JPH08287724A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPH08287724A JPH08287724A JP9101595A JP9101595A JPH08287724A JP H08287724 A JPH08287724 A JP H08287724A JP 9101595 A JP9101595 A JP 9101595A JP 9101595 A JP9101595 A JP 9101595A JP H08287724 A JPH08287724 A JP H08287724A
- Authority
- JP
- Japan
- Prior art keywords
- metal powder
- conductive paste
- powder
- resin
- needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims abstract description 42
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052709 silver Inorganic materials 0.000 abstract description 9
- 239000004332 silver Substances 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 238000001035 drying Methods 0.000 abstract description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005406 washing Methods 0.000 abstract description 3
- 239000004925 Acrylic resin Substances 0.000 abstract description 2
- 229920000178 Acrylic resin Polymers 0.000 abstract description 2
- 239000003513 alkali Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- -1 for example Substances 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 abstract description 2
- 150000002500 ions Chemical class 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 6
- 239000002904 solvent Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(II) oxide Inorganic materials [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 2
- YADSGOSSYOOKMP-UHFFFAOYSA-N dioxolead Chemical compound O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 2
- DZKDPOPGYFUOGI-UHFFFAOYSA-N tungsten(iv) oxide Chemical compound O=[W]=O DZKDPOPGYFUOGI-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N Carbazole Natural products C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- 229910021541 Vanadium(III) oxide Inorganic materials 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- YOBAEOGBNPPUQV-UHFFFAOYSA-N iron;trihydrate Chemical compound O.O.O.[Fe].[Fe] YOBAEOGBNPPUQV-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001088 polycarbazole Polymers 0.000 description 1
- 229920000414 polyfuran Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、導電性が良好な導電性
ペーストに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste having good conductivity.
【０００２】[0002]
【従来の技術】樹脂と金属粉又は樹脂と金属粉と半導体
粉からなる導電性ペーストは、この材料が持つ柔軟性の
ために電気工業、電子部品工業等の産業に多量に使用さ
れている。このような導電性ペーストの成分のうち、金
属粉又は金属粉と半導体粉が導電性に寄与し、樹脂が柔
軟な接着性を保つために寄与している。そして導電性ペ
ースト中に占める金属粉又は金属粉と半導体粉の割合が
多い程、導電性ペーストの導電性が高くなるが、極端に
その割合を多くすると導電性ペーストの接着性が損なわ
れる。このように導電性ペーストの導電性と接着性は反
比例のような関係があるため、使用目的に応じて導電性
ペーストの組成が決定されている。2. Description of the Related Art A conductive paste composed of resin and metal powder or resin, metal powder and semiconductor powder is widely used in industries such as electric industry and electronic component industry because of the flexibility of the material. Among the components of such a conductive paste, metal powder or metal powder and semiconductor powder contribute to conductivity, and resin contributes to maintain soft adhesiveness. Then, the larger the ratio of the metal powder or the metal powder and the semiconductor powder in the conductive paste, the higher the conductivity of the conductive paste, but if the ratio is extremely increased, the adhesiveness of the conductive paste is impaired. As described above, since the conductivity and the adhesiveness of the conductive paste have an inversely proportional relationship, the composition of the conductive paste is determined according to the purpose of use.
【０００３】[0003]
【発明が解決しようとする課題】導電性ペーストに使用
される金属粉の形状は、通常球形であるが、前述したよ
うに、同一の接着性を保って少しでも導電性を高めるた
めに、扁平形状とか楕円形状のものが提案され、実用に
供されている。このような平板状の金属粉は、導電性ペ
ースト中を電子が移動する場合に有利だと考えられてい
るが、その機構については未だ明らかにはされていな
い。しかしながら、このような新規な導電性ペーストに
おいてもさらに導電性を高めたい用途には不向きであっ
た。The shape of the metal powder used in the conductive paste is usually spherical, but as described above, in order to maintain the same adhesiveness and increase the conductivity even a little, Shapes and elliptical shapes have been proposed and put to practical use. Such a plate-shaped metal powder is considered to be advantageous when electrons move in the conductive paste, but its mechanism has not been clarified yet. However, even such a novel conductive paste was not suitable for the purpose of further increasing the conductivity.
【０００４】[0004]
【課題を解決するための手段】本発明は、上記課題を達
成すべくなされたもので、その要旨は金属粉が直径１μ
ｍ以下、長さ５０μｍ以下の針状突起物を表面に有する
ことを特徴とする導電性ペーストである。なお金属粉の
一部を半導体粉に置換してもよい。SUMMARY OF THE INVENTION The present invention has been made to achieve the above objects, and the gist thereof is that metal powder has a diameter of 1 μm.
The conductive paste has needle-like protrusions having a length of m or less and a length of 50 μm or less on the surface. A part of the metal powder may be replaced with semiconductor powder.
【０００５】以下、本発明の導電性ペーストについて説
明する。本発明において使用される樹脂としては、エポ
キシ樹脂、アルキッド樹脂、アクリル樹脂、フッ素樹
脂、シリコン樹脂、フェノール樹脂、アリール樹脂、炭
化水素樹脂、セルロース樹脂等従来公知の樹脂が１種以
上使用される。又、このような樹脂は、モノマー又はオ
リゴマーの形で１種以上使用し、最終的な導電性ペース
トを使用した場合の硬化後に目的組成の樹脂になるもの
でも良い。The conductive paste of the present invention will be described below. As the resin used in the present invention, one or more conventionally known resins such as epoxy resin, alkyd resin, acrylic resin, fluororesin, silicone resin, phenol resin, aryl resin, hydrocarbon resin, and cellulose resin are used. In addition, one or more of such resins may be used in the form of a monomer or an oligomer, and a resin having a desired composition may be obtained after curing when the final conductive paste is used.
【０００６】次に本発明において使用される金属粉とし
ては、例えば、銀粉、金粉、パラジウム粉、銅粉、ニッ
ケル粉、銀コートニッケル粉、銀コート銅粉およびこれ
らの合金等があげられ、２種以上使用しても良い。この
中でもとりわけ銀粉、銀コートニッケル粉、銀コート銅
粉が導電性が高いため望ましい。これら金属粉は、表面
が針状突起物を有することが肝要である。Next, examples of the metal powder used in the present invention include silver powder, gold powder, palladium powder, copper powder, nickel powder, silver-coated nickel powder, silver-coated copper powder and alloys thereof. You may use more than one kind. Among these, silver powder, silver-coated nickel powder, and silver-coated copper powder are particularly preferable because they have high conductivity. It is essential that these metal powders have needle-like protrusions on the surface.
【０００７】前記金属粉の表面が針状突起物を有するた
めには、金属粉表面を水洗して不純物イオンを除去した
後乾燥し、さらにアルカリ洗浄、水洗、乾燥をくり返し
た後、４０〜９０℃、８０〜９０％ＲＨの恒湿槽中で、
数日〜２・３週間放置後、室温で乾燥することによって
得られる。使用する金属粉の形状は、前述した球状、扁
平状、楕円状いずれの形状であっても良い。本発明で
は、各金属粉表面の針状突起物の大きさは直径０．００
１〜１μｍ、長さ０．０１〜５０μｍが好ましい。直径
０．００１μｍ、長さ０．０１μｍ以下では作製した導
電性ペーストの導電性が十分でなく、直径１μｍ、長さ
５０μｍを超えると作製した導電性ペーストの導電性の
向上は顕著でなく、逆にコスト的に不利となり好ましく
ない。In order for the surface of the metal powder to have needle-like protrusions, the surface of the metal powder is washed with water to remove impurity ions, dried, and then repeatedly washed with alkali, washed with water, and dried, and then 40 to 90. In a constant humidity chamber at 80 to 90% RH,
After being left for several days to a few weeks, it is obtained by drying at room temperature. The shape of the metal powder used may be any of the above-mentioned spherical, flat, and elliptical shapes. In the present invention, the size of the needle-shaped protrusion on the surface of each metal powder is 0.00
It is preferably 1 to 1 μm and a length of 0.01 to 50 μm. If the diameter is 0.001 μm and the length is 0.01 μm or less, the conductivity of the prepared conductive paste is not sufficient, and if the diameter exceeds 1 μm and the length is 50 μm, the conductivity of the prepared conductive paste is not significantly improved. It is disadvantageous in terms of cost, which is not preferable.
【０００８】また、使用する金属粉と樹脂との比率を適
当に調節することにより所望の導電率を有する導電性ペ
ーストが得られるが、ペースト中に占める金属粉の含量
の好ましい割合は、２０〜９６重量％である。金属粉の
割合が２０重量％未満ではペーストの導電性が不十分で
あり、又、９６重量％を超えるとペーストの接着性が不
十分であり、共に良好でない。Further, a conductive paste having a desired conductivity can be obtained by appropriately adjusting the ratio of the metal powder and the resin used, but the preferable ratio of the content of the metal powder in the paste is 20 to 20. 96% by weight. If the proportion of the metal powder is less than 20% by weight, the conductivity of the paste is insufficient, and if it exceeds 96% by weight, the adhesiveness of the paste is insufficient and both are not good.
【０００９】又、前述した金属粉は、一般に高価である
ため、安価性を求める場合には金属粉の一部を半導体粉
に置換してもよい。該半導体粉としては、電導度が１０
-5ｓ・ｃｍ-1〜１０3 ｓ・ｃｍ-1の間にある半導体粉で
ある。代表例として、二酸化マンガン、二酸化スズ、二
酸化タングステン、二酸化鉛、二酸化チタン、一酸化
銅、一酸化亜鉛、一酸化ニッケル、一酸化コバルト、三
二酸化鉄、チタン酸バリウム、酸化タンタル、三二酸化
バナジウム、三酸化タングステン、ポリチオフェン、ポ
リフラン、ポリピロール、ポリアニリン、ポリオキシベ
ンゼン、ポリサルフィドベンゼン、ポリベンゼン、ポリ
ベンゾピロリン、ポリピロリン、ポリカルバゾール、ポ
リフェノチアジン等が挙げられる。これらの半導体粉に
適当な公知のドーパントを入れることにより電導度を調
節して使用しても良い。Further, since the above-mentioned metal powder is generally expensive, a part of the metal powder may be replaced with a semiconductor powder when low cost is required. The semiconductor powder has an electric conductivity of 10
-5 s · cm −1 to 10 3 s · cm −1 semiconductor powder. As typical examples, manganese dioxide, tin dioxide, tungsten dioxide, lead dioxide, titanium dioxide, copper monoxide, zinc monoxide, nickel monoxide, cobalt monoxide, iron sesquioxide, barium titanate, tantalum oxide, vanadium sesquioxide, Examples thereof include tungsten trioxide, polythiophene, polyfuran, polypyrrole, polyaniline, polyoxybenzene, polysulfidobenzene, polybenzene, polybenzopyrroline, polypyrroline, polycarbazole, and polyphenothiazine. You may use it, adjusting an electric conductivity by putting a suitable well-known dopant into these semiconductor powders.
【００１０】上述した導電性ペーストは、樹脂が溶解し
た適当な溶媒中に金属粉が分散した状態にあり、溶媒を
除去して目的とする樹脂と金属粉又は樹脂と金属粉と半
導体粉とからなる導電性ペーストとなる。又、樹脂自身
が液体状のものは、前述した溶媒を使用しなくても良
く、乾燥硬化することによって固形の導電性ペーストと
なる。The above-mentioned conductive paste is in a state in which metal powder is dispersed in a suitable solvent in which resin is dissolved, and the solvent is removed to remove the target resin and metal powder or resin, metal powder and semiconductor powder. It becomes a conductive paste. Further, when the resin itself is in a liquid state, it is not necessary to use the above-mentioned solvent, and a solid conductive paste is obtained by drying and curing.
【００１１】[0011]
【作用】金属粉が表面に針状突起物を有すると金属粉間
の電子移動が針状突起物先端間を通して容易に行われる
ものと考えられる。When the metal powder has needle-like protrusions on its surface, it is considered that the electron transfer between the metal powders is easily carried out through the tips of the needle-like protrusions.
【００１２】[0012]
【実施例】以下、実施例、比較例でもって本発明をさら
に詳しく説明する。 実施例１〜６、比較例１〜６ 粒径３〜４μｍ、厚さ１μｍの扁平銀粉を水洗し、５０
℃で減圧乾燥した。さらに２％ＫＯＨ水溶液で洗浄した
後、水洗し乾燥した。この操作を２回くり返した後６０
℃８０％ＲＨの恒湿槽に１週間放置した。このようにし
て得た金属粉は、針状突起物を表面に有し、その針状突
起物は、径が平均０．０３μｍ、長さが０．５μｍであ
ることを顕微鏡観察で確認した。表１は、このようにし
て得た銀粉を各種ポリマーに加えて導電性ペーストを作
製した時の電導度を示した。尚、電導度は、ガラス板状
に１ｍｍの厚さで導電性ペーストを塗布し、極間距離１
ｃｍで測定した値である。又、各比較例は、各々の実施
例で銀粉を前述した処理を行わない場合の導電性ペース
トの電導度である。EXAMPLES The present invention will be described in more detail with reference to Examples and Comparative Examples. Examples 1 to 6, Comparative Examples 1 to 6 Flat silver powder having a particle size of 3 to 4 μm and a thickness of 1 μm was washed with water, and 50
It was dried under reduced pressure at ℃. After further washing with a 2% KOH aqueous solution, it was washed with water and dried. After repeating this operation twice, 60
The sample was left to stand in a constant humidity chamber at 80 ° C RH for 1 week. It was confirmed by microscopic observation that the metal powder thus obtained had needle-like protrusions on its surface, and the needle-like protrusions had an average diameter of 0.03 μm and a length of 0.5 μm. Table 1 shows the electric conductivity when the silver powder thus obtained was added to various polymers to prepare a conductive paste. The conductivity is 1 mm thick when a conductive paste is applied on a glass plate and the distance between the electrodes is 1 mm.
It is a value measured in cm. In addition, each comparative example is the conductivity of the conductive paste when the above-mentioned treatment of the silver powder is not performed in each example.
【００１３】実施例７〜１２、比較例７〜１２ 粒径７μｍの球状銀コートニッケル粉に実施例１と同様
な処理で針状突起物を有する表面を形成した。針状突起
物は径が平均０．０１μｍ、長さ０．０４μｍであっ
た。このような銀コートニッケル粉と、別に用意した各
種の半導体粉と樹脂からなる導電性ペーストを作製し、
電導度を測定し表２に示した。Examples 7 to 12 and Comparative Examples 7 to 12 A spherical silver-coated nickel powder having a particle size of 7 μm was treated in the same manner as in Example 1 to form a surface having needle-like protrusions. The needle-like protrusions had an average diameter of 0.01 μm and a length of 0.04 μm. Such a silver-coated nickel powder, and a conductive paste made of various semiconductor powder and resin prepared separately,
The electric conductivity was measured and shown in Table 2.
【００１４】実施例１３〜１８ 実施例２で銀粉を恒湿槽に放置する時間を変化させた以
外は、実施例２と同様にして導電性ペーストを作製し、
各例の電導度を測定し表３に示した。Examples 13 to 18 Conductive pastes were prepared in the same manner as in Example 2 except that the time for leaving the silver powder in the humidity chamber was changed.
The conductivity of each example was measured and is shown in Table 3.
【００１５】比較例１３ 比較例２で作製した導電性ペーストを６０℃８０％ＲＨ
の恒湿槽に１週間放置した後に乾燥して電導度を測定
し、その値を表３に並記した。Comparative Example 13 The conductive paste prepared in Comparative Example 2 was treated at 60 ° C. and 80% RH.
The sample was allowed to stand for 1 week in a constant humidity chamber, dried, and then the electric conductivity was measured.
【００１６】[0016]
【表１】 [Table 1]
【００１７】[0017]
【表２】 [Table 2]
【００１８】[0018]
【表３】 [Table 3]
【００１９】[0019]
【発明の効果】以上説明したように、本発明は、樹脂と
金属粉からなる導電性ペースト又は樹脂と金属粉と半導
体粉からなる導電性ペーストであって、金属粉が直径１
μｍ以下、長さ５０μｍ以下の針状突起物を表面に有す
るので導電性が良好である。As described above, the present invention provides a conductive paste made of resin and metal powder or a conductive paste made of resin, metal powder and semiconductor powder, in which the metal powder has a diameter of 1 mm.
Since the surface has needle-like protrusions having a length of less than or equal to μm and a length of less than or equal to 50 μm, the conductivity is good.
Claims (2)
あって、金属粉が直径１μｍ以下、長さ５０μｍ以下の
針状突起物を表面に有することを特徴とする導電性ペー
スト。1. A conductive paste comprising a resin and metal powder, wherein the metal powder has needle-like protrusions having a diameter of 1 μm or less and a length of 50 μm or less on the surface.
性ペーストであって、金属粉が直径１μｍ以下、長さ５
０μｍ以下の針状突起物を表面に有することを特徴とす
る導電性ペースト。2. A conductive paste comprising resin, metal powder and semiconductor powder, wherein the metal powder has a diameter of 1 μm or less and a length of 5
A conductive paste having needle-like protrusions of 0 μm or less on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09101595A JP3656274B2 (en) | 1995-04-17 | 1995-04-17 | Conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09101595A JP3656274B2 (en) | 1995-04-17 | 1995-04-17 | Conductive paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08287724A true JPH08287724A (en) | 1996-11-01 |
| JP3656274B2 JP3656274B2 (en) | 2005-06-08 |
Family
ID=14014737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09101595A Expired - Lifetime JP3656274B2 (en) | 1995-04-17 | 1995-04-17 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3656274B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6863986B2 (en) * | 1999-04-28 | 2005-03-08 | Neomax Co., Ltd. | Process for forming metal layer on surface of resin molded product |
| US7799408B2 (en) * | 2001-01-24 | 2010-09-21 | Kaken Tech Co. Ltd. | Conductive powder, conductive composition, and producing method of the same |
| JP2012248706A (en) * | 2011-05-27 | 2012-12-13 | Sony Chemical & Information Device Corp | Solar cell module, method for manufacturing the same, and tab wire for thin-film solar cell |
| CN104575683A (en) * | 2015-01-08 | 2015-04-29 | 安徽凤阳德诚科技有限公司 | Conductive silver paste long in service life |
-
1995
- 1995-04-17 JP JP09101595A patent/JP3656274B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6863986B2 (en) * | 1999-04-28 | 2005-03-08 | Neomax Co., Ltd. | Process for forming metal layer on surface of resin molded product |
| US7799408B2 (en) * | 2001-01-24 | 2010-09-21 | Kaken Tech Co. Ltd. | Conductive powder, conductive composition, and producing method of the same |
| JP2012248706A (en) * | 2011-05-27 | 2012-12-13 | Sony Chemical & Information Device Corp | Solar cell module, method for manufacturing the same, and tab wire for thin-film solar cell |
| CN104575683A (en) * | 2015-01-08 | 2015-04-29 | 安徽凤阳德诚科技有限公司 | Conductive silver paste long in service life |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3656274B2 (en) | 2005-06-08 |
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