JPH08320341A - Dynamic-quantity detection device - Google Patents

Abstract

PURPOSE: To obtain an acceleration detection device having a structure which is simple and which can be miniaturized. CONSTITUTION: A lid part 4 is attached to a housing body part 2, a hollow part 5 is formed, and a sensor chip 3 which is displaced when subjected to an acceleration is bonded and fixed inside the hollow part 5. The bousing body part 2 comprises a flat edge, and electric interconnections 8, 9 which are connected electrically to the sensor chip 3 are formed on the edge via the inside of the housing body part 2. The edge is connected electrically and mechanically to a circuit board 10 by a jointing material 12, and the housing body part 2 is fixed to the circuit board 10 nearly vertically.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mechanical quantity detecting device provided with a sensor chip which is displaced by the action of force, and detects acceleration by, for example, a cantilever formed on a silicon substrate receiving acceleration and displaced. The present invention can be applied to a semiconductor type acceleration detecting device.

[0002]

2. Description of the Related Art The structure of a conventional acceleration detecting device is shown in FIG. FIG. 13A is a side cross-sectional view thereof, and the housing 100 has a lid portion 100a and forms a hollow portion inside. A sensor chip for detecting acceleration, a processing circuit, and the like are housed in the hollow portion. The housing 100 has a cover 100b for fixing which has a screw hole.
And is fixed to the fixing plate 103 with screws 102. The fixing plate 103 is L-shaped, and has a screw 103
It is fixed to the circuit board 104 by a. Therefore, the housing 100 is mechanically fixed to the circuit board 104 substantially vertically through the fixing plate 103.

Further, the housing 100 has a terminal 101 connected to an electric circuit provided therein. The terminal 101 is connected to the takeout terminal 105, and the takeout terminal 105 is further connected to the circuit board 104.
To be electrically connected to the wiring on the circuit board 104. The lead-out terminal 105 is fixed in position by the resin mold portion 106.

FIG. 13B shows a plan view of the housing 100 with the lid portion 100a removed. As shown in the figure, in the housing 100, a processing circuit 109 including chip parts such as a sensor chip 108, a processing chip, a resistor, and a capacitor is formed on a ceramic substrate 107. The processing circuit 109 detects a displacement of the sensor chip 108 due to acceleration and outputs an acceleration signal. This acceleration signal is sent to the ECU (not shown) on the circuit board 104 via the terminal 101 and the takeout terminal 105,
It is used for controlling airbags.

FIG. 14 shows a schematic sectional structure of the housing 100. Ceramic substrate 107 on stem 110
Are bonded and fixed, and the sensor chip 108 and the processing circuit 109 are formed on the ceramic substrate 107. Further, on the front side of the stem 110, the metallic lid 1
00a is attached by welding to hermetically seal the hollow portion 111. A metallic fixing cover 100b is attached to the back side by welding. These constitute a sensor assembly.

Further, the terminal 101 and the sensor chip 108,
The processing circuit 109 is wire-bonded with a wire 112 and electrically connected to the outside. The terminal 101 is
The stem 110 is hermetically sealed with a low melting point glass 113, and the lid 100a is welded to the stem 110 to hermetically seal the inside of the housing 100.

The circuit board 104 shown in FIG.
Is mounted on a plane parallel to the floor in the passenger compartment,
The housing 100 is attached to the circuit board 104 via the fixing plate 103 so that the sensor chip 108 is substantially perpendicular to the circuit board 104.

[0008]

As described above, the conventional acceleration detecting device has a large number of parts, a complicated structure, and a large size, and accordingly, a large number of manufacturing steps are required. That is, according to the above-described conventional configuration, the lid portion 100a, the stem 110, the terminal 101 are provided as the configuration of the airtightly sealed portion.
Is provided. Further, in order to mechanically connect the housing 100 to the circuit board 104 substantially vertically, a fixing plate 103 fixed substantially vertically to the circuit board 104 is provided, and a fixing cover 1 for fixing it to the circuit board 104 with screws.
00b and screws 102 are required. Furthermore, in order to electrically connect the circuit board 104 and the acceleration detection device, the lead-out terminal 105 and the through hole for soldering of the circuit board 104 are required.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a mechanical quantity detection device such as an acceleration detection device with a structure that is simple and can be miniaturized.

[0010]

In order to achieve the above object, in the invention described in claim 1, the circuit board (1
0) a housing (2, 21, 22, 22, 4, 41, 42, 43) fixed on the housing and having a hollow portion (5), and displaced by receiving a force in a direction parallel to the circuit board mounted in the hollow portion. And a sensor chip (3) for controlling the mechanical quantity, wherein the housing has a flat end surface (B surface).
And electrical wiring (8, 81, 82, 9, for extracting an electrical signal indicating the displacement state of the sensor chip).
91) is formed on the end surface through the inside of the housing, and the end surface on which the electric wiring is formed is electrically and mechanically connected to the circuit board, and the housing is fixed substantially perpendicular to the circuit board. It is characterized by being.

According to a second aspect of the present invention, the sensor has a hollow portion (5) inside and a flat end surface (B surface) and is displaced in the hollow portion due to acceleration. A housing (2, 21, 22, 4, 4, 41, 42, 43) to which a chip (3) is attached, and an electric signal formed in the housing and on the end face for extracting an electric signal indicating a displacement state of the sensor chip. A circuit board (1) on which electric wiring (8, 81, 82, 9, 91) and a circuit element that operates based on the electric signal are formed.
0) and connecting means (12) for electrically and mechanically connecting the end surface on which the electric wiring is formed to the circuit board to fix the housing substantially perpendicularly to the circuit board. It features a detection device.

According to a third aspect of the present invention, in the acceleration detecting device according to the second aspect, the housing is a flat substrate (21) to which the sensor chip is attached.
And a lid portion (41) having a concave shape, which is attached to one surface side of the substrate to form the hollow portion and hermetically seals the hollow portion. There is.

According to a fourth aspect of the present invention, in the acceleration detecting device according to the second aspect, the housing includes a box-shaped housing main body portion (2, 21, 22) having a recess for accommodating the sensor chip. A lid part (4, 41, 4) attached to the front surface of the concave part of the housing body part to form the hollow part and hermetically seal the hollow part.
2, 43).

According to a fifth aspect of the present invention, in the acceleration detecting device according to the fourth aspect, the lid portion is formed on the same plane as the end portion and the first portion attached to the entire surface of the recess. And an L-shaped part (42) having a part (1), wherein the connecting means connects the end face of the housing and the second part to the circuit board.

According to a sixth aspect of the present invention, there is provided a housing main body (2), which is a box-shaped member having a recess, in which a sensor chip (3) which is displaced by receiving acceleration is mounted in the recess. A lid part (4) attached to the front surface of the recess of the housing main body to form a hollow part for accommodating the sensor chip and hermetically sealing the hollow part; Electrical wiring (84, which is formed on one surface of the outer periphery (the upper surface of the housing body 2) and the other surface orthogonal to the one surface (the back surface of the housing body 2) for extracting an electrical signal indicating the displacement state of the sensor chip. 93), a circuit board (10) on which circuit elements that operate based on the electric signal are formed, and one of the one surface and the other surface is electrically connected to the circuit board. And mechanically connected, is characterized in acceleration detecting device and a connection means (12) for fixing said housing body to the circuit board.

According to a seventh aspect of the invention, in the acceleration detecting device according to any one of the fourth to sixth aspects, the housing body is formed by laminating a plurality of insulating substrates. It is characterized by being. The invention according to claim 8 is the acceleration detecting device according to any one of claims 2 to 7, characterized in that the connecting means is a conductive bonding agent.

In the invention described in claim 9, the first,
Housings (2, 4) having a second outer wall (outer walls on the upper surface and the back surface of the housing body portion 2) and having a hollow portion (5), and the housing (2, 4) mounted in the hollow portion and displaced by receiving acceleration A sensor chip (3) for outputting an electric signal indicating a state, and an electric wiring means (7, 84,) having a pad area (93) formed on the first and second outer walls for taking out the electric signal. 93), and one of the pad regions formed on the first and second outer walls is electrically and mechanically connected to the circuit board (10), and the housing is fixed to the circuit board. It is characterized by that.

According to a tenth aspect of the present invention, in the acceleration detecting device according to any one of the second to ninth aspects,
A processing circuit, which is electrically connected to the sensor chip and detects acceleration by displacement of the sensor chip and outputs the electric signal, is provided in the hollow portion. In the invention according to claim 11, a sensor chip (3) having a hollow portion (5) inside and a flat end face outside is provided, and a sensor chip (3) displaced in the hollow portion by receiving acceleration. The attached housings (2, 4), electrical wiring (83, 92) formed in the housing and on the outer peripheral portion of the housing for taking out an electrical signal indicating the displacement state of the sensor chip, and the electrical signal A circuit board (10) having a circuit element that operates based on the circuit board and having a circuit wiring (11) connected to the circuit element, and a wire means (19) for electrically connecting the electric wiring and the circuit wiring. ) And a connecting means (12) for connecting the end surface of the housing to the circuit board and fixing the housing in a substantially vertical direction. .

According to the invention of claim 12, in claim 11,
The acceleration detecting device according to claim 1, further comprising a case (18) having a step, wherein the circuit board is attached to an upper step portion of the step and the housing is fixed to a lower step portion of the housing and the circuit board. It is characterized in that they are formed in substantially the same plane. The reference numerals in parentheses of the above-mentioned means indicate the correspondence with the concrete means described in the embodiments described later.

[0020]

According to the invention described in claims 1 to 10, the sensor chip is mounted in the hollow portion of the housing. The electric signal indicating the displacement state of the sensor chip is taken out to the outside by the electric wiring formed in the housing and the flat end surface. The end surface of the housing is electrically and mechanically connected to the circuit board, so that the housing is fixed substantially perpendicularly to the circuit board and the electric signal is sent to the circuit board.

Therefore, since the housing having the flat end surface is electrically and mechanically connected and fixed to the circuit board,
Since a fixing plate as in the related art is not required and electrical and mechanical connections are made at one place, the structure can be simplified as compared with the conventional one. In the inventions according to claims 2 to 9, the invention can be applied to an acceleration detecting device for detecting acceleration to simplify the configuration.

According to the sixth and ninth aspects of the invention, in such an acceleration detecting device, the housing can be fixed to the circuit board in both the vertical direction and the horizontal direction, and the mounting is free. The degree can be increased. According to the invention as set forth in claims 11 and 12, electric wiring for extracting an electric signal indicating the displacement state of the sensor chip is formed in the housing and on the outer peripheral portion of the housing, and the electric wiring and the circuit wiring on the circuit board are formed. And are connected by wire means. Further, the flat end surface of the housing is fixed to the circuit board substantially vertically.

Therefore, also in the present invention, the acceleration detecting device can be constructed with a simple structure without the need for the conventional fixing plate.

[0024]

【Example】

(First Embodiment) FIG. 1 shows a side sectional structure of an acceleration sensor (hereinafter referred to as a G sensor) 1 in an acceleration detecting device. The G sensor 1 is composed of a housing body 2, a sensor chip 3, a lid 4, etc., and as shown in the figure,
It is mounted substantially perpendicular to the circuit board 10. The housing body 2 and the lid 4 form a housing.

The housing main body 2 is a box-shaped member having a recess formed by laminating a plurality of insulating substrates such as ceramics and glass, and has a hollow portion 5 for accommodating the sensor chip 3 and the like. There is. The hollow portion 5 is hermetically sealed by the lid portion 4 made of a ceramic material being bonded and fixed to the housing body portion 2 by solder, low melting point glass, adhesive or the like. The lid 4 is provided to protect the sensor chip 3 from water vapor or the like from the outside. The lid 4 can be made of an insulator such as glass or a metal, in addition to the ceramic material.

The sensor chip 3 is adhesively fixed to the inner surface of the housing body 2 by a die bonding agent 6. The sensor chip 3 has a cantilever composed of a weight 3a and a thin portion 3b formed on a single crystal silicon substrate, and the displacement of the weight 3a is detected by a strain gauge provided in the thin portion 3b. This strain gauge has a bridge structure as is known, and acceleration is detected by a processing circuit. In addition,
Although not shown in FIG. 1, the processing circuit is formed on the surface of the housing body 2 on which the sensor chip 3 is formed.

The housing body 2 is provided with wirings 8 and 9 for making electrical connection with the outside. The wiring 8 is electrically connected to the wiring lead-out pads provided in the sensor chip 3 and a processing circuit (not shown) by wire bonding using a wire 7 such as Al or Au, and also passes through the inside of the housing main body 2 and the housing main body 2. It is electrically connected to the wiring 9 which is formed on the end surface, the upper surface and the lower surface of the portion 2 and forms a pad region. Here, the wire 7 and the wirings 8 and 9 constitute an electric wiring means for taking out an electric signal from the sensor chip 3.
The wiring 8 may be formed by forming a via hole in the substrate as in the embodiment of FIG. 7 described later.

The G sensor 1 is fixed substantially vertically on a circuit board 10 on which a circuit element such as an ECU is mounted by a bonding agent 12 such as solder or Ag paste. Here, the wiring 9 formed on the housing body 2 and the wiring 11 (circuit wiring connected to the circuit element) formed on the circuit board 10 are electrically connected via the bonding agent 12. Therefore, the G sensor 1 is electrically and mechanically connected to the circuit board 10 by the bonding agent 12.

With the above-described structure, the G sensor 1 can be mounted substantially perpendicular to the circuit board 10. In the above embodiment, unlike the conventional one, the housing body 2 and the lid 4 are made of a ceramic material or the like. Even with such a configuration,
By providing a noise countermeasure amplifier in the processing circuit in the G sensor 1 and further providing a noise elimination filter in the circuit on the circuit board 10 side, sufficient noise countermeasures can be taken.

FIG. 2 shows the structure of the housing body 2. 2A to 2E show the upper surface, the front surface, the lower surface, the side surface, and the rear surface of the housing body portion 2, respectively.
As shown in this figure, the housing body 2 has a hollow portion 5
Is formed, and the sensor chip 3 and the like are formed on the surface A of the hollow portion 5. Further, the wiring 8 is formed in the housing main body 2, and the upper surface of the housing main body 2 shown in FIG.
The wiring 9 is formed on a part of the front surface and the back surface. The B surface side is connected to the circuit board 10 via the bonding agent 12, and the wiring 9 is electrically connected to the wiring 11 on the circuit board 10.

The housing body 2 is formed by stacking punched substrates. A manufacturing method of this product will be described with reference to FIG. ceramic,
Prepare 6 substrates made of insulating material such as glass (the number of layers is determined by the size of the housing, circuit scale, etc.),
The upper three of them are punched as shown in FIG. For these six substrates, a large number of punched holes are formed in one substrate as shown in FIG. 4 in order to form a large number of housing body portions at once.

Then, as shown in FIG. 3B, the conductor paste 13 is formed by printing at a predetermined position, and these are laminated and pressed (FIG. 3C). Next, as shown in FIG. 3D, cutting is performed with a cutter or the like. This cutting is performed in the vertical direction of FIG. 4, that is, in the direction indicated by the dotted line in the drawing. After this, as shown in FIG. 3E, the conductor paste 14 is printed on the side surface that is the B side so as to be connected to the conductor paste 13 formed previously. After that, firing is performed, Cu or Ni or Au plating is applied (FIG. 3 (F)), and further cut laterally with a cutter or the like to form one housing body 2.

The conductor pastes 13 and 14 are the wirings 8,
It is for forming 9. The sensor chip 3 and the like are adhesively fixed to the housing body 2 in the hollow portion 5, and the lid portion 4 is further adhesively fixed to the front surface of the housing body 2. Thereafter, as shown in FIG. 1, the end surface of the housing body 2 is fixed to the circuit board 10 substantially vertically by the bonding agent 12.

The verticality of the G sensor 1 and the circuit board 10 is determined by the dimensional accuracy of the housing body 2. The parallelism of the A surface can be formed at 0.5 ° or less, and the perpendicularity of the B surface is determined by the accuracy of a cutter or the like for cutting the B surface, and can be processed at the accuracy of 0.5 ° or less. Therefore, as a whole, 1 °
The G sensor 1 can be fixed to the circuit board 10 substantially vertically with the following inclination.

In the above embodiment, FIGS. 3D and 3E are used.
As shown in, the conductor paste 14 is printed on the end face after cutting the laminated substrate, but the conductor paste may be formed in advance by using the via hole.
The substrates may be cut in the same vertical and horizontal steps.
That is, as shown in FIG. 5A, the via holes 15 are formed in each substrate along with the punching of the substrate,
In the step of (B), the conductor paste 1 is applied to the substrate in the same manner as in FIG. 3 (B).
At the same time when 3 is printed, a conductor paste is embedded in the via hole 15.

After that, as shown in FIG. 5C, the substrates are laminated, pressed and baked, and then plated as shown in FIG. 5D, and finally the via hole 15 is formed. One housing main body 2 is constructed by cutting in the vertical direction (the direction of the dotted line in FIG. 4) with a cutter or the like at the point where it is present. By thus forming the wiring 9 using the via hole 15, the vertical direction and the horizontal direction can be performed in the same step, so that a large number of housing main body portions 2 can be manufactured at one time. (Second Embodiment) This embodiment is a modification of the structure of the housing with respect to the first embodiment. In this embodiment, as shown in FIG. 6, a flat plate-shaped substrate 21 is used and a hollow portion is provided on the lid 41 side. Lid 4
1 is a metallic material having a concave portion,
It is adhesively fixed to one surface side. As a result, the hollow portion 5 that houses the sensor chip 3 is formed, and the inside of the hollow portion 5 is hermetically sealed. Also, the recessed lid portion 4
1, the thickness in the width direction can be increased, and the stability when bonded to the circuit board 10 can be improved.

In this embodiment, a via hole is provided in the substrate 21, a wiring 81 is formed in this via hole, and is connected to the wiring 9 formed on the end face. The lid 41 may be made of ceramic, glass, or the like, instead of being made of metal. (Third Embodiment) In this embodiment, as shown in FIG. 7, a metallic L-shaped lid portion 42 is used. By using the L-shaped lid portion 42,
The stability when fixing the sensor 1 to the circuit board 10 is improved, and as a result, the thickness of the housing body 2 can be reduced.

As in the first embodiment, the housing body 2 is formed by laminating a plurality of insulating substrates, and the wiring 8 is formed in the housing body 2 via a via hole.
2 is formed and the wiring 82 is formed on the end face of the wiring 9
Connected to The L-shaped lid 42 may be made of ceramic, glass, or the like, instead of being made of metal. (Fourth Embodiment) In this embodiment, a laminated substrate is not used for the housing main body 2 and a resin is molded as shown in FIG. As the resin, a liquid crystal polymer having a low moisture permeability can be used. The lid 43 is also made of resin in consideration of the coefficient of thermal expansion with the resin housing body 22.

The manufacturing method of this product is shown in FIG. First,
After a resin using a liquid crystal polymer is insert-molded as shown in FIG. 9A, a via hole 16 is formed. As shown in FIG. 9 (B), Cu or Ni is formed on the entire surface of this material.
Alternatively, plating is performed with Au or the like, and then, as shown in FIG.
After forming a resist on the entire surface as shown in FIG. Finally, as shown in FIG. 9D, etching is performed to obtain a wiring pattern 91 having a desired shape.

Further, in order to enhance the airtightness in the hollow portion 5 with respect to the formation of the via hole 16, the bonding agent 1 is applied to the via hole 16.
7 is provided to hermetically seal. The lid 4
In addition to resin, 3 may be made of metal as long as it has a thermal expansion coefficient close to that of the housing main body 22. (Fifth Embodiment) In this embodiment, as shown in FIG. 10, a resin case 18 is used, a step is provided on the resin case 18, and the G sensor 1 is bonded and fixed to the lower part of the step. It is the one. The circuit board 10 is fixed to the upper part of the resin case 18.

The G sensor 1 has wirings 83 and 92 on the upper side thereof.
Is formed, and is electrically connected to the circuit board 10 by wire bonding with the wire 19. With such a configuration, the G sensor 1 and the circuit board 10 can be formed in substantially the same plane. Note that the third
In the fifth embodiment, the lid is made of metal, resin or the like, but it may be made of ceramic or the like. (Sixth Embodiment) This embodiment is shown in FIGS. The G sensor 1 is fixed on the circuit board 10 on which the circuit elements a and b such as an ECU are mounted at the same time as the circuit elements a and b by a bonding agent 12 such as solder or Ag paste by, for example, reflow. Not only in the sixth embodiment but also in the first embodiment and the like, the circuit elements a and b are mounted on the circuit board 10 and the G-sensor 1 is bonded by the bonding agent 12.
At the same time, it is fixed on the circuit board 10.

Here, the wirings 93, 95 or 94, 95 formed on the housing body 2 and the wirings 11 formed on the circuit board 10 (circuit wiring connected to the above circuit elements).
Are electrically connected via the bonding agent 12. Therefore, G
The sensor 1 is bonded to the circuit board 10 by the bonding agent 12.
It will be electrically and mechanically connected. Since the circuit board 10 on which the G sensor 1 is mounted is mounted on a plane parallel to the floor in the vehicle compartment, the G sensor 1 is fixed to the circuit board 10 only in the vertical direction in the various embodiments described above. However, the circuit board 1 on which the G sensor 1 is mounted
When 0 is mounted in the handle, the G sensor 1 is horizontally fixed to the circuit board 10.

Therefore, in this embodiment, the G sensor 1 can be selectively fixed to the circuit board 10 not only in the vertical direction but also in the horizontal direction, thereby increasing the degree of freedom in mounting the G sensor 1. . Therefore, as shown in FIG. 11, wirings 93 to 95 are formed on the outer peripheral surface of the housing body 2, and the wirings 93 electrically connect to the wirings 11 on the circuit board 10. In this case, since the wiring 93 is formed on the upper surface (the bottom surface in the attached state of FIG. 11A) and the back surface of the housing main body portion 2, the wiring 93 shown in FIG.
(B) As shown in each of the drawings, the wiring 93 and the wiring 11 on the circuit board 10 can be electrically connected regardless of whether the circuit board 10 is fixed vertically or horizontally.

In this embodiment, the wiring 84 is formed by forming a via hole in the housing body 2. Other configurations are similar to those shown in the first embodiment. FIG. 12 shows the structure of the housing body 2 in this embodiment. (A) to (E) show an upper surface, a front surface, a lower surface, a side surface, and a back surface of the housing body portion 2, respectively. As shown in this figure, the wiring 94, 95
Are formed separately from the wiring 93. Wiring 93-9
Although it is possible to form 5 without separating them, it is preferable to separate them in consideration of the durability of the bonding agent 12.

Although the wirings 94 and 95 are dummy wirings not related to signal transmission, the wirings 84 and the like may be provided for these wirings to serve as signal wirings.
In the various embodiments described above, the processing circuit is not limited to being formed on the same surface as the sensor chip 3 in the housing body 2, but may be integrally formed with the sensor chip 3 or the housing. It may be provided on the outer peripheral surface of the main body 2. Further, the signal from the sensor chip 3 may be received and the signal processing may be performed on the circuit board 10 side. In either case, the electric signal taken out from the housing body 2 becomes the electric signal indicating the displacement state of the sensor chip in the claims.

Further, although the strain gauge type acceleration sensor using single crystal silicon is shown in the above embodiment, the present invention can be applied to a thin film capacitance type acceleration sensor using polycrystalline silicon or the like. Further, the application of the present invention to the acceleration detecting device is shown, but the housing is fixed substantially perpendicular to the circuit board, and the sensor chip is provided in the housing to detect the force in the direction parallel to the circuit board. Any other detection device may be used as long as it is applicable, for example, a pressure sensor that detects pressure.

[Brief description of drawings]

FIG. 1 is a sectional configuration diagram showing a first embodiment of the present invention.

2A and 2B show the structure of a housing body 2 in FIG. 1, where FIG. 2A is a top view, FIG. 2B is a front view, FIG. 2C is a bottom view, FIG. 2D is a side view, and FIG. Is a back view.

FIG. 3 is a process drawing showing a manufacturing process of the housing body 2.

FIG. 4 is a perspective view showing six substrates forming the housing body 2.

FIG. 5 is a process drawing showing another manufacturing process of the housing body 2.

FIG. 6 is a sectional configuration diagram showing a second embodiment of the present invention.

FIG. 7 is a sectional configuration diagram showing a third embodiment of the present invention.

FIG. 8 is a sectional configuration diagram showing a fourth embodiment of the present invention.

FIG. 9 is a process drawing showing the manufacturing process of the housing body 22 in FIG.

FIG. 10 is a sectional configuration diagram showing a fifth embodiment of the present invention.

FIG. 11 is a sectional configuration diagram showing a sixth embodiment of the present invention,
(A) shows the G sensor vertically fixed to the circuit board,
(B) shows a state in which the G sensor is horizontally fixed to the circuit board.

12A and 12B show the configuration of the housing body 2 in FIG. 11, where FIG. 12A is a top view, FIG. 12B is a front view, FIG. 12C is a bottom view, FIG. Is a back view.

FIG. 13 shows a configuration of a conventional acceleration detection device,
(A) is a side sectional view and (B) is a plan view of the housing 100 with a lid portion 100a removed.

14 is a schematic cross-sectional configuration diagram of a housing 100 in FIG.

[Explanation of symbols]

1 ... G sensor, 2 ... Housing main body part, 3 ... Sensor chip, 4 ... Lid part, 5 ... Hollow part, 8, 9 ... Wiring, 10 ... Circuit board, 12 ... Bonding agent.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasushi Shimoyama 1-1-1, Showa-cho, Kariya city, Aichi prefecture Nihon Denso Co., Ltd.

Claims (12)

[Claims] 1. A mechanical quantity detection device comprising: a housing fixed on a circuit board and having a hollow portion; and a sensor chip mounted in the hollow portion and displaced by receiving a force in a direction parallel to the circuit board. The housing has a flat end surface, and electric wiring for extracting an electric signal indicating the displacement state of the sensor chip is formed on the end surface through the inside of the housing, and the end surface on which the electric wiring is formed Is electrically and mechanically connected to the circuit board, and the housing is fixed substantially perpendicularly to the circuit board. 2. A housing having a hollow portion inside and a flat end surface, wherein a sensor chip is mounted inside the hollow portion, the sensor chip being displaced by acceleration, and a housing inside and inside the housing. Formed, the electric wiring for taking out an electric signal indicating the displacement state of the sensor chip, a circuit board on which a circuit element that operates based on the electric signal is formed, and an end surface on which the electric wiring is formed, An acceleration detecting device, comprising: a connecting unit that is electrically and mechanically connected to a circuit board to fix the housing substantially vertically to the circuit board. 3. The housing has a flat plate-shaped substrate to which the sensor chip is attached and a recess, and is attached to one surface of the substrate to form the hollow portion and the hollow portion. The acceleration detecting device according to claim 2, wherein the acceleration detecting device comprises a lid portion that hermetically seals the. 4. The box-shaped housing main body having a recess for accommodating the sensor chip, and the housing is attached to a front surface of the recess of the housing main body.
3. A lid portion which forms the hollow portion and hermetically seals the hollow portion.
The acceleration detection device according to. 5. The lid portion is L-shaped having a first portion attached to the entire surface of the recess and a second portion formed on the same surface as the end surface, and the connecting means is The acceleration detecting device according to claim 4, wherein the end surface of the housing and the second portion are connected to the circuit board. 6. A box-shaped member having a recess, wherein a sensor chip, which is displaced by receiving acceleration, is mounted in the recess, and a housing main body is mounted on the front surface of the recess in the housing body.
A lid portion that forms a hollow portion in which the sensor chip is housed and hermetically seals the hollow portion, and is formed in the housing body portion, on one surface of the outer periphery of the housing body portion and on the other surface orthogonal to the one surface, Electrical wiring for extracting an electrical signal indicating the displacement state of the sensor chip, a circuit board on which a circuit element that operates based on the electrical signal is formed, and one of the one surface and the other surface, the circuit An acceleration detecting device, comprising: a connecting unit that is electrically and mechanically connected to a board to fix the housing body to the circuit board. 7. The acceleration detecting device according to claim 4, wherein the housing body is formed by laminating a plurality of insulating substrates. 8. The acceleration detecting device according to claim 2, wherein the connecting unit is a conductive bonding agent. 9. A housing having first and second outer walls and having a hollow portion, a sensor chip which is mounted in the hollow portion and which receives an acceleration to displace and outputs an electric signal indicating the displacement state, An electric wiring means for extracting the electric signal, the pad area being formed on the first and second outer walls, and one of the pad areas formed on the first and second outer walls being a circuit. An acceleration detecting device, wherein the housing is fixed to the circuit board by being electrically and mechanically connected to the board. 10. A processing circuit, which is electrically connected to the sensor chip and detects acceleration by displacement of the sensor chip and outputs the electric signal, is provided in the hollow portion. The acceleration detection device according to any one of 1. 11. A housing having a hollow portion inside and a flat end surface outside, and a sensor chip attached to the hollow portion, the sensor chip being displaced upon receiving acceleration, and the inside of the housing and the housing. And an electric wiring for forming an electric signal indicating the displacement state of the sensor chip, and a circuit wiring that has a circuit element that operates based on the electric signal and is connected to the circuit element. Circuit board, wire means for electrically connecting the electric wiring and the circuit wiring, and connecting means for connecting the end surface of the housing to the circuit board and fixing the housing substantially vertically. An acceleration detection device characterized by the above. 12. A housing having a step is formed, the circuit board is attached to an upper step of the step, and the housing is fixed to a lower step, so that the housing and the circuit board are formed in substantially the same plane. The acceleration detection device according to claim 11, wherein the acceleration detection device is provided.