JPH08307032A - Circuit board device - Google Patents

Circuit board device

Info

Publication number
JPH08307032A
JPH08307032A JP7105843A JP10584395A JPH08307032A JP H08307032 A JPH08307032 A JP H08307032A JP 7105843 A JP7105843 A JP 7105843A JP 10584395 A JP10584395 A JP 10584395A JP H08307032 A JPH08307032 A JP H08307032A
Authority
JP
Japan
Prior art keywords
terminals
lead plate
lead
insulating substrate
burring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7105843A
Other languages
Japanese (ja)
Inventor
Hideaki Hosokawa
秀彰 細川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Home Technology Corp
Original Assignee
Toshiba Home Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Home Technology Corp filed Critical Toshiba Home Technology Corp
Priority to JP7105843A priority Critical patent/JPH08307032A/en
Publication of JPH08307032A publication Critical patent/JPH08307032A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308Adaptations of leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PURPOSE: To make it possible to bring terminals into an electric continuity with one kind of a lead board even if pitches between terminals are different by adjusting the lead board to each of the pitches. CONSTITUTION: This is to bring a terminal 10a of a relay 10 which is installed on an insulating substrate 1 and a terminal 11a of a lead wire 11 into electric continuity through a lead board 3. The lead board 3 has a constant length and has at its both ends burring projections 4, 4. By bending back this lead board 3 in the middle, a distance in a straight line between the burring projections 4 and 4 is adjusted to a distance corresponding to a pitch between the terminals 10a and 11a. Under this conditions, the lead board 3 is installed on the insulating substrate 1 and then the terminals 10a and 11a are inserted into the burring projections 4, 4 and thereby terminals 10a and 11a are brought into electric continuity.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、絶縁基板に電気部品
の端子間を電気的に導通させる回路を設けてなる回路基
板装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board device having an insulating board provided with a circuit for electrically connecting terminals of an electric component.

【0002】[0002]

【従来の技術】一般に各種の電気機器に組み込まれる回
路基板装置は、絶縁基板の板面にエッチング処理により
金属箔からなるパターン配線を形成し、この絶縁基板に
半導体等の電気部品を実装し、これら電気部品の端子を
前記パターン配線の所定の部位に接続するようにしてい
る。
2. Description of the Related Art In general, a circuit board device incorporated in various electric devices has a pattern wiring made of a metal foil formed on a plate surface of an insulating substrate by etching, and an electric component such as a semiconductor is mounted on the insulating substrate. The terminals of these electric parts are connected to predetermined portions of the pattern wiring.

【0003】金属箔からなるパターン配線は、その厚さ
が薄いから大電流が流れると発熱の問題が生じ、このた
め絶縁基板に半導体等に加えてさらにリレー等の大電流
(10〜15A)が流れる電気部品を実装する場合に
は、その大電流を流すための比較的厚さの厚いリード板
を絶縁基板に取り付け、このリード板を用いて大電流を
流すようにしている。このリード板は銅板や銅合金板等
の厚さが0.3mm 程度の導電性金属板をプレスによる打抜
き加工で所定の長さの帯板状に形成してなる。
Since the pattern wiring made of metal foil has a small thickness, a problem of heat generation occurs when a large current flows. Therefore, in addition to a semiconductor or the like, a large current (10 to 15 A) of a relay or the like is further applied to the insulating substrate. When mounting a flowing electric component, a lead plate having a relatively large thickness for passing the large current is attached to an insulating substrate, and the large current is passed using the lead plate. This lead plate is made of a conductive metal plate having a thickness of about 0.3 mm, such as a copper plate or a copper alloy plate, which is formed into a strip plate having a predetermined length by punching with a press.

【0004】[0004]

【発明が解決しようとする課題】ところで、絶縁基板に
実装される電気部品の端子間のピッチはしばしば変更さ
れることがあり、この場合、一定の長さのリード板では
そのピッチの変更に対応することができない。
By the way, the pitch between terminals of an electric component mounted on an insulating substrate is often changed, and in this case, a lead plate having a certain length can cope with the change of the pitch. Can not do it.

【0005】長さの異なる種々のリード板を予め用意し
ておけば、それに対応することができるが、しかしリー
ド板はプレスによる打抜き加工で形成するものであるか
ら、長さの異なる種々のリード板を形成しようとする
と、それに応じた多種の打抜き金型が必要でコストがか
かり、経済性が低下してしまう。
If various lead plates having different lengths are prepared in advance, it is possible to cope with the situation. However, since the lead plates are formed by punching by a press, various lead plates having different lengths are formed. If a plate is to be formed, various punching dies corresponding to the plate are required, which is costly and reduces economic efficiency.

【0006】この発明はこのような点に着目してなされ
たもので、その目的とするところは、端子間のピッチが
異なっても一種のリード板でそのピッチに合わせて端子
間を接続して電気的に導通させることができる回路基板
装置を提供することにある。
The present invention has been made by paying attention to such a point, and an object thereof is to connect terminals according to the pitch with a kind of lead plate even if the terminals have different pitches. It is to provide a circuit board device which can be electrically conducted.

【0007】[0007]

【課題を解決するための手段】この発明はこのような目
的を達成するために、請求項1に記載の発明として、一
定の長さを有するリード板を形成し、このリード板の途
中を折曲して折り返すことにより、その一端側の端部と
他端側の端部との直線距離を、電気部品の端子間のピッ
チに対応する距離に合わせ、このリード板を絶縁基板に
取り付け、その一端側の端部および他端側の端部に電気
部品の端子をそれぞれ接続してその端子間を電気的に導
通させるようにしたものである。
In order to achieve such an object, the present invention provides a lead plate having a certain length as an invention according to claim 1, and folds the lead plate halfway. By bending and folding back, the linear distance between the end on the one end side and the end on the other end side is adjusted to the distance corresponding to the pitch between the terminals of the electric component, and this lead plate is attached to the insulating substrate. The terminals of the electric component are respectively connected to the end portion on the one end side and the end portion on the other end side to electrically connect the terminals.

【0008】そして、請求項2に記載の発明として、一
定の長さのリード板を形成し、さらにこのリード板の両
端側の端部にそれぞれバーリング突起を形成し、このリ
ード板の途中を折曲して折り返すことにより、前記両バ
ーリング突起間の直線距離を電気部品の端子間のピッチ
に対応する距離に合わせ、このリード板を絶縁基板に取
り付け、その一方の端部のバーリング突起内および他方
の端部のバーリング突起内に電気部品の端子をそれぞれ
挿入してその端子間を電気的に導通させる。
According to the second aspect of the invention, a lead plate having a constant length is formed, and burring protrusions are formed at both ends of the lead plate, and the lead plate is bent halfway. By bending and folding back, the linear distance between the burring protrusions is adjusted to the distance corresponding to the pitch between the terminals of the electric component, and this lead plate is attached to the insulating substrate, and the burring protrusions at one end of the burring protrusion and the other end are attached. The terminals of the electric component are inserted into the burring protrusions at the ends of the terminals to electrically connect the terminals.

【0009】また、請求項3に記載の発明として、一定
の長さのリード板を形成し、このリード板の両端側の端
部にそれぞれ接続孔を形成し、このリード板の途中を折
曲して折り返すことにより、前記両接続孔間の直線距離
を電気部品の端子間のピッチに対応する距離に合わせ、
このリード板を絶縁基板に取り付け、その一方の端部の
接続孔内および他方の端部の接続孔内に電気部品の端子
をそれぞれ挿入してその端子間を電気的に導通させる。
As a third aspect of the present invention, a lead plate having a constant length is formed, connection holes are formed at both ends of the lead plate, and the lead plate is bent in the middle. Then, by folding back, the linear distance between the both connection holes is adjusted to the distance corresponding to the pitch between the terminals of the electric component,
This lead plate is attached to an insulating substrate, and the terminals of the electric component are inserted into the connection hole at one end and the connection hole at the other end, respectively, to electrically connect the terminals.

【0010】さらに、請求項4に記載の発明として、一
定の長さのリード板を形成し、このリード板の一方の端
部にバーリング突起を、他方の端部に接続孔を形成し、
このリード板の途中を折曲して折り返すことにより、前
記バーリング突起と接続孔との間の直線距離を電気部品
の端子間のピッチに対応する距離に合わせ、このリード
板を絶縁基板に取り付け、その一方の端部のバーリング
突起内および他方の端部の接続孔内に電気部品の端子を
それぞれ挿入してその端子間を電気的に導通させる。
Further, as the invention according to claim 4, a lead plate having a constant length is formed, a burring protrusion is formed at one end of the lead plate, and a connection hole is formed at the other end.
By bending and folding the lead plate in the middle, the linear distance between the burring protrusion and the connection hole is adjusted to the distance corresponding to the pitch between the terminals of the electric component, and the lead plate is attached to the insulating substrate. The terminals of the electric component are respectively inserted into the burring protrusions at the one end and the connection holes at the other end to electrically connect the terminals.

【0011】[0011]

【作用】請求項1に記載の発明においては、リード板は
一定の長さを有するが、このリード板の途中を折曲して
折り返すときにおけるその折曲部分の位置を選択するこ
とにより、リード板の折曲後における両端部間の直線距
離を任意に設定することができ、したがって電気部品の
端子間のピッチが種々異なる場合であっても、一種のリ
ード板を用いてその両端部間の直線距離を前記端子間の
ピッチに合わせ、そのリード板の両端部に電気部品の端
子をそれぞれ接続することによりその端子間を電気的に
導通させることが可能となる。
According to the first aspect of the invention, the lead plate has a fixed length, and the lead plate is selected by selecting the position of the bent portion when the lead plate is bent in the middle and folded back. The linear distance between both ends of the plate after bending can be set arbitrarily, and therefore, even if the pitch between the terminals of the electrical component is different, a type of lead plate is used to provide a gap between the ends. By matching the linear distance to the pitch between the terminals and connecting the terminals of the electric component to both ends of the lead plate respectively, it becomes possible to electrically connect the terminals.

【0012】請求項2に記載の発明においては、リード
板は一定の長さを有するが、このリード板の途中を折曲
して折り返すときにおけるその折曲部分の位置を選択す
ることにより、リード板の折曲後におけるバーリング突
起間の直線距離を任意に設定することができ、したがっ
て電気部品の端子間のピッチが種々異なる場合であって
も、一種のリード板を用いてその両バーリング突起間の
直線距離を前記端子間のピッチに合わせ、そのリード板
の両バーリング突起内に電気部品の端子をそれぞれ挿入
することによりその端子間を電気的に導通させることが
可能となる。
According to the second aspect of the present invention, the lead plate has a fixed length, but by selecting the position of the bent portion when the lead plate is bent in the middle and folded back, The straight line distance between the burring protrusions after bending the plate can be set arbitrarily, so even if the pitch between the terminals of the electrical component is different, a type of lead plate is used between the burring protrusions. It is possible to establish electrical continuity between the terminals by inserting the terminals of the electric component into both burring protrusions of the lead plate by adjusting the linear distance of the above to the pitch between the terminals.

【0013】請求項3に記載の発明においては、リード
板は一定の長さを有するが、このリード板の途中を折曲
して折り返すときにおけるその折曲部分の位置を選択す
ることにより、リード板の折曲後における接続孔間の直
線距離を任意に設定することができ、したがって電気部
品の端子間のピッチが種々異なる場合であっても、一種
のリード板を用いてその両接続孔間の直線距離を前記端
子間のピッチに合わせ、そのリード板の両接続孔内に電
気部品の端子をそれぞれ挿入することによりその端子間
を電気的に導通させることが可能となる。
According to the third aspect of the present invention, the lead plate has a fixed length, but by selecting the position of the bent portion when the lead plate is bent in the middle and folded back, The linear distance between the connection holes after bending the plate can be set arbitrarily, so even if the pitch between the terminals of the electrical component is different, use a kind of lead plate to It is possible to electrically connect between the terminals by adjusting the linear distance of the above to the pitch between the terminals and inserting the terminals of the electric component into the both connection holes of the lead plate.

【0014】請求項4に記載の発明においては、リード
板は一定の長さを有するが、このリード板の途中を折曲
して折り返すときにおけるその折曲部分の位置を選択す
ることにより、リード板の折曲後におけるバーリング突
起と接続孔との間の直線距離を任意に設定することがで
き、したがって電気部品の端子間のピッチが種々異なる
場合であっても、一種のリード板を用いてそのバーリン
グ突起と接続孔との間の直線距離を前記端子間のピッチ
に合わせ、そのリード板のバーリング突起内および接続
孔内に電気部品の端子をそれぞれ挿入することによりそ
の端子間を電気的に導通させることが可能となる。
According to the invention described in claim 4, the lead plate has a fixed length, but by selecting the position of the bent portion when the lead plate is bent in the middle and folded back, The straight line distance between the burring protrusion and the connection hole after bending the plate can be set arbitrarily, so even if the pitch between the terminals of the electric component is different, a kind of lead plate is used. The linear distance between the burring protrusion and the connection hole is adjusted to the pitch between the terminals, and the terminals of the electrical component are inserted into the burring protrusion and the connection hole of the lead plate to electrically connect the terminals. It becomes possible to conduct electricity.

【0015】[0015]

【実施例】以下、この発明の実施例について図面を参照
して説明する。図1ないし図7には第1の実施例を示し
てあり、符号1が絶縁基板で、この絶縁基板1の下面に
は、厚さが数十μm(例えば35μm)の銅箔をエッチン
グして所定の形状に形成したパターン配線2…が設けら
れている。
Embodiments of the present invention will be described below with reference to the drawings. 1 to 7 show a first embodiment, in which reference numeral 1 is an insulating substrate, and a lower surface of the insulating substrate 1 is formed by etching a copper foil having a thickness of several tens of μm (for example, 35 μm). Pattern wirings 2 ... Formed in a predetermined shape are provided.

【0016】絶縁基板1の上面には、大電流を流すため
のリード板3,3が取り付けられ、これらリード板3,
3は、例えば厚さが 0.3mmの銅板や銅合金板等の導電性
の金属板をプレスによる打抜き加工により一定の長さを
有する帯板状に形成してなる。そしてこれらリード板
3,3はその途中が折曲されて折り返された状態で絶縁
基板1の上に取り付けられている。
Lead plates 3 and 3 for passing a large current are attached to the upper surface of the insulating substrate 1.
3 is formed by punching a conductive metal plate such as a copper plate or a copper alloy plate having a thickness of 0.3 mm into a strip plate shape having a certain length. The lead plates 3 and 3 are mounted on the insulating substrate 1 in a state where the lead plates 3 and 3 are bent and folded back.

【0017】またこれらリード板3,3の両端部には、
図2に示すように、バーリング突起4,4が一体に突出
形成され、これらバーリング突起4,4の周面が複数の
分割片5…に切り裂かれている。
At both ends of the lead plates 3 and 3,
As shown in FIG. 2, the burring protrusions 4 and 4 are integrally formed so as to project, and the peripheral surfaces of the burring protrusions 4 and 4 are cut into a plurality of divided pieces 5.

【0018】絶縁基板1には、各リード板3,3のバー
リング突起4…に対応する複数の取付孔6…が形成さ
れ、これら取付孔6…内に絶縁基板1の上面側からリー
ド板3,3のバーリング突起4…が挿入され、かつ各バ
ーリング突起4…の分割片5…の先端部が外側に折曲さ
れて加締められ、これによりリード板3,3が絶縁基板
1の上に固定されている。さらに絶縁基板1には、その
上面から前記パターン配線2…の端部に達して貫通する
取付孔7,7が形成されている。
A plurality of mounting holes 6 ... Corresponding to the burring protrusions 4 of the lead plates 3 and 3 are formed in the insulating substrate 1, and the lead plate 3 is formed in the mounting holes 6 from the upper surface side of the insulating substrate 1. , 3 of the burring protrusions 4 ... Are inserted, and the tips of the divided pieces 5 of the burring protrusions 4 are bent outward and crimped, whereby the lead plates 3 and 3 are placed on the insulating substrate 1. It is fixed. Further, the insulating substrate 1 is provided with mounting holes 7, 7 which penetrate from the upper surface to the end portions of the pattern wirings 2 ...

【0019】絶縁基板1の上には電気部品としてのリレ
ー10が配設され、このリレー10の下面にはピン状を
なす複数の端子10a,10b,10c,10dが設け
られている。
A relay 10 as an electric component is arranged on the insulating substrate 1, and a plurality of pin-shaped terminals 10a, 10b, 10c and 10d are provided on the lower surface of the relay 10.

【0020】そしてこのリレー10の端子10a,10
bが絶縁基板1の上面側から前記リード板3,3におけ
る一端側のバーリング突起4,4内に挿入され、これに
より端子10a,10bとリード板3,3とが電気的に
接続され、また端子10c,10dが絶縁基板1の前記
取付孔7,7内に挿入され、これにより端子10c,1
0dとパターン配線2,2とが電気的に接続されてい
る。
The terminals 10a, 10 of the relay 10 are
b is inserted into the burring protrusions 4 and 4 on one end side of the lead plates 3 and 3 from the upper surface side of the insulating substrate 1, whereby the terminals 10a and 10b and the lead plates 3 and 3 are electrically connected, and The terminals 10c and 10d are inserted into the mounting holes 7 and 7 of the insulating substrate 1, whereby the terminals 10c and 1d are inserted.
0d and the pattern wirings 2 and 2 are electrically connected.

【0021】また、絶縁基板1の上には電気部品として
一対のリード線11,12が配設され、これらリード線
11,12の端部にはピン状をなす端子11a,12a
が取り付けられ、これらリード線11,12の端子11
a,12aが絶縁基板1の上面側から前記リード板3,
3における他端側のバーリング突起4,4内に挿入さ
れ、これにより端子11a,12aとリード板3,3と
が電気的に接続されている。そして前記リード線11,
12の端子11a,12aからリード板3,3を通して
リレー10の端子10a,10bに大電流が流れるよう
になっている。
Further, a pair of lead wires 11 and 12 are arranged on the insulating substrate 1 as electric parts, and pin-shaped terminals 11a and 12a are provided at the ends of the lead wires 11 and 12.
Are attached to the terminals 11 of these lead wires 11 and 12.
a and 12a are from the upper surface side of the insulating substrate 1 to the lead plate 3,
3 is inserted into the burring protrusions 4 and 4 on the other end side, whereby the terminals 11a and 12a and the lead plates 3 and 3 are electrically connected. And the lead wire 11,
A large current flows from the terminals 11a and 12a of 12 through the lead plates 3 and 3 to the terminals 10a and 10b of the relay 10.

【0022】なお、リレー10の端子10a,10bと
リード板3,3の一端側のバーリング突起4,4、リレ
ー10の端子10c,10dとパターン配線2,2、お
よびリード線11,12の端子11a,12aとリード
板3,3の他端側のバーリング突起4,4とはそれぞれ
絶縁基板1の下面側からハンダ付けして接合させる。
The terminals 10a and 10b of the relay 10 and the burring protrusions 4 and 4 on one end side of the lead plates 3 and 3, the terminals 10c and 10d of the relay 10 and the pattern wirings 2 and 2, and the terminals of the lead wires 11 and 12 are provided. 11a and 12a and the burring protrusions 4 and 4 on the other end side of the lead plates 3 and 3 are soldered and joined from the lower surface side of the insulating substrate 1.

【0023】図3には、リード板3,3を介して接続さ
れたリレー10の端子10a,10bとリード線11,
12の端子11a,12aとの間のピッチの寸法を示し
てあり、リレー10の端子10aとリード線11の端子
11aとの間のピッチがP1,リレー10の端子10b
とリード線12の端子12aとの間のピッチがP2 とな
っている。
In FIG. 3, terminals 10a and 10b of a relay 10 and lead wires 11 connected via lead plates 3 and 3 are connected.
12 shows the dimensions of the pitch between the terminals 11a and 12a of the relay 12, the pitch between the terminal 10a of the relay 10 and the terminal 11a of the lead wire 11 is P1, and the terminal 10b of the relay 10 is shown.
The pitch between the lead wire 12 and the terminal 12a of the lead wire 12 is P2.

【0024】図4および図5には、打抜き加工されたリ
ード板3の平面図および側面図を示してあり、このリー
ド板3は一方向に長い帯板状をなし、かつその長さが前
記ピッチP1 ,P2 の間隔よりも充分に大きな寸法とな
っている。そしてこのリード板3の一端側の端部のバー
リング突起4はリード板3の一方の板面側に突出し、他
端側の端部のバーリング突起4はリード板3の他方の板
面側に突出している。
FIGS. 4 and 5 show a plan view and a side view of the lead plate 3 that has been punched, and the lead plate 3 is in the form of a strip plate that is long in one direction, and the length thereof is as described above. The size is sufficiently larger than the interval between the pitches P1 and P2. The burring protrusion 4 at one end of the lead plate 3 projects to one plate surface side of the lead plate 3, and the burring protrusion 4 at the other end of the lead plate 3 projects to the other plate surface side of the lead plate 3. ing.

【0025】このリード板3を絶縁基板1に取り付ける
際には、図6に示すように、リード板3の一端側と他端
側との間の途中を折曲してその折曲部分から他端側に亘
る部分を折り返すことにより、一方のバーリング突起4
と他方のバーリング突起4との間の直線距離Lを前記ピ
ッチP1 あるいはP2 に合わせる。リード板3の途中を
折曲して折り返すことにより、互いに反対側に向いて突
出していたバーリング突起4,4が同一方向に向く状態
となる。
When attaching the lead plate 3 to the insulating substrate 1, as shown in FIG. 6, the lead plate 3 is bent in the middle between one end side and the other end side, and the bent portion By folding back the part extending over the end side, one burring protrusion 4
The linear distance L between the burring protrusion 4 and the other burring protrusion 4 is adjusted to the pitch P1 or P2. By bending and folding the lead plate 3 in the middle, the burring protrusions 4 and 4 protruding toward the opposite sides are directed in the same direction.

【0026】バーリング突起4,4間の直線距離Lは、
リード板3の折曲位置を選択することにより任意に決定
することができる。図7には、リード板3の折曲位置を
種々選択してバーリング突起4,4間の直線距離を種々
の寸法に設定した例を示してあり、図7(A)の状態の
ときにはバーリング突起4,4間の直線距離がL1 、図
7(B)の状態のときにはバーリング突起4,4間の直
線距離がL2 、図7(C)の状態のときにはバーリング
突起4,4間の直線距離がL3 、図7(D)の状態のと
きにはバーリング突起4,4間の直線距離がL4 とな
り、L1 <L2 <L3 <L4 の関係が生じている。
The linear distance L between the burring protrusions 4 and 4 is
It can be arbitrarily determined by selecting the bending position of the lead plate 3. FIG. 7 shows an example in which the bending position of the lead plate 3 is variously selected and the linear distance between the burring protrusions 4 and 4 is set to various dimensions. In the state of FIG. The linear distance between the burring protrusions 4 and 4 is L1, the linear distance between the burring protrusions 4 and 4 is L2 in the state of FIG. 7B, and the linear distance between the burring protrusions 4 and 4 is the state of FIG. 7C. In the state of L3 and FIG. 7D, the linear distance between the burring protrusions 4 and 4 is L4, and the relationship of L1 <L2 <L3 <L4 is generated.

【0027】一つのリード板3の途中を折曲してバーリ
ング突起4,4間の直線距離Lを前記ピッチP1 に合わ
せ、また他の一つのリード板3の途中を折曲してバーリ
ング突起4,4間の直線距離Lを前記ピッチP2 に合わ
せ、こののち各リード板3を絶縁基板1の上に配置し、
所定のバーリング突起4…を所定の取付孔6…内にそれ
ぞれ挿入し、さらに各バーリング突起4…における各分
割片5…の先端部を外側に加締めて各リード板3,3を
絶縁基板1に固定する。
The lead bar 3 is bent in the middle to match the straight line distance L between the burring protrusions 4 and 4 with the pitch P1, and the other lead plate 3 is bent in the middle to produce the burring protrusion 4. , 4 the linear distance L between them is adjusted to the pitch P2, and then each lead plate 3 is placed on the insulating substrate 1,
The predetermined burring protrusions 4 ... Are inserted into the predetermined mounting holes 6, respectively, and the tip ends of the divided pieces 5 of the respective burring protrusions 4 ... Fixed to.

【0028】絶縁基板1の上に各リード板3,3を取り
付けたのちには、リレー10の端子10a,10bを前
記リード板3,3における一端側のバーリング突起4,
4内にそれぞれ挿入してリレー10を絶縁基板1に取り
付け、さらに前記リード板3,3の他端側のバーリング
突起4,4内にリード線11,12の端子11a,12
aをそれぞれ挿入してリード線11,12を絶縁基板1
に取り付ける。
After mounting the lead plates 3 and 3 on the insulating substrate 1, the terminals 10a and 10b of the relay 10 are connected to the burring protrusions 4 on one end side of the lead plates 3 and 3.
4, the relay 10 is attached to the insulating substrate 1, and the terminals 11a and 12 of the lead wires 11 and 12 are further inserted into the burring protrusions 4 and 4 on the other end side of the lead plates 3 and 3, respectively.
a and insert the lead wires 11 and 12 into the insulating substrate 1 respectively.
Attach to

【0029】このようにリード板3は一定の長さを有す
るものであるが、このリード板3の途中を折曲して折り
返すことにより、バーリング突起4,4間の直線距離を
任意に定めることができ、したがってリレー10の端子
10a,10bとリード線11,12の端子11a,1
2aの間のピッチの寸法が変更となっても、一種のリー
ド板3を用いてそれに対応することができ、各ピッチご
とのリード板を用意する必要がない。このため、リード
板3の打抜き加工用の金型として一種の金型を備えれば
よく、したがって製造上のコストが安くなり、経済性が
向上する。
As described above, the lead plate 3 has a fixed length, but by bending the lead plate 3 in the middle and folding it back, the linear distance between the burring protrusions 4, 4 can be arbitrarily determined. Therefore, the terminals 10a and 10b of the relay 10 and the terminals 11a and 1 of the lead wires 11 and 12 are formed.
Even if the pitch dimension between 2a is changed, it can be dealt with by using a kind of lead plate 3, and it is not necessary to prepare a lead plate for each pitch. Therefore, it is sufficient to provide a kind of die as a die for punching the lead plate 3, so that the manufacturing cost is reduced and the economical efficiency is improved.

【0030】図8ないし図10には第2の実施例を示し
てあり、この第2の実施例においては、リード板3の両
端部に前記第1の実施例におけるバーリング突起に替え
て、その板面を円形に打抜いてなる接続孔14,14が
形成されている。
8 to 10 show a second embodiment. In this second embodiment, both ends of the lead plate 3 are replaced by the burring protrusions in the first embodiment, and Connection holes 14, 14 are formed by punching the plate surface in a circular shape.

【0031】この場合においては、リード板3の途中を
折曲して折り返して接続孔14,14間の直線距離を例
えばリレー10の端子10aとリード線11の端子11
aとの間のピッチに合わせ、こののちこのリード板3を
絶縁基板1の上に配置して接続孔14,14を取付孔
6,6に対向合致させる。そしてこの状態もとで、絶縁
基板1の上面側からリレー10の端子10aをリード板
3の一端側の接続孔14内およびこれに対向した取付孔
6内に、またリード線11の端子11aをリード板3の
他端側の接続孔14内およびこれに対向した取付孔6内
にそれぞれ挿入してリレー10の端子10aとリード線
11の端子11aとをリード板3を介して電気的に導通
させる。そしてリレー10の端子10aとリード板3の
一端側の接続孔14、およびリード線11の端子11a
とリード板3の他端側の接続孔14とを絶縁基板1の下
面側からそれぞれハンダ付けして接合させる。
In this case, the lead plate 3 is bent in the middle and folded back so that the linear distance between the connection holes 14, 14 is, for example, the terminal 10a of the relay 10 and the terminal 11 of the lead wire 11.
Then, the lead plate 3 is arranged on the insulating substrate 1 so that the connection holes 14 and 14 are oppositely aligned with the mounting holes 6 and 6. Under this condition, the terminal 10a of the relay 10 is inserted into the connection hole 14 on one end side of the lead plate 3 and the mounting hole 6 opposed to the terminal 10a from the upper surface side of the insulating substrate 1, and the terminal 11a of the lead wire 11 is attached. The lead plate 3 is inserted into the connection hole 14 on the other end side and into the mounting hole 6 facing the connection hole 14 to electrically connect the terminal 10a of the relay 10 and the terminal 11a of the lead wire 11 to each other through the lead plate 3. Let Then, the terminal 10a of the relay 10, the connection hole 14 on one end side of the lead plate 3, and the terminal 11a of the lead wire 11
And the connection hole 14 on the other end side of the lead plate 3 are soldered and joined from the lower surface side of the insulating substrate 1.

【0032】この発明は、さらに異なる構造のリード板
3を用いて実施することが可能である。例えば、図11
および図12に示すように、リード板3のいずれか一方
の端部にバーリング突起4を形成し、他方の端部に打抜
き加工による接続孔14を形成し、このリード板3の途
中を折曲して折り返すことにより、前記バーリング突起
4と接続孔14との間の直線距離を、リレーやリード線
等の電気部品の端子間のピッチに対応する距離に合わ
せ、このリード板3を絶縁基板に取り付け、その一方の
端部のバーリング突起4内および他方の端部の接続孔1
4内に前記電気部品の端子をそれぞれ挿入してその端子
間を電気的に導通させる。
The present invention can be implemented by using the lead plate 3 having a different structure. For example, in FIG.
As shown in FIG. 12 and FIG. 12, a burring protrusion 4 is formed on one end of the lead plate 3, and a connection hole 14 is formed on the other end by punching, and the lead plate 3 is bent halfway. Then, the linear distance between the burring protrusion 4 and the connection hole 14 is adjusted to the distance corresponding to the pitch between the terminals of the electric component such as the relay and the lead wire by folding back the lead plate 3 as an insulating substrate. Mounting, in the burring protrusion 4 at one end and in the connection hole 1 at the other end
The terminals of the electric component are inserted into the respective parts 4 to electrically connect the terminals.

【0033】あるいは、図13および図14に示すよう
に、リード板3の両端部にバーリング突起4,4を形成
し、さらにその中間部にもバーリング突起4aを形成
し、このリード板3の途中を折曲して折り返すことによ
り、リード板3の両端部のバーリング突起4,4間の直
線距離を、リレーやリード線等の電気部品の端子間のピ
ッチに対応する距離に合わせ、このリード板3を絶縁基
板に取り付け、その両端部のバーリング突起4,4内に
前記電気部品の端子をそれぞれ挿入するとともに、さら
に中間部のバーリング突起4a内に他の電気部品の端子
を挿入して前記各端子を電気的に導通させる。
Alternatively, as shown in FIGS. 13 and 14, burring protrusions 4 and 4 are formed at both ends of the lead plate 3, and burring protrusions 4a are further formed in the middle thereof. By bending and folding the lead plate 3, the linear distance between the burring protrusions 4 and 4 at both ends of the lead plate 3 is adjusted to the distance corresponding to the pitch between terminals of electric parts such as relays and lead wires. 3 is attached to an insulating substrate, the terminals of the electric component are inserted into the burring protrusions 4 and 4 at both ends of the insulating substrate, and the terminals of other electric components are further inserted into the burring protrusions 4a in the intermediate portion. Make the terminals electrically conductive.

【0034】さらには、図15および図16に示すよう
に、リード板3の両端部に打抜き加工による接続孔1
4,14を形成し、またその中間部に打抜き加工による
同様の接続孔14aを形成し、このリード板3の途中を
折曲して折り返すことにより、リード板3の両端部の接
続孔14,14間の直線距離を、リレーやリード線等の
電気部品の端子間のピッチに対応する距離に合わせ、こ
のリード板3を絶縁基板に取り付け、その両端部の接続
孔14,14内に前記電気部品の端子をそれぞれ挿入す
るとともに、さらに中間部の接続孔14a内に他の電気
部品の端子を挿入して前記各端子を電気的に導通させ
る。
Further, as shown in FIG. 15 and FIG. 16, the connection holes 1 are formed by punching at both ends of the lead plate 3.
4, 14 and the same connecting hole 14a is formed by punching in the middle thereof, and the lead plate 3 is bent and folded back in the middle thereof, so that the connecting holes 14 at both ends of the lead plate 3, The linear distance between 14 is adjusted to the distance corresponding to the pitch between terminals of electric parts such as relays and lead wires, and this lead plate 3 is attached to an insulating substrate. The terminals of the parts are respectively inserted, and the terminals of the other electric parts are further inserted into the connection holes 14a in the middle part to electrically connect the terminals.

【0035】[0035]

【発明の効果】以上説明したようにこの発明によれば、
端子間のピッチが種々異なる場合であっても、一種のリ
ード板を用いてその端子間を電気的に接続して導通させ
ることができ、したがって端子間のピッチごとに対応す
るリード板が不要で、経済性が確実に向上する。
As described above, according to the present invention,
Even if the pitch between the terminals is different, it is possible to electrically connect the terminals by using a kind of lead plate and make them conductive, so that there is no need for a lead plate corresponding to each pitch between the terminals. , Economic efficiency is surely improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の第1の実施例に係る回路基板装置の
下面図。
FIG. 1 is a bottom view of a circuit board device according to a first embodiment of the present invention.

【図2】その回路基板装置の要部を分解した状態の側面
図。
FIG. 2 is a side view of the main part of the circuit board device in a disassembled state.

【図3】その回路基板装置における端子間のピッチの大
きさを表示した下面図。
FIG. 3 is a bottom view showing the size of the pitch between terminals in the circuit board device.

【図4】その回路基板装置における折曲前のリード板を
示す平面図。
FIG. 4 is a plan view showing a lead plate before bending in the circuit board device.

【図5】そのリード板の側面図。FIG. 5 is a side view of the lead plate.

【図6】そのリード板の途中を折曲して折り返した状態
の平面図。
FIG. 6 is a plan view showing a state in which the lead plate is bent in the middle and folded back.

【図7】そのリード板の折曲形態の例を示す平面図。FIG. 7 is a plan view showing an example of a bent form of the lead plate.

【図8】この発明の第2の実施例に係る回路基板装置の
要部を分解して示す側面図。
FIG. 8 is a side view showing an exploded main part of a circuit board device according to a second embodiment of the present invention.

【図9】その回路基板装置における折曲前のリード板を
示す平面図。
FIG. 9 is a plan view showing a lead plate before bending in the circuit board device.

【図10】そのリード板の側面図。FIG. 10 is a side view of the lead plate.

【図11】リード板の変形例を示す平面図。FIG. 11 is a plan view showing a modified example of the lead plate.

【図12】そのリード板の側面図。FIG. 12 is a side view of the lead plate.

【図13】リード板の他の変形例を示す平面図。FIG. 13 is a plan view showing another modification of the lead plate.

【図14】そのリード板の側面図。FIG. 14 is a side view of the lead plate.

【図15】リード板のさらに異なる他の変形例を示す平
面図。
FIG. 15 is a plan view showing still another modification of the lead plate.

【図16】そのリード板の側面図。FIG. 16 is a side view of the lead plate.

【符号の説明】[Explanation of symbols]

1…絶縁基板 3…リード板 4,4a…バーリング突起 10…リレー(電気部品) 10a,10b,10c,10d…端子 11,12…リード線(電気部品) 11a,12a…端子 14,14a…接続孔 DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 3 ... Lead plate 4, 4a ... Burring protrusion 10 ... Relay (electrical part) 10a, 10b, 10c, 10d ... Terminal 11, 12 ... Lead wire (electrical part) 11a, 12a ... Terminal 14, 14a ... Connection Hole

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】絶縁基板に取り付けられた電気部品の端子
間を、導電性金属板からなるリード板を介して電気的に
導通させた回路基板装置において、 前記リード板は一定の長さを有し、このリード板の途中
を折曲して折り返すことにより、その一端側の端部と他
端側の端部との直線距離を、前記電気部品の端子間のピ
ッチに対応する距離に合わせ、このリード板を絶縁基板
に取り付け、その一端側の端部および他端側の端部に前
記端子をそれぞれ接続してその端子間を電気的に導通さ
せたことを特徴とする回路基板装置。
1. A circuit board device in which terminals of an electric component mounted on an insulating substrate are electrically connected to each other through a lead plate made of a conductive metal plate, wherein the lead plate has a constant length. Then, by bending and folding the lead plate in the middle, the linear distance between the end on the one end side and the end on the other end side is adjusted to the distance corresponding to the pitch between the terminals of the electric component, A circuit board device characterized in that the lead plate is attached to an insulating substrate, and the terminals are respectively connected to one end and the other end of the lead plate to electrically connect the terminals.
【請求項2】絶縁基板に取り付けられた電気部品の端子
間を、導電性金属板からなるリード板を介して電気的に
導通させた回路基板装置において、 前記リード板は一定の長さを有し、かつその両端側の端
部にそれぞれバーリング突起が形成されており、このリ
ード板の途中を折曲して折り返すことにより、前記両バ
ーリング突起間の直線距離を、前記電気部品の端子間の
ピッチに対応する距離に合わせ、このリード板を絶縁基
板に取り付け、その一方の端部のバーリング突起内およ
び他方の端部のバーリング突起内に前記端子をそれぞれ
挿入してその端子間を電気的に導通させたことを特徴と
する回路基板装置。
2. A circuit board device in which terminals of an electric component mounted on an insulating substrate are electrically connected to each other through a lead plate made of a conductive metal plate, wherein the lead plate has a constant length. Further, burring protrusions are formed at both ends of the burring protrusion. This lead plate is attached to the insulating substrate according to the distance corresponding to the pitch, and the terminals are inserted into the burring protrusions at one end and the burring protrusions at the other end, respectively, to electrically connect the terminals. A circuit board device characterized by being electrically connected.
【請求項3】絶縁基板に取り付けられた電気部品の端子
間を、導電性金属板からなるリード板を介して電気的に
導通させた回路基板装置において、 前記リード板は一定の長さを有し、かつその両端側の端
部にそれぞれ接続孔が形成されており、このリード板の
途中を折曲して折り返すことにより、前記両接続孔間の
直線距離を、前記電気部品の端子間のピッチに対応する
距離に合わせ、このリード板を絶縁基板に取り付け、そ
の一方の端部の接続孔内および他方の端部の接続孔内に
前記端子をそれぞれ挿入してその端子間を電気的に導通
させたことを特徴とする回路基板装置。
3. A circuit board device in which terminals of an electric component mounted on an insulating substrate are electrically connected to each other through a lead plate made of a conductive metal plate, wherein the lead plate has a constant length. In addition, connection holes are formed at the end portions on both ends thereof, and by bending and folding the lead plate in the middle, the linear distance between the connection holes can be set to a value between terminals of the electric component. This lead plate is attached to an insulating substrate according to the distance corresponding to the pitch, and the terminals are inserted into the connection holes at one end and the connection holes at the other end, respectively, and the terminals are electrically connected to each other. A circuit board device characterized by being electrically connected.
【請求項4】絶縁基板に取り付けられた電気部品の端子
間を、導電性金属板からなるリード板を介して電気的に
導通させた回路基板装置において、 前記リード板は一定の長さを有し、かつその一方の端部
にバーリング突起が、他方の端部に接続孔が形成されて
おり、このリード板の途中を折曲して折り返すことによ
り、前記バーリング突起と接続孔との間の直線距離を、
前記電気部品の端子間のピッチに対応する距離に合わ
せ、このリード板を絶縁基板に取り付け、その一方の端
部のバーリング突起内および他方の端部の接続孔内に前
記端子をそれぞれ挿入してその端子間を電気的に導通さ
せたことを特徴とする回路基板装置。
4. A circuit board device in which terminals of an electric component mounted on an insulating substrate are electrically connected to each other via a lead plate made of a conductive metal plate, wherein the lead plate has a constant length. Further, a burring protrusion is formed at one end of the burring protrusion, and a connection hole is formed at the other end of the burring protrusion. Straight line distance,
The lead plate is attached to an insulating substrate according to the distance corresponding to the pitch between the terminals of the electric component, and the terminals are inserted into the burring protrusions at one end and the connection holes at the other end, respectively. A circuit board device characterized in that the terminals are electrically connected.
JP7105843A 1995-04-28 1995-04-28 Circuit board device Pending JPH08307032A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7105843A JPH08307032A (en) 1995-04-28 1995-04-28 Circuit board device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7105843A JPH08307032A (en) 1995-04-28 1995-04-28 Circuit board device

Publications (1)

Publication Number Publication Date
JPH08307032A true JPH08307032A (en) 1996-11-22

Family

ID=14418307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7105843A Pending JPH08307032A (en) 1995-04-28 1995-04-28 Circuit board device

Country Status (1)

Country Link
JP (1) JPH08307032A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6325640B1 (en) 1999-01-04 2001-12-04 Sumitomo Wiring Systems Ltd. Electrical junction box having a bus bar
KR20170083088A (en) * 2014-11-10 2017-07-17 티이 커넥티비티 코포레이션 Bus bar for a battery connector system
JP2020166944A (en) * 2019-03-28 2020-10-08 アイシン精機株式会社 Busbar and busbar manufacturing method
JP2025155709A (en) * 2024-03-28 2025-10-14 晶科▲儲▼能科技有限公司 Connection member, cell module and energy storage battery pack

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6325640B1 (en) 1999-01-04 2001-12-04 Sumitomo Wiring Systems Ltd. Electrical junction box having a bus bar
KR20170083088A (en) * 2014-11-10 2017-07-17 티이 커넥티비티 코포레이션 Bus bar for a battery connector system
JP2017531304A (en) * 2014-11-10 2017-10-19 ティーイー・コネクティビティ・コーポレイションTE Connectivity Corporation Bus bar for battery connector system
US10396405B2 (en) 2014-11-10 2019-08-27 Te Connectivity Corporation Bus bar for a battery connector system
JP2020166944A (en) * 2019-03-28 2020-10-08 アイシン精機株式会社 Busbar and busbar manufacturing method
JP2025155709A (en) * 2024-03-28 2025-10-14 晶科▲儲▼能科技有限公司 Connection member, cell module and energy storage battery pack

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