JPH08264588A - Bonding method - Google Patents

Abstract

(57) [Summary] [Objective] When bonding a TAB film to a liquid crystal display panel, it is possible to extremely easily adjust the irradiation light amount by two light sources used for confirming the positions of both. [Configuration] Light emitted from the first light source 4 is emitted from the liquid crystal display panel 2
The alignment mark of No. 1 is irradiated and the reflected light is CC
It is incident on the D-type image sensor 8. The light emitted from the second light source 5 is applied to the alignment mark on the TAB film 31, and the reflected light is incident on the CCD type image pickup device 8. In this case, the first and second light sources 4, 5 are connected to the switching circuit 1
When the light is alternately turned on by the action of 3, the both image recognition results by the CCD type image pickup device 8 are alternately displayed on the monitor television 6 for a short time, but it seems that both image recognition results are simultaneously displayed due to the afterimage phenomenon. Will be seen. By alternately turning on both the light sources 4 and 5, it is not necessary to consider the balance of each irradiation light amount and the total irradiation light amount so much.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding method for bonding one electronic component to another electronic component.

[0002]

2. Description of the Related Art For example, a TA in which a semiconductor chip for driving the liquid crystal display panel is mounted on the liquid crystal display panel.
Bonding one end of B film,
When one electronic component is bonded to another electronic component, generally, the two are aligned and then the bonding is performed.

FIG. 3 shows an outline of a conventional bonding apparatus used in such a case. This bonding apparatus includes a first moving stage 1, a second moving stage 2, a camera 3, first and second light sources 4 and 5 including a halogen lamp, a monitor television 6, a bonding head 7 and the like. . Of these, the first and second moving stages 1 and 2 are movable in the horizontal direction and can be finely adjusted in the X and Y directions. In addition,
A predetermined portion of the first moving stage 1 is a transparent portion. The camera 3 includes a CCD image pickup device 8 and a half mirror 9.
And a lens 10, and is fixedly arranged below the first moving stage 1 together with the first and second light sources 4 and 5. The CCD image pickup device 8 of the camera 3 is connected to the monitor television 6, and the first and second light sources 4 and 5 are connected to the first and second power supplies 11 and 12, respectively. Bonding head 7 is the first
Is arranged above the moving stage 1 so as to be vertically movable.

A liquid crystal display panel 21 is arranged and positioned on the first moving stage 1 in the X, Y and θ directions. As shown in FIG. 4, in the liquid crystal display panel 21, one end portion of the lower transparent substrate 22 is projected from the upper transparent substrate 23, and the connection terminal 24 is provided on the upper surface of the projected portion.
Is provided, and a cross-shaped alignment mark 25 is provided at both ends of the upper surface of the projecting portion. In this case, the connection terminal 24 and the alignment mark 25 are made of the same material (ITO) as the transparent display electrode (not shown) of the liquid crystal display panel 21.

A TAB film 31 is positioned and arranged in the X, Y and θ directions on the second moving stage 2. In this case, a predetermined one end of the TAB film 31 is projected from the second moving stage 2 toward the first moving stage 2 by a predetermined amount. T
As shown in FIG. 5, the AB film 31 has a slit (outer lead hole) 3 in which a connection terminal (outer lead) 33 is formed in the lower surface of one end of a film substrate 32.
4, and the cross-shaped alignment marks 35 are provided on both ends of the lower surface of one end of the film substrate 32. In this case, the connection terminal 33 and the alignment mark 35 are formed of the same material (Cu) as the wiring pattern (not shown) of the TAB film 31. Although not shown, a solder layer is provided on the surface of at least one of the connection terminal 33 of the TAB film 31 and the connection terminal 24 of the liquid crystal display panel 21.

When performing bonding with this bonding apparatus, first, the first and second moving stages 1 and 2 are positioned at the bonding position. In this state, one end portion of the TAB film 31 protruding from the second moving stage 2 has the lower transparent substrate 2 of the liquid crystal display panel 21.
The TAB film 31 is positioned above the protruding portion of the second TAB film 31.
Alignment marks 35 provided at two predetermined positions at one end of the alignment mark 2 provided at two predetermined positions on the protruding portion of the lower transparent substrate 22 of the liquid crystal display panel 21.
5 will be superposed on each other due to the mechanical positional accuracy.
Since the alignment marks 25 and 35 are provided at two positions respectively, two sets of the camera 3 and the like are provided correspondingly, but one set will be described. However, there may be one monitor television 6.

Next, both the first and second light sources 4 and 5 are turned on. Then, the light emitted horizontally from the first light source 4 is reflected right above by the half mirror 9, and the reflected light is reflected by the lens 10, the transparent portion of the first stage 1 and the lower transparent substrate of the liquid crystal display panel 21. After passing through 22, the alignment mark 25 of the liquid crystal display panel 21 is irradiated with the reflected light, and after passing through the lower transparent substrate 22 of the liquid crystal display panel 21 and the transparent portion of the first stage 1, the reflected light is condensed by the lens 10. The condensed light passes through the half mirror 9 and then enters the CCD type image pickup device 8. On the other hand, the light emitted obliquely upward from the second light source 5 passes through the transparent portion of the first stage 1, the lower transparent substrate 22 of the liquid crystal display panel 21 and the alignment mark 25, and then becomes the alignment mark 35 of the TAB film 31. The reflected light is irradiated and transmitted through the alignment mark 25 of the liquid crystal display panel 21, the lower transparent substrate 22 and the transparent portion of the first stage 1 and then condensed by the lens 10, and the condensed light is a half mirror. After passing through 9, it is incident on the CCD type image pickup device 8. Therefore, the CCD image pickup device 8 simultaneously recognizes the images of both alignment marks 25 and 35. Then, the recognition result is displayed on the monitor television 6.
Therefore, the operator visually recognizes the positional deviation of both alignment marks 25 and 35 based on the images corresponding to the both alignment marks 25 and 35 displayed on the monitor television 6, and if there is a positional deviation, By finely adjusting the first or second stage 1, 2 in the X and Y directions,
The position of the liquid crystal display panel 21 or the TAB film 31 is corrected to align the liquid crystal display panel 21 and the TAB film 31. And when the alignment is finished,
The bonding head 7 is lowered to perform bonding, and the connection terminal 33 of the TAB film 31 is conductively connected to the connection terminal 24 of the liquid crystal display panel 21 via solder.

Here, the light from the first light source 4 is irradiated onto the alignment mark 25 of the liquid crystal display panel 21 from directly below, and the light from the second light source 5 is irradiated onto the alignment mark 35 of the TAB film 31 from obliquely below. The reason for doing so will be explained. Since ITO, which is a material of the alignment mark 25 of the liquid crystal display panel 21, is transparent, when the light is irradiated from directly below, the irradiation light is reflected by the alignment mark 25. Is transmitted through the alignment mark 25 without being reflected by the alignment mark 25. Therefore, as described above, when the alignment mark 25 of the liquid crystal display panel 21 is image-recognized, light is emitted from directly below, and when the alignment mark 35 of the TAB film 31 is image-recognized, light is obliquely illuminated from below. Will be irradiated. As a result, two light sources, that is, the first light source 4 for irradiating light from directly below and the second light source 5 for irradiating light from diagonally below are required.

[0009]

However, in such a conventional bonding method, the CCD type image pickup device 8 is used.
Therefore, since the first and second light sources 4 and 5 need to be turned on at the same time in order to simultaneously recognize the images of both alignment marks 25 and 35, there was the following problem. 1
On the other hand, if the irradiation light amount (brightness) for both alignment marks 25, 35 is different, the mark with the smaller irradiation light amount becomes difficult to see, and it becomes difficult for the CCD image pickup device 8 to recognize the image for this mark. In order to make both the alignment marks 25 and 35 easy to see, it is necessary to balance the irradiation light amount with respect to both the alignment marks 25 and 35, but there is a problem that the adjustment is difficult. Moreover, when the image is recognized by the CCD type image pickup device 8 or the like, the range of the total irradiation light amount is determined by the CCD type image pickup device 8 or the like, so that the irradiation light amount is balanced and the total irradiation light amount is also taken into consideration. It must be done, and the adjustment becomes even more difficult.
The other is that the light from directly below and the light from diagonally below cancel each other's illumination effect, so that the alignment marks 25 and 35 are different from those when individually illuminated.
Is difficult to see, and a complicated and expensive image processing device is required for image recognition. An object of the present invention is to provide a bonding method capable of extremely easily adjusting the irradiation light amount by both light sources and capable of recognizing an image without using a complicated and expensive image processing apparatus.

[0010]

According to the first aspect of the present invention,
When bonding one electronic component to another electronic component having a transparent portion, first position the one electronic component on the other electronic component, and then obliquely from directly below the transparent portion of the other electronic component. Alternately radiate light from below, the light from directly below is reflected at a predetermined location of the other electronic component and the reflected light obtained from a diagonally downward direction is reflected at a predetermined location of the one electronic component. Based on the obtained reflected light, each predetermined part of the both electronic parts is image-recognized by a camera, the recognition result is displayed on a monitor TV, and then the one or other electronic parts are displayed based on the displayed image. The position of the component is corrected to align the one electronic component with the other electronic component, and then the one electronic component is bonded onto the other electronic component. Claim 2
In the invention described above, both recognition results by the camera are alternately displayed on the monitor television for a short time. According to a third aspect of the present invention, one of the two recognition results by the camera is delayed and the other is displayed on the monitor television at the same time.

[0011]

According to the first aspect of the invention, since light is alternately emitted from directly below and obliquely below the transparent portion of another electronic component, the light from directly below is emitted at a predetermined position of the other electronic component. The reflected light obtained by reflection and the reflected light obtained by reflecting the light from diagonally below at one predetermined position of one electronic component are alternately incident on the camera, and therefore each predetermined position of both electronic components by the camera. Will be recognized alternately. In this case, when the both recognition results by the camera are alternately displayed on the monitor television for a short time as in the second aspect of the invention, each image corresponding to both recognition results is simultaneously displayed on the monitor television due to an afterimage phenomenon. It will be visually recognized as displayed. As a result, the light source for irradiation from directly below and the light source for irradiation from diagonally below should be alternately turned on. Therefore, it is necessary to consider the balance of the irradiation light amounts of both light sources and the total irradiation light amount so much. Therefore, it becomes possible to adjust the irradiation light amount by both light sources extremely easily. Further, since a predetermined location of one electronic component and a predetermined location of another electronic component are alternately irradiated, each predetermined location does not become difficult to see, and therefore a complicated and expensive image processing device is used. The image can be recognized without any trouble. When one of the two recognition results by the camera is delayed and the other is simultaneously displayed on the monitor television as in the invention described in claim 3, a better image can be obtained than in the case of the display by the afterimage phenomenon. It will be.

[0012]

1 is a schematic view of a bonding apparatus according to an embodiment of the present invention. In this figure,
The same parts as those in FIG. 3 are designated by the same reference numerals, and the description thereof will be omitted as appropriate. In this embodiment, the first and second light sources 4,
Reference numeral 5 is connected to the first and second power supplies 11 and 12 via the switching circuit 13, respectively.

When performing bonding with this bonding apparatus, first, the first and second moving stages 1 and 2 are positioned at the bonding position. In this state, one end portion of the TAB film 31 protruding from the second moving stage 2 has the lower transparent substrate 2 of the liquid crystal display panel 21.
The TAB film 31 is positioned above the protruding portion of the second TAB film 31.
Alignment marks (not shown) provided at two predetermined positions on one end of the liquid crystal display panel 21 are transparent substrates 2 on the lower side.
The alignment marks (not shown) provided at two predetermined positions of the two protruding portions are superposed on each other with mechanical position accuracy. Up to this point, it is the same as the conventional case.

Next, the first and second light sources 4 and 5 are alternately turned on by the action of the switching circuit 13. When the first light source 4 is turned on, the light emitted in the horizontal direction from the first light source 4 is reflected right above by the half mirror 9, and the reflected light is applied to the alignment mark of the liquid crystal display panel 21, The reflected light is condensed by the lens 10 and then incident on the CCD type image pickup device 8, so that the alignment mark of the liquid crystal display panel 21 is image-recognized by the CCD type image pickup device 8. Then, the recognition result is displayed on the monitor television 6. On the other hand, when the second light source 5 is turned on, the light emitted obliquely upward from the second light source 5 is TA
The alignment mark of the B film 31 is irradiated, and the reflected light is condensed by the lens 10 and then is incident on the CCD type image pickup element 8, and the CCD type image pickup element 8 causes TAB.
The alignment mark on the film 31 is image-recognized. Then, the recognition result is displayed on the monitor television 6.

In this case, the CCD type image pickup device 8 alternately recognizes both alignment marks, but if switching by the switching circuit 13 is performed at high speed, CC will occur.
Both recognition results by the D-type image pickup device 8 are alternately displayed on the monitor television 6 for a short time. Then, due to the afterimage phenomenon, each image corresponding to both recognition results is visually recognized as being simultaneously displayed on the monitor television 6.
Therefore, the worker, based on the images corresponding to both alignment marks displayed on the monitor TV 6,
The positional deviation of both alignment marks is visually checked, and if there is a positional deviation, it will be corrected. When the alignment is completed, the bonding head 7 is lowered to perform bonding, and the connection terminals (not shown) of the TAB film 31 are soldered (not shown) to the connection terminals (not shown) of the liquid crystal display panel 21. Conductive connection through.

As described above, the light source 4 for irradiation from directly below
Since it is only necessary to alternately turn on and the light source 5 for obliquely irradiating from below, it is not necessary to consider the balance of the amount of irradiation light by both light sources 4, 5 and the total amount of irradiation light much.
As a result, it is possible to extremely easily adjust the irradiation light amount by the both light sources 4 and 5. In addition, since the alignment marks of the liquid crystal display panel 21 and the alignment marks of the TAB film 31 may be alternately irradiated, it is possible to prevent the alignment marks from being difficult to see, and thus, without using a complicated and expensive image processing device. Can be recognized.

Next, FIG. 2 shows a part of a circuit of a bonding apparatus according to another embodiment of the present invention.
This circuit delays one of the two recognition results by the CCD image pickup device 8 and displays it on the monitor television 6 at the same time as the other. Explaining this circuit, the CCD image pickup device 8 is connected to the movable contact 41a of the switching circuit 41. The switching circuit 41 includes two fixed contacts 41b and 41c in addition to the movable contact 41a.
It has. And the movable contact 4 which is normally in the neutral position
When 1a is connected to one fixed contact 41b, C
A video signal corresponding to the alignment mark of the liquid crystal display panel 21 photographed by the CD image pickup device 8 is sent to the delay circuit 42, while the movable contact 41a is fixed to the other fixed contact 41c.
When it is connected to, the video signal corresponding to the alignment mark of the TAB film 31 photographed by the CCD type image pickup device 8 is sent to the other input section 43b of the synthesizing circuit 43. The delay circuit 42 delays the input video signal by a predetermined time and sends the delayed video signal to one input section 43a of the synthesizing circuit 43. Synthesis circuit 4
3 has one output unit 43c in addition to two input units 43a and 43b, and synthesizes a video signal input to one input unit 43a and a video signal input to the other input unit 43b, and synthesizes them. The signal is output from the output section 43c to the monitor television 6
It is designed to be sent to.

Therefore, in the case of this embodiment, the switching timing of the switching circuit 41 and the delay time of the delay circuit 42 are shown in FIG.
When it corresponds to the switching timing by 3,
The video signal corresponding to the alignment mark of the liquid crystal display panel 21 taken by the CCD image pickup device 8 is delayed by the delay circuit 42.
Is input to one input portion 43a of the synthesizing circuit 43 after being delayed by a predetermined time, and at the same time, a video signal corresponding to the alignment mark of the TAB film 31 photographed by the CCD image pickup element 8 is inputted to the synthesizing circuit 43. The input signal is input to the other input section 43b, and the combined signal of both video signals is output from the output section 43c to the monitor television 6. As a result, each image corresponding to both alignment marks is simultaneously displayed on the monitor television 6. Therefore, in the case of this embodiment, a better image can be obtained than in the case of the display by the afterimage phenomenon. The delayed video signal may be the reverse of the above case.

[0019]

As described above, according to the present invention, the light source for irradiation from directly below and the light source for irradiation from diagonally below may be alternately turned on, so that the amount of irradiation light from both light sources can be changed. The balance and the total irradiation light amount need not be considered so much, and thus the irradiation light amounts of both light sources can be adjusted extremely easily. Further, since it is only necessary to irradiate a predetermined location of one electronic component and a predetermined location of another electronic component alternately, each predetermined location does not become difficult to see, and therefore a complicated and expensive image processing device is not used. Images can be recognized.

[Brief description of drawings]

FIG. 1 is a schematic view of a bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a circuit diagram of a part of a bonding apparatus according to another embodiment of the present invention.

FIG. 3 is a schematic view of a conventional bonding apparatus.

FIG. 4 is a plan view of a part of the liquid crystal display panel.

FIG. 5 is a plan view of a part of the TAB film.

[Explanation of symbols]

 3 camera 4, 5 light source 6 monitor TV 13 switching circuit 21 liquid crystal display panel 31 TAB film

Claims (4)

[Claims] 1. When bonding one electronic component onto another electronic component having a transparent portion, the one electronic component is first positioned on the other electronic component, and then the transparent portion of the other electronic component. The light from below and the light from diagonally below and the light from below is obtained by being reflected at a predetermined location of the other electronic component, and the light from below is predetermined to the one electronic component. Based on the reflected light obtained by being reflected at the location, each predetermined location of the both electronic components is image-recognized by the camera, these recognition results are displayed on the monitor TV, and then the above-mentioned image is displayed based on the displayed image. Correcting the position of one or other electronic component to align the one electronic component with the other electronic component, and then bond the one electronic component onto the other electronic component. Characteristic bonding method. 2. The bonding method according to claim 1, wherein both recognition results by the camera are alternately displayed on the monitor television for a short time. 3. The bonding method according to claim 1, wherein one of the two recognition results by the camera is delayed and the other is simultaneously displayed on the monitor television. 4. The bonding method according to claim 1, wherein the one electronic component is a TAB film and the other electronic component is a liquid crystal display panel.