sheet (13) punched out inside the solid molding dies 21a, 21b is then injected with a high-temperature thermoplastic plastic conductive resin (12) from the injection port 22 to produce the dies 21a, 2b.
A shape is formed along the concave shape of the mold inside 1b.

In this process, the display portion 16 such as the logo is provided on a part of the mold by the non-ferrous metal sheet (13) stretched by the pressure when the thermo-plasticizing conductive resin (12) is injected at a high pressure. The shape is formed along the shape of the recess. At this point, the display of the logo or the like is formed in a convex shape.

That is, in FIG. 4, the molds 21a and 21b are
The non-ferrous metal sheet (13) located in the gap formed between the two is a logo mark previously formed on the mold 21b by the pressure of the thermo-plasticizing conductive resin (12) injected at a high pressure from the injection port 22. Etc. is pressed into the concave portion. Then mold 21
The thermo-plasticizing conductive resin (12) is cooled inside a and 21b, and the non-ferrous metal sheet (13) and the thermo-plasticizing conductive resin (1
2) and 1 are integrated, and the cover 1 and the base 2 having a predetermined shape are obtained.

FIG. 2 shows an example of a display portion such as a logo formed in the concave portion of the mold due to the fitting state of the housing and the pressure during the molding after the solid molding. A non-ferrous metal sheet (13) is covered on the outer surface of the base 2 mainly composed of the thermoplastic conductive resin 12, and a display portion 16 having a convex shape such as a logo is formed on a part thereof.

On the surface of the non-ferrous metal sheet layer (the surface-treated layer made of a non-ferrous metal sheet) 13, a print layer 14 for appearance makeup is formed for the purpose of cosmetic makeup, and the surface hardness is further improved on the upper surface thereof. For that purpose, the ultraviolet curing treatment layer 15 is formed.

Since the cover 1 and the base 2 are integrated by the tightening screw, the integrated cover 1 and the base 2 are formed on the mutual end faces of the heat-plasticizable conductive resins 12, 12 which are the bases thereof. Conductive contact is made, whereby a substantially box-shaped, electrically conductive electromagnetic shield housing is obtained.

The non-ferrous metal sheet thus surface-treated is supplied to the solid forming machine, and the non-ferrous metal sheet is punched into a required shape by press working before the injection of the thermo-plasticizing conductive resin, and then the forming machine. By injecting a thermo-plastic conductive resin into, and by injection pressure, three-dimensionally forming a non-ferrous metal sheet into a predetermined mold shape, in a simple and easy process, surface treatment such as any logo mark was applied, An electronic device casing having a high electromagnetic shield effect can be obtained.

As described above, according to the embodiment of the present invention, in order to prevent the leakage of the interfering radio waves to the outside of the housing, the thermo-plasticizing conductive resin is solid-molded, so that aluminum and nickel which have been conventionally implemented are used. A coating structure such as the above is not required, and at the same time, the quality of the housing is stable and an inexpensive housing structure can be realized.

Further, it is possible to easily obtain a case having a shield structure in which necessary parts are doubled (two layers). Further, by using a casing material mainly composed of non-ferrous metal, a product having higher toughness can be provided.

Further, by subjecting the surface of the housing to the ultraviolet curing treatment, the surface hardness can be improved, and it becomes possible to provide a product having higher wear resistance. Further, since the logo and the like can be integrally formed and the convex shape can be displayed at the same time as the molding inside the die, the product can be easily differentiated.

Further, by forming the external part of the housing with a non-ferrous metal, the housing has a high toughness, so that the amount of resin to be integrally molded is reduced, and it is possible to provide an inexpensive and lightweight product. Becomes

In the above embodiment, the thickness of the non-ferrous metal sheet layer (surface-treated layer of non-ferrous metal sheet) 13 is set to 3
Although it is about 00 μ, the configuration is not limited to this, and a non-ferrous metal sheet having a thickness of about 600 μ or less may be used.

[0048]

As described above in detail, according to the present invention, it is possible to easily and inexpensively manufacture, and to provide a highly reliable shield effect, and to obtain a satisfactory quality in terms of abrasion resistance. A portable electronic device housing and a method for manufacturing the housing can be provided.

That is, according to the present invention, in order to prevent interfering radio waves from leaking to the outside of the housing, the thermo-plasticizing conductive resin is solid-molded, so that the conventional coating process of aluminum, nickel or the like is unnecessary. At the same time, it is possible to realize a stable and inexpensive housing structure. In addition, it is possible to easily obtain a casing having a shield structure in which necessary portions are doubled (two layers). Further, by using a casing material mainly composed of non-ferrous metal, a product having higher toughness can be provided. Further, by applying an ultraviolet curing treatment to the surface of the housing, it is possible to improve the surface hardness, and it is possible to provide a product with more abrasion resistance. or,
At the same time as the molding process inside the mold, the display process of the logo and the like can be integrally performed, and since the display in the convex shape is possible, product differentiation and the like can be easily performed. Also, by forming the exterior part of the housing with a non-ferrous metal, the housing has high toughness, so the amount of resin that is integrally molded decreases.
It is possible to provide inexpensive and lightweight products.

[Brief description of drawings]

FIG. 1 is a perspective view showing an external configuration of a portable information input device equipped with an electronic pen according to an embodiment of the present invention.

2 is a cross-sectional view of the information input device shown in FIG. 1 taken along the line AA.

FIG. 3 is a view showing an initial processing state of a non-ferrous metal sheet inside a solid molding die in the above embodiment.

FIG. 4 is a diagram showing a solid-molded state after processing in FIG.

FIG. 5 is a perspective view showing an external configuration of a portable information input device including a conventional electronic pen.

6 is a sectional view taken along line BB of the information input device shown in FIG.

[Explanation of symbols]

1 ... Cover, 2 ... Base, 3 ... Lid (protective cover), 4
... input display section, 4a ... electromagnetic tablet, 4b ... backlit liquid crystal display (LCD), 5 ... electronic pen, 11
... PCB (printed wiring board), 12 ... Thermoplastic conductive resin,
Reference numeral 13 ... Surface treatment layer (non-ferrous metal sheet layer), 14 ... Appearance cosmetic print layer, 15 ... UV curing treatment layer, 16 ... Logo and other display portions, 21a, 21b ... Solid molding die, 22 ...
Ejection port, S ... screw.

Claims (9)

[Claims] 1. A portable electronic device casing structure in which a non-ferrous metal layer is integrally formed on at least a part of the surface of a base made of a heat-plasticizable conductive resin. 2. In a portable electronic equipment casing formed by combining a cover portion and a base portion, a base body made of a thermoplastic conductive resin forming the base portion, and at least a part of this base body. A base-side non-ferrous metal layer integrally formed on the surface, a base body made of a thermo-plasticizing conductive resin forming a cover portion, a cover-side non-ferrous metal layer integrally formed on at least a part of the surface of the base, A portable electronic device casing structure, comprising means for electrically connecting the respective non-ferrous metal layers to each other through the base body. 3. The non-ferrous metal layer forming the surface of the housing is 60
The electronic device casing structure according to claim 1, which is formed of a sheet-shaped material having a thickness of 0 μ or less. 4. The non-ferrous metal layer forming the surface of the housing is silk-screened on the surface, and decorative printing by offset printing,
Alternatively, the electronic device housing structure according to claim 1 or 2, which is formed of a material obtained by adhering a plastic sheet that has been subjected to similar processing. 5. The electronic device casing structure according to claim 4, wherein the surface of the non-ferrous metal is subjected to a makeup treatment, and further the surface thereof is subjected to an ultraviolet curing treatment. 6. A non-ferrous metal sheet is fed to a solid forming machine, the sheet is punched into a required shape by press working before the injection of the thermoplastic resin, and then the thermoplastic resin is injected into the forming machine, A method for manufacturing a portable electronic device housing, which comprises three-dimensionally forming a non-ferrous metal sheet into a predetermined mold shape by the injection pressure. 7. The portable electronic device according to claim 6, wherein the non-ferrous metal sheet is three-dimensionally formed into a predetermined mold shape by injecting a conductive thermoplastic resin into a molding machine and injecting the injection pressure. Manufacturing method of housing. 8. A solid molding machine is partially engraved with display characters such as a logo mark by a carving process on a part of a die, and a part of a non-ferrous metal sheet is inflated by injection pressure of a thermoplastic resin to form a logo mark or the like. 7. The method for manufacturing a portable electronic device casing according to claim 6, wherein the three-dimensional structure is formed. 9. An interference radiated from an internally mounted electronic circuit portion due to a shielding effect of a plurality of casing parts formed by solid molding, which are assembled by a fastening member and then brought into surface contact with each other. 7. The method for manufacturing a portable electronic device housing according to claim 6, wherein leakage of radio waves is prevented.