JPH08328025A - Liquid crystal display manufacturing method - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a method for manufacturing a liquid crystal display device, which is capable of dividing a substrate with high productivity and accuracy. According to the present invention, first, a liquid crystal sealant 23 having a liquid crystal injection port 23a is applied around each TFT 11 or each color filter 21 on one of the drive side substrate 1 or the counter side substrate 2, and The outer peripheral sealant 2 is formed so as to surround the outermost periphery of the region where the plurality of liquid crystal sealants 23 are arranged.
Apply 4. Next, a cutting groove is formed halfway in the thickness direction of each substrate in a state where the driving-side substrate 1 and the opposing-side substrate 2 are superposed, and thereafter, an external force is applied to each of the driving-side substrate 1 and the opposing-side substrate 2. Is a method for manufacturing a liquid crystal display device in which individual liquid crystal panel components are formed by cutting at the positions of the cutting grooves.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a drive side substrate having a plurality of liquid crystal drive elements formed thereon and a counter side substrate having a plurality of counter electrodes formed thereon, with a common agent and a sealant interposed therebetween. After that, the present invention relates to a method for manufacturing a liquid crystal display device in which each substrate is divided to form individual liquid crystal panel components.

[0002]

2. Description of the Related Art In the manufacture of liquid crystal display devices, there are a so-called single-piece assembly method in which substrates are divided and then stacked, and a so-called face-to-face assembly method in which substrates are stacked and then divided. . In the case of a so-called single-assembly method, first, thin film transistors for driving a liquid crystal or the like are formed in a matrix on a glass substrate (hereinafter, the thin film transistors or the like formed in the matrix are simply referred to as TFTs), and are diced. Divide into a single piece, apply the alignment film, perform rubbing treatment and cleaning, apply the common agent, then form the counter electrode and color filter on another glass substrate, and apply the alignment film and perform the rubbing treatment. After cleaning, apply sealant to each substrate,
Liquid crystal panel parts are formed by stacking both.

In the case of the so-called face-to-face assembly system, first, a plurality of TFTs are formed on a glass substrate before division, application of an alignment film, rubbing treatment and cleaning, application of a common agent, and then, Application of counter electrode, color filter and alignment film, rubbing treatment and cleaning, and application of sealant on other glass substrate before dividing, and after overlapping each glass substrate, divide to form individual liquid crystal panel parts. are doing.

Among the methods of manufacturing such a liquid crystal display device, in the so-called surface assembly method, all terminals are short-circuited in order to protect elements such as TFTs from electrostatic damage, and all elements on the glass substrate are manufactured. By applying a roll coating of an alignment film made of polyimide or the like and performing a rubbing treatment, it is possible to make the alignment film uniform, improve the orientation, and reduce dust adhesion.

[0005]

However, in the method of manufacturing a liquid crystal display device in which the respective glass substrates are superposed and then divided, the substrate division after the superposition is carried out.
Since scribe breaks are made along the boundaries of each TFT and the boundaries of each color filter, there are problems such as damage due to external force during breaks, chipping and cracking of the glass substrate, and deterioration of the reliability of the sealant. .

Therefore, if the full cut dicing is performed after the glass substrates are superposed on each other, there is no need for a break, and problems such as chipping or cracking of the glass substrates and deterioration of the reliability of the sealing agent at that time occur. It can be resolved.
However, performing full-cut dicing with the glass substrates stacked together imposes a great load on the dicing blade, and it is very difficult to cut accurately.
In addition, the life of the dicing blade is shortened.

Further, when full cut dicing is performed,
The cutting water required at this time enters into the frame of the sealant through the liquid crystal injection port of the sealant, which adversely affects elements such as TFTs and color filters inside the gap. Therefore, it is an object of the present invention to provide a method for manufacturing a liquid crystal display device, which is capable of accurately dividing a substrate with high productivity.

[0008]

SUMMARY OF THE INVENTION A method of manufacturing a liquid crystal display device, which has been made to achieve the above object of the present invention.
That is, according to the present invention, a driving-side substrate on which a plurality of liquid crystal driving elements are formed and an opposite-side substrate on which a plurality of opposite electrodes are formed are superposed, and then each substrate is divided into individual liquid crystal panels. A method of manufacturing a liquid crystal display device for forming a component, wherein first, a liquid crystal sealant having a liquid crystal injection port is provided around each liquid crystal driving element or each counter electrode on one of the drive side substrate or the counter side substrate. Along with the application, the outer peripheral sealant is applied so as to surround the outermost periphery of the region where the plurality of liquid crystal sealants are lined up. Next, in a state where the drive side substrate and the counter side substrate coated with the common agent are overlapped with each other with the liquid crystal sealant and the outer peripheral sealant, cutting along the boundary of each liquid crystal drive element and the boundary of each counter electrode. Grooves are formed halfway in the thickness direction of each substrate, and then external forces are applied to the driving-side substrate and the opposing-side substrate to divide at the cutting groove positions to form individual liquid crystal panel components.

[0009]

According to the present invention, a liquid crystal sealant having a liquid crystal injection port is applied around each liquid crystal driving element or each counter electrode on one of the drive side substrate and the counter side substrate, and a plurality of liquid crystal seals are applied. The outer peripheral sealant is applied so as to surround the outermost periphery of the region where the agents are lined up. Therefore, the region where the plurality of liquid crystal sealants are lined up is closed by the peripheral sealant. Further, the liquid crystal injection space inside each liquid crystal sealant formed by superposing the drive side substrate and the counter side substrate through the liquid crystal sealant and the outer peripheral sealant with respect to the space outside the outer peripheral sealant. Will be sealed.

Further, in a state where the driving side substrate and the counter side substrate are overlapped with each other, a cutting groove along the boundary of each liquid crystal driving element and the boundary of each counter electrode is formed halfway in the thickness direction of each substrate, After that, an external force is applied to each of the driving-side substrate and the opposing-side substrate to divide at the position of the cutting groove. That is, the cutting force is smaller when the cutting groove is formed halfway in the thickness direction of each substrate than when full-cut dicing is performed on two substrates, and an external force is applied to each of the cutting grooves. The division allows the substrates to be divided with a smaller force as compared with the case of scribing and breaking each substrate.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the method for manufacturing a liquid crystal display device of the present invention will be described below with reference to the drawings. 1 to 3 are schematic cross-sectional views for sequentially explaining the method for manufacturing a liquid crystal display device of the present invention. Further, FIG. 4 is a schematic plan view illustrating a printing example of the outer peripheral sealant, which is one of the features of the present invention.

That is, according to the method of manufacturing a liquid crystal display device of the present invention, the driving side substrate 1 on which a plurality of TFTs 11 are formed,
A plurality of liquid crystal panel components 10, which are the main components of the liquid crystal display device, are formed by stacking a plurality of color filters 21 and a counter substrate 2 on which a counter electrode (not shown) is formed, and then dividing each substrate. It is a method of forming.

First, in the common electrode applying step shown in FIG. 1A, a process of applying the common electrode 13 to the driving side substrate 1 is performed. The drive side substrate 1 has, for example, 6 to 8
Multiple TFTs on a quartz glass plate with an inch diameter of 0.8 mm
11 and an alignment film 12 made of polyimide or the like (for example,
(Thickness of 30 to 50 nm) is formed and subjected to rubbing treatment and cleaning, and each TF is used as the common electrode 13.
Printing is applied corresponding to T11.

Next, as a seal printing step shown in FIG. 1B, a process of printing and applying a liquid crystal sealant 23 and an outer peripheral sealant 24 to the counter substrate 2 is performed. The opposite substrate 2 is, for example, a borosilicate glass plate having a diameter of 6 to 8 inches or a diameter of 6 to 8 inches and a thickness of 1.1 mm, and a transparent electrode (for example, an ITO electrode) which is an opposite electrode, a color filter, or a polyimide. An alignment film 22 (for example, 30
˜50 nm thickness) is formed and subjected to rubbing treatment and cleaning. The liquid crystal sealant 23, which is applied by printing on the counter substrate 2, surrounds each color filter 21 and the alignment film 22 in order to seal the liquid crystal injected between the driving substrate 1 and the counter substrate 2 in the subsequent processing. , And liquid crystal injection ports 23a are provided at predetermined positions.

The outer peripheral sealant 24 is applied by printing so as to surround the outermost periphery of the region where the liquid crystal sealants 23 are lined up. As the print pattern of the outer peripheral sealant 24,
An example as shown in the schematic plan views of FIGS. 4A and 4B can be considered. That is, in the example shown in FIG. 4A, the outer peripheral sealant 24 is printed so as to surround the outside of the region S where the liquid crystal sealants 23 are lined up on the opposite substrate 2. As a result, the area S including the liquid crystal injection port 23a is sealed in the outer peripheral sealant 2
It becomes a closed state by 4.

In the example shown in FIG. 4B, a part of the liquid crystal sealant 23, which is the outermost periphery of the region S where the liquid crystal sealants 23 are lined up on the opposite substrate 2, is shared with the outer peripheral sealant 24. It is a print pattern. That is, in the liquid crystal sealant 23 that is the outermost periphery of the region S, the open side of the side where the liquid crystal injection port 23a is absent is connected by the outer peripheral sealant 24, and the side where the injection port 23a is present is an outer peripheral seal on the outside. Agent 24 is connected. by this,
The amount of the peripheral sealant 24 used can be reduced, and the region S can be closed by the peripheral sealant 24.

Next, in a superposition process shown in FIG. 1C, the driving side substrate 1 coated with the common electrode 13 and the opposite side substrate 2 on which the liquid crystal sealant 23 and the outer peripheral sealant 24 are printed. Perform the overlapping process. This allows
The common electrode 13 is connected between the driving-side substrate 1 and the counter-side substrate 2, and the alignment film 12 on the TFT 11 side is connected.
A predetermined gap (for example, 3.5 to 4.0 μm) is formed between and the alignment film 22 on the color filter 21 side.

By this superposition, the liquid crystal injection space T in each liquid crystal sealant 23 is sealed to the space outside the outer peripheral sealant 24. That is,
Even if the liquid crystal sealant 23 is provided with the liquid crystal injection port 23 a, the liquid crystal injection space T inside thereof is sealed by the outer peripheral sealant 24.

Next, in this state, the first portion shown in FIG.
Perform dicing. Before performing the first dicing, the dicing tape 31 is attached to the opposite substrate 2.
As the dicing tape 31, for example, an ultraviolet irradiation curing type tape or a heat shrinkable peeling type tape is used. And
Cutting grooves 15 are formed at regular pitches in the XY directions along the boundaries of the TFTs 11 on the drive-side substrate 1 which is the upper side.

The cutting groove 15 is formed by half-cut dicing or semi-full-cut dicing by cutting the driving-side substrate 1 halfway in the thickness direction of the driving-side substrate 1 with a dicing blade (not shown) so that the driving-side substrate 1 has a thickness of 50 to 100 μm.
It is formed so as to leave about m. When performing the half-cut dicing or the semi-full-cut dicing, the cutting is performed while flowing a predetermined cutting water. As described above, the liquid crystal injection space T inside the liquid crystal sealant 23 is sealed by the outer peripheral sealant 24. Therefore, the cutting water does not enter the liquid crystal injection space T from the liquid crystal injection port 23a, and the internal TFT 11 and the color filter 2 are prevented.
1. The alignment films 12 and 22 are not adversely affected.

Next, as the second dicing shown in FIG. 2B, the opposite substrate 2 is diced. Before performing the second dicing, the dicing tape 32 is attached to the driving side substrate 1. As the dicing tape 32, for example, an ultraviolet irradiation curing type tape is used. Then, along the boundary of the color filter 21 on the counter substrate 2 on the upper side, a regular pitch in the X direction and an irregular pitch in the Y direction (to expose the electrode pad portion (not shown) of the TFT 11) are cut grooves. Insert 25.

The cutting groove 25 is formed by fully cutting the dicing tape 31 with a dicing blade (not shown),
The opposite substrate 2 is formed by half-cut dicing or semi-full-cut dicing in which a notch is formed in the thickness direction of the opposite substrate 2 to leave the opposite substrate 2 at about 50 to 100 μm. At this time, a predetermined cutting water is used, but since the liquid crystal injection space T inside the liquid crystal sealant 23 is sealed by the outer peripheral sealant 24 as in the previous case, this cutting water is injected from the liquid crystal injection port 23a. It does not enter the liquid crystal injection space T and does not adversely affect the internal TFT 11, the color filter 21, and the alignment films 12 and 22.

Next, the braking process shown in FIG. 2C is performed. For braking, use the designated roller 3
Drive side substrate 1 by means of 3 or a breaker (not shown)
An external force is applied to the opposite side substrate 2 and the cutting groove 1 previously formed.
The drive side substrate 1 and the counter side substrate 2 are divided at positions 5 and 25. At this time, the driving-side substrate 1 and the counter-side substrate 2 are each left in the cutting grooves 15 and 25 by about 50 to 100 μm, so that the substrate is much smaller than the force required for the scribe break. The division can be done. In other words, in this braking, the load applied to the drive-side substrate 1 and the counter-side substrate 2 becomes very small, and the chipping or cracking of the substrate and the decrease in reliability of the liquid crystal sealant 23 will not occur. Further, since it is protected by the dicing tapes 31 and 32, the surface of the drive-side substrate 1 and the counter-side substrate 2 is not scratched or dust is attached due to braking.

After the braking is finished, a predetermined ultraviolet ray is irradiated (for example, 120 to 150 mJ / cm ² ).
The dicing tape 31 is cured to reduce the adhesive force. Further, when an ultraviolet ray irradiation curable tape is used as the dicing tape 32, this is also irradiated with ultraviolet rays (for example, 120 to 150 mJ / cm ² ) to be cured to reduce the adhesive strength.

Next, as a pick-up step shown in FIG. 3A, the push-up pins 34 are attached to the dicing tape 3.
By pushing up from the lower side of 2, the individual liquid crystal panel components 10 are separated by pickup. At this time, the scratches of the push-up pins 34 are arranged outside the effective area of each substrate. Alternatively, it is necessary to just push up the dicing tape 32 without breaking it. The liquid crystal panel component 10 taken out is conveyed with the dicing tape 31 still attached. Then, as shown in FIG. 3B, the dicing tape 31 is peeled off (when a heat shrinkable peeling type tape is used, the dicing tape 31 is heated to 70 ° C. or more to be self-contracted), thereby performing the subsequent treatment ( The liquid crystal panel component 10 prepared for liquid crystal injection, electrical wiring, etc.) is completed.

Through these steps, dicing (half-cut dicing or semi-full-cut dicing) is performed without injecting cutting water into the liquid crystal injection space T inside the liquid crystal sealant 23, and a small braking force is applied to the substrate. The liquid crystal panel component 10 can be manufactured without chipping or cracking, deterioration in reliability of the liquid crystal sealant 23, and reduction in yield due to panel scratches or dust adhesion.

In this embodiment, the counter substrate 2
An example in which the color filter 21 is formed is shown in
The color filter 21 does not necessarily have to be formed as long as the counter electrode (not shown) is formed. Further, an example in which the dicing tape 31 is used when performing the first dicing shown in FIG. 2A has been described.
The dicing tape 31 is not always necessary.

The printed pattern of the outer peripheral sealant 24 is not limited to that shown in FIGS. 4 (a) and 4 (b), and may be another pattern shape surrounding the region S where the liquid crystal sealants 23 are arranged. Good. Further, in this embodiment, after the substrates are bonded together, the driving-side substrate 1 is first diced,
Next, an example in which the opposite substrate 2 is diced has been described, but the opposite substrate 2 may be diced first, and then the driving substrate 1 may be diced.

[0029]

As described above, the method of manufacturing a liquid crystal display device of the present invention has the following effects. That is, when the driving-side substrate and the counter-side substrate are superposed and then divided to manufacture individual liquid crystal panel components, the outer peripheral sealant is applied in a state of enclosing the outermost periphery of the region where each liquid crystal sealant is lined up. Therefore, even if dicing is performed, the cutting water used at this time does not enter the liquid crystal injection space inside the liquid crystal sealant, so that the reliability of the driving element, the counter electrode, the alignment film, etc. can be secured. Become.

Further, as the dicing of each substrate, a cutting groove is formed halfway in the thickness direction of the substrate, so that the cutting resistance can be reduced as compared with the case of performing full-cut dicing, and the dicing blade The life is extended and the productivity can be improved. Moreover,
Since there is a dicing tape for surface protection, there is no problem of generation of tape cutting scraps or adhesive dust and adhesion, and the manufacturing yield can be improved.

Furthermore, an external force is applied to the driving-side substrate and the opposing-side substrate whose surfaces are protected by a dicing tape to divide the substrates at the position of the cutting groove, so that the substrates are squeezed with a smaller force than in the case of scribing and breaking each substrate. Highly reliable liquid crystal that can be divided and prevents chipping or cracking of the board during breaks, scratches on the back surface of each board (panel surface), and dust adhesion, while suppressing adhesion damage to the liquid crystal sealant. It becomes possible to form panel parts.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view (No. 1) for sequentially explaining the manufacturing method of the present invention.

FIG. 2 is a schematic sectional view (No. 2) for sequentially explaining the manufacturing method of the present invention.

FIG. 3 is a schematic sectional view (No. 3) for sequentially explaining the manufacturing method of the present invention.

FIG. 4 is a schematic plan view illustrating a printing example of a peripheral sealant.

[Explanation of symbols]

 1 Driving Side Substrate 2 Opposing Side Substrate 10 Liquid Crystal Panel Parts 11 TFTs 12 and 22 Alignment Film 13 Common Electrodes 15 and 25 Cutting Grooves 21 Color Filter 23 Liquid Crystal Sealant 23a Injection Port 24 Peripheral Sealant

Claims (1)

[Claims] 1. A liquid crystal panel component comprising: a driving-side substrate having a plurality of liquid crystal driving elements formed thereon and a counter-side substrate having a plurality of counter electrodes formed thereon; A method of manufacturing a liquid crystal display device, wherein first, a liquid crystal sealant having a liquid crystal injection port around each liquid crystal driving element or each counter electrode on one of the drive side substrate or the counter side substrate. And a peripheral sealant is applied in a state of enclosing the outermost periphery of a region where a plurality of liquid crystal sealants are lined up, and then the drive side substrate and the counter side substrate coated with a predetermined common agent are With the liquid crystal sealant and the outer peripheral sealant interposed, a cutting groove along the boundary of each liquid crystal driving element and the boundary of each counter electrode is inserted halfway in the thickness direction of each substrate, and then, Drive A method for manufacturing a liquid crystal display device, characterized in that an external force is applied to each of the side substrate and the opposing substrate to divide at the position of the cutting groove to form individual liquid crystal panel components.