JPH08264382A - Substrate for coupling dielectric filter - Google Patents

Abstract

(57) [Summary] [Structure] For dielectric filter coupling, which is composed of a calcining material 11 having a calcining temperature of 900 ° C. or less and in which the input / output electrodes 16 and 17 and the coupling capacitors C _{1 to} C ₃ are integrated. Substrate 10. [Effect] When a coaxial resonator or the like is connected, the effect as a two-stage bandpass filter can be obtained, and parts such as a chip capacitor are omitted, and the soldering work is eliminated, so that the solder removal Since troubles can be prevented and the input / output electrodes 16 and 17 are integrally formed on the surfaces 11b, 11c, and 11d of the dielectric substrate 11, the size can be reduced and the handling can be facilitated. It can be surface mounted. Further, since the input / output electrodes 16 and 17 can be prevented from being damaged, the strength confirmation test and the like can be omitted, and as a result, the cost can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric filter coupling substrate, and more particularly, to a coaxial resonator or the like, for example, a car phone, a mobile phone, a fire radio, an MCA (Multi).
Channel Acess: a dielectric filter coupling substrate mounted in a circuit using microwaves in a commercial wireless system), CATV, or the like.

[0002]

2. Description of the Related Art Conventionally, various types of substrates as shown below have been used as substrates for coupling dielectric filters. (1) A surface mount type chip capacitor. (2) A type in which a single plate capacitor is surface-mounted. (3) An inductor using a winding coil is connected. (4) A type in which a chip inductor is mounted. (5) A type in which the above (1) to (4) are combined. (6) A type in which an electrode pattern is printed on a dielectric substrate and is used as a coupling capacitor. (7) A type in which the inductor in (3) or (4) is combined with the inductor in (6).

FIG. 5 is a perspective view schematically showing a dielectric filter coupling substrate of the type in which a conventional chip capacitor of this type is surface-mounted, and 51 in the figure shows an insulating substrate. The insulator substrate 51 is made of glass epoxy resin, alumina firing material or the like.
A low resistivity material such as Cu
Electrodes 52a to 52d made of (copper) or Ag (silver) are formed. Electrodes 52a-52b, 52b-52c, 52c
Chip capacitors 53a to 53c are surface-mounted by high temperature solder 56 on electrodes 52a to 52d, respectively.
Input terminals 5 made of, for example, a thin phosphor bronze plate are provided for a and 52d.
4. Output terminal 55 is connected using high temperature solder 56. These insulator substrate 51, electrodes 52a to 52d,
Chip capacitors 53a to 53c, input / output terminals 54,
A dielectric filter coupling substrate 50 including 55 and the like is configured. Further, for example, the coaxial resonators 41 and 42 (FIG. 2) are connected to the electrodes 52b and 52c, respectively. In that case, the one terminals 41a and 42a are connected to the electrodes 52b and 52c, respectively. Terminals 41b, 42
b is connected to ground 43 (FIG. 2).

In the dielectric filter coupling substrate 50 having such a structure, as shown in the equivalent circuit diagram of FIG. 2, the coupling capacitors for coupling the coaxial resonators 41 and 42 mainly by the chip capacitors 53a to 53c. C _{1 to} C ₃
Is formed. When the microwave signal is input from the input terminal 54, it is filtered by the coupling capacitors C _{1 to} C ₃ and the coaxial resonators 41 and 42, and the microwave signal in the predetermined frequency band is output from the output terminal 55.

FIG. 6 is a perspective view schematically showing a dielectric filter coupling substrate of a type in which a conventional chip capacitor and an inductor using a winding coil are combined, and 61 in the figure is an insulating substrate. Shows. Similar to that shown in FIG. 5, the insulating substrate 61 is formed by using a glass epoxy resin, an alumina firing material or the like, and a low resistivity material such as Cu
Electrodes 62a to 62e made of Ag or Ag are formed. On the electrodes 62a and 62e, on the electrodes 62a and 62c, on the electrode 62
The chip capacitors 63a, 63b, 63c, 63d are provided on the electrodes b, 62d and the electrodes 62b, 62e with the high temperature solder 67.
Are surface mounted. Also, the electrodes 62a to
A winding coil 64 is connected between 62b using high temperature solder 67, and an input terminal 65 and an output terminal 66 made of, for example, a thin phosphor bronze plate using high temperature solder 67 on the electrodes 62a and 62b. Each is connected. These insulator substrate 61, electrodes 62a to 62e, chip capacitors 63a to 63d, winding coil 64, input / output terminal 6
A dielectric filter coupling substrate 60 including 5, 66 and the like is configured. Further, for example, coaxial resonators 41 and 42 (FIG. 4) are connected to the electrodes 62c and 62d, respectively. In that case, the terminals 41a and 42a are connected.
Is connected to the electrodes 62c and 62d, and the other terminals 41b,
42b is connected to ground 43 (FIG. 2).

In the dielectric filter coupling substrate 60 thus constructed, as shown in the equivalent circuit diagram of FIG. 4, the inductor L ₁ is formed by the winding coil 64 and mainly the chip capacitors 63a to 63d. coaxial resonators 41 and 42, coupling capacitors C ₁ -C ₄ for coupling the inductor L ₁ is formed. When the microwave signal is input from the input terminal 65, the coupling capacitors C _{1 to} C ₄ , the inductor L ₁ , the coaxial resonator 41,
At 42, a signal having a predetermined frequency bandwidth is cut and output from the output terminal 66.

FIG. 7 is a perspective view schematically showing a dielectric filter coupling substrate of a type in which a conventional single plate capacitor and an inductor using a winding coil are combined.
Reference numeral 71 in the figure denotes an insulating substrate. Like the one shown in FIG. 5, the insulator substrate 71 is formed by using glass epoxy resin, alumina firing material, or the like.
A low-resistivity material such as Cu or A is provided at a predetermined position on the upper side.
An electrode 72 made of g is formed. Single plate capacitors 73a and 73d are surface-mounted on the electrode 72 by high temperature solder 77, respectively.
A winding coil 74 is connected between d using high temperature solder 77. Further, on the single plate capacitors 73a and 73d, for example, an input terminal 75 and an output terminal 76 made of a thin phosphor bronze plate are provided.
Are connected by using high temperature solder 77, and the single plate capacitors 73b, 73c are sandwiched by the winding coil 74 and the input / output terminals 75, 76 on the single plate capacitors 73a, 73d by using high temperature solder (not shown). Are connected to each other. These insulator substrate 71, electrode 72, single plate capacitors 73a to 73d, winding coil 74, input / output terminal 75,
A dielectric filter coupling substrate 70 including 76 and the like is configured. Further, for example, the coaxial resonator 4 is provided on the electrode 72.
1 and 42 (FIG. 4) are connected to each other. In this case, the one terminal 41a and 42a are connected to the upper surfaces of the single plate capacitors 73b and 73c, and the other terminal 41 is connected.
b and 42b are connected to the electrode 72 as a ground.

In the dielectric filter coupling substrate 70 thus configured, as shown in the equivalent circuit diagram of FIG. 4, the winding coil 74 forms the inductor L ₁ and the single plate capacitors 73a to 73d. coaxial resonators 41 and 42, coupling capacitors C ₁ -C ₄ for coupling the inductor L ₁ is formed. When the microwave signal is input from the input terminal 75, the coupling capacitors C ₁ to
A signal having a predetermined frequency bandwidth is cut off at C ₄ , the inductor L ₁ , and the coaxial resonators 41 and 42, and the output terminal 76
Will be output.

[0009]

In the above-described dielectric filter coupling substrates 50, 60, 70, the chip capacitors 53a-53c, 63a-63d, the single plate capacitors 73a-73d, the winding coils 64, 74, The output terminals 54 to 55, 65 to 66, 75 to 76, etc. are required, and many parts are required.
It is troublesome to connect using 7 and 77, and there are problems that it is costly and it is difficult to reduce the size. Circuit board using high temperature solder (both not shown)
When connecting the dielectric filter coupling substrates 50, 60, and 70 to the same or the like, the soldered portions 56, 67, and 77 of each component are easily detached due to thermal stress or the like, and it is difficult to maintain desired filter characteristics. was there. I / O terminal 5
4 to 55, 65 to 66, and 76 to 77 are formed of a thin plate of phosphor bronze or the like, which is relatively weak in strength, and protrude from the insulating substrates 51, 61, 71, and are easily detached or damaged during handling, There is a problem that it is necessary to perform a pre-shipment test such as a tensile strength test to confirm the presence or absence of damage, which results in cost increase.

Further, in a type in which an electrode pattern is printed on a dielectric substrate and is used as a coupling capacitor, there is a problem that the area of the electrode pattern becomes large and it is difficult to miniaturize it. It was

The present invention has been made in view of the above problems, and can integrate an input / output terminal, a coupling capacitor, and an inductor, reduce the number of parts to be soldered, and reduce the cost. It is an object of the present invention to provide a dielectric filter coupling substrate that can prevent problems such as detachment of solder and damage to input / output terminals, can be miniaturized, and can be surface-mounted.

[0012]

In order to achieve the above object, a dielectric filter coupling substrate according to the present invention comprises a firing material having a firing temperature of 900 ° C. or less, and an input / output electrode and a coupling capacitor, Alternatively, the input / output electrode, the coupling capacitor, and the inductor are integrated.

[0013]

A dielectric material obtained by adding an oxide additive of Al-Cu-Si-B to an oxide dielectric material of Ba-Nd-Ti-Bi-Pb can be fired at a temperature of 900 ° C or lower. Therefore, a green sheet is formed using these materials, and electrodes having a predetermined shape and a predetermined interval are screen-printed on the green sheet by using a low resistivity paste such as Ag or Cu, and after laminating these. When firing is performed at a predetermined temperature of 900 ° C. or less, the coupling capacitor and the inductor are integrally formed between the electrodes on the surface of or inside the dielectric substrate. Further, after masking the surface of the dielectric substrate, immersing it in a paste liquid such as Ag, Cu, etc. and baking it, input / output electrodes are integrally formed at predetermined locations on the surface of this dielectric substrate. It will be.

According to the dielectric filter coupling substrate having the above-mentioned structure, the substrate is made of a firing material having a firing temperature of 900 ° C. or lower,
Since the input / output electrode and the coupling capacitor, or the input / output electrode, the coupling capacitor and the inductor are integrated, a coaxial resonator or the like is connected to a predetermined position on the dielectric filter coupling substrate. Then, the action as a bandpass filter or a notch filter can be obtained. Further, since the parts such as the chip capacitor, the winding coil, the input / output terminal and the like are omitted, and the trouble of soldering these parts is eliminated, the occurrence of the solder detachment trouble can be prevented. Further, since the number of parts is small and the input / output electrodes are integrally formed on the surface of the substrate, the size can be reduced, the handling can be facilitated, and the surface mounting can be performed. . Further, since the input / output electrodes can be prevented from being damaged, the strength confirmation test and the like can be omitted, and as a result, the cost can be reduced.

[0015]

Embodiments of the dielectric filter coupling substrate according to the present invention will be described below with reference to the drawings. In addition, the same symbols are given to the components having the same functions as those of the conventional example. FIG. 1 is a schematic diagram showing a first embodiment of a dielectric filter coupling substrate according to the present invention, in which (a) is a perspective view,
(B) is the sectional view on the AA line in (a). The dielectric substrate 11 is made of Ba-N that can be fired at a temperature of 900 ° C. or lower.
Al-Cu-Si- was added to the oxide system of d-Ti-Bi-Pb.
It is formed into a substantially rectangular parallelepiped shape by using a material or the like to which the oxide-based additive of B is added, and electrodes 12 and 13 having a predetermined shape are formed at predetermined positions on the upper surface 11a of the dielectric substrate. The electrodes 14 and 15 having a predetermined shape are embedded in predetermined positions. Extraction electrodes 14a from the electrodes 14 and 15,
15a is extended outward, and the extraction electrodes 14a, 15
A substantially L-shaped input electrode 16 and output electrode 17 extend from the end a along the side surfaces 11b and 11c and the lower surface 11d of the dielectric substrate 11. Input / output electrodes 16, 1
7, the extraction electrodes 14a and 15a, and the electrodes 12 to 15 are formed by using a low-resistivity material such as Cu or Ag, and the electrodes 12 to 15 are each set to a predetermined distance. The dielectric filter coupling substrate 10 is configured to include the dielectric substrate 11, electrodes 12 to 15, extraction electrodes 14a and 15a, input / output electrodes 16 and 17, and the like. Further, for example, the coaxial resonator 4 is provided at a predetermined position on the dielectric substrate 11.
1 and 42 (FIG. 2) are connected to each other. In that case, the one terminals 41a and 42a are connected to the electrode 12,
13 and the other terminals 41b and 42b are connected to the ground 43 (FIG. 2).

When manufacturing the dielectric filter coupling substrate 10 having the above-described structure, first, Ba-Nd-Ti-B is prepared.
A substantially plate-shaped green sheet is formed by adding a binder or the like to a material or the like obtained by adding an Al-Cu-Si-B oxide-based additive to an i-Pb oxide-based additive. Then, screen printing is performed on this green sheet using a paste of Cu or Ag to form patterns to be the electrodes 12 to 15 and the extraction electrodes 14a and 15a, respectively. Next, these green sheets are dried, then laminated and thermocompression bonded. Next, after baking this laminated body at a predetermined temperature of about 900 ° C. or lower, it is masked, dipped in a paste liquid such as Ag, Cu, etc. and baked, and the input / output electrode 1 is formed at a predetermined position on the surface of the baked body.
6, 17 are formed.

In the dielectric filter coupling substrate 10 thus configured, as shown in the equivalent circuit diagram of FIG. 2, between the electrodes 12 to 13 sandwiching the dielectric substrate 11 and between the electrodes 12 to 14.
, And coupling capacitors C ₂ , C ₁ and C ₃ for coupling the coaxial resonators 41 and 42 are formed between the electrodes 13 to 15, respectively. When the microwave signal is input from the input electrode 16, it is filtered by the coupling capacitors C _{1 to} C ₃ and the coaxial resonators 41 and 42, and the microwave signal in a predetermined frequency band is output from the output electrode 17. It

As is apparent from the above description, in the dielectric filter coupling substrate 10 according to the first embodiment, the firing temperature is 9
The input / output electrode 1 is made of a fired material 11 whose temperature is 00 ° C. or lower.
Since 6, 17 and the coupling capacitors C _{1 to} C ₃ are integrated, when the coaxial resonators 41, 42 (FIG. 2) or the like are connected to predetermined locations on the dielectric filter coupling substrate 10, The effect as a two-stage bandpass filter can be obtained. Further, since the parts such as the chip capacitor, the winding coil, the input / output terminal and the like are omitted, and the trouble of soldering these parts is eliminated, it is possible to prevent the occurrence of the solder detachment trouble. Further, the number of parts is small, and the input / output electrodes 16 and 17 are provided on the surfaces 11b and 1 of the dielectric substrate 11.
Since it is formed integrally with 1c and 11d, it can be made compact and easy to handle, and can be surface-mounted. Further, the input / output electrodes 16 and 1
Since the damage of No. 7 can be prevented, the strength confirmation test and the like can be omitted, and as a result, the cost can be reduced.

3A and 3B are schematic views showing a dielectric filter coupling substrate according to the second embodiment. FIG. 3A is a perspective view and FIG.
FIG. 7A is a sectional view taken along line AA in (a). Dielectric substrate 2
1 is Ba-Nd-T that can be fired at a temperature of 900 ° C or lower.
It is formed into a substantially rectangular parallelepiped shape by using a material obtained by adding an Al-Cu-Si-B oxide-based additive to an i-Bi-Pb oxide-based material, and is formed at a predetermined position on the dielectric substrate upper surface 21a. The electrodes 22 and 23 having a predetermined shape are formed. In addition, electrodes 24, 25 having a predetermined shape are provided at predetermined locations inside the dielectric substrate 21.
Are embedded, and electrodes 26 and 27 having a predetermined shape are formed on the lower surface 21d of the dielectric substrate, and the electrodes 26 and 27 are connected to the ground 43 (FIG. 4). A coil electrode 28 is embedded in a horizontal plane between the electrodes 24 and 25, one end of the coil electrode 28 is connected to the electrode 24, and the other end of the coil electrode 28 is a through hole 28a, a connection electrode 29, and a through hole. It is connected to the electrode 25 through the hole 25b and the like. Further, the extraction electrode 2 is connected to the electrodes 24 and 25.
4a and 25a are extended outward and lead electrodes 24a and 25a are provided.
A substantially L-shaped input electrode 31 and output electrode 32 are extended from the end a along the side surfaces 21b and 21c and the lower surface 21d of the dielectric substrate 21. Input / output electrodes 31, 3
2, extraction electrodes 24a and 25a, coil electrode 28, electrode 2
2 to 27 are formed using a low resistivity material such as Cu or Ag, and the electrodes 22 to 27 are each set to a predetermined distance. These dielectric substrate 21, electrode 22
To 27, the extraction electrodes 24a and 25a, the coil electrode 28, the input / output electrodes 31 and 32, and the like, the dielectric filter coupling substrate 20 is configured. Further, for example, coaxial resonators 41 and 42 (FIG. 2) are respectively connected to predetermined locations on the dielectric substrate 21, and in this case, the terminals 41a and 42a are connected to the electrodes 22 and 23, respectively. Then, the other terminals 41b and 42b are connected to the ground 43 (FIG. 2).

When manufacturing the dielectric filter coupling substrate 20 having the above-described structure, first, Ba-Nd-Ti-B is prepared.
A substantially plate-shaped green sheet is formed by adding a binder or the like to a material or the like obtained by adding an Al-Cu-Si-B oxide-based additive to an i-Pb oxide-based additive. Next, punching is performed on predetermined portions of the green sheet to form the through holes 28.
After forming a and 25b, screen printing is performed on this green sheet using a paste of Cu or Ag to form electrodes 22 to 27, extraction electrodes 24a and 25a, and coil electrode 2.
8 and patterns to be the connection electrodes 29 are formed.
Next, these green sheets are dried, then laminated and thermocompression bonded. Next, after the laminated body is fired at a predetermined temperature of about 900 ° C. or less, a predetermined portion of the surface of the fired body is masked and dipped in a paste liquid such as Ag, Cu or the like, and fired. , 32 are formed.

In the dielectric filter coupling substrate 20 thus constructed, as shown in the equivalent circuit diagram of FIG. 4, the inductor L ₁ is formed by the coil electrode 28 and the electrodes sandwiching the dielectric substrate 21 are formed. Between 22 and 24, electrode 23
Between 25, between the electrodes 24 to 26, coaxial resonators 41 and 42, coupling capacitor C ₂ for coupling the inductor _{L 1, C 3, C 1} , C 4 are respectively formed between the electrodes 25 to 27. When the microwave signal is input from the input electrode 31, the coupling capacitors C _{1 to} C ₄ and the inductor L are connected.
_{1. In} the coaxial resonators 41 and 42, a signal having a predetermined frequency bandwidth is cut and output from the output electrode 32.

As is clear from the above description, in the dielectric filter coupling substrate 20 according to the second embodiment, the firing temperature is 9
The input / output electrode 3 is made of a fired material 21 having a temperature of 00 ° C. or lower.
Since 1, 32, the coupling capacitors C _{1 to} C ₄ and the inductor L ₁ are integrated, when the coaxial type resonators 41, 42, etc. are connected to predetermined locations on the dielectric filter coupling substrate 20. The effect as a two-stage notch filter can be obtained. Further, since the parts such as the chip capacitor, the winding coil, the input / output terminal and the like are omitted, and the trouble of soldering these parts is eliminated, it is possible to prevent the occurrence of the solder detachment trouble. Further, the number of parts is small, and the input / output electrodes 31 and 32 are on the surface 21 of the dielectric substrate 21.
Since it is formed integrally with b, 21c, and 21d, it is possible to achieve downsizing and easy handling,
Moreover, surface mounting can be performed. Input / output electrode 3
Since damage to Nos. 1 and 32 can be prevented, the strength confirmation test and the like can be omitted, and as a result, the cost can be reduced.

[0023]

As described above in detail, the dielectric filter coupling substrate according to the present invention is made of a calcined material having a calcining temperature of 900 ° C. or less, and has an input / output electrode and a coupling capacitor, or Since the entry output electrode, the coupling capacitor and the inductor are integrated, when a coaxial resonator or the like is connected to a predetermined location on the dielectric filter coupling substrate, a bandpass filter or a notch filter is formed. The effect can be obtained. Also chip capacitors,
Parts such as winding coil and input / output terminals are omitted,
Since the trouble of soldering these pieces is eliminated, it is possible to prevent the trouble of detaching the solder. Further, since the number of parts is small and the input / output electrodes are integrally formed on the surface of the substrate, the size can be reduced and the handling can be facilitated, and the surface mounting can be performed. . Further, since it is possible to prevent the input / output electrodes from being damaged, it is possible to omit the strength confirmation test and the like, and as a result, it is possible to reduce the cost.

[Brief description of drawings]

1A and 1B are schematic views showing a first embodiment of a dielectric filter coupling substrate according to the present invention, in which FIG. 1A is a perspective view and FIG. 1B is a sectional view taken along line AA in FIG.

FIG. 2 is an equivalent circuit diagram shown for explaining the effect of the dielectric filter coupling substrate according to the first example or the conventional example.

3A and 3B are schematic diagrams showing a dielectric filter coupling substrate according to Example 2, where FIG. 3A is a perspective view and FIG. 3B is a sectional view taken along line AA in FIG. 3A.

FIG. 4 is an equivalent circuit diagram shown for explaining the effect of the dielectric filter coupling substrate according to the second embodiment or the conventional example.

FIG. 5 is a perspective view schematically showing a dielectric filter coupling substrate of a type in which a conventional chip capacitor is surface-mounted.

FIG. 6 is a perspective view schematically showing a dielectric filter coupling substrate of a type in which a conventional chip capacitor and an inductor using a winding coil are combined.

FIG. 7 is a perspective view schematically showing a dielectric filter coupling substrate of a type in which a conventional single plate capacitor and an inductor using a winding coil are combined.

[Explanation of symbols]

10 Dielectric Filter Coupling Substrate 16 Input Electrode 17 Output Electrode C ₁ , C ₂ , C ₃ Coupling Capacitor

Claims (1)

[Claims] 1. An input / output electrode and a coupling capacitor, or the input / output electrode, the coupling capacitor and an inductor are integrated, which is made of a burning material having a firing temperature of 900 ° C. or less. Substrate for coupling dielectric filter.