JPH0828568B2 - Printed circuit board soldering device with inert gas sealing device - Google Patents
Printed circuit board soldering device with inert gas sealing deviceInfo
- Publication number
- JPH0828568B2 JPH0828568B2 JP2202550A JP20255090A JPH0828568B2 JP H0828568 B2 JPH0828568 B2 JP H0828568B2 JP 2202550 A JP2202550 A JP 2202550A JP 20255090 A JP20255090 A JP 20255090A JP H0828568 B2 JPH0828568 B2 JP H0828568B2
- Authority
- JP
- Japan
- Prior art keywords
- inert gas
- circuit board
- printed circuit
- soldering
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、はんだ付け装置内に充満する不活性ガス
が外部へ流出するのを封止する不活性ガス封止装置を備
えたプリント基板のはんだ付け装置に関するものであ
る。Description: TECHNICAL FIELD The present invention relates to a printed circuit board provided with an inert gas sealing device that seals the inert gas filling the soldering device from flowing out. The present invention relates to a soldering device.
従来、プリント基板を不活性ガスの中ではんだ付けを
行うプリント基板のはんだ付け装置は、予備加熱装置と
はんだ槽とをカバーで覆ってはんだ付け処理室を形成
し、このはんだ付け処理室内にボンベ等から供給される
不活性ガスを充満してはんだ付け処理を行うか、プリン
ト基板の搬送方向に対してはんだ付け装置の前段の搬入
口と後段の搬出口にシャッター等による開閉装置を設け
たものもあった。Conventionally, a printed circuit board soldering device for soldering a printed circuit board in an inert gas forms a soldering treatment chamber by covering a preheating device and a solder bath with a cover, and a cylinder is placed in the soldering treatment chamber. The soldering process is performed by filling the inert gas supplied from the etc., or the opening and closing devices such as shutters are provided at the carry-in inlet and the carry-out outlet of the soldering device in the conveying direction of the printed circuit board. There was also.
ところで、従来の不活性ガス内ではんだ付けを行うは
んだ付け装置は、はんだ付け処理室内の不活性ガスが加
圧された状態にあるため、プリント基板の搬入口や搬出
口から流出してしまうので、はんだ付け処理室内へ不活
性ガスを常時補充しなければならず、したがって、高価
な不活性ガスの使用量が多くなって製造コストが増大す
るという問題点があった。By the way, in a conventional soldering device that performs soldering in an inert gas, since the inert gas in the soldering processing chamber is under pressure, it may flow out from the carry-in port or carry-out port of the printed circuit board. However, there is a problem that the inert gas must be constantly replenished in the soldering processing chamber, and therefore the amount of expensive inert gas used increases and the manufacturing cost increases.
この発明は、上記の問題点を解消するためになされた
もので、はんだ付け処理室内に充満した不活性ガスが外
部へ流出するのを封止するようにしたプリント基板のは
んだ付け装置を得ることを目的とする。The present invention has been made in order to solve the above problems, and to obtain a soldering apparatus for a printed circuit board that seals the outflow of the inert gas filled in the soldering processing chamber to the outside. With the goal.
この発明に係るプリント基板のはんだ付け装置は、電
子部品を装着したプリント基板を搬送し、不活性ガスを
充満させてはんだ付けを行うはんだ付け処理室を設け、
プリント基板の搬送方向に対してはんだ付け処理室の前
段と後段に空気およびはんだ付け処理室内の不活性ガス
よりも軽い不活性ガスを上方に滞留させた第１の不活性
ガス室と第２の不活性ガス室とをプリント基板の搬送レ
ベルよりも上方に設け、これらの第１の不活性ガス室と
第２の不活性ガス室内にプリント基板をその搬送レベル
から上昇させる上昇装置と、上昇したプリント基板を水
平方向に搬送させる水平搬送装置と、水平に搬送されて
きたプリント基板を下降させる下降装置とをプリント基
板の搬送方向に対して順次設け、さらにはんだ付け処理
室内の不活性ガスが外部へ流出するのを第1,第２の不活
性ガス室内の不活性ガスにより封止させるための仕切板
を第１の不活性ガス室と第２の不活性ガス室の各下面か
ら上方に向けて各上昇装置と下降装置との間に設けたも
のである。The printed circuit board soldering apparatus according to the present invention conveys a printed circuit board on which electronic components are mounted, and is provided with a soldering processing chamber for filling an inert gas for soldering.
The first inert gas chamber and the second inert gas chamber in which air and an inert gas lighter than the inert gas in the soldering treatment chamber are retained upward in the front and rear stages of the soldering treatment chamber with respect to the conveyance direction of the printed circuit board. An inert gas chamber is provided above the carrying level of the printed circuit board, and a raising device for raising the printed circuit board from the carrying level into the first inert gas chamber and the second inert gas chamber is raised. A horizontal transfer device for horizontally transferring the printed circuit board and a lowering device for lowering the horizontally transferred printed circuit board are sequentially provided in the transfer direction of the printed circuit board. A partition plate for sealing the outflow to the first and second inert gas chambers with the inert gas is directed upward from the lower surface of each of the first inert gas chamber and the second inert gas chamber. Each In which it provided between the temperature device and a lowered device.
この発明の不活性ガス封止装置を備えたプリント基板
のはんだ付け装置は、プリント基板は第1,第２の不活性
ガス室内を上昇してから水平方向に搬送された後、下降
することにより仕切板の上を乗り越えるようにして搬送
される。In the soldering apparatus for a printed circuit board provided with the inert gas sealing device of the present invention, the printed circuit board is raised in the first and second inert gas chambers, horizontally conveyed, and then lowered. It is transported so as to get over the partition plate.
この発明の実施例を説明する前に、この発明の基礎と
なるプリント基板のはんだ付け装置（実開平3-91195号
公報参照）について説明する。第１図（ａ），（ｂ）は
前記プリント基板のはんだ付け装置を示す平断面図と側
断面図で、１ははんだ付け装置の全体を示し、２は基
台、３は前記基台２の上部を覆うカバー、４は後述の不
活性ガスを充満した第１の不活性ガス室、５ははんだ付
け処理室、６は第２の不活性ガス室、７は前記第1,第２
の不活性ガス室4,6内でその上面から下方に向けて鉛直
方向に形成された仕切板で、その下方の部分は電子部品
（図示せず）を装着したプリント基板８が通過するよう
になっている。なお、各不活性ガス室4,6はプリント基
板８の搬送レベルよりも下方で、かつ搬送方向に対して
はんだ付け処理室５の前段と後段に設けられている。11
は前記はんだ付け処理室５内に設けた予備加熱装置、12
は同じくはんだ槽である。21,24,26,29は前記プリント
基板８を載置して搬送する手段としての搬送コンベア、
22,27は前記搬送コンベア21,26から搬送されてきたプリ
ント基板８を上下動する一対の無端状のチェーンに設け
た係合片に把持して下降させる搬送手段としての下降装
置、23,28は前記下降装置22,27から移送されてきたプリ
ント基板８を上下動する一対の無端状のチェーンの係合
片に把持して上昇させる搬送手段としての上昇装置で、
プリント基板８の搬送方向に対して順次設けられ、かつ
下降装置22,27と上昇装置23,28との間には仕切板７によ
り仕切られている。25は前記プリント基板８を保持爪
（図示せず）に係合して搬送する手段としての搬送チェ
ーンである。なお、搬送コンベア21,24,26,29および搬
送チェーン25はプリント基板８の搬送レベルとなる。31
〜36は前記プリント基板８を搬送して次段へ乗り移らせ
る動作を行わせるシリンダで、主としてロッドレスシリ
ンダが使用されている。41,51,61はボンベで、ボンベ4
1,61はいずれも外部の空気Airおよび後述の第２の不活
性ガスGas2よりも重いアルゴン等からなる第１の不活性
ガスGas1が充填されている。ボンベ51は外部の空気Air
よりも軽いヘリウム等からなる第２の不活性ガスGas2が
充填されている。42,52,62はガス量調整用バルブ、43,5
3,63は切換弁、44,54,64,65は前記第1,第２の不活性ガ
スGas1,Gas2の濃度を検出するガスセンサである。Before describing the embodiments of the present invention, a printed circuit board soldering apparatus (see Japanese Utility Model Laid-Open No. 3-91195), which is the basis of the present invention, will be described. FIGS. 1 (a) and 1 (b) are a plan sectional view and a side sectional view showing a soldering device for the printed circuit board, where 1 is the whole of the soldering device, 2 is a base, and 3 is the base 2. A cover for covering the upper part of the above, 4 is a first inert gas chamber filled with an inert gas described later, 5 is a soldering treatment chamber, 6 is a second inert gas chamber, and 7 is the first and second
Is a partition plate formed vertically in the inert gas chambers 4, 6 from its upper surface downward so that the printed circuit board 8 on which electronic components (not shown) are mounted passes therethrough. Has become. The inert gas chambers 4 and 6 are provided below the carrying level of the printed circuit board 8 and in the front and rear stages of the soldering processing chamber 5 in the carrying direction. 11
Is a preheating device provided in the soldering chamber 5, 12
Is also a solder bath. 21,24,26,29 are conveyors as means for mounting and conveying the printed circuit board 8,
Numerals 22 and 27 are descending devices as conveying means for grasping the printed circuit board 8 conveyed from the conveyer conveyors 21 and 26 by engaging pieces provided on a pair of endless chains that move up and down and lowering it. Is a lifting device as a conveying means for gripping and lifting the printed circuit board 8 transferred from the lowering devices 22 and 27 by the engaging pieces of a pair of endless chains that move up and down.
The printed circuit board 8 is sequentially provided in the conveying direction, and the lowering devices 22 and 27 and the rising devices 23 and 28 are partitioned by a partition plate 7. Reference numeral 25 denotes a transport chain as a means for transporting the printed circuit board 8 by engaging a holding claw (not shown). The transport conveyors 21, 24, 26, 29 and the transport chain 25 are at the transport level of the printed circuit board 8. 31
Numerals to 36 are cylinders for carrying the printed circuit board 8 and moving it to the next stage, and mainly rodless cylinders are used. 41,51,61 are cylinders, cylinder 4
Each of 1,61 is filled with outside air Air and a first inert gas Gas 1 composed of argon or the like, which is heavier than a second inert gas Gas 2 described later. The cylinder 51 is the outside air Air
The second inert gas Gas 2 made of helium or the like, which is lighter in weight, is filled. 42,52,62 are valves for adjusting gas amount, 43,5
3, 63 is a switching valve, and 44, 54, 64, 65 are gas sensors for detecting the concentrations of the first and second inert gases Gas 1 and Gas 2 .
なお、第1,第２の不活性ガスは実施例の説明のために
用いる適宜的呼称である。The first and second inert gases are proper names used for explaining the embodiments.
次に、動作について説明する。 Next, the operation will be described.
まず、ボンベ51のバルブ52を開いて第２の不活性ガス
Gas2を噴出して、はんだ付け処理室５内の空気Airを追
い出して第２の不活性ガスGas2で充満させる。次いで、
ボンベ41,61のバルブ42,62を開いて第１の不活性ガスGa
s1を噴出して噴出して第1,第２の不活性ガス室4,6内の
空気Airを追い出して空気より重い第１の活性ガスGas1
で充満させ、第１の不活性ガスGas1と、第２の不活性ガ
スGas2と外部の空気Airとの境界となるレベルが第１図
（ｂ）の中の破線で示す位置になるように各不活性ガス
Gas1,Gas2の噴出量を調整する。First, open the valve 52 of the cylinder 51 to open the second inert gas.
Gas 2 is jetted to expel the air Air in the soldering processing chamber 5 and fill it with the second inert gas Gas 2 . Then
Open the valves 42 and 62 of the cylinders 41 and 61 to open the first inert gas Ga.
s 1 is ejected and ejected to expel the air Air in the first and second inert gas chambers 4 and 6, and the first active gas that is heavier than air Gas 1
So that the level of the boundary between the first inert gas Gas 1 and the second inert gas Gas 2 and the outside air Air becomes the position shown by the broken line in FIG. 1 (b). To each inert gas
Adjust the injection amount of Gas 1 and Gas 2 .
次に、搬送コンベア21に載置されたプリント基板８は
矢印Ａ方向に搬送された後、シリンダ31の駆動により第
１の不活性ガス室４内に入り、下降装置22に係合され
る。次いで、プリント基板８は下降し、第１の不活性ガ
スGas1の中に入る。次いで、シリンダ32の駆動により仕
切板７の下方を通過し、上昇装置23へ搬送されてから上
昇し、第２の不活性ガスGas2が充満されているはんだ付
け処理室５の中に入る。次いで、プリント基板８はシリ
ンダ33の駆動により搬送コンベア24へ移送された後、搬
送チェーン25の保持爪に係合して走行し、予備加熱装置
11で加熱された後、はんだ槽12ではんだ付けされる。次
いで、搬送コンベア26に載置されてから、さらにシリン
ダ34の駆動で第２の不活性ガス室６内に入り、下降装置
27に係合されて下降し、第１の不活性ガスGas1の中に入
る。次いで、シリンダ35により仕切板７の下方を通過
し、上昇装置28で搬送され、第１の不活性ガスGas1から
脱出して空気Airの中に入り、シリンダ36により搬送コ
ンベア29へ載置され、送出される。Next, the printed circuit board 8 placed on the transfer conveyer 21 is transferred in the direction of arrow A, and then driven by the cylinder 31 to enter the first inert gas chamber 4 and is engaged with the lowering device 22. Next, the printed circuit board 8 descends and enters the first inert gas Gas 1 . Next, the cylinder 32 is driven to pass under the partition plate 7, is conveyed to the elevating device 23, and then ascends to enter the soldering processing chamber 5 filled with the second inert gas Gas 2 . Next, the printed circuit board 8 is transferred to the transfer conveyor 24 by the drive of the cylinder 33, then engages with the holding claws of the transfer chain 25 and runs, and the preheating device
After being heated at 11, it is soldered at a solder bath 12. Next, after being placed on the transport conveyor 26, the cylinder 34 is driven to enter the second inert gas chamber 6 and the descending device.
It is engaged with 27, descends, and enters the first inert gas Gas 1 . Next, the cylinder 35 passes below the partition plate 7, is transported by the lifting device 28, escapes from the first inert gas Gas 1 and enters the air Air, and is mounted on the transport conveyor 29 by the cylinder 36. , Sent out.
第２図はこの発明の一実施例を示す側断面図で、第１
図と同一符号は同一部分を示し、71ははんだ付け装置の
全体を示す。72は基台、73はカバー、74は仕切板であ
る。なお、第１図に示すボンベ41,51,61関係の図示は省
略してある。FIG. 2 is a side sectional view showing an embodiment of the present invention.
The same reference numerals as those in the figure denote the same parts, and 71 denotes the entire soldering apparatus. 72 is a base, 73 is a cover, and 74 is a partition plate. The illustration of the cylinders 41, 51, 61 shown in FIG. 1 is omitted.
このように、第２図においては、第1,第２の不活性ガ
ス室4,6の各下降装置22,27と各上昇装置23,28とがプリ
ント基板８を搬送する搬送コンベア21,24,26,29,搬送チ
ェーン25の搬送レベルより上方に取り付けられている。
このため、第1,第２の不活性ガス室4,6の内部には空気A
irおよび第１の不活性ガスGas1よりも軽い第２の不活性
ガスGas2が充満し、空気Airと遮断されている。As described above, in FIG. 2, the conveyors 21, 24 for conveying the printed circuit board 8 by the descending devices 22, 27 and the ascending devices 23, 28 of the first and second inert gas chambers 4, 6, respectively. , 26, 29 and above the carrying level of the carrying chain 25.
For this reason, the air A is placed inside the first and second inert gas chambers 4 and 6.
ir and the second inert gas Gas 2, which is lighter than the first inert gas Gas 1, is filled and is cut off from the air Air.
また、はんだ付け処理室５内には空気Airより重い第
１の不活性ガスGas1で充満されている。The soldering chamber 5 is filled with the first inert gas Gas 1 heavier than the air Air.
動作については第１図と同様であるため、その説明を
省略する。Since the operation is the same as that in FIG. 1, its explanation is omitted.
第３図はこの発明のさらに他の実施例を示す側断面図
で、第１図，第２図と同一符号は同一部分を示し、81は
電子部品をはんだぺーストではんだ付けを行うリフロー
はんだ付け装置の全体を示し、82は１次予備加熱室、83
は２次予備加熱室、84ははんだぺーストを融解してはん
だ付け処理を行うリフロー室、85は搬送チェーン、86は
送風機、87はヒータ、88は基台、89はカバー、90は仕切
板である。FIG. 3 is a side sectional view showing still another embodiment of the present invention, the same reference numerals as those in FIGS. 1 and 2 designate the same parts, and 81 is a reflow solder for soldering electronic parts by a solder paste. Shows the whole of the attachment device, 82 is the primary preheating chamber, 83
Is a secondary preheating chamber, 84 is a reflow chamber for melting solder paste and performing soldering processing, 85 is a transport chain, 86 is a blower, 87 is a heater, 88 is a base, 89 is a cover, 90 is a partition plate Is.
このように第1,第２の不活性ガス室4,6の部分の構成
と作用は第２図と同一符号であり、かつ空気Airおよび
第１の不活性ガスGas1よりも軽い第２の不活性ガスGas2
により充満されている。In this way, the configuration and operation of the portions of the first and second inert gas chambers 4 and 6 are the same as those in FIG. 2, and the second and lighter than the air Air and the first inert gas Gas 1 . Inert gas Gas 2
Is filled by.
なお、第1,第２の不活性ガス室4,6の各下降装置22,27
と各上昇装置23,28とを第１図（ｂ）と同様にプリント
基板８を搬送チェーン21,29,85の搬送レベルよりも下方
に設けても良い。The lowering devices 22, 27 for the first and second inert gas chambers 4, 6 are
The printed circuit board 8 may be provided below the carrying level of the carrying chains 21, 29, 85, as in FIG. 1 (b).
以上説明したように、この発明に係る不活性ガス封止
装置を備えたプリント基板のはんだ付け装置は、電子部
品を装着したプリント基板を搬送し、不活性ガスを充満
させてはんだ付けを行うはんだ付け処理室を設け、プリ
ント基板の搬送方向に対してはんだ付け処理室の前段と
後段に空気およびはんだ付け処理室内の不活性ガスより
も軽い不活性ガスを上方に滞留させた第１の不活性ガス
室と第２の不活性ガス室とをプリント基板の搬送レベル
よりも上方に設け、これらの第１の不活性ガス室と第２
の不活性ガス室内にプリント基板をその搬送レベルから
上昇させる上昇装置と、上昇したプリント基板を水平方
向に搬送させる水平搬送装置と、水平に搬送されてきた
プリント基板を下降させる下降装置とをプリント基板の
搬送方向に対して順次設け、さらにはんだ付け処理室内
の不活性ガスが外部へ流出するのを第1,第２の不活性ガ
ス室内の不活性ガスにより封止させるための仕切板を第
１の不活性ガス室と第２の不活性ガス室の各下面から上
方に向けて各上昇装置と下降装置との間に設けたので、
はんだ付け処理室内の不活性ガスの流出が阻止されるの
で、不活性ガスの補充による使用量が少なくて済み、プ
リント基板の製造コストの低減がはかれる等の利点を有
する。As described above, the soldering apparatus for a printed circuit board provided with the inert gas sealing device according to the present invention is a solder for carrying a printed circuit board on which electronic components are mounted and filling an inert gas for soldering. A first inerting chamber is provided in which a soldering processing chamber is provided, and air and an inert gas lighter than the inert gas in the soldering processing chamber are retained upward in the front and rear stages of the soldering processing chamber with respect to the printed circuit board transport direction. The gas chamber and the second inert gas chamber are provided above the carrying level of the printed circuit board, and the first inert gas chamber and the second inert gas chamber are provided.
Prints an ascending device that raises the printed circuit board from the transfer level in the inert gas chamber, a horizontal transfer device that horizontally transfers the lifted printed circuit board, and a descending device that lowers the horizontally transferred printed circuit board. A partition plate is provided in order in the substrate transport direction, and a partition plate is provided to seal the outflow of the inert gas in the soldering processing chamber to the outside with the inert gas in the first and second inert gas chambers. Since the first inert gas chamber and the second inert gas chamber are provided between the ascending device and the descending device in the upward direction from the respective lower surfaces,
Since the inert gas is prevented from flowing out of the soldering chamber, the amount of the inert gas to be replenished can be reduced, and the manufacturing cost of the printed circuit board can be reduced.
第１図（ａ），（ｂ）はこの発明の基礎となるはんだ付
け装置を示す平断面図と側断面図、第２図はこの発明の
一実施例を示す側断面図、第３図はこの発明のさらに他
の実施例を示す側断面図である。 図中、１ははんだ付け装置、２は基台、３はカバー、４
は第１の不活性ガス室、５ははんだ付け処理室、６は第
２の不活性ガス室、７は仕切板、８はプリント基板、11
は予備加熱装置、12ははんだ槽、21,24,26,29は搬送コ
ンベア、22,27は下降装置、23,28は上昇装置、25は搬送
チェーン、31〜36はシリンダ、Gas1は第１の不活性ガ
ス、Gas2は第２の不活性ガス、Airは空気である。1 (a) and 1 (b) are a plan sectional view and a side sectional view showing a soldering apparatus which is the basis of the present invention, FIG. 2 is a side sectional view showing an embodiment of the present invention, and FIG. It is a sectional side view which shows other embodiment of this invention. In the figure, 1 is a soldering device, 2 is a base, 3 is a cover, 4
Is a first inert gas chamber, 5 is a soldering treatment chamber, 6 is a second inert gas chamber, 7 is a partition plate, 8 is a printed circuit board, 11
Is a preheating device, 12 is a solder bath, 21, 24, 26, 29 are conveyors, 22, 27 are descending devices, 23, 28 are elevating devices, 25 is a transport chain, 31-36 are cylinders, Gas 1 is the first 1 is an inert gas, Gas 2 is a second inert gas, and Air is air.
Claims (1)
し、不活性ガスを充満させてはんだ付けを行うはんだ付
け処理室を設け、前記プリント基板の搬送方向に対して
前記はんだ付け処理室の前段と後段に空気および前記は
んだ付け処理室内の不活性ガスよりも軽い不活性ガスを
上方に滞留させた第１の不活性ガス室と第２の不活性ガ
ス室とを前記プリント基板の搬送レベルよりも上方に設
け、これらの第１の不活性ガス室と第２の不活性ガス室
内に前記プリント基板をその搬送レベルから上昇させる
上昇装置と、前記上昇したプリント基板を水平方向に搬
送させる水平搬送装置と、前記水平に搬送されてきたプ
リント基板を下降させる下降装置とを前記プリント基板
の搬送方向に対して順次設け、さらに前記はんだ付け処
理室内の不活性ガスが外部へ流出するのを前記第1,第２
の不活性ガス室内の不活性ガスにより封止させるための
仕切板を前記第１の不活性ガス室と第２の不活性ガス室
の各下面から上方に向けて前記各上昇装置と下降装置と
の間に設けたことを特徴とする不活性ガス封止装置を備
えたプリント基板のはんだ付け装置。1. A soldering processing chamber for carrying a printed circuit board on which an electronic component is mounted and filling an inert gas for soldering, and a front stage of the soldering processing chamber in the carrying direction of the printed circuit board. And a first inert gas chamber and a second inert gas chamber, in which air and an inert gas lighter than the inert gas in the soldering treatment chamber are retained above, in a subsequent stage from the transfer level of the printed circuit board. Is also provided above, and a raising device for raising the printed circuit board from its transport level into the first inert gas chamber and the second inert gas chamber, and a horizontal transport for horizontally transporting the raised printed circuit board. An apparatus and a descending device for descending the horizontally conveyed printed circuit board are sequentially provided in the conveying direction of the printed circuit board, and an inert gas in the soldering processing chamber is further provided. Wherein the outflow to the outside first, second
A partition plate for sealing with an inert gas in the inert gas chamber of the first inert gas chamber and the second inert gas chamber from the lower surface of each of the rising device and the descending device upward. A soldering device for a printed circuit board, comprising an inert gas sealing device, which is provided between the two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2202550A JPH0828568B2 (en) | 1990-08-01 | 1990-08-01 | Printed circuit board soldering device with inert gas sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2202550A JPH0828568B2 (en) | 1990-08-01 | 1990-08-01 | Printed circuit board soldering device with inert gas sealing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0488698A JPH0488698A (en) | 1992-03-23 |
| JPH0828568B2 true JPH0828568B2 (en) | 1996-03-21 |
Family
ID=16459360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2202550A Expired - Fee Related JPH0828568B2 (en) | 1990-08-01 | 1990-08-01 | Printed circuit board soldering device with inert gas sealing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0828568B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008002747A (en) * | 2006-06-22 | 2008-01-10 | Kanto Yakin Kogyo Co Ltd | Atmospheric gas sealing method for heating furnace, sealing apparatus therefor, and heating furnace equipped with the apparatus |
| CN102514971A (en) * | 2011-12-08 | 2012-06-27 | 深圳市鑫联达包装机械有限公司 | Transfer system capable of continuously delivering paper and transfer method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006186060A (en) * | 2004-12-27 | 2006-07-13 | Oanesu:Kk | Reflow soldering equipment |
| EP1878527A1 (en) * | 2006-07-10 | 2008-01-16 | Linde Aktiengesellschaft | Process and apparatus for reflow soldering with two different gases |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3091195U (en) * | 2002-07-04 | 2003-01-17 | 千蔵工業株式会社 | Cleaning device for door running rail |
-
1990
- 1990-08-01 JP JP2202550A patent/JPH0828568B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008002747A (en) * | 2006-06-22 | 2008-01-10 | Kanto Yakin Kogyo Co Ltd | Atmospheric gas sealing method for heating furnace, sealing apparatus therefor, and heating furnace equipped with the apparatus |
| CN102514971A (en) * | 2011-12-08 | 2012-06-27 | 深圳市鑫联达包装机械有限公司 | Transfer system capable of continuously delivering paper and transfer method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0488698A (en) | 1992-03-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |