JPH0831431B2 - Inspection methods - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an inspection method.

(Prior Art) Generally, in the manufacture of semiconductor devices, a large number of semiconductor devices are formed on a semiconductor wafer formed in a substantially disk shape, and cut into individual semiconductor devices by a dicing saw.

In such a dicing process, a dicing device as shown in FIG. 3 is conventionally used. That is,
The dicing device 1 is composed of an annular plate having an opening 2 at the center, and an adhesive seal 3 is attached from the back surface side so as to close the opening 2, and the semiconductor is attached to the adhesive seal 3 exposed at the opening 2 part. By sticking the wafer 4, the semiconductor wafer 4 is fixed to the dicing device 1. Then, it is cut along a scribe line (not shown) formed on the semiconductor wafer 4 by a dicing saw, and non-defective products are selected and taken out from these semiconductor devices. In order to select good products and defective products at this time, test measurement is performed on individual semiconductor devices in a probing process which is a pre-process of the dicing process, and for example, defective semiconductor devices are inked by an inker, A good product and a defective product are distinguished by the presence or absence of this ink.

(Problems to be Solved by the Invention) Generally, a semiconductor wafer is printed with identification symbols, such as letters, numbers, and bar codes, but in the process of manufacturing a semiconductor device, a plurality of layers are formed on the semiconductor wafer. Since the process of forming the film is performed, a multi-layer film is also formed on the identification symbol, and such an identification symbol is used in the final step such as performing the test measurement by the probe device. Is difficult to read mechanically. Further, after the semiconductor wafer is cut into individual semiconductor devices in the dicing process, it becomes impossible to mechanically read the identification symbol.

As described above, since it is difficult to identify the semiconductor wafer, a map showing the positions on the semiconductor wafer of non-defective and defective semiconductor devices can be obtained as data during the test measurement by the probe device, but this can be obtained in the subsequent process. It becomes difficult to match the map and the semiconductor wafer. Therefore, conventionally, defective semiconductor devices are inked according to the map, and non-defective and defective products are selected according to the presence or absence of the ink.

However, when inking is performed, the ink may be scattered and adhere to a non-defective semiconductor device, or baking for drying the ink is required, which increases the number of steps and deteriorates productivity. There's a problem.

The present invention has been made in view of such conventional circumstances, and an object thereof is to provide an inspection method capable of eliminating the inking and the baking process associated with the inking.

[Structure of the Invention] (Means for Solving Problems) That is, according to the present invention, a semiconductor wafer is probed,
Test measurement is performed on each semiconductor device formed on this semiconductor wafer, and
The step of obtaining a map showing the measurement result of the defect, and the map obtained in this step to an annular plate holding the semiconductor wafer by an adhesive seal attached so as to close the opening provided in the center. A step of writing in the electric circuit device provided, a step of carrying the annular plate holding the semiconductor wafer, a step of dicing the semiconductor wafer held by the annular plate carried by this step, and A step of reading the map from the provided electric circuit device and selecting a non-defective product of the semiconductor device of the semiconductor wafer diced according to the map.

(Operation) In the inspection method of the present invention having the above configuration, a semiconductor wafer is probed, and test measurement is performed on individual semiconductor devices formed on this semiconductor wafer, and a map showing measurement results of good and defective of these semiconductor devices. And the map obtained in this step in an electric circuit device provided on an annular plate holding the semiconductor wafer by an adhesive seal attached so as to close the opening provided at the center. A writing step, a step of transferring the annular plate holding the semiconductor wafer, a step of dicing the semiconductor wafer held by the annular plate transferred in this step, and the electric circuit device provided on the annular plate Read the map from the above, and select non-defective semiconductor device of the semiconductor wafer diced according to this map. And a separate step.

Therefore, for example, it is possible to read the information electrically or optically to identify the semiconductor wafer,
The above-mentioned map created by the probe device and the semiconductor wafer can be associated with each other, and the process can be performed according to the map. Therefore, inking becomes unnecessary.

(Examples) Examples of the inspection method of the present invention will be described below with reference to the drawings.

The dicing device 11 is composed of an annular plate having an opening 12 in the center, and an adhesive seal 13 is attached from the back surface side so as to close the opening 12, and the adhesive seal 13 exposed at the opening 12 is a semiconductor. By sticking the wafer 14, the semiconductor wafer 14 is fixed to the dicing device 11.

Further, for example, in the upper portion of the annular plate of the dicing device 11, a plurality of through holes 15 which are regularly arranged are formed. These through holes 15 are for displaying information about the semiconductor wafer 14 attached to the opening 12 portion, and like the opening 12, an adhesive seal 13 is provided so as to close these through holes 15. By sticking, for example, by forming a through hole only in a predetermined through hole 15 portion with a laser device or a mechanical needle-like object, an ID code or the like of the semiconductor wafer 14 is determined depending on the presence and position of this through hole. Represent

When the wafer dicing apparatus 11 of this embodiment having the above-mentioned configuration is used, a dicing saw is used to cut along a scribe line (not shown) formed on the semiconductor wafer 14, and non-defective products are selected from these semiconductor devices. When taking out, the semiconductor wafer 14 can be identified by reading the ID code displayed by the through hole 15 with an optical device using, for example, a laser beam or a photodiode. Therefore, after the test measurement of the semiconductor device by the probe device, for example, even when carrying it to another factory for dicing, it is possible to associate the map obtained by the measurement with the probe device with the ID code of the semiconductor wafer. By sending the map of the measurement results and the ID code to the non-defective item selection step, the non-defective item can be accurately selected according to the map. Therefore, inking becomes unnecessary.

FIG. 2 shows a wafer dicing apparatus according to another embodiment. In this embodiment, an electric circuit device for electrically storing information instead of the through hole 15 as means for indicating information about the semiconductor wafer 14 is shown. For example, a small IC card 20 is fixed to the upper part of the annular plate of the dicing device 11, for example.

With the wafer dicing apparatus of this embodiment having the above-described structure, the same effects as those of the above-described embodiment can be obtained, and it is also possible to directly write the map obtained by the measurement by the probe device to the IC card 20, for example. .

In these examples, an example using the through hole 15 as a mechanism for indicating information about the semiconductor wafer 14 and an IC card
Although the example using 20 has been described, the present invention is not limited to such an example, and it goes without saying that any mechanism may be used as a mechanism for indicating information about the semiconductor wafer 14. However, since the wafer dicing apparatus 11 is often used repeatedly, the information about the semiconductor wafer 14 needs to be easily rewritten.

[Effects of the Invention] As described above, according to the inspection method of the present invention, the inking process and the baking process associated with the inking process can be eliminated. Therefore, the ink does not scatter and adhere to the non-defective semiconductor device, and the productivity can be improved by reducing the steps. further,
Re-measurement after redundancy becomes easy, and troublesome adjustment of the inker is unnecessary.

[Brief description of drawings]

FIG. 1 is a front view showing a wafer dicing apparatus according to an embodiment of the present invention, FIG. 2 is a front view showing a wafer dicing apparatus according to another embodiment, and FIG. 3 is a conventional wafer dicing apparatus. It is a front view. 11 ... Dicing device, 12 ... Opening part, 13 ... Adhesive seal, 14 ... Semiconductor wafer, 15 ... Through hole.

Claims (1)

[Claims] 1. A step of probing a semiconductor wafer, performing test measurement on individual semiconductor devices formed on this semiconductor wafer, and obtaining a map showing measurement results of good and defective of these semiconductor devices; Writing the obtained map in an electric circuit device provided on an annular plate holding the semiconductor wafer by an adhesive seal attached so as to close an opening provided in the center; The step of transporting the annular plate, the semiconductor wafer held by the annular plate transported by this step is diced, and the map is read from the electric circuit device provided on the annular plate. A step of selecting a good product of the semiconductor device of the semiconductor wafer diced according to Characterized inspection method.