JPH0831192A - Storage device - Google Patents

Abstract

PURPOSE:To prevent start of discharge of a bit line before a potential of a word line is confirmed. CONSTITUTION:Word lines X1-Xi are connected to gates of dummy transistors 210-1 to 210-i respectively. The dummy transistors 210-1 to 210-i are connected in series between a P channel MOS transistor 223 connected between a power supply potential and a ground potential and a ground potential. A potential between the dummy transistors 210-1 to 210-i and the p channel MOS transistor 223 is supplied to a gate of a transistor 224 for discharge, when a potential supplied to a gate is a high level, the transistor 224 for discharge make bit lines 230 and 231 discharge to a ground potential.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a memory device, and more particularly to a read-only memory (vertical ROM) in which memory cell transistors are connected in series.

[0002]

2. Description of the Related Art FIG. 4 is a diagram showing a part of a conventional vertical ROM, in which 400 to 405 are N-channel memory cell transistors each storing 1 bit, and 420.
And 421 are bit lines, and X1 to Xi are word lines. Further, among the memory cell transistors, the memory cell transistors 400, 402 and 40 indicated by double circles.
Reference numeral 5 is a depletion type MOS transistor, and memory cell transistors 401, 403 and 404 indicated by single circles are enhancement type MOS transistors. As shown in the figure, in a vertical ROM, a large number of memory cell transistors are connected in series on a bit line, and the gates of these memory cell transistors are connected to the corresponding word lines.

Next, the read operation of the vertical ROM shown in FIG. 4 will be described with reference to the timing chart of FIG. First, an address is input from the outside, and both the precharge signal and the discharge signal are kept at a high level until the value is fixed. As a result, the P channel MOS transistors 410 to 412 are turned off and the N channel MOS transistor 413 is turned on, so that the bit lines 420 and 421 are discharged to the ground potential (GND). After that, when the address is confirmed,
Both the precharge signal and the discharge signal become low level. As a result, the P-channel MOS transistors 410 to 412 are turned on and the N-channel MOS transistor 413 is turned off, so that the discharge of the bit lines 420 and 421 is completed and the power supply potential (VD
Precharge to D). Next, according to the determined address, one corresponding word line among the word lines X1 to Xi is selected and set to the low level. All unselected word lines are at high level. Therefore, all the high-level potentials are supplied to the gates of the memory cell transistors corresponding to the unselected word lines, so that all of them are turned on, whereas the memory cell transistors corresponding to the selected word line are enhanced. If it is, it will be off, and if it is a depletion type, it will be on. As an example, if the word line X1 is selected, the memory cell transistors 400, 402 to 405 are turned on,
The memory cell transistor 401 will be turned off.
After that, the precharge signal and the discharge signal respectively become high level, the precharge of the bit line is completed, and the bit line is again discharged to the ground potential (GND).
At this time, when the word line X1 is selected as described above, all the memory cell transistors other than the enhancement-type memory cell transistor 401 are turned on, and therefore, except the portion which is cut off by the memory cell transistor 401 and is not discharged. Ground potential (G
ND), and the latch signal generated subsequently latches the potentials of the bit lines 420 and 421. That is, the low level and the high level are respectively latched and output as data.

[0004]

[Problems to be Solved by the Invention] The conventional RO shown in FIG.
In M, when the discharge of the bit line is started before the selected word line has fallen to the low level, the enhancement type memory cell transistor to be turned off in response to the low level of the word line is turned off earlier than the turn-off. There is a problem that the data will be discharged and the accurate reading of data will be impaired. In other words, since the word line has a certain capacity, the potential of the selected word line after the address is fixed is not immediately set to the low level, but gradually drops to the low level with a certain delay time. However, if the bit line is discharged before the potential of the selected word line falls below the threshold value of the enhancement-type memory cell transistor, erroneous data will be read.

In order to prevent this, conventionally, as shown in FIG.
The discharge start timing is delayed from the precharge end timing to allow a margin until the selected word line falls to the low level.However, if sufficient margin is secured, the read time also becomes longer. I will end up.

Therefore, it is an object of the present invention to prevent the discharge from starting before the word line is completely lowered to the low level and to accurately read the data without sacrificing the read time.

[0007]

A memory device according to the present invention comprises means for determining that the potential of a word line corresponding to an input address has been determined, and means for controlling the potential of a bit line based on the determination result. have.

[0008]

As a result, the discharge of the bit line is started at the time when the potential of the selected word line is determined, so that the start of the discharge of the bit line before the potential of the word line is determined is prevented, and Data is reliably read.

[0009]

Embodiments of the present invention will now be described with reference to the drawings.

The memory device shown in this embodiment has a dummy data line in which dummy transistors are connected in series in a vertical ROM, and at least one word line is set to a low level by the dummy data line. It is determined whether or not the voltage has completely dropped, and on / off of the discharge transistor is controlled based on the potential of the dummy data line. That is, in FIG. 1, reference numeral 100 in the drawing denotes a vertical ROM memory cell array. Address signals AO to An input from the outside are supplied to the address buffer 101 and are supplied to the address decoder 102 and the address change detection circuit 103 as internal address signals. The address change detection circuit 103 is a circuit that outputs a detection signal (hereinafter referred to as ATD) 111 in response to a change in an input address signal. 10
Reference numeral 4 denotes a timing signal generation circuit, which receives the ATD 111 and a chip enable signal (low active and hereinafter referred to as inverted CE signal) 110 supplied from the outside, and receives a decode enable signal (high active and hereinafter referred to as DE signal). 112, precharge control signal (low active, hereinafter referred to as inverted CDP signal)
113 and latch signal 114 are generated. A data latch 105 latches the data read from the memory cell array 100 in response to the latch signal 114.

FIG. 2 is a diagram showing a part of the memory cell array 100 in detail. In FIG.
It is an N-channel memory cell transformer that stores bits. Among these memory cell transistors, the memory cell transistors 200, 202 and 205 indicated by double circles are depletion type MOS transistors, and the memory cell transistors 201 and 2 indicated by single circles.
03 and 204 are enhancement type MOS transistors. Reference numeral 210 is a dummy transistor which is an N-channel MOS type transistor, and 232 is a dummy data line in which i dummy transistors 210 are connected in series. 230 and 231 are bit lines,
I memory cell transistors are connected in series. X1 to Xi are word lines, which are connected to the gates of the corresponding memory cell transistor and dummy transistor, respectively. Reference numerals 220 to 222 denote precharge transistors, which are P-channel MOS transistors.
It is a transistor. A P-channel MOS transistor 223 controls the gate voltage supplied to the discharge transistor 224.

Next, the read operation of the memory device according to this embodiment will be described in detail with reference to the timing chart of FIG. FIG. 3 shows an example in which the word line X2 is selected and the corresponding data is read, and then the selection is changed to the word line X1 and the corresponding data is read. Therefore, the beginning of the timing diagram shows immediately after the data corresponding to the word line X2 is read. In this state, the inverted CDP signal 113 is at a high level, and the precharge transistors 220 to 222 to which this signal is supplied are off. Also, a reverse CD
P channel MO to which an inverted signal of P signal 113 is supplied
Since the S transistor 223 is on and the dummy transistor 210-2 is off in response to the low level of the selected word line X2, the potential at the point Y is high level. Therefore, since the discharge transistor 224 is on and the bit lines 230 and 231 are discharged to the ground potential, the potential at the point Z is low level.

Next, when the addresses AO to An input to the address buffer 101 change from the address corresponding to the word line X2 to the address corresponding to the word line X1,
The address change detection circuit 103 detects such a change and generates an ATD 111 which is a one-shot pulse. The timing signal generation circuit 104 receives the generation of the ATD 111 and the low level of the inverted CE signal 110, receives both the DE signal 112 and the inverted CDP signal 113 at the low level, and receives the DE signal 112 and the inverted CDP signal 113.
Are both low level. As a result, the precharge transistors 220 to 222 are turned on, the P-channel MOS transistor 223 is turned off, and the address decoder 102 is reset, so that the potential of the word line X2 which has been selected and is at the low level until now. Returned to high level. Therefore, the word lines X1 to Xi
Since the potentials of all become high level and all the dummy transistors 210-1 to 210-i are turned on, the potential of the point Y changes from high level to low level. Since the discharge transistor 224 is turned off when the potential at the point Y becomes low level, the bit lines 230 and 23 are turned on by turning on the precharge transistors 220 to 222.
1 is precharged to the power supply potential, and the potential at the Z point becomes high level.

After the bit lines 230 and 231 are sufficiently precharged, the inverted CDP signal 113 is changed from the low level to the high level, and the precharge is completed. Further, although the P-channel MOS transistor 223 is turned on in response to the high level of the inverted CDP signal 113, all the dummy transistors 210-1 to 210-i are turned on, so the potential at the point Y does not become high level. Therefore, the discharge transistor 224 is not turned on. That is, the discharge of the bit line is not started. Then, the DE signal 112 becomes high level, and the address decoder 102 starts to decode the addresses AO to An corresponding to the word line X1.
The potential of changes gradually from high level to low level. Then, when the potential of the word line X1 is sufficiently lowered to the low level and the dummy transistor 210-1 is turned off, the potential at the point Y finally becomes the high level. When the potential at the Y point becomes high level, the discharge transistor 224 is turned on and the potential at the Z point becomes low level. That is, the bit lines 230 and 231 are discharged. Then, as described above, the word line X
When the potential of 1 drops to the low level, the enhancement type memory cell transistor 201 is turned off, and the depletion type memory cell transistor 202 is still turned on. Therefore, in response to the latch signal generated subsequently, from the bit line 230. The low level data is latched in the data latch, and the high level data from the bit line 231 is latched in the data latch and output to the outside.

As described above, the discharge transistor 224 is controlled by the potential of the dummy data line 232. That is, unless the potential of the point Y on the dummy data line 232 is at the high level, the discharge transistor 224 does not turn on, so the bit lines 230 and 231 are not discharged. On the other hand, in order for the potential at the point Y on the dummy data line 232 to become high level, the P-channel MOS transistor 223 turns on and the dummy transistor 210
Since at least one of -1 to 210-i needs to be turned off, in order to satisfy this, the inverted CDP signal 11
It is necessary that 3 is at a high level and at least one of the word lines X1 to Xi is at a sufficiently low level. Therefore, it is impossible for the bit line to be discharged before the potential of the selected word line is determined, so that accurate data reading is performed.

In this embodiment, the DE signal is set to the high level after the inverted CDP signal becomes the high level, but they may be set to the high level at the same time. In this case, the inverted CDP signal and the DE signal can be shared.

[0017]

As described above, according to the present invention, since the means for detecting whether or not the potential of the word line is determined in the vertical ROM is provided, the discharge start of the bit line before the determination of the potential of the word line is started. Since this is prevented, the data can be read accurately. Further, by such means, the bit line can be discharged immediately after the potential of the word line is determined, and the data can be read at high speed.

[Brief description of drawings]

FIG. 1 is an overall view of a storage device according to an embodiment of the present invention.

FIG. 2 is a diagram showing a main part of an embodiment of the present invention.

FIG. 3 is a timing chart showing the operation of the embodiment.

FIG. 4 is a diagram showing a conventional example.

FIG. 5 is a timing chart showing the operation of a conventional example.

[Explanation of symbols]

 100 memory cell array 101 address buffer 102 address decoder 103 address change detection circuit 104 timing signal generation circuit 105 data latch 110 chip enable signal 111 detection signal 112 decode enable signal 113 precharge signal 114 latch signal 200 to 205 memory cell transistor 210 dummy transistor 220 ~ 223 P-channel MOS transistor 224 N-channel MOS transistor 230, 231 Bit line 232 Dummy data line X Word line

Claims (6)

[Claims] 1. A first means for determining that the potential of a word line corresponding to an input address has been determined, and a second means for controlling the potential of a bit line based on the determination result of the first means. A storage device having: 2. The first means is a dummy transistor in which corresponding word lines are connected to respective gates.
2. The storage device according to claim 1, wherein a plurality of dummy data lines are connected in series between the power supply terminal and the second power supply terminal, and the determination is made based on the potential of the dummy data lines. 3. A memory cell, which receives a potential of a word line selected according to an input address and a signal for controlling precharge and discharge of a bit line, reads a memory cell corresponding to the potential of the selected word line. A memory device comprising: means for discharging the bit line in response to the potential that can be output and the signal instructing the discharge of the bit line. 4. A first and second means connected in series between a first power supply terminal and a second power supply terminal, and the first means.
Third means for receiving the potential at the connection point between said means and said second means
Means for responding to the fact that the potential of the word line corresponding to the input address is determined to be a potential at which the corresponding memory cell can be read, the connection point and the first power supply terminal are provided. Between the connection point and the second power supply terminal in a conductive state in response to the generation of the signal for permitting the discharge of the bit line. The means of 3 supplies the potential of the first power supply terminal to the bit line in response to the potential of the connection point. 5. The memory device according to claim 1, wherein the bit line is a bit line in which a plurality of depletion type or enhancement type memory cell transistors are connected in series. 6. The bit line is a bit line in which a plurality of depletion type or enhancement type memory cell transistors are connected in series, and the readable potential makes the enhancement type memory cell transistor non-conductive. 4. The potential is a potential.
Or the storage device according to item 4.