JPH08323746A - Combination prepreg - Google Patents
Combination prepregInfo
- Publication number
- JPH08323746A JPH08323746A JP13183895A JP13183895A JPH08323746A JP H08323746 A JPH08323746 A JP H08323746A JP 13183895 A JP13183895 A JP 13183895A JP 13183895 A JP13183895 A JP 13183895A JP H08323746 A JPH08323746 A JP H08323746A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- combination
- prepregs
- resin
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000005520 cutting process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 238000005485 electric heating Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、積層板や多層プリント
配線板の製造に使用される組合せ用プリプレグに関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a combination prepreg used for manufacturing laminated boards and multilayer printed wiring boards.
【０００２】[0002]
【従来の技術】プリプレグは、ガラス織布やガラス不織
布を基材とし、熱硬化性樹脂を含浸させた後、乾燥処理
を施して半硬化にしたものである。2. Description of the Related Art A prepreg is made of glass woven cloth or glass nonwoven cloth as a base material, impregnated with a thermosetting resin, and then dried to be semi-cured.
【０００３】このプリプレグは、所定寸法に切断した
後、金属箔等と組み合わせられ、積層板や多層プリント
配線板等の製造に使用されている。This prepreg is cut to a predetermined size and then combined with a metal foil or the like to be used for manufacturing a laminated board, a multilayer printed wiring board or the like.
【０００４】上記プリプレグは絶縁層を形成するために
使用され、厚みを容易に調整できるように、薄物のプリ
プレグを複数枚重ね合わせて使用される。The above prepreg is used to form an insulating layer, and a plurality of thin prepregs are superposed on each other so that the thickness can be easily adjusted.
【０００５】したがって、例えば、多層プリント配線板
を製造する際には、組み合わせ及びＢＵ工程で、必要な
寸法、厚み、及び、種類を有するプリプレグを必要な枚
数だけ重ね合わせて使用している。Therefore, for example, when manufacturing a multilayer printed wiring board, prepregs having a required size, thickness, and type are used in a combined and BU process in a required number of layers.
【０００６】ところが、従来、所定寸法に切断されたプ
リプレグは積み重ねて積載されているので、上記のよう
に、複数枚のプリプレグを使用する際には、枚数を間違
えたり、枚数をカウントするのに時間を有していた。However, conventionally, prepregs cut into a predetermined size are stacked and stacked. Therefore, as described above, when using a plurality of prepregs, the number of prepregs may be wrong or may be counted. Had time.
【０００７】また、異なる種類のプリプレグを組み合わ
せて使用する場合には、その組み合わせを間違えること
があった。When different types of prepregs are used in combination, the combination may be wrong.
【０００８】[0008]
【発明が解決しようとする課題】本発明は上記の事情を
鑑みてなされたもので、その目的とするところは、予
め、使用する枚数のプリプレグを結合して一体化するこ
とにより、組み合わせやＢＵの作業効率を向上し、組み
合わせ間違いの発生を防ぐことができる組合せ用プリプ
レグを提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to combine and integrate the prepregs of the number of sheets to be used in advance to obtain a combination or BU. It is to provide a prepreg for combination which can improve the working efficiency of and prevent the occurrence of a combination error.
【０００９】[0009]
【課題を解決するための手段】本発明の請求項１に係る
組合せ用プリプレグは、基材に含浸された樹脂が半硬化
したプリプレグ７を所定寸法に切断して重ね合わせ、該
プリプレグ７の端部２を結合して一体化したことを特徴
とする。A combination prepreg according to claim 1 of the present invention is a prepreg 7 in which a resin impregnated in a base material is semi-cured and cut to a predetermined size and superposed, and the end of the prepreg 7 is cut. It is characterized in that the parts 2 are joined and integrated.
【００１０】また、本発明の請求項２に係る組合せ用プ
リプレグは、プリプレグ７の端部２を加熱して接着した
ことを特徴とする。The prepreg for combination according to claim 2 of the present invention is characterized in that the end portion 2 of the prepreg 7 is heated and bonded.
【００１１】また、本発明の請求項３に係る組合せ用プ
リプレグは、プリプレグ７の端部２をホッチキス、又
は、はとめにより結合したことを特徴とする。Further, the prepreg for combination according to claim 3 of the present invention is characterized in that the end portion 2 of the prepreg 7 is joined by a stapler or a fit.
【００１２】[0012]
【作用】本発明に係る組合せ用プリプレグによれば、基
材に含浸された樹脂が半硬化したプリプレグを所定寸法
に切断して重ね合わせ、該プリプレグの端部を結合して
一体化しているので、端部を基準としてプリプレグの移
積を図ることにより、一度の動作で、必要な種類、か
つ、必要な枚数のプリプレグを取り扱うことができる。According to the prepreg for combination of the present invention, the prepreg in which the resin impregnated into the base material is semi-cured is cut into a predetermined size and overlapped, and the ends of the prepreg are joined and integrated. By transferring the prepregs based on the ends, it is possible to handle the required types and the required number of prepregs in one operation.
【００１３】本発明で使用される組合せ用プリプレグ
は、樹脂を基材に含浸した後、乾燥させて樹脂を半硬化
して形成される。The prepreg for combination used in the present invention is formed by impregnating a base material with a resin and then drying it to semi-cure the resin.
【００１４】基材としては、例えば、ガラス繊維やアラ
ミド繊維等の無機繊維やポリエステル、ポリアミド、ポ
リビニルアルコール、アクリル等の有機合成繊維や木綿
等の天然繊維からなる、織布、不織布、マット或いは紙
又はこれらの組み合わせ等が知られている。Examples of the substrate include inorganic fibers such as glass fibers and aramid fibers, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol and acrylic, and natural fibers such as cotton. Alternatively, a combination of these is known.
【００１５】また、この基材に含浸する樹脂としては、
エポキシ樹脂、フェノール樹脂、ポリイミド樹脂、ポリ
フェニレンオキサイド樹脂、フッ素樹脂などの熱硬化性
樹脂の単体、変成物、混合物が使用され、必要に応じ
て、炭酸カルシウム、水酸化アルミニウム、タルク、ア
ルミナ、シリカ、炭酸マグネシウム等の無機充填剤を樹
脂に添加することができる。As the resin with which the base material is impregnated,
Epoxy resin, phenol resin, polyimide resin, polyphenylene oxide resin, simple substance of thermosetting resin such as fluororesin, modified product, mixture is used, and if necessary, calcium carbonate, aluminum hydroxide, talc, alumina, silica, Inorganic fillers such as magnesium carbonate can be added to the resin.
【００１６】上記プリプレグを結合する方法としては、
樹脂を溶融して接着する方法、ホッチキスやはとめによ
り物理的に結合する方法がある。As a method of connecting the above prepregs,
There are a method of melting and adhering the resin, and a method of physically bonding with a stapler or a staple.
【００１７】樹脂を溶融する方法としては、熱風、赤外
線、電熱体等で接触または非接触により７０℃〜１３０
℃に加熱して溶融させる。As a method of melting the resin, hot air, infrared rays, an electric heating element or the like may be contacted or not contacted to 70 ° C. to 130 ° C.
Heat to ℃ to melt.
【００１８】以下、本発明の組合せ用プリプレグを実施
例に基づいて説明する。The combination prepreg of the present invention will be described below based on examples.
【００１９】[0019]
実施例１ 厚み０．１ｍｍ、幅１０５０ｍｍの長尺ガラス織布にテ
トラビスフェノールＡ型エポキシ樹脂（エポキシ当量５
００）８７．５部、クレゾールノボラック型エポキシ樹
脂（エポキシ当量２２０）１２．５部、ジシアンジアミ
ド（硬化剤）２．４部、２エチル４メチルイミダゾール
０．０６部、溶剤（ジメチルホルムアミド）２５部を混
合攪拌して形成した、硬化剤含有エポキシ樹脂ワニスを
含浸、乾燥後５３０×５３０ｍｍのサイズに切断してプ
リプレグ７を得た。Example 1 Tetrabisphenol A type epoxy resin (epoxy equivalent 5
00) 87.5 parts, cresol novolac type epoxy resin (epoxy equivalent 220) 12.5 parts, dicyandiamide (hardening agent) 2.4 parts, 2 ethyl 4-methylimidazole 0.06 parts, solvent (dimethylformamide) 25 parts A prepreg 7 was obtained by impregnating a curing agent-containing epoxy resin varnish formed by mixing and stirring, drying and cutting into a size of 530 × 530 mm.
【００２０】次に、該プリプレグ７ａ、７ｂを２枚重ね
合わせ、線状の電熱体を上下に有するシーラで、１００
℃、７ｋｇ／ｃｍ2 で６０秒間挟持して、プリプレグを
加熱し、樹脂を再溶融させて接着し、一体化を図ること
により組合せ用プリプレグ１を得る。Next, two prepregs 7a and 7b are superposed on each other and a sealer having a linear electric heating element on the upper and lower sides is used.
The combination of prepregs 1 is obtained by sandwiching at 60 ° C. and 7 kg / cm 2 for 60 seconds, heating the prepregs to remelt the resin and adhering the prepregs for integration.
【００２１】図１（ａ）は、上記シーラにより接着した
組合せ用プリプレグの上面図で、図１（ｂ）は、図１
（ａ）の断面図である。FIG. 1 (a) is a top view of the prepreg for combination bonded by the above sealer, and FIG. 1 (b) is FIG.
It is sectional drawing of (a).
【００２２】図に示す如く、本実施例の組合せ用プリプ
レグ１は、端部２の四辺が再溶融されて、結合部２ａが
形成され、上下のプリプレグ７ａ、７ｂが接着されてい
る。この結合部２ａは、プリプレグ７の端面より１０ｍ
ｍの幅で、端面に沿って形成されている。また、このプ
リプレグ７の端部２を四辺とも、完全に接着すると、成
形する際に、重ね合わせたプリプレグ７の間に残留する
空気が抜け出すことができないので、少なくとも、一辺
に、未結合部２ｂが設けてある。As shown in the figure, in the combination prepreg 1 of this embodiment, the four sides of the end portion 2 are re-melted to form a joint 2a, and the upper and lower prepregs 7a and 7b are bonded. This connecting portion 2a is 10 m from the end surface of the prepreg 7.
It has a width of m and is formed along the end face. Further, if the end portions 2 of the prepreg 7 are completely adhered to all four sides, air remaining between the prepregs 7 that have been overlapped cannot escape during molding, so that at least one side of the unbonded portion 2b is not removed. Is provided.
【００２３】図２は、上記実施例１の他の実施例で、プ
リプレグ７の対向する二辺の端部２を接着し、一体化し
たものである。FIG. 2 shows another embodiment of the first embodiment, in which the end portions 2 of the two opposite sides of the prepreg 7 are bonded and integrated.
【００２４】実施例１とはことなり、向かい合う二辺に
結合部２ａを形成したもので、成形する際の樹脂の流動
性が向上されている。In contrast to the first embodiment, the joint portions 2a are formed on the two opposite sides, and the fluidity of the resin at the time of molding is improved.
【００２５】実施例２ 上記実施例１と同様にして得られた５３０×５３０ｍｍ
のサイズのプリプレグ７を２枚重ね合わせ、線状の電熱
体を上下に有するシーラで、１００℃、７ｋｇ／ｃｍ2
で６０秒間挟持して、四隅を加熱し、樹脂を再溶融させ
て結合部２ａを形成し一体化を図る。Example 2 530 × 530 mm obtained in the same manner as in Example 1 above
2 sheets of prepreg 7 of the same size are stacked, and with a sealer having linear electric heating elements at the top and bottom, 100 ° C, 7 kg / cm 2
After that, the four corners are heated, the four corners are heated, the resin is re-melted, and the joint portion 2a is formed to be integrated.
【００２６】図３は上記で得られた組合せ用プリプレグ
の上面図で、プリプレグ７の四隅に１０×１０ｍｍの結
合部２ａが形成されている。FIG. 3 is a top view of the prepreg for combination obtained as described above. The prepreg 7 has 10 × 10 mm coupling portions 2a formed at the four corners.
【００２７】さらに、図３に示す、プリプレグ７の各辺
の中央部３を加熱し、再溶融させて接着してもよい。Further, the central portion 3 of each side of the prepreg 7 shown in FIG. 3 may be heated, re-melted and adhered.
【００２８】実施例３ 上記実施例１と同様にして得られた５３０×５３０ｍｍ
のサイズのプリプレグ７を２枚重ね合わせ、図４に示す
如く、プリプレグ７の各辺の中央部３をホッチキスによ
り、物理的に接合して一体化を図る。Example 3 530 × 530 mm obtained in the same manner as in Example 1 above
Two prepregs 7 of the same size are superposed, and as shown in FIG. 4, the central portion 3 of each side of the prepreg 7 is physically joined by a stapler to be integrated.
【００２９】図４では、各辺の中央部３にそれぞれ一箇
所ずつホッチキスで接合したが、特に、この接合箇所の
数は限定する物ではなく、複数個有しても良い。In FIG. 4, a stapler is attached to each of the central portions 3 of the respective sides, but the number of the joined portions is not limited, and a plurality may be provided.
【００３０】（利用例）実施例１〜実施例３で得られた
組合せ用プリプレグ１を使用して、以下のようにして多
層配線板を成形した。(Application Example) Using the combination prepreg 1 obtained in Examples 1 to 3, a multilayer wiring board was formed as follows.
【００３１】図５は、多層プリント配線板を成形する際
の組合せを説明する構成図である。多層プリント配線板
は、例えば、図５に示されるように、厚さ０．９ｍｍの
黒化処理が施された内層材５の上下にそれぞれプリプレ
グ７を２枚配し、さらに、上下に厚さ１８μｍの銅箔４
を重ねて、被圧体を形成する。この被圧体を、温度１７
０℃、圧力４０kg/cm2、２０分間の成形条件で加熱加圧
して、厚さ１．６ｍｍの４層配線板を形成される。FIG. 5 is a constitutional view for explaining a combination when molding a multilayer printed wiring board. For example, as shown in FIG. 5, the multilayer printed wiring board has two prepregs 7 arranged on the upper and lower sides of a blackened inner layer material 5 having a thickness of 0.9 mm. 18 μm copper foil 4
Are stacked to form a body to be pressed. This compressed body is heated to a temperature of 17
A 4-layer wiring board having a thickness of 1.6 mm is formed by heating and pressing under the molding conditions of 0 ° C., a pressure of 40 kg / cm 2 and a time of 20 minutes.
【００３２】上記実施例で得られた２枚のプリプレグ７
が一体化された組合せ用プリプレグ１を、上記プリプレ
グ７を２枚使用する際に使用し、被圧体を形成する組み
合わせ工程の作業時間を測定すると、従来、プリプレグ
７を２枚ずつ組み合わせて被圧体を形成していたとき、
つまり、一被圧体に対してプリプレグ７を４枚組み合わ
せていた時に比べ、組合せ用プリプレグ１を使用した場
合、時間にして約３０％の短縮を図ることができた。Two prepregs 7 obtained in the above embodiment
The prepreg for combination 1 in which the above are integrated is used when two sheets of the above prepreg 7 are used, and the working time of the combination step of forming the body to be pressed is measured. When forming a pressure body,
That is, compared with the case where four prepregs 7 were combined with one pressed body, it was possible to reduce the time by about 30% when the combination prepreg 1 was used.
【００３３】また、組合せ用プリプレグ１の端部２は接
着されているので、剛性が高くなり、端部２を挟持して
搬送しても、垂れ下がったり、屈折することがなく、容
易に搬送することができた。Further, since the end portion 2 of the combination prepreg 1 is adhered, the rigidity is high, and even if the end portion 2 is sandwiched and conveyed, it does not sag or bend and is easily conveyed. I was able to.
【００３４】[0034]
【発明の効果】本発明の組合せ用プリプレグは、基材に
含浸された樹脂が半硬化したプリプレグを所定寸法に切
断して重ね合わせ、該プリプレグの端部を結合して一体
化しているので、所望の種類のプリプレグを一体化する
ことができ、必要な品種かつ必要な枚数のプリプレグを
容易に取り扱うことができるので、組み合わせやＢＵの
作業効率を向上することができる。また、予め、必要な
種類で必要枚数を組み合わせて一体化されているので、
組合せ間違いをすることもなく、正確な構成を得ること
ができる。The prepreg for combination of the present invention has a structure in which the prepreg in which the resin impregnated into the base material is semi-cured is cut into a predetermined size and overlapped with each other, and the end portions of the prepreg are joined and integrated. It is possible to integrate desired types of prepregs and easily handle the required types and the required number of prepregs, thus improving the working efficiency of combinations and BUs. In addition, because it is integrated in advance by combining the required number of required types.
An accurate configuration can be obtained without making a mistake in combination.
【図１】（ａ）本発明の一実施例に係る組合せ用プリプ
レグの上面図である。 （ｂ）図１(a) の組合せ用プリプレグの断面図である。FIG. 1A is a top view of a combination prepreg according to an embodiment of the present invention. (B) It is sectional drawing of the prepreg for a combination of FIG.1 (a).
【図２】本発明の他の一実施例に係る組合せ用プリプレ
グの上面図である。FIG. 2 is a top view of a combination prepreg according to another embodiment of the present invention.
【図３】本発明の他の一実施例に係る組合せ用プリプレ
グの上面図である。FIG. 3 is a top view of a combination prepreg according to another embodiment of the present invention.
【図４】本発明の他の一実施例に係る組合せ用プリプレ
グの上面図である。FIG. 4 is a top view of a combination prepreg according to another embodiment of the present invention.
【図５】多層プリント配線板を成形する際の組合せを説
明する構成図である。FIG. 5 is a configuration diagram illustrating a combination when molding a multilayer printed wiring board.
１ 組合せ用プリプレグ ２ 端部 ２ａ 結合部 ３ 中央部 ４ 銅箔 ５ 内層材 ７ プリプレグ 1 Combination prepreg 2 End part 2a Joint part 3 Center part 4 Copper foil 5 Inner layer material 7 Prepreg
Claims (3)
プレグ（７）を所定寸法に切断して重ね合わせ、該プリ
プレグ（７）の端部（２）を結合して一体化したことを
特徴とする組合せ用プリプレグ。1. A prepreg (7) in which a resin impregnated into a base material is semi-cured is cut into a predetermined size and overlapped with each other, and an end portion (2) of the prepreg (7) is joined and integrated. Characteristic combination prepreg.
て接着したことを特徴とする請求項１記載の組合せ用プ
リプレグ。2. The prepreg for combination according to claim 1, wherein the end (2) of the prepreg (7) is heated and bonded.
ッチキス、又は、はとめにより結合したことを特徴とす
る請求項１又は請求項２記載の組合せ用プリプレグ。3. The prepreg for combination according to claim 1 or 2, wherein the ends (2) of the prepreg (7) are joined by a stapler or a snap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13183895A JPH08323746A (en) | 1995-05-30 | 1995-05-30 | Combination prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13183895A JPH08323746A (en) | 1995-05-30 | 1995-05-30 | Combination prepreg |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08323746A true JPH08323746A (en) | 1996-12-10 |
Family
ID=15067290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13183895A Withdrawn JPH08323746A (en) | 1995-05-30 | 1995-05-30 | Combination prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08323746A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008174630A (en) * | 2007-01-18 | 2008-07-31 | Toyota Motor Corp | Fiber reinforced composite material, molding method of fiber reinforced composite material, pair of prepregs, and pair of prepreg manufacturing methods |
-
1995
- 1995-05-30 JP JP13183895A patent/JPH08323746A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008174630A (en) * | 2007-01-18 | 2008-07-31 | Toyota Motor Corp | Fiber reinforced composite material, molding method of fiber reinforced composite material, pair of prepregs, and pair of prepreg manufacturing methods |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020806 |